Four-wafer LED packaging structure

Abstract

The utility model discloses a four-wafer LED packaging structure which comprises a common-pole support, four control supports, four LED chips, a protective fence, a plurality of wires and an injection molding shell. Wherein the first die bonding area and the second die bonding area are arranged on the common-pole support, and the four control supports are provided with a third die bonding area and a fourth die bonding area; furthermore, after the four LED chips are respectively arranged on the four die bonding areas, the four LED chips are respectively connected with the common-pole support and the corresponding control supports through wires, and the adjacent die bonding areas are isolated through protective fences. The technical problems that in the prior art, when a multi-wafer LED is packaged, LED chips with different color temperatures are not effectively isolated, mutual interference is easily caused when different wafers are electrified, or humid gas is easily attached to the surfaces of the wafers in a humid environment, and an LED lamp cannot work normally or even is damaged are solved.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging technology, and in particular to a four-chip LED packaging structure. Background Technology

[0002] With the development of LED lighting technology, various types of LED packaging structures have emerged in the market to meet the lighting requirements of different scenarios. Among them, in order to meet users' multi-color temperature lighting needs, it is often necessary to set multiple color temperature LED chips in the LED lamp. In related technologies, when packaging multi-chip LEDs, multiple chips are usually simply fixed on the die bond area without effective isolation between LED chips of different color temperatures. This can easily lead to mutual interference when different chips are powered on, and in humid environments or after a period of use, moisture can easily adhere to the chip surface, causing the LED lamp to malfunction or even be damaged.

[0003] Therefore, how to improve the structure of multi-chip LED packaging to prevent electrical interference and moisture gas adhesion has become a technical problem that needs to be solved by those skilled in the art. Utility Model Content

[0004] This invention proposes a four-chip LED packaging structure to solve the technical problems of power-on interference and short service life caused by moisture adhering to the chips in multi-chip LED lamps in related technologies.

[0005] This utility model discloses a four-chip LED packaging structure, which includes:

[0006] A common electrode support, wherein a first die-bonding region and a second die-bonding region are provided on the common electrode support;

[0007] Four control supports, each equipped with a third and a fourth die-bonding zone;

[0008] Four LED chips are respectively fixed on the first die-bonding area, the second die-bonding area, the third die-bonding area, and the fourth die-bonding area;

[0009] The four LED chips are respectively connected to the common electrode bracket and the control bracket via multiple wires;

[0010] A protective fence is used to isolate adjacent die-bonding areas among the first die-bonding area, the second die-bonding area, the third die-bonding area, and the fourth die-bonding area.

[0011] The injection-molded housing is used to wrap and fix the common pole bracket, the four control brackets, and the protective fence respectively, and the common pole bracket and the four control brackets extend out of the injection-molded housing to form wiring pins.

[0012] The four-chip LED packaging structure of this utility model embodiment has at least the following beneficial effects:

[0013] This utility model discloses a four-chip LED packaging structure, including a common electrode support, four control supports, four LED chips, four die-bonding areas, a protective enclosure, multiple wires, and an injection-molded housing. The first and second die-bonding areas are disposed on the common electrode support, and the four control supports have a third and a fourth die-bonding area. After the four LED chips are respectively placed on the four die-bonding areas, the four LED chips are connected to the common electrode support and the corresponding control supports via wires. Adjacent die-bonding areas are isolated by the protective enclosure. Finally, the injection-molded housing encapsulates and fixes the common electrode support, the four control supports, and the protective enclosure, with the common electrode support and the four control supports extending out of the injection-molded housing to form wiring pins. This solves the technical problem in related technologies where multi-chip LED packaging fails to effectively isolate LED chips of different color temperatures, which can easily lead to mutual interference when different chips are powered on, or allow humid gases to easily adhere to the chip surface in humid environments, causing the LED to malfunction or even be damaged. This provides a four-chip LED packaging structure that effectively avoids power-on interference and offers stable performance.

[0014] According to other embodiments of the present invention, the four-chip LED packaging structure includes a first control bracket, a second control bracket, a third control bracket, and a fourth control bracket; and the four LED chips include a first LED chip, a second LED chip, a third LED chip, and a fourth LED chip.

[0015] The first LED chip is fixed in the first die bonding area, and the first LED chip forms a power-conducting branch with the first control bracket and the common electrode bracket through the wire;

[0016] The second LED chip is fixed in the second die bonding area, and the second LED chip forms a power-conducting branch with the third control bracket and the common electrode bracket through the wire;

[0017] The third LED chip is fixed to the third die-bonding region, and the third LED chip forms a power-conducting branch with the second control bracket and the common electrode bracket through the wire;

[0018] The fourth LED chip is fixed to the fourth die-bonding region, and the fourth LED chip forms a power-conducting branch with the fourth control bracket and the common electrode bracket through the wire.

[0019] According to other embodiments of the present invention, in the four-chip LED packaging structure, the protective fence isolates adjacent die-bonding areas among the first die-bonding area, the second die-bonding area, the third die-bonding area, and the fourth die-bonding area in a crisscross manner.

[0020] According to other embodiments of the present invention, the four-chip LED packaging structure includes a first horizontal protective fence, a second horizontal protective fence, a third horizontal protective fence, a first vertical protective fence, a second vertical protective fence, a third vertical protective fence, and a fourth vertical protective fence.

[0021] The first transverse protective fence is used to isolate the first die-bonding area and the third die-bonding area, and the first longitudinal protective fence is used to isolate the first control bracket from the common electrode bracket;

[0022] The second transverse protective fence is used to isolate the second die-bonding area and the third die-bonding area, and the second longitudinal protective fence is used to isolate the second control bracket from the common electrode bracket;

[0023] The third transverse protective fence is used to isolate the second die-bonding area and the fourth die-bonding area, and the third longitudinal protective fence is used to isolate the third control bracket and the common electrode bracket;

[0024] The fourth longitudinal protective fence is used to isolate the fourth control from the common pole support.

[0025] According to other embodiments of the present invention, in a four-chip LED packaging structure, the plurality of said wires include a plurality of arc-shaped gold wires;

[0026] The four LED chips are respectively connected to the common electrode bracket and the four control brackets via multiple arc-shaped gold wires.

[0027] According to other embodiments of the present invention, the protective fence is made of PPA material. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of a specific embodiment of the four-chip LED packaging structure of this utility model from a top view.

[0029] Figure 2 This is a schematic diagram of the positional structure of a specific embodiment of the four-chip LED packaging structure of this utility model, including four control brackets and four LED chips in a top view.

[0030] Figure 3This is a schematic diagram of the location structure of a protective fence in a top view of a four-chip LED packaging structure according to this utility model. Detailed Implementation

[0031] The following will describe the concept and technical effects of the utility model clearly and completely with reference to the embodiments, so as to fully understand the purpose, features and effects of the utility model. Obviously, the described embodiments are only some embodiments of the utility model, not all embodiments. Other embodiments obtained by those skilled in the art based on the embodiments of the utility model without creative effort are all within the protection scope of the utility model.

[0032] In the description of the embodiments of this utility model, the term "several" means one or more, and the term "multiple" means two or more. The terms "greater than," "less than," and "exceeding" should be understood as excluding the stated number, while the terms "above," "below," and "within" should be understood as including the stated number. The terms "first" and "second" should be understood as distinguishing technical features and not as indicating or implying relative importance, the number of indicated technical features, or the order of the indicated technical features.

[0033] Reference Figure 1This utility model embodiment provides a four-chip LED packaging structure, which includes a common electrode support 100, four control supports 200, four LED chips 300, multiple wires 400, a protective fence 500, and an injection-molded housing 600. The common electrode support 100 is provided with a first die-bonding area and a second die-bonding area, and the four control supports are provided with a third die-bonding area and a fourth die-bonding area. The four LED chips 300 are respectively fixed in the first die-bonding area to the fourth die-bonding area. After the four LED chips 300 are respectively fixed in the first die-bonding area, the second die-bonding area, the third die-bonding area, and the fourth die-bonding area, they are respectively connected to the common electrode support 100 and the corresponding control supports 200 through multiple wires 400. In this embodiment, a protective fence 500 is provided to isolate adjacent die-bonding areas among the first, second, third, and fourth die-bonding areas. Finally, an injection-molded housing 600 is used to wrap and fix the common electrode support 100, the four control supports 200, and the protective fence 500. The common electrode support 100 and the four control supports 200 all extend out of the injection-molded housing 600 to form wiring pins. These wiring pins are used for simple and quick wiring and fixing when installing and fixing the four-chip LED packaging structure proposed in this embodiment. In this embodiment, the protective fence 500 achieves physical isolation between die-bonding areas (i.e., between LED chips), thereby solving the technical problems of mutual interference when different chips are powered on, or the easy adhesion of humid gases to the chip surface in humid environments, causing the LED to malfunction or even be damaged.

[0034] Reference Figure 1 In practical applications, the common electrode bracket 100 also extends into the injection-molded housing 600 to form four wiring pins, which makes it easier and more efficient to fix and install the four-chip LED packaging structure proposed in this utility model embodiment.

[0035] Reference Figure 2In some embodiments, four control supports 200 are used to precisely control four LED chips. In this embodiment, the four control supports 200 include a first control support 210, a second control support 220, a third control support 230, and a fourth control support 240; the four LED chips include a first LED chip 310, a second LED chip 320, a third LED chip 330, and a fourth LED chip 340. In this embodiment, the first die-bonding region is disposed above the common electrode support 100 and is flush with the first control support 210; the second die-bonding region is disposed below the common electrode support 100 and is flush with the third control support 230; the third die-bonding region is disposed on the second control support 220; and the fourth die-bonding region is disposed on the fourth control support 240. Furthermore, after fixing the first LED chip 310 to the first die-bonding area and forming a power-carrying branch with the first control bracket 210 and the common electrode bracket 100 through wires 400, fixing the second LED chip 320 to the second die-bonding area and forming a power-carrying branch with the third control bracket 230 and the common electrode bracket 100 through wires 400, fixing the third LED chip 330 to the third die-bonding area and forming a power-carrying branch with the second control bracket 220 and the common electrode bracket 100 through wires 400, and fixing the fourth LED chip 340 to the fourth die-bonding area and forming a power-carrying branch with the fourth control bracket 210 and the common electrode bracket 100 through wires 400, the wiring positions between each LED chip and the control bracket 200 and the common electrode bracket 100 are relatively staggered and fixed, further reducing the technical problem of mutual interference when multiple LED chips are powered on. Moreover, the staggered die-bonding area structure gives the chip LED packaging structure of Embodiment 4 of this utility model a good aesthetic appearance.

[0036] Reference Figure 1 In some embodiments, to ensure the stable operation of the four LED chips and prevent the connecting wires from breaking due to heat during the injection molding process or use, in this embodiment, the multiple wires 400 include multiple curved gold wires. The multiple curved gold wires connect the first LED chip, the second LED chip, the third LED chip, and the fourth LED chip to the common electrode bracket 100 and the corresponding control bracket, respectively. The curved gold wires have good conductivity and toughness, thereby ensuring the stable operation of the four LED chips.

[0037] Reference Figure 1 and Figure 2 In some embodiments, in order to reduce the production cost and improve the aesthetics of the LED chip packaging structure of Embodiment 4 of this utility model, in this embodiment, the protective fence 500 isolates adjacent die-bonding areas in the first die-bonding area, the second die-bonding area, the third die-bonding area, and the fourth die-bonding area in a crisscross manner.

[0038] Reference Figure 2 and Figure 3 In one specific embodiment, the protective fence 500 includes a first horizontal protective fence 510, a second horizontal protective fence 520, a third horizontal protective fence 530, a first vertical protective fence 540, a second vertical protective fence 550, a third vertical protective fence 560, and a fourth vertical protective fence 570. The first horizontal fence 510 is used to laterally isolate the first die-bonding area and the third die-bonding area, preventing mutual interference between the first LED chip 310 on the first die-bonding area and the third LED chip 330 on the third die-bonding area when powered on. Simultaneously, since there is a gap between the first control bracket 210 and the common electrode bracket 100, the first vertical protective fence 540 is used to isolate the first die-bonding area disposed on the common electrode bracket 100 from the first control bracket 210, preventing moisture from entering the first die-bonding area and adhering to the first LED chip 310. The second lateral protective fence 520 is used to laterally isolate the second and third die-bonding areas to prevent the second LED chip 320 on the second die-bonding area and the third LED chip 330 on the third die-bonding area from interfering with each other when energized. Simultaneously, the second longitudinal protective fence 550 is used to isolate the third die-bonding area, located on the second control bracket 220, from the common electrode bracket 100 to prevent moisture from entering the second die-bonding area and adhering to the third LED chip 330. The third lateral protective fence 530 is used to laterally isolate the second and fourth die-bonding areas to prevent the second LED chip 320 on the second die-bonding area and the fourth LED chip 340 on the fourth die-bonding area from interfering with each other when energized. Simultaneously, the third longitudinal protective fence 560 is used to isolate the second die-bonding area, located on the common electrode bracket 100, from the third control bracket 230 to prevent moisture from entering the second die-bonding area and adhering to the second LED chip 320. The fourth longitudinal protective fence 570 is used to isolate the fourth die-bonding area, which is set on the fourth control bracket 240, from the common electrode bracket 100, preventing moisture from entering the fourth die-bonding area and adhering to the fourth LED chip 340. In this embodiment, the die-bonding areas and the four control brackets (including the first control bracket 210 to the fourth control bracket 240) are effectively isolated from the common electrode bracket 100 in a crisscross manner. This effectively avoids the technical problems of mutual interference when different chips are powered on, or the easy adhesion of humid gas to the chip surface in a humid environment, which could cause the LED to malfunction or even be damaged.

[0039] Reference Figures 1 to 3 In some specific embodiments, the protective fence 500 needs to have good insulation performance and water vapor ingress characteristics. Therefore, the material of the protective fence 500 is PPA material, which ensures the performance requirements of the four-chip LED packaging structure of this utility model for the protective fence 500.

[0040] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A four-chip LED packaging structure, characterized in that, include: A common electrode support, wherein a first die-bonding region and a second die-bonding region are provided on the common electrode support; Four control supports, each equipped with a third and a fourth die-bonding zone; Four LED chips are respectively fixed on the first die-bonding area, the second die-bonding area, the third die-bonding area, and the fourth die-bonding area; The four LED chips are respectively connected to the common electrode bracket and the control bracket via multiple wires; A protective fence is used to isolate adjacent die-bonding areas among the first die-bonding area, the second die-bonding area, the third die-bonding area, and the fourth die-bonding area. The injection-molded housing is used to wrap and fix the common pole bracket, the four control brackets, and the protective fence respectively, and the common pole bracket and the four control brackets extend out of the injection-molded housing to form wiring pins.

2. The four-chip LED packaging structure according to claim 1, characterized in that, The four control brackets include a first control bracket, a second control bracket, a third control bracket, and a fourth control bracket; the four LED chips include a first LED chip, a second LED chip, a third LED chip, and a fourth LED chip. The first LED chip is fixed in the first die bonding area, and the first LED chip forms a power-conducting branch with the first control bracket and the common electrode bracket through the wire; The second LED chip is fixed in the second die bonding area, and the second LED chip forms a power-conducting branch with the third control bracket and the common electrode bracket through the wire; The third LED chip is fixed to the third die-bonding region, and the third LED chip forms a power-conducting branch with the second control bracket and the common electrode bracket through the wire; The fourth LED chip is fixed to the fourth die-bonding region, and the fourth LED chip forms a power-conducting branch with the fourth control bracket and the common electrode bracket through the wire.

3. The four-chip LED packaging structure according to claim 2, characterized in that, The protective fence isolates adjacent die-bonding areas among the first, second, third, and fourth die-bonding areas in a crisscross pattern.

4. The four-chip LED packaging structure according to claim 3, characterized in that, The protective fence includes a first horizontal protective fence, a second horizontal protective fence, a third horizontal protective fence, a first vertical protective fence, a second vertical protective fence, a third vertical protective fence, and a fourth vertical protective fence. The first transverse protective fence is used to isolate the first die-bonding area and the third die-bonding area, and the first longitudinal protective fence is used to isolate the first control bracket from the common electrode bracket; The second transverse protective fence is used to isolate the second die-bonding area and the third die-bonding area, and the second longitudinal protective fence is used to isolate the second control bracket from the common electrode bracket; The third transverse protective fence is used to isolate the second die-bonding area and the fourth die-bonding area, and the third longitudinal protective fence is used to isolate the third control bracket and the common electrode bracket; The fourth longitudinal protective fence is used to isolate the fourth control from the common pole support.

5. The four-chip LED packaging structure according to any one of claims 1 to 4, characterized in that, The plurality of said conductors include a plurality of arc-shaped gold wires; The four LED chips are respectively connected to the common electrode bracket and the four control brackets via multiple arc-shaped gold wires.

6. The four-chip LED packaging structure according to any one of claims 1 to 4, characterized in that, The protective fence is made of PPA material.

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