Power supply water cooling plate and power supply

Abstract

The utility model relates to a power supply water cooling plate and a power supply. The power supply water cooling plate comprises a substrate and a cover plate. The substrate comprises a first substrate and a second substrate which is formed by bending downwards along the length direction of the first substrate; a first water inlet groove and a first water outlet groove are formed in the first substrate; a second water inlet groove communicated with the first water inlet groove and a second water outlet groove communicated with the first water outlet groove are formed in the second substrate; the cover plate comprises a first cover plate and a second cover plate which is formed by bending downwards along the length direction of the first cover plate; the first cover plate is fixedly connected with the first substrate, and the second cover plate is fixedly connected with the second substrate; a plurality of pits are formed in the mounting surface of the first substrate fixedly connected with the first cover plate, or a plurality of pits are formed in the mounting surface of the second substrate fixedly connected with the second cover plate. The heat dissipation capability is improved by arranging the water tanks in the first substrate and the second substrate, and a plurality of pits are formed in the mounting surface of the first substrate or the second substrate, so that welding flux is uniformly distributed, and the welding yield is improved.

Description

Technical Field

[0001] This utility model relates to the field of liquid cooling technology, and in particular to a power supply water cooling plate and a power supply. Background Technology

[0002] In the field of liquid cooling, continuous soldering is a common connection method. It typically involves applying solder paste to the soldering surfaces and then heating the surfaces at high temperatures to achieve the connection. This process performs well in single-sided soldering, but it has significant limitations in practical applications, especially in multi-sided soldering.

[0003] In multi-faceted welding, the welding direction extends from the horizontal to the vertical. At high temperatures, the paste-like solder, influenced by gravity, flows towards the bottom in the vertical direction and accumulates, resulting in uneven solder distribution. This uneven distribution significantly increases the weld defect rate, affecting the sealing performance and mechanical strength of the weld joint. For example, when welding L-shaped water-cooled plates, uneven solder distribution on the vertical surface of the plate may lead to insufficient local weld strength, subsequently causing leakage or structural failure. Furthermore, the available welding processes are very limited when welding L-shaped water-cooled plates due to constraints such as the location and volume of the water-cooling joint and the magnitude of flow resistance.

[0004] For multi-sided welding, existing technologies typically require a preliminary welding process without solder, followed by the application of solder for a secondary welding. This step-by-step welding process is not only inefficient and costly, but may also introduce additional thermal stress, affecting weld quality.

[0005] Therefore, the existing continuous welding process has obvious shortcomings in multi-face welding, especially in terms of solder uniformity and welding quality, while the existing distributed welding process also has shortcomings in multi-face welding, especially in terms of efficiency and cost.

[0006] To address the problem of uneven solder distribution and high failure rate caused by the flow of solder under gravity at high temperatures during continuous welding of power supply water-cooled plates, the industry urgently needs to develop a new type of power supply water-cooled plate and power supply. Utility Model Content

[0007] The aforementioned issue addresses the problem that the solder used in continuous welding of power supply water-cooled plates is affected by gravity at high temperatures, causing solder to accumulate at the bottom of the vertical surface, resulting in uneven solder distribution and a high rate of welding defects.

[0008] This utility model provides a power supply water-cooled plate, comprising: a base plate and a cover plate;

[0009] The substrate includes a first substrate and a second substrate formed by bending downward along the length of the first substrate; the first substrate has a first water inlet groove and a first water outlet groove; the second substrate has a second water inlet groove communicating with the first water inlet groove and a second water outlet groove communicating with the first water outlet groove.

[0010] The cover plate includes a first cover plate and a second cover plate formed by bending downward along the length of the first cover plate; the first cover plate is fixedly connected to the first substrate, and the second cover plate is fixedly connected to the second substrate.

[0011] The mounting surface of the first substrate, which is fixedly connected to the first cover plate, is provided with multiple recesses, or the mounting surface of the second substrate, which is fixedly connected to the second cover plate, is provided with multiple recesses.

[0012] Optionally, the bottom of the first substrate is provided with a first water channel partition, and the first water channel partition and the two opposite sidewalls of the first substrate form the first water inlet groove and the first water outlet groove.

[0013] Optionally, one end of the first water channel spacer is flush with one end of the first substrate.

[0014] Optionally, the bottom of the first substrate is further provided with a second water channel partition, which is used to divide the first water inlet tank into two or the first water outlet tank into two.

[0015] Optionally, the second water inlet channel is provided with a water inlet at its top end, and the second water outlet channel is provided with a water outlet at its top end.

[0016] Optionally, the second cover plate has two openings, which correspond one-to-one with the water inlet and the water outlet, respectively.

[0017] Optionally, the power supply water-cooled plate further includes two connectors, which are connected to the water inlet and the water outlet respectively through the two openings.

[0018] Optionally, the substrate further includes a third substrate and a fourth substrate formed by bending downward along the length of the third substrate, wherein one end of the fourth substrate away from the third substrate is connected to one end of the second substrate.

[0019] Optionally, the sidewall of the first substrate is provided with a step, and the first cover plate is fixedly connected to the step.

[0020] Optionally, the width of the second substrate is smaller than the width of the first substrate.

[0021] Optionally, the first cover plate has a protrusion at one end near the second cover plate, and the end of the protrusion is flush with one side wall of the first substrate.

[0022] This application also provides a power supply, including:

[0023] Power module;

[0024] As described above, the power supply water cooling plate is disposed on two adjacent sides of the power module.

[0025] The beneficial effects of this application include at least the following:

[0026] In the above technical solution, the power supply water-cooled plate provided in this embodiment includes a substrate and a cover plate; the substrate includes a first substrate and a second substrate formed by bending downward along the length direction of the first substrate; the first substrate has a first water inlet groove and a first water outlet groove; the second substrate has a second water inlet groove communicating with the first water inlet groove and a second water outlet groove connected to the first water outlet groove; the cover plate includes a first cover plate and a second cover plate formed by bending downward along the length direction of the first cover plate; the first cover plate is fixedly connected to the first substrate, and the second cover plate is fixedly connected to the second substrate; multiple recesses are formed on the mounting surface of the first substrate fixedly connected to the first cover plate, or multiple recesses are formed on the mounting surface of the second substrate fixedly connected to the second cover plate. The heat dissipation capacity is improved by providing water inlet grooves and water outlet grooves in both the first substrate and the second substrate, and the multiple recesses on the mounting surface of the first substrate fixedly connected to the first cover plate, or the multiple recesses on the mounting surface of the second substrate fixedly connected to the second cover plate, enable the solder to be evenly distributed on the corresponding mounting surface, improving the soldering yield.

[0027] The features and technical advantages of this application have been broadly outlined above to facilitate a better understanding of the following detailed description. Additional features and advantages of this application, which form the subject matter of the claims, will be described below. Those skilled in the art will understand that the disclosed concepts and specific embodiments can be readily utilized as the basis for modifying or designing other structures or processes to achieve the same purpose as this application. Those skilled in the art will also recognize that such equivalent constructions do not depart from the spirit and scope of this application as set forth in the appended claims. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the substrate of the power supply water-cooling plate in this utility model;

[0029] Figure 2 This is a schematic diagram of the cover plate of the power supply water-cooling plate in this utility model;

[0030] Figure 3 This is a schematic diagram of the power supply water-cooled plate in this utility model;

[0031] Figure 4 yes Figure 1A schematic diagram of the side of the middle substrate;

[0032] Figure 5 yes Figure 1 A schematic diagram of the front side of the substrate;

[0033] Figure 6 This is an exploded view of the power supply section structure in this utility model;

[0034] Figure 7 This is a schematic diagram of the power supply section structure in this utility model. Detailed Implementation

[0035] The technical solutions of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0036] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are used only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0037] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0038] Furthermore, to better illustrate this utility model, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this utility model can be implemented even without certain specific details. In some instances, methods, means, components, and circuits well-known to those skilled in the art have not been described in detail, in order to highlight the main points of this utility model.

[0039] Server power supplies are high-efficiency, high-reliability power devices specifically designed for servers to provide stable power to components such as the CPU, memory, hard drives, and fans. Server power supply design typically needs to meet requirements such as high power demands, redundancy, hot-swapping capabilities, and efficient heat dissipation to ensure stable and efficient server operation.

[0040] Liquid cooling utilizes the high thermal conductivity of liquids to rapidly remove heat, making it suitable for server power supplies. Specifically, server power supplies generate a significant amount of heat during operation. The liquid, through a water-cooled plate, indirectly contacts the heat-generating components, absorbing the heat and then releasing it through a cooling tower or condenser, effectively reducing the temperature and ensuring stable operation of the server power supply.

[0041] In server power supplies, the water-cooled plate is installed and fixed on the side of the power supply, which can directly contact the heat-generating components. The heat is quickly conducted through the coolant, thereby achieving efficient heat dissipation. It can also prevent the coolant from directly contacting critical electronic components, reducing the risk of damage to the equipment caused by leakage. It can also prevent coolant leakage due to vibration or improper installation. In addition, it is easy to disassemble and maintain, reducing maintenance costs and time.

[0042] Installing a water-cooled plate on one side of the server power supply may not meet the cooling requirements, necessitating the installation of water-cooled plates on both sides. However, installing two separate water-cooled plates on the left and right sides of the power supply increases the number of manufacturing steps and makes the process more difficult. Therefore, this invention provides a novel power supply water-cooled plate that effectively meets the cooling requirements of the server power supply.

[0043] Figure 1 This is a schematic diagram of the substrate of the power supply water-cooling plate in this utility model. Figure 2 This is a schematic diagram of the cover plate of the power supply water cooling plate in this utility model. Figure 3 This is a schematic diagram of the power supply water-cooled plate in this utility model. Figure 4 yes Figure 1 A schematic diagram of the side of the middle substrate. Figure 5 yes Figure 1 A schematic diagram of the front side of the substrate. (Combined with...) Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5The power supply water-cooling plate includes a substrate 1 and a cover plate 2. The substrate 11 includes a first substrate 11 and a second substrate 12 formed by bending downwards along the length of the first substrate 11. The first substrate 11 and the second substrate 12 form an L-shaped structure; for example, the L-shaped structure is integrally formed from a profile, resulting in lower costs. The first substrate 11 has a first water inlet channel 113 and a first water outlet channel 117, with their tails connected. The second substrate 12 has a second water inlet channel 125 communicating with the first water inlet channel 113 and a second water outlet channel 123 communicating with the first water outlet channel 117. The cover plate 2 includes a first cover plate 21 and a second cover plate 22 formed by bending downwards along the length of the first cover plate 21. The first cover plate 21 and the second cover plate 22 form an L-shaped structure; for example, the L-shaped structure is integrally formed from a profile, resulting in lower costs. The first cover plate 21 is fixedly connected to the first substrate 11, and the second cover plate 22 is fixedly connected to the second substrate 12. Multiple recesses are formed on the mounting surface of the first substrate 11, which is fixedly connected to the first cover plate 21. Similarly, multiple recesses 122 are formed on the mounting surface of the second substrate 12, which is fixedly connected to the second cover plate 22. In this embodiment, the positions of the first water inlet and the first water outlet in the first substrate 11 can be interchanged as needed, and the corresponding positions of the second water inlet and the second water outlet in the second substrate 12 can also be interchanged as needed, without limitation. The presence of water inlets and outlets in both the first substrate 11 and the second substrate 12 enhances heat dissipation. Furthermore, the presence of multiple recesses 122 on the mounting surface of either the first substrate 11 (fixedly connected to the first cover plate 21) or the second substrate 12 (fixedly connected to the second cover plate 22) allows for uniform distribution of solder on the respective mounting surfaces, improving soldering yield.

[0044] In other embodiments, the first substrate 11 and the second substrate 12 may be formed by welding or other mechanical processes connecting two independent profiles, and the first cover plate 21 and the second cover plate 22 may also be formed by welding or other mechanical processes connecting two independent profiles, without specific limitations.

[0045] like Figure 1 and 4As shown, a region for fixing and connecting the first cover plate 21 is formed on the surface of the first substrate 11. A cooling cavity is provided inside the region, and the cooling cavity has a U-shaped structure. The end of the cooling cavity near the second substrate 12 is open, i.e., it does not have a sidewall. The three sidewalls of the first substrate 11 are provided with the steps 116 to facilitate the fixing and connection of the first cover plate 21. After the first cover plate 21 is fixedly connected to the first substrate 11, the upper surface of the first cover plate 21 is flush with the top of the first substrate 11.

[0046] A first water channel partition 114 is provided at the bottom of the first substrate 11. The first water channel partition 114 is located within the cooling cavity and parallel to the sidewall of the first substrate 11 along its length. The first water channel partition 114 and two opposing sidewalls of the first substrate 11 form the first water inlet groove 113 and the first water outlet groove 117. Specifically, the water inlet groove and the water outlet groove are milled out using a machining process, such that the water inlet groove and the water outlet groove are separated by an unmilled portion, which is the first water channel partition 114.

[0047] One end of the first water channel partition 114 is close to one end of the first substrate and has a predetermined distance from the side wall of the cooling chamber, wherein one end of the first substrate 11 is far away from the second substrate 12; the other end of the first water channel partition 114 extends to be flush with the other end of the first substrate 11, wherein the other end of the first substrate 11 is connected to the second substrate 12, which can effectively separate the inlet and outlet of water and effectively achieve heat dissipation.

[0048] The bottom of the first substrate 11 is also provided with a second water channel partition 115 parallel to the first water channel isolation 114, which is used to divide the first water inlet tank into two or the first water outlet tank into two. Dividing the first water inlet tank or the first water outlet tank into two by the second water channel partition 115 increases the heat dissipation area and helps to improve heat dissipation capacity. Specifically, when milling the water inlet tank or the water outlet tank by machining process, multiple water inlet tanks or multiple water outlet tanks can be milled, so that the multiple water inlet tanks or multiple water outlet tanks are separated by the unmilled part, which is the second water channel partition 115.

[0049] Two grooves 111 and 112 are provided on the upper surface of the sidewall of the first substrate 11 to facilitate the installation with two protrusions provided on other components during use, making the structure more compact.

[0050] like Figure 1 and 5 As shown, the top of the second water inlet tank 125 is provided with a water inlet 124, and the top of the second water outlet tank 123 is provided with a water outlet 121. In this embodiment, the positions of the water inlet and the water outlet can be interchanged as needed, and there is no limitation here.

[0051] The coolant is injected into the second inlet tank through the inlet, and after passing through the first inlet tank, the first outlet tank, and the second outlet tank, it returns to the cooling system through the outlet. This allows the heat dissipated by the heat-generating components to be carried to the outside of the power supply by the coolant, thereby reducing the temperature.

[0052] Multiple recesses 122 are formed on the mounting surface of the second substrate 12. Specifically, the mounting surface of the second substrate 12 is the surface formed by the sidewall of the second water inlet tank and the upper surface of the sidewall of the second water outlet tank. By forming multiple recesses 122 on the mounting surface of the second substrate 12, during soldering, when the second substrate 12 is in a vertical state, the solder will remain in the recesses 122. Utilizing the surface tension of the recesses, the solder is difficult to flow downwards, thus improving the soldering quality. In other suitable embodiments, multiple recesses are formed on the mounting surface of the first substrate 11. For example, the mounting surface of the first substrate is the surface formed by the step 116, the upper surface of the first water channel spacer 114, and / or the second water channel spacer 115. Utilizing the surface tension of the recesses, the solder is difficult to flow downwards, thus improving the soldering quality. Whether to create multiple recesses on the mounting surface of the first substrate or the mounting surface of the second substrate depends on whether the first substrate or the second substrate is placed vertically during the soldering process. If the first substrate is placed vertically, multiple recesses need to be created on the mounting surface of the first substrate; if the second substrate is placed vertically, multiple recesses need to be created on the mounting surface of the second substrate.

[0053] The width of the second substrate 12 is smaller than the width of the first substrate 11, so that the connecting components in the power module can be placed in the area of ​​the width difference between the second substrate 12 and the first substrate 11 during subsequent power supply assembly.

[0054] The substrate 1 further includes a third substrate 13 and a fourth substrate 14 formed by bending the third substrate 13 downwards along its length. One end of the fourth substrate 14 away from the third substrate 13 is connected to one end of the second substrate 12. The third substrate 13 and the fourth substrate 14 form an L-shaped structure. Specifically, the fourth substrate 14 and the first substrate 11 are located at opposite ends of the second substrate 12, with the fourth substrate 14 closer to the mounting surface of the second substrate 12 and the first substrate 11 farther from the mounting surface of the second substrate 12. The third substrate 13 and the second substrate 12 are located at opposite ends of the fourth substrate 14 and on both sides of the fourth substrate 14. In this embodiment, the fourth substrate 14 can be formed by bending along the length of the second substrate 12, and the third substrate 13 can be formed by bending along the width of the fourth substrate 14. The first substrate 11, the second substrate 12, the third substrate 13, and the fourth substrate 14 are integrally formed from a profile, forming a double L-shaped structure, which helps to reduce costs.

[0055] The third substrate 13 has a notch on its side wall.

[0056] like Figure 2 The first cover plate 21 has a protrusion 23 at one end, and the height of the protrusion 23 is equal to the width difference between the first substrate 11 and the second substrate 12.

[0057] The thickness of the first cover plate 21 is the same as the height between the top of the first step and the top of the first substrate, so that after the first cover plate 21 is fixedly connected to the first substrate 11, the top of the first cover plate 21 and the top of the first substrate 11 are located on the same plane.

[0058] The second cover plate 22 is provided with two openings 24 and 25, the positions of which correspond one-to-one with the water inlet 124 and water outlet 121 on the second substrate 12.

[0059] The thickness of the second cover plate 22 is equal to the width of the fourth substrate 14, where the width of the fourth substrate 14 is the distance between the second substrate 12 and the third substrate 13. When the second cover plate 22 is fixedly connected to the second substrate 12, the second cover plate 22 and the third substrate 13 are on the same plane.

[0060] like Figure 3 As shown, the first cover plate 21 is fixedly connected to the first substrate 11, for example, by welding the first cover plate and the mounting surface of the first substrate together by continuous welding; the second cover plate 22 is fixedly connected to the second substrate 12, for example, by welding the second cover plate and the mounting surface of the second substrate together by continuous welding, so as to form a power supply water cooling plate.

[0061] The end of the protrusion 23 on the first cover plate 21 is flush with the side wall of the first substrate 11.

[0062] In this embodiment, when the cover plate is welded to the substrate, the first substrate 11 can be placed horizontally, so that the second substrate 12 is vertically downward. When the power supply water-cooled plate passes through the tunnel furnace once, the solder will melt. By opening multiple pits 122 on the mounting surface of the second substrate 12, the solder will remain in the pits. Utilizing the surface tension of the pits, the solder is difficult to flow downward, thus improving the welding quality.

[0063] Figure 6 This is an exploded view of the power supply section structure in this utility model. Figure 7 This is a schematic diagram of the power supply section structure in this utility model. (See diagram below.) Figure 1 , Figure 3 , Figure 6 and Figure 7 As shown, the power supply water cooling plate also includes two connectors 41 and 42. One end of the two connectors 41 and 42 passes through two openings 24 and 25 respectively and is connected to the water inlet and water outlet. The other end of the two connectors 41 and 42 is connected to the cooling system respectively.

[0064] The present invention also provides a power supply, including a power module and the aforementioned power supply water-cooling plate. The power supply water-cooling plate is disposed on two connected sides of the power module and close to components of the power module that generate significant heat, for dissipating heat from these components to the outside of the power supply through heat exchange. The power supply also includes two side plates and a top cover plate 3. The two side plates are disposed on two adjacent sides of the power module, and the top cover plate 3 is disposed on top of the power module.

[0065] In this embodiment, the first substrate, second substrate, third substrate, and fourth substrate of the power supply water-cooled plate are integrally formed from profiles to form a double L-shaped structure, which helps to reduce costs. The water inlet and outlet grooves on the first and second substrates can meet both the server height requirements and the heat dissipation requirements. In addition, multiple pits can be made on the vertically placed substrates. When the cover plate is welded to the substrate, the solder melts when the power supply water-cooled plate passes through the tunnel furnace once, so that the solder remains in the pits. Utilizing the surface tension of the pits, the solder is difficult to flow downwards, thus improving the welding quality.

[0066] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A power supply water-cooled plate, characterized in that, include: Substrate (1) and cover plate (2); The substrate (1) includes a first substrate (11) and a second substrate (12) formed by bending downward along the length direction of the first substrate (11); the first substrate (11) is provided with a first water inlet groove and a first water outlet groove; the second substrate (12) is provided with a second water inlet groove communicating with the first water inlet groove and a second water outlet groove communicating with the first water outlet groove. The cover plate (2) includes a first cover plate (21) and a second cover plate (22) formed by bending downward along the length direction of the first cover plate (21); the first cover plate (21) is fixedly connected to the first substrate (11), and the second cover plate (22) is fixedly connected to the second substrate (12); The mounting surface of the first substrate (11) which is fixedly connected to the first cover plate (21) is provided with a plurality of recesses, or the mounting surface of the second substrate (12) which is fixedly connected to the second cover plate (22) is provided with a plurality of recesses (122).

2. The power supply water-cooled plate according to claim 1, characterized in that, The bottom of the first substrate (11) is provided with a first water channel partition (114), and the first water inlet groove and the first water outlet groove are formed between the first water channel partition (114) and two opposite side walls of the first substrate (11).

3. The power supply water-cooled plate according to claim 2, characterized in that, One end of the first water channel partition (114) is flush with one end of the first substrate (11).

4. The power supply water-cooled plate according to claim 2, characterized in that, The bottom of the first substrate (11) is also provided with a second water channel partition (115), which is used to divide the first water inlet tank into two or the first water outlet tank into two.

5. The power supply water-cooled plate according to claim 1, characterized in that, The second water inlet tank has an inlet at its top, and the second water outlet tank has an outlet at its top.

6. The power supply water-cooled plate according to claim 5, characterized in that, The second cover plate (22) has two openings, which correspond one-to-one with the water inlet and the water outlet, respectively.

7. The power supply water-cooled plate according to claim 6, characterized in that, The power supply water-cooled plate also includes two connectors, which are connected to the water inlet and the water outlet respectively through the two openings.

8. The power supply water-cooled plate according to claim 1, characterized in that, The substrate (1) further includes a third substrate (13) and a fourth substrate (14) formed by bending downward along the length direction of the third substrate (13), wherein one end of the fourth substrate (14) away from the third substrate (13) is connected to one end of the second substrate (12).

9. The power supply water-cooled plate according to claim 1, characterized in that, The first substrate (11) has a step (116) on its side wall, and the first cover plate (21) is fixedly connected to the step (116).

10. The power supply water-cooled plate according to claim 1, characterized in that, The width of the second substrate (12) is smaller than the width of the first substrate (11).

11. The power supply water-cooled plate according to claim 1, characterized in that, The first cover plate (21) has a protrusion at one end near the second cover plate (22), and the end of the protrusion is flush with one side wall of the first substrate (11).

12. A power supply, characterized in that, include: Power module; The power supply water-cooled plate as described in any one of claims 1-11; The power supply water cooling plate is located on two adjacent sides of the power supply module.

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