Dustless packaging device for LED lamp bead processing

Abstract

The utility model discloses a dustless packaging device for LED lamp bead processing, and relates to the technical field of LED lampshade dispensing. Comprising a supporting table, the top of the supporting table is fixedly connected with a shielding box with an opening in the front side, the front side of the shielding box is provided with a dustproof curtain, the top of the shielding box is provided with a dust remover for extracting air in the shielding box, and the top of the supporting table is fixedly provided with a mounting table located in an inner cavity of the shielding box; a mounting plate is fixedly mounted at the top of the movable plate, a mounting frame is arranged on one side of the mounting plate in a liftable mode, a dispensing gun is mounted on the mounting frame, and a lamp bead feeding table capable of entering the shielding box is movably arranged at the position, located on the outer side of the shielding box, of the top of the supporting table. According to the dust-free packaging device for LED lamp bead processing, the glue dispensing gun can conduct displacement on the Z axis and the X axis, the lamp bead feeding table can conduct displacement on the X axis, and when glue dispensing operation is conducted on LED lamp beads on the lamp bead feeding table, manual operation is not needed for the LED lamp beads.

Description

Technical Field

[0001] This utility model relates to the field of LED lampshade dispensing technology, specifically to a dust-free packaging device for LED lamp bead processing. Background Technology

[0002] LED beads are light-emitting diodes. LED beads have many advantages over ordinary light bulbs and are ubiquitous in daily production and life. In order to extend the lifespan of LED beads, they need to be encapsulated during the LED bead manufacturing process. Encapsulation generally requires dispensing adhesive onto the LED beads.

[0003] LED chip dispensing is usually performed in a cleanroom environment. Existing chip packaging equipment requires manual alignment of the chips on the packaging board, which can lead to uneven dispensing and low packaging efficiency. Utility Model Content

[0004] This invention provides a dust-free packaging device for LED bead processing to solve the problems in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a dust-free packaging device for LED bead processing, comprising a support platform, a shielding box with a front opening fixedly connected to the top of the support platform, a dustproof curtain provided on the front side of the shielding box, a dust collector for extracting air from the shielding box installed on the top of the shielding box, an mounting platform fixedly installed on the top of the support platform within the shielding box, a movable plate movably provided on the top of the mounting platform, an mounting plate fixedly installed on the top of the movable plate, a mounting frame movably provided on one side of the mounting plate, a glue gun mounted on the mounting frame, and an LED bead loading platform movably provided on the top of the support platform outside the shielding box, allowing entry into the shielding box.

[0006] Furthermore, the top of the mounting platform is equipped with two first pulleys that are rotatably connected, and the two first pulleys are connected by a first belt drive. The mounting platform is equipped with a motor that drives one of the first pulleys to rotate. The bottom of the movable plate is equipped with a slider that is connected to the first belt, and the top of the mounting platform is equipped with a linear guide rail that slides with the slider.

[0007] Furthermore, two second pulleys are mounted on the mounting plate, and the two second pulleys are connected by a second belt drive. A drive motor that drives one of the second pulleys to rotate is mounted on the rear side of the mounting plate, and the mounting bracket is connected to the second belt.

[0008] Furthermore, a drive cylinder is installed on one side of the top of the support platform to push the lamp bead feeding platform toward the mounting platform.

[0009] Furthermore, a slide is installed at the bottom of the lamp bead loading platform, and a guide rail that slides with the slide is installed at the top of the support platform.

[0010] Furthermore, a fixed platform is installed on the top of the support platform on the side of the shield box away from the lamp bead feeding platform, and a CCD camera is installed on the fixed platform.

[0011] Compared with the prior art, this utility model provides a dust-free packaging device for LED chip processing, which has the following advantages:

[0012] 1. This dust-free packaging device for LED bead processing has a glue gun that can move along the Z and X axes, while the LED bead loading platform can move along the X axis. When the LED beads placed on the LED bead loading platform are being glued, no manual operation is required.

[0013] 2. The dust-free packaging device for LED lamp bead processing, through the cooperation of a shielding box, a dustproof curtain and a dust collector, can facilitate dust removal operations inside the shielding box, ensuring relative cleanliness inside the shielding box. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the structure of the shielding box of this utility model;

[0016] Figure 3 This is an enlarged schematic diagram of point A of this utility model.

[0017] In the diagram: 1. Support platform; 2. Shielding box; 3. Dustproof curtain; 4. Dust collector; 5. Mounting platform; 6. Movable plate; 7. Mounting plate; 8. Mounting frame; 9. Glue gun; 10. LED bead loading platform; 11. Drive cylinder; 12. First pulley; 13. First belt; 14. Slider; 15. Linear guide rail; 16. Second pulley; 17. Second belt; 18. Drive motor; 19. Guide slide rail; 20. Fixed platform; 21. CCD camera. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Please see Figure 1-3This utility model discloses a dust-free packaging device for LED lamp bead processing, including a support platform 1. A shielding box 2 with a front opening is fixedly connected to the top of the support platform 1. A dustproof curtain 3 is provided on the front side of the shielding box 2. A dust collector 4 for extracting air from the shielding box 2 is installed on the top of the shielding box 2. An mounting platform 5 is fixedly installed on the top of the support platform 1 inside the shielding box 2. A movable plate 6 is movably provided on the top of the mounting platform 5. An mounting plate 7 is fixedly installed on the top of the movable plate 6. A mounting frame 8 is provided on one side of the mounting plate 7 that can be raised and lowered. A glue gun 9 is installed on the mounting frame 8. An LED bead loading platform 10 that can enter the shielding box 2 is movably provided on the top of the support platform 1 outside the shielding box 2.

[0020] Mounting bracket 8 is equipped with an infrared position detection sensor assembly known in the prior art, which will not be described in detail here.

[0021] Specifically, the top of the mounting platform 5 is equipped with two first pulleys 12 that are rotatably connected. The two first pulleys 12 are connected by a first belt 13. The mounting platform 5 is equipped with a motor that drives one of the first pulleys 12 to rotate. The bottom of the movable plate 6 is equipped with a slider 14 that is connected to the first belt 13. The top of the mounting platform 5 is equipped with a linear guide rail 15 that slides with the slider 14.

[0022] In this embodiment, the two first pulleys 12 cooperate with the first belt 13 to drive the movable plate 6 to move in the X-axis direction, and the cooperation of the slider 14 and the linear guide rail 15 can guide the movement of the movable plate 6.

[0023] Specifically, two second pulleys 16 are mounted on the mounting plate 7, and the two second pulleys 16 are connected by a second belt 17. A drive motor 18 for driving one of the second pulleys 16 to rotate is mounted on the rear side of the mounting plate 7, and the mounting bracket 8 is connected to the second belt 17.

[0024] In this embodiment, two second pulleys 16 cooperate with the second belt 17 to drive the mounting frame 8 to move in the Z-axis direction. A vertical slider is installed on the rear side of the mounting frame 8, and a vertical guide rail that slides with the vertical slider is installed on the mounting plate 7.

[0025] Specifically, a drive cylinder 11 is installed on one side of the top of the support platform 1 to push the lamp bead loading platform 10 toward the mounting platform 5.

[0026] The bottom of the LED bead loading platform 10 is equipped with a slide table, and the top of the support platform 1 is equipped with a guide rail 19 that slides with the slide table.

[0027] In this embodiment, the drive cylinder 11 drives the lamp bead loading platform 10 to move along the Y-axis.

[0028] The guide rail 19 works in conjunction with the slide table to guide the movement of the LED bead loading table 10.

[0029] Alternatively, a linear motor can be used to replace the drive cylinder 11 to move the lamp bead loading platform 10.

[0030] Specifically, a fixed platform 20 is installed on the top of the support platform 1 on the side of the shielding box 2 away from the lamp bead feeding platform 10, and a CCD camera 21 is installed on the fixed platform 20.

[0031] In this embodiment, the CCD camera 21 is used for visual inspection of the dispensing operation. The CCD camera 21 has conventional components such as a light source and a telecentric lens.

[0032] In summary, this dust-free packaging device for LED bead processing allows the dispensing gun 9 to move along the Z and X axes, while the bead loading platform 10 can move along the X axis. When dispensing LED beads placed on the loading platform 10, no manual operation is required. Through the cooperation of the shielding box 2, the dustproof curtain 3, and the dust collector 4, the dust removal operation inside the shielding box 2 can be easily carried out, ensuring the relative cleanliness of the interior of the shielding box 2.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A dust-free packaging device for LED bead processing, comprising a support platform (1), characterized in that: The top of the support platform (1) is fixedly connected to a shield box (2) with a front opening. A dustproof curtain (3) is provided on the front side of the shield box (2). A dust collector (4) for extracting air from the shield box (2) is installed on the top of the shield box (2). An installation platform (5) is fixedly installed on the top of the support platform (1) in the inner cavity of the shield box (2). A movable plate (6) is movably provided on the top of the installation platform (5). An installation plate (7) is fixedly installed on the top of the movable plate (6). An installation frame (8) is provided on one side of the installation plate (7) that can be raised and lowered. A glue gun (9) is installed on the installation frame (8). A lamp bead loading platform (10) that can enter the shield box (2) is movably provided on the top of the support platform (1) outside the shield box (2).

2. The dust-free packaging apparatus for LED bead processing according to claim 1, characterized in that: The top of the mounting platform (5) is equipped with two first pulleys (12) that are rotatably connected. The two first pulleys (12) are connected by a first belt (13). The mounting platform (5) is equipped with a motor that drives one of the first pulleys (12) to rotate. The bottom of the movable plate (6) is equipped with a slider (14) that is connected to the first belt (13). The top of the mounting platform (5) is equipped with a linear guide rail (15) that slides with the slider (14).

3. The dust-free packaging apparatus for LED bead processing according to claim 1, characterized in that: Two second pulleys (16) are mounted on the mounting plate (7). The two second pulleys (16) are connected by a second belt (17). A drive motor (18) that drives one of the second pulleys (16) to rotate is mounted on the rear side of the mounting plate (7). The mounting bracket (8) is connected to the second belt (17).

4. The dust-free packaging apparatus for LED bead processing according to claim 1, characterized in that: A drive cylinder (11) is installed on one side of the top of the support platform (1) to push the lamp bead loading platform (10) toward the mounting platform (5).

5. The dust-free packaging apparatus for LED bead processing according to claim 4, characterized in that: The bottom of the lamp bead feeding platform (10) is equipped with a slide table, and the top of the support platform (1) is equipped with a guide rail (19) that slides with the slide table.

6. The dust-free packaging apparatus for LED bead processing according to claim 1, characterized in that: The top of the support platform (1) is located on the side of the shield box (2) away from the lamp bead feeding platform (10) and a fixed platform (20) is installed thereon. A CCD camera (21) is installed on the fixed platform (20).

Images