Chip capacitor leveling mechanism based on thick rubber plate

Abstract

The utility model discloses a chip capacitor leveling mechanism based on a thick rubber plate. The chip capacitor leveling mechanism comprises a leveling conveying device, a jacking platform, a feeding belt, a turnover device, a lead-in plate recovery device and a leveling device, the leveling and conveying device comprises a conveying rack and a conveying tray, and the conveying tray is horizontally and movably mounted at the top of the conveying rack; the jacking platform, the feeding belt, the turnover device and the guide-in plate recovery device are sequentially arranged at the feeding end of the conveying rack in a right-facing mode from bottom to top, and the jacking platform can move up and down relative to the feeding belt and the turnover device and can penetrate out of the feeding belt and the conveying face of the leveling conveying device. According to the chip capacitor leveling mechanism based on the thick rubber plate, the leveling clamp is used for clamping the thick rubber plate, the thick rubber plate is made to move downwards to the top of the leveling platform, after the ends of chip capacitors in the thick rubber plate abut against the upper surface of the leveling platform, the ends of the chip capacitors are flush, and the leveling action is completed; and the end sealing quality can be ensured.

Description

Technical Field

[0001] This utility model relates to the technical field of chip capacitor production equipment, and in particular to a chip capacitor leveling mechanism based on a thick adhesive plate. Background Technology

[0002] Currently, fully automated end-sealing machines / production lines for surface mount capacitors typically use a stencil as the carrier for transferring the capacitors. Specifically, as detailed in Chinese Utility Model Patent CN218849426U, the end-sealing process involves first applying an adhesive film to one side of the stencil to seal one end of the mesh. After the film is smoothly adhered, the surface mount capacitors are inserted into the mesh, and the adhesive film adheres hundreds of miniature capacitors to the stencil, preventing them from falling off. Then, the other end of the capacitors without adhesive film is dipped in resin for end-sealing. During this insertion process, the ends of the surface mount capacitors are aligned by the adhesive film. However, due to potential manufacturing tolerances (such as varying lengths) in the surface mount capacitors themselves, the ends to be sealed within the same stencil are difficult to align perfectly after insertion, resulting in poor consistency in the resin dipping process and significantly affecting the end-sealing quality.

[0003] Therefore, to ensure the sealing quality of surface mount capacitors, some manufacturers have begun to use thick plastic plates instead of stencils as the transport carrier for surface mount capacitors. The thick plastic plate is a carrier that fixes the surface mount capacitor using silicone clamps. Therefore, to successfully implant the surface mount capacitor into the holes of the thick plastic plate, a guide plate needs to be placed on top of the thick plastic plate. First, the surface mount capacitor is implanted into the guide hole of the guide plate by vibration. Then, a bed of needles presses the surface mount capacitor located in the guide plate into the hole of the thick plastic plate, thus completing the implantation process of the surface mount capacitor into the thick plastic plate.

[0004] In the process of sealing surface mount capacitors, the existing technology generally uses a bed of needles to press the surface mount capacitor located in the guide plate into the hole of the thick adhesive plate, and only the pressing needles of the bed of needles make the end face of the protruding end of the surface mount capacitor implanted in the thick adhesive plate relatively flush, without adding an additional leveling step.

[0005] However, since the pressure pins in the needle bed also have tolerances, and the clamping force of each hole in the thick plastic plate on the chip capacitor has slight differences, it is necessary to flatten the end face of the chip capacitor in the thick plastic plate before impregnation to ensure the sealing quality of the chip capacitor. Utility Model Content

[0006] The purpose of this invention is to propose a surface mount capacitor leveling mechanism based on a thick adhesive plate, which can effectively ensure the sealing quality of surface mount capacitors and overcome the shortcomings of the prior art.

[0007] To achieve this objective, the present invention adopts the following technical solution:

[0008] A chip capacitor leveling mechanism based on a thick adhesive plate includes a leveling conveyor, a lifting platform, a feeding belt, a turning device, an inlet plate recycling device, and a leveling device.

[0009] The leveling and conveying device includes a conveyor frame and a conveyor tray. The conveyor tray is horizontally movably mounted on top of the conveyor frame and is used to hold thick rubber sheets.

[0010] The lifting platform, the feeding belt, the tilting device, and the guide plate recycling device are arranged in a top-to-bottom arrangement at the feeding end of the conveyor frame, with the lifting platform and the feeding belt located at the inner bottom of the conveyor frame, and the tilting device and the guide plate recycling device located at the top of the conveyor frame.

[0011] The lifting platform can move up and down relative to the feeding belt and the tilting device, and the lifting platform can pass through the conveying surface of the feeding belt and the leveling conveying device; the conveying pallet is U-shaped, and an avoidance opening is provided in the middle of the conveying pallet, and the avoidance opening is used to avoid the lifting platform;

[0012] The leveling device is located in front of the flipping device, and the leveling device includes a leveling clamp and a leveling platform arranged opposite each other in the vertical direction. The leveling clamp is located above the conveyor frame and can move up and down relative to the conveyor frame. The leveling platform is located below the conveyor frame. The leveling clamp is used to clamp the thick rubber sheet.

[0013] Preferably, the leveling fixture includes a leveling mounting base and a fixture assembly. The leveling mounting base is mounted directly above the conveyor frame and can move up and down relative to the conveyor frame. Two sets of fixture assemblies are provided, and the two sets of fixture assemblies are arranged opposite to each other on the bottom sides of the leveling mounting base. The fixture assembly is used to clamp the thick rubber sheet.

[0014] The clamping assembly includes a horizontal extension cylinder, a bottom extension cylinder, and clamping plates;

[0015] The horizontal extension cylinder is installed on the edge of the leveling mounting base, and the output end of the horizontal extension cylinder can be far away from and close to the center of the leveling mounting base;

[0016] The output end of the horizontal extension cylinder is equipped with the bottom extension cylinder, and the output end of the bottom extension cylinder can move up and down relative to the leveling mounting base.

[0017] The clamp is installed at the output end of the bottom protruding cylinder.

[0018] Preferably, the flipping device includes two sets of flipping components arranged opposite each other in the horizontal direction, and the two sets of flipping components are respectively mounted on both sides of the conveyor frame;

[0019] The flipping assembly includes a flipping mounting bracket, a lateral extension cylinder, a flipping motor, and a flipping gripper;

[0020] The lateral extension cylinder is detachably mounted to the conveyor frame via the flip mounting bracket;

[0021] The output end of the lateral extension cylinder can be located away from or near the center of the conveyor frame, and the tilting motor is installed at the output end of the lateral extension cylinder;

[0022] The output end of the flipping motor is mounted on the flipping gripper used to hold the thick rubber plate, and the flipping gripper rotates relative to the conveyor frame via the flipping motor.

[0023] Preferably, the leveling and conveying device further includes a discharge tray, which is horizontally movably mounted on the top of the conveyor frame and located in front of the conveying tray.

[0024] Preferably, both the upper surface of the conveying pallet and the upper surface of the unloading pallet are provided with a plurality of support blocks, and the plurality of support blocks are used to support the thick rubber sheet.

[0025] Preferably, it further includes a cleaning device, and the cleaning device is located between the flipping device and the leveling device;

[0026] The cleaning device includes an upper roller brush, a lower roller brush, and a product receiving tray;

[0027] The upper roller brush is positioned above the conveyor frame and is used to clean the upper surface of the thick rubber sheet; the lower roller brush is positioned below the conveyor frame and is used to clean the lower surface of the thick rubber sheet.

[0028] The product receiving tray is located directly below the upper roller brush and the lower roller brush.

[0029] The technical solution provided by this utility model can include the following beneficial effects:

[0030] This technical solution proposes a leveling mechanism for chip capacitors based on a thick adhesive plate. The thick adhesive plate is clamped by a leveling fixture and moved downward to the top of the leveling platform. After the end of the chip capacitor in the thick adhesive plate comes into contact with the upper surface of the leveling platform, the end of the chip capacitor is flush with the upper surface of the leveling platform, thus completing the leveling action. This helps to ensure the sealing quality of the chip capacitor. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the structure of the guide plate and the thick adhesive plate in this utility model.

[0032] Figure 2 This is a side view of a chip capacitor leveling mechanism based on a thick adhesive plate according to this utility model.

[0033] Figure 3 This is a schematic diagram of the structure of a chip capacitor leveling mechanism based on a thick adhesive plate according to this utility model.

[0034] Figure 4 This is a schematic diagram of the structure of a chip capacitor leveling mechanism based on a thick adhesive plate, which is another perspective of this utility model.

[0035] Figure 5 This is a partial structural schematic diagram of a chip capacitor leveling mechanism based on a thick adhesive plate according to this utility model.

[0036] Among them: leveling conveyor device 41, conveyor frame 411, conveyor pallet 412, unloading pallet 413, support block 414, lifting platform 42, loading belt 43, tilting device 44, tilting mounting bracket 441, lateral extension cylinder 442, tilting motor 443, tilting gripper 444, leveling device 45, leveling clamp 451, leveling mounting base 4511, horizontal extension cylinder 4512, bottom extension cylinder 4513, clamping plate 4514, leveling platform 452, cleaning device 46, upper roller brush 461, lower roller brush 462, product receiving tray 463;

[0037] Import plate 92, thick glue plate 93. Detailed Implementation

[0038] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0039] This technical solution provides a chip capacitor leveling mechanism based on a thick adhesive plate, including a leveling conveyor 41, a lifting platform 42, a feeding belt 43, a turning device 44, an inlet plate recycling device, and a leveling device 45.

[0040] The leveling and conveying device 41 includes a conveyor frame 411 and a conveying tray 412. The conveying tray 412 is horizontally movably installed on the top of the conveyor frame 411 and is used to hold the thick rubber sheet 93.

[0041] The lifting platform 42, the feeding belt 43, the tilting device 44, and the guide plate recycling device are arranged in a top-to-bottom arrangement at the feeding end of the conveyor frame 411, with the lifting platform 42 and the feeding belt 43 located at the inner bottom of the conveyor frame 411, and the tilting device 44 and the guide plate recycling device located at the top of the conveyor frame 411.

[0042] The lifting platform 42 can move up and down relative to the feeding belt 43 and the tilting device 44, and the lifting platform 42 can pass through the conveying surface of the feeding belt 43 and the leveling conveying device 42; the conveying tray 412 is U-shaped, and a clearance opening is provided in the middle of the conveying tray 412, and the clearance opening is used to avoid the lifting platform 42.

[0043] The leveling device 45 is located in front of the flipping device 44, and the leveling device 45 includes a leveling clamp 451 and a leveling platform 452 arranged opposite each other in the vertical direction. The leveling clamp 451 is located above the conveyor frame 411 and can move up and down relative to the conveyor frame 411. The leveling platform 452 is located below the conveyor frame 411. The leveling clamp 451 is used to clamp the thick rubber plate 93.

[0044] In the process of sealing the surface mount capacitor, the existing technology generally uses a bed of needles to press the surface mount capacitor located in the guide plate 92 into the plate hole of the thick adhesive plate 93, and only the pressing needles of the bed of needles make the end face of the protruding end of the surface mount capacitor implanted in the thick adhesive plate 93 relatively flush, without adding an additional leveling step.

[0045] However, since the pressure needles in the needle bed also have tolerances, and the clamping force of each hole in the thick plastic plate 93 on the chip capacitor has slight differences, it is necessary to flatten the end face of the chip capacitor in the thick plastic plate 93 before impregnation to ensure the sealing quality of the chip capacitor.

[0046] Therefore, this technical solution proposes a leveling mechanism, such as... Figure 2-5 As shown, it includes a leveling conveyor 41, a lifting platform 42, a feeding belt 43, a tilting device 44, an inlet plate recycling device (not shown in the figure), and a leveling device 45.

[0047] Specifically, the leveling process in the leveling mechanism of this solution includes the following steps:

[0048] (1) The assembly from the previous process is conveyed to the top of the lifting platform 42 using the feeding belt 43, while the conveying tray 412 is moved away from the feeding end of the conveyor frame 411; it should be noted that the assembly includes a thick rubber plate 93 and an inlet plate 92 attached from bottom to top, such as Figure 1As shown, the holes in the thick adhesive plate 93 accommodate surface mount capacitors.

[0049] (2) The lifting platform 42 moves upward and lifts the assembly away from the conveying surface of the feeding belt 43, and the guide plate 92 located on the top of the assembly is removed by the inlet plate recycling device, and then the remaining thick rubber plate 93 in the assembly is clamped by the flipping device 44.

[0050] (3) The lifting platform 42 moves downward and provides sufficient space for the flipping device 44 to flip. At the same time, the conveying tray 412 is moved to the bottom of the flipping device 44, and the flipping device 44 flips the thick plastic plate 93 180°. At this time, the end of the chip capacitor to be sealed protrudes from the lower surface of the thick plastic plate 93.

[0051] (4) After the lifting platform 42 moves upward and retrieves the thick rubber plate 93, the thick rubber plate 93 is placed on top of the conveyor tray 412.

[0052] (5) The conveyor pallet 412 is conveyed forward and the thick rubber sheet 93 is conveyed to the top of the leveling platform 452;

[0053] (6) Use the leveling clamp 451 to clamp the thick plastic plate 93 and move the thick plastic plate 93 downward to the top of the leveling platform 452. After the end of the chip capacitor in the thick plastic plate 93 is against the upper surface of the leveling platform 452, the end of the chip capacitor is flush with the surface, thus completing the leveling action.

[0054] It should be noted that the thick rubber sheet 93, after completing the leveling action, can be conveyed to the unloading end of the leveling conveyor 41 by the pallet 413, which is not limited here. The guide plate recycling device used in this solution can be a robot for conveying the guide plate to the guide plate storage rack, and the output end of the robot is equipped with a gripper or suction cup for moving the guide plate 92, which is not limited here.

[0055] To further explain, the leveling fixture 451 includes a leveling mounting base 4511 and a fixture assembly. The leveling mounting base 4511 is mounted directly above the conveyor frame 411 and can move up and down relative to the conveyor frame 411. Two sets of fixture assemblies are provided, and the two sets of fixture assemblies are arranged opposite each other on the bottom sides of the leveling mounting base 4511. The fixture assembly is used to clamp the thick rubber plate 93.

[0056] The clamping assembly includes a horizontal extension cylinder 4512, a bottom extension cylinder 4513, and a clamping piece 4514;

[0057] The horizontal extension cylinder 4512 is installed on the edge of the leveling mounting base 4511, and the output end of the horizontal extension cylinder 4512 can be away from and close to the center of the leveling mounting base 4511.

[0058] The output end of the horizontal extension cylinder 4512 is equipped with the bottom extension cylinder 4513, and the output end of the bottom extension cylinder 4513 can move up and down relative to the leveling mounting base 4511.

[0059] The clamp 4514 is installed at the output end of the bottom protruding cylinder 4513.

[0060] In a preferred embodiment of this technical solution, the leveling fixture 451 includes a leveling mounting base 4511 and two sets of fixture assemblies for clamping the thick rubber sheet 93. The fixture assembly includes a horizontal extension cylinder 4512 and a bottom extension cylinder 4513, which respectively enable horizontal and vertical movement of the clamping piece 4514. These two driving structures allow the fixture assembly to flexibly and effectively clamp the heavy thick rubber sheet 93, ensuring the stable operation of the leveling mechanism.

[0061] To further explain, the flipping device 44 includes two sets of flipping components arranged opposite each other in the horizontal direction, and the two sets of flipping components are respectively mounted on both sides of the conveyor frame 411;

[0062] The flipping assembly includes a flipping mounting bracket 441, a lateral extension cylinder 442, a flipping motor 443, and a flipping gripper 444;

[0063] The lateral extension cylinder 442 is detachably mounted to the conveyor frame 411 via the flip mounting bracket 441;

[0064] The output end of the lateral extension cylinder 442 can be away from and close to the center of the conveyor frame 411, and the output end of the lateral extension cylinder 442 is equipped with the flipping motor 443;

[0065] The output end of the flipping motor 443 is mounted on the flipping gripper 444 for holding the thick rubber plate 93, and the flipping gripper 444 rotates relative to the conveyor frame 411 via the flipping motor 443.

[0066] In another preferred embodiment of this technical solution, the flipping device 44 includes two sets of flipping assemblies for clamping the thick plastic sheet 93. Each flipping assembly includes a lateral extension cylinder 442 and a flipping motor 443, which respectively enable the flipping gripper 444 to move horizontally and rotate. These two driving structures allow the flipping assembly to flexibly and effectively clamp and flip the heavy thick plastic sheet 93, ensuring the stable operation of the leveling mechanism.

[0067] Furthermore, the leveling and conveying device 42 also includes a discharge tray 413, which is horizontally movably mounted on the top of the conveyor frame 411 and is located in front of the conveying tray 412.

[0068] In a preferred embodiment of this technical solution, the thick rubber sheet 93 after the leveling action is completed can be conveyed to the unloading end of the leveling conveyor 41 by the unloading pallet 413, so that the leveling mechanism can level the next thick rubber sheet 93 by using the conveyor pallet 412 while unloading after leveling, so as to improve the leveling efficiency of the leveling mechanism.

[0069] To further explain, both the upper surface of the conveying pallet 412 and the upper surface of the unloading pallet 413 are provided with a plurality of support blocks 414, and the plurality of support blocks 414 are used to support the thick rubber plate 93.

[0070] This facilitates the positioning and conveying of the thick rubber plate 93, and also makes it easier for other devices to clamp the thick rubber plate 93.

[0071] Furthermore, it also includes a cleaning device 46, which is located between the flipping device 44 and the leveling device 45;

[0072] The cleaning device 46 includes an upper roller brush 461, a lower roller brush 462, and a product receiving tray 463;

[0073] The upper roller brush 461 is disposed above the conveyor frame 411 and is used to clean the upper surface of the thick rubber sheet 93; the lower roller brush 462 is disposed below the conveyor frame 411 and is used to clean the lower surface of the thick rubber sheet 93.

[0074] The product receiving tray 463 is located directly below the upper roller brush 461 and the lower roller brush 462.

[0075] To further ensure the smooth progress of the leveling step, this solution also adds a cleaning device 46 between the flipping device 44 and the leveling device 45 for cleaning the upper and lower surfaces of the thick adhesive plate 93, thereby preventing abnormal products or impurities remaining on the upper and lower surfaces of the thick adhesive plate 93 from affecting the flushing of the chip capacitor ends.

[0076] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0077] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0078] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0079] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0080] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0081] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.

[0082] The technical principles of this utility model have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this utility model without any inventive effort, and these embodiments will all fall within the scope of protection of this utility model.

Claims

1. A surface mount capacitor leveling mechanism based on a thick adhesive plate, characterized in that: It includes a leveling conveyor, a lifting platform, a feeding belt, a tilting device, a guide plate recycling device, and a leveling device; The leveling and conveying device includes a conveyor frame and a conveyor tray. The conveyor tray is horizontally movably mounted on top of the conveyor frame and is used to hold thick rubber sheets. The lifting platform, the feeding belt, the tilting device, and the guide plate recycling device are arranged in a top-to-bottom arrangement at the feeding end of the conveyor frame, with the lifting platform and the feeding belt located at the inner bottom of the conveyor frame, and the tilting device and the guide plate recycling device located at the top of the conveyor frame. The lifting platform can move up and down relative to the feeding belt and the tilting device, and the lifting platform can pass through the conveying surface of the feeding belt and the leveling conveying device; the conveying pallet is U-shaped, and an avoidance opening is provided in the middle of the conveying pallet, and the avoidance opening is used to avoid the lifting platform; The leveling device is located in front of the flipping device, and the leveling device includes a leveling clamp and a leveling platform arranged opposite each other in the vertical direction. The leveling clamp is located above the conveyor frame and can move up and down relative to the conveyor frame. The leveling platform is located below the conveyor frame. The leveling clamp is used to clamp the thick rubber sheet.

2. The chip capacitor leveling mechanism based on a thick adhesive plate according to claim 1, characterized in that: The leveling fixture includes a leveling mounting base and a clamping assembly. The leveling mounting base is mounted directly above the conveyor frame and can move up and down relative to the conveyor frame. Two sets of clamping assemblies are provided, and the two sets of clamping assemblies are arranged opposite each other on the bottom sides of the leveling mounting base. The clamping assemblies are used to clamp thick rubber sheets. The clamping assembly includes a horizontal extension cylinder, a bottom extension cylinder, and clamping plates; The horizontal extension cylinder is installed on the edge of the leveling mounting base, and the output end of the horizontal extension cylinder can be far away from and close to the center of the leveling mounting base; The output end of the horizontal extension cylinder is equipped with the bottom extension cylinder, and the output end of the bottom extension cylinder can move up and down relative to the leveling mounting base. The clamp is installed at the output end of the bottom protruding cylinder.

3. The chip capacitor leveling mechanism based on a thick adhesive plate according to claim 1, characterized in that: The flipping device includes two sets of flipping components arranged opposite each other in the horizontal direction, and the two sets of flipping components are respectively mounted on both sides of the conveyor frame; The flipping assembly includes a flipping mounting bracket, a lateral extension cylinder, a flipping motor, and a flipping gripper; The lateral extension cylinder is detachably mounted to the conveyor frame via the flip mounting bracket; The output end of the lateral extension cylinder can be located away from or near the center of the conveyor frame, and the tilting motor is installed at the output end of the lateral extension cylinder; The output end of the flipping motor is mounted on the flipping gripper used to hold the thick rubber plate, and the flipping gripper rotates relative to the conveyor frame via the flipping motor.

4. The chip capacitor leveling mechanism based on a thick adhesive plate according to claim 1, characterized in that: The leveling and conveying device also includes a discharge tray, which is horizontally movably mounted on the top of the conveyor frame and located in front of the conveying tray.

5. A chip capacitor leveling mechanism based on a thick adhesive plate according to claim 4, characterized in that: Both the upper surface of the conveying pallet and the upper surface of the unloading pallet are provided with multiple support blocks, and the multiple support blocks are used to support the thick rubber sheet.

6. The chip capacitor leveling mechanism based on a thick adhesive plate according to claim 1, characterized in that: It also includes a cleaning device, which is located between the flipping device and the leveling device; The cleaning device includes an upper roller brush, a lower roller brush, and a product receiving tray; The upper roller brush is positioned above the conveyor frame and is used to clean the upper surface of the thick rubber sheet; the lower roller brush is positioned below the conveyor frame and is used to clean the lower surface of the thick rubber sheet. The product receiving tray is located directly below the upper roller brush and the lower roller brush.

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