Silicon wafer adsorption device and silicon wafer transfer equipment
By combining a vacuum chuck and an annular soft pad, the problem of stable adsorption of warped thin silicon wafers is solved, realizing a safe and efficient silicon wafer transfer process and reducing the risk of breakage and contamination.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JILIN SINO MICROELECTRONICS CO LTD
- Filing Date
- 2025-03-31
- Publication Date
- 2026-04-24
AI Technical Summary
Existing silicon wafer gripping tools are difficult to hold firmly on warped thin silicon wafers, which can easily lead to wafer breakage or contamination, and are also inconvenient to operate.
The silicon wafer adsorption device employs a vacuum suction cup, annular soft pad, tubular body, and connecting components. It forms a negative pressure adsorption by tightly adhering to the back of the warped thin silicon wafer through the vacuum adsorption zone and the annular soft pad. Combined with a vacuum valve, it precisely controls the adsorption and release of the silicon wafer.
It achieves stable adsorption and safe transfer of warped thin silicon wafers, reduces the risk of surface damage to the silicon wafers during adsorption and release, and improves the accuracy and comfort of operation.
Smart Images
Figure CN224165111U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor manufacturing technology, and more specifically, to a silicon wafer adsorption device and a silicon wafer transfer device. Background Technology
[0002] In the semiconductor device manufacturing process, in order to improve chip performance, silicon wafers are usually thinned to 200um or less. However, excessively thin silicon wafers warp significantly and are particularly fragile. The degree of warping is exacerbated after metal is evaporated on the back side, making the handling of thin silicon wafers a challenge.
[0003] Currently, commonly used silicon wafer handling tools include pneumatic tweezers and clamps, but both are generally used for handling silicon wafers with flat surfaces and a thickness of around 750µm. When using pneumatic tweezers to handle warped thin silicon wafers, the uneven contact surface between the tweezers and the warped wafer, due to the hard, flat tip, results in weak adhesion and can easily cause the wafer to break if forced into contact. When using clamps, the clamps can only grip the edge of the wafer through two clamping plates, which can scratch the edge chips and easily cause the wafer to break. Furthermore, the contact area between the clamps and the wafer is small, making it easy for the wafer to fall off due to instability. In addition to using the above tools, silicon wafers can also be handled manually, but this method is not only prone to contaminating the wafer but also makes it difficult to control the handling force, which can easily cause the wafer to break. Utility Model Content
[0004] In order to at least overcome the above-mentioned deficiencies in the prior art, the purpose of this application is to provide a silicon wafer adsorption device and a silicon wafer transfer device.
[0005] In a first aspect, embodiments of this application provide a silicon wafer adsorption device, which includes a vacuum suction cup, an annular soft pad, a tubular body, and connecting components.
[0006] The vacuum suction cup includes an adsorption surface, which includes a suction adsorption area and a connecting area surrounding the suction adsorption area. The suction adsorption area is provided with a vacuum hole, and the annular soft pad is fixed in the connecting area.
[0007] The vacuum suction cup and the connecting assembly are respectively connected to the two opposite ends of the tubular body to form an airflow passage, and the connecting assembly is used to connect the air extraction device.
[0008] In one possible implementation, the silicon wafer adsorption device further includes a vacuum valve disposed on the tubular body.
[0009] In one possible implementation, the distance between the vacuum valve and the vacuum suction cup is 1 / 2 to 2 / 3 of the length of the tubular body.
[0010] In one possible implementation, the shape of the suction adsorption area includes a circle, and the radius of the suction adsorption area is 1.5cm to 2.5cm;
[0011] The shape of the connecting area includes a ring, and the ring width of the connecting area is 1cm to 3cm.
[0012] In one possible implementation, the annular pad is detachably fixed to the connection area, and the annular pad has a ring width of 1cm to 3cm and a thickness of 0.8cm to 1.2cm.
[0013] In one possible implementation, the material of the annular pad includes silicone.
[0014] In one possible implementation, the shape of the vacuum hole includes a circle or a square, and the size of the vacuum hole is 4mm to 6mm;
[0015] The number of vacuum holes is multiple, and the multiple vacuum holes are arranged in an array on the suction adsorption zone.
[0016] In one possible implementation, the length of the tubular body includes 24cm to 30cm.
[0017] In one possible implementation, the connecting component includes a plastic hose or a rubber hose.
[0018] Secondly, embodiments of this application also provide a silicon wafer transfer device, including the silicon wafer adsorption device described in any one of the first aspects, and an air extraction device connected to the connecting component.
[0019] Based on any of the above aspects, the silicon wafer adsorption device and silicon wafer transfer equipment provided in this application include a vacuum suction cup, an annular soft pad, a tubular body, and a connecting assembly. The vacuum suction cup includes an adsorption surface, which includes a suction adsorption area and a connecting area surrounding the suction adsorption area. The suction adsorption area is provided with a vacuum hole communicating with an internal air passage, and the annular soft pad is fixed to the connecting area. The vacuum suction cup and the connecting assembly are respectively connected to opposite ends of the tubular body to form an airflow passage, and the connecting assembly is used to connect an air extraction device. The air extraction device can create a negative pressure within the suction adsorption area, generating a strong suction force on the adsorption surface to achieve the purpose of adsorbing warped thin silicon wafers. The annular soft pad can tightly conform to the back of the warped thin silicon wafer, better adapting to the surface contour of the silicon wafer, forming a good sealing environment, and ensuring adsorption stability. At the same time, compared to a hard surface, the annular soft pad can reduce surface wear during the adsorption and release of the silicon wafer. Attached Figure Description
[0020] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This is a schematic diagram of a possible structure of the silicon wafer adsorption device provided in this application.
[0022] icon:
[0023] 1-Vacuum suction cup; 2-Annular soft pad; 3-Tube-shaped body; 4-Connecting assembly; 5-Vacuum valve; 11-Vacuum hole. Detailed Implementation
[0024] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0025] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0026] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0027] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0028] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "connected," "linked," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0029] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.
[0030] To address the problems in the existing technology, please refer to... Figure 1 This application provides a silicon wafer adsorption device, which may include a vacuum suction cup 1, an annular soft pad 2, a tubular body 3, and a connecting component 4.
[0031] The tubular body 3 serves as the main support structure and airflow passage. The vacuum suction cup 1 and the connecting component 4 are respectively connected to the two opposite ends of the tubular body 3 to form an airflow passage. The connecting component 4 is used to connect to the air extraction equipment (e.g., air pump).
[0032] The vacuum suction cup 1 includes a flat adsorption surface, which may consist of a suction adsorption area and a connecting area surrounding the suction adsorption area. The suction adsorption area is provided with a vacuum hole 11 communicating with the internal air passage. The annular soft pad 2 is fixed in the connecting area. The annular soft pad 2 may be made of a soft and deformable material to ensure that the annular soft pad 2 can tightly adsorb the silicon wafer surface and form a good sealing environment.
[0033] In the above structure, since the vacuum hole 11 is connected to the internal air passage, a negative pressure can be formed in the suction adsorption zone by pumping air, generating a strong suction force on the adsorption surface, thereby achieving the purpose of adsorbing the warped thin silicon wafer. The annular soft pad 2 can tightly conform to the back of the warped thin silicon wafer, better adapting to the surface contour of the wafer, forming a good sealing environment, and ensuring adsorption stability. At the same time, compared to a hard surface, the annular soft pad 2 also reduces the impact force on the silicon wafer during adsorption or release, reducing the risk of surface damage during adsorption and release.
[0034] In some possible embodiments, the silicon wafer adsorption device further includes a vacuum valve 5, which is disposed on the tubular body 3. The vacuum valve 5 allows for precise control of the adsorption and release of the silicon wafer, ensuring the accuracy and reliability of the operation process. Specifically, after the silicon wafer is adsorbed and transferred to the target location, the vacuum passage can be disconnected by pressing the vacuum valve 5, thereby releasing the silicon wafer.
[0035] Furthermore, to ensure sufficient gripping space for the silicon wafer adsorption device, the length of the tubular body 3 can be 24cm to 30cm. For example, the length of the tubular body 3 includes 24cm, 24.5cm, 25cm, 26cm, 27cm, 28cm, 29cm, 29.5cm, and 30cm. Preferably, the length of the tubular body 3 is 26cm to ensure sufficient gripping space for the silicon wafer adsorption device, improving operational comfort and flexibility.
[0036] Furthermore, to facilitate handheld control of the vacuum valve 5, the vacuum valve 5 can be located in the middle of the tubular body 3. Specifically, the distance between the vacuum valve 5 and the vacuum suction cup 1 is 1 / 2 to 2 / 3 of the length of the tubular body 3. For example, the vacuum valve 5 can be located at 2 / 3 of the distance between the tubular body 3 and the vacuum suction cup 1. After the silicon wafer is adsorbed and transferred to the target position, the vacuum valve 5 can be easily touched to disconnect the vacuum passage without significantly moving the hand, thus improving operating efficiency and comfort.
[0037] In some possible embodiments, the shape of the suction adsorption area includes a circle, and the radius of the suction adsorption area is 1.5cm to 2.5cm. Exemplarily, the radius of the suction adsorption area includes 1.5cm, 1.75cm, 1.9cm, 2cm, 2.1cm, 2.2cm, 2.3cm, 2.4cm, 2.45cm, 2.49cm, and 2.5cm, etc. Preferably, the radius of the suction adsorption area is 2cm. It is easy to understand that the shape of the suction adsorption area can also include a square, rhombus, etc.
[0038] The shape of the connecting area is adapted to the shape of the annular pad 2 to better fix the annular pad 2. Specifically, the shape of the connecting area is circular, and the width of the connecting area is 1cm to 3cm. For example, the width of the connecting area includes 1cm, 1.1cm, 1.2cm, 1.5cm, 2cm, 2.5cm, 2.7cm, 2.8cm, 2.9cm, and 3cm, etc. Preferably, the width of the connecting area is 2cm.
[0039] Furthermore, the number of vacuum holes 11 is multiple, and the multiple vacuum holes 11 can be arranged in an array or irregularly on the suction adsorption area. Preferably, the multiple vacuum holes 11 are arranged in an array on the suction adsorption area. The shape of the vacuum holes 11 includes circular, square, etc., and the size of the vacuum holes 11 can be 4mm to 6mm. For example, the size of the vacuum holes 11 includes 4mm, 4.2mm, 4.5mm, 4.7mm, 5mm, 5.5mm, 5.7mm, 5.8mm, 5.9mm, and 6mm. Preferably, the size of the vacuum holes 11 is 5mm.
[0040] It is easy to understand that the size of the vacuum hole 11 determines the opening size of the vacuum hole 11, which is related to the shape of the vacuum hole 11. Specifically, when the vacuum hole 11 is circular, its size can be the diameter of the circle; while when the vacuum hole 11 is square, its size can be the side length of the square. Preferably, the vacuum hole 11 is circular, and its size is the diameter of the circle.
[0041] It is easy to understand that, in addition to vacuum holes, vacuum slits communicating with the internal air passages can also be provided within the suction adsorption zone. Multiple vacuum slits can be distributed radially along the suction adsorption zone; the number and arrangement of the vacuum slits are not specifically limited here.
[0042] Furthermore, the annular pad 2 is detachably fixed to the connection area, allowing for the replacement of different sized annular pads 2 according to the size of the silicon wafer (e.g., 8 inches, 12 inches, etc.), ensuring sufficient contact area between the annular pad 2 and the silicon wafer and increasing adsorption stability. To ensure that the annular pad 2 can tightly adhere to the surface of the silicon wafer without damaging its surface during adsorption, the annular pad 2 can be made of a soft and easily deformable material. For example, highly elastic and wear-resistant silicone material can be used to make annular pads 2 of different sizes. The annular pad 2 has a ring width of 1cm to 3cm and a thickness of 0.8cm to 1.2cm. For example, the ring width of the annular pad 2 includes 1cm, 1.1cm, 1.2cm, 1.5cm, 2cm, 2.5cm, 2.7cm, 2.8cm, 2.9cm, and 3cm, and the thickness of the annular pad 2 includes 0.8cm, 0.85cm, 0.9cm, 0.95cm, 1cm, 1.1cm, 1.15cm, and 1.2cm. Preferably, the annular pad 2 has a ring width of 2cm and a thickness of 1cm.
[0043] In some possible embodiments, the connecting component 4 can be a flexible tubing such as a plastic hose or a rubber hose, with one end connected to one end of the tubular body 3 and the other end matched and connected to the interface of the air extraction device to ensure the sealing and stability of the air circuit connection, thereby generating negative pressure through the air extraction device to achieve the purpose of adsorbing silicon wafers.
[0044] The silicon wafer adsorption device also includes a protective shell, which can protect the disassembled annular pad 2 from contamination.
[0045] Furthermore, this application embodiment also provides a silicon wafer transfer device, which includes any of the silicon wafer adsorption devices in the above embodiments, and an air extraction device connected to the connecting component 4. Exemplarily, the air extraction device includes a device such as an air pump. Specifically, one end of the connecting component 4 is connected to one end of the tubular body 3, and the other end is matched and connected to the interface of the air extraction device, forming a complete air path with the tubular body 3. When it is necessary to transfer the silicon wafer, the air extraction device evacuates the silicon wafer adsorption device, creating a negative pressure within the adsorption zone and generating a strong suction force on the adsorption surface, thereby achieving the purpose of adsorbing the warped thin silicon wafer. After the silicon wafer is adsorbed and transferred to the target position, the vacuum passage can be disconnected by pressing the vacuum valve 5, thereby releasing the silicon wafer. In the above process, the annular soft pad 2 can closely conform to the back of the warped thin silicon wafer, better adapting to the surface contour of the silicon wafer, forming a good sealing environment, and ensuring adsorption stability. Meanwhile, compared to a hard surface, the annular soft pad 2 also reduces the impact force on the silicon wafer during the adsorption or release process, thereby reducing the risk of surface damage to the silicon wafer during adsorption and release.
[0046] In summary, this application provides a silicon wafer adsorption device, which includes a vacuum suction cup, an annular soft pad, a tubular body, and connecting components. The vacuum suction cup includes a flat adsorption surface, which can be composed of two parts: a suction adsorption area and a connecting area surrounding the suction adsorption area. The suction adsorption area is provided with a vacuum hole communicating with the internal air passage, and the annular soft pad is fixed to the connecting area. The tubular body serves as the main support structure and airflow passage. The vacuum suction cup and connecting components are respectively connected to the opposite ends of the tubular body to form airflow passages, and the connecting components are used to connect to a vacuum pump. The vacuum pump can create a negative pressure in the suction adsorption area, generating a strong suction force on the adsorption surface to achieve the purpose of adsorbing warped thin silicon wafers. The annular soft pad can closely fit the back of the warped thin silicon wafer, better adapt to the surface contour of the silicon wafer, form a good sealing environment, and ensure adsorption stability. At the same time, compared with a hard surface, the annular soft pad can also reduce the risk of surface damage to the silicon wafer during adsorption and release.
[0047] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A silicon wafer adsorption device, characterized in that, Includes a vacuum suction cup, a ring-shaped soft pad, a tubular body, and connecting components; The vacuum suction cup includes an adsorption surface, which includes a suction adsorption area and a connecting area surrounding the suction adsorption area. The suction adsorption area is provided with a vacuum hole, and the annular soft pad is fixed in the connecting area. The vacuum suction cup and the connecting assembly are respectively connected to the two opposite ends of the tubular body to form an airflow passage, and the connecting assembly is used to connect the air extraction device.
2. The silicon wafer adsorption device according to claim 1, characterized in that, The silicon wafer adsorption device also includes a vacuum valve, which is disposed on the tubular body.
3. The silicon wafer adsorption device according to claim 2, characterized in that, The distance between the vacuum valve and the vacuum suction cup is 1 / 2 to 2 / 3 of the length of the tubular body.
4. The silicon wafer adsorption device according to claim 1, characterized in that, The shape of the suction adsorption area includes a circle, and the radius of the suction adsorption area is 1.5cm to 2.5cm; The shape of the connecting area includes a ring, and the ring width of the connecting area is 1cm to 3cm.
5. The silicon wafer adsorption device according to claim 1, characterized in that, The annular soft pad is detachably fixed in the connection area. The annular soft pad has a ring width of 1cm to 3cm and a thickness of 0.8cm to 1.2cm.
6. The silicon wafer adsorption device according to claim 1, characterized in that, The material of the annular cushion includes silicone.
7. The silicon wafer adsorption device according to claim 1, characterized in that, The vacuum hole can be circular or square, and its size is 4mm to 6mm. The number of vacuum holes is multiple, and the multiple vacuum holes are arranged in an array on the suction adsorption zone.
8. The silicon wafer adsorption device according to claim 1, characterized in that, The length of the tubular body ranges from 24cm to 30cm.
9. The silicon wafer adsorption device according to claim 1, characterized in that, The connection assembly includes a plastic hose or a rubber hose.
10. A silicon wafer transfer device, characterized in that, It includes the silicon wafer adsorption device according to any one of claims 1-9, and the air extraction device connected to the connecting assembly.