Stamping device

Abstract

The utility model relates to the technical field of stamping, in particular to a stamping device which comprises an upper die assembly and a lower die assembly, the upper die assembly is arranged above the lower die assembly, the top of the upper die assembly and the bottom of the lower die assembly can be connected with stamping device driving equipment, an object placing hole is formed in the upper die assembly, elastic pieces with different rebound capacities can be placed in the object placing hole, and the upper die assembly is connected with the lower die assembly. When the upper die assembly is controlled by stamping device driving equipment to move downwards, the upper die base and the upper die base plate are driven to move downwards, the upper die base plate applies pressure to the connecting plate, at the moment, the elastic pieces in the connecting plate have different resilience capacities, the local stress condition of a pressed workpiece can be locally changed, and then the purpose of changing the local thickness of the workpiece is achieved. The stamping depth control blocks in the first storage groove and the second storage groove can control the overall appearance height of the pressed workpiece, and then the purpose of changing the overall depth of the workpiece, namely the appearance height of the product, is achieved.

Description

Technical Field

[0001] This utility model relates to the field of stamping technology, specifically a stamping device. Background Technology

[0002] Stamping equipment is used to apply pressure to workpieces, causing them to undergo plastic deformation or separation, thereby obtaining workpieces with specific shapes, dimensions, and properties. However, the molds used in stamping equipment are extremely expensive. In most cases, factories cannot afford to create new molds for small orders. This makes it difficult to meet customer requirements while balancing cost when minor adjustments to certain molds are needed. For example, for workpieces of the same shape, if products with different surface heights need to be manufactured, i.e., the stamping depth needs to be changed, traditional stamping equipment can only re-create the mold. However, the cost of re-creating the mold is too high, which increases the unit price of the new workpiece, making it unfavorable for sales and use. In such cases, the above product requirements can be met by adding depth control blocks. Furthermore, for workpieces requiring localized thickening to increase local strength or wear resistance, localized thickening of a specific area can be achieved by changing the elastic modulus of the elastomer.

[0003] In the prior art, the stamping device in patent CN116060495A cannot individually change the thickness of a local area of ​​the workpiece to be stamped. It requires re-molding, increasing production costs. Re-molding not only increases economic costs but also lengthens the production cycle and reduces efficiency. Therefore, there is a need for a stamping device that can produce products of different depths with slight adjustments without changing the mold; and for products requiring multiple stampings, a device that can locally change the depth of each stamping by adjusting the stamping depth, thus controlling the apparent height of the stamped workpiece. Furthermore, without changing the mold, the thickness of a local area of ​​the stamped workpiece can be altered by changing the installed elastic body, improving the strength of vulnerable parts and enhancing product quality and competitiveness. This device requires only slight adjustments to the mold to change the local thickness of the workpiece, eliminating the need for re-molding. Utility Model Content

[0004] The purpose of this invention is to provide a stamping device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model adopts the following technical solution: a stamping device, comprising: an upper die assembly and a lower die assembly, wherein the upper die assembly is disposed above the lower die assembly, and both the top of the upper die assembly and the bottom of the lower die assembly can be connected to a stamping device drive device. The upper die assembly includes an upper die base, an upper die pad, a connecting plate, a pressure ring, and a punch. An upper die base is disposed at the top of the upper die assembly, and an upper die pad is fixedly connected to the lower end of the upper die base. A punch is disposed below the upper die pad and is fixedly connected to the upper die pad. Limit grooves are fixedly connected to both sides of the bottom of the upper die pad. Limit posts are disposed on both sides of the top of the pressure ring at positions corresponding to the projection of the limit grooves, and the tops of the limit posts are confined within the limit grooves. The ring is slidably connected to the limiting groove via the limiting post. The pressure ring has a through hole through which the punch passes. A connecting plate is provided above the pressure ring and below the upper die pad, and the connecting plate is detachably connected to the upper die pad. The connecting plate has a through hole with the same projection as the through hole on the pressure ring. The connecting plate also has several placement holes, which can hold springs. The lower die assembly includes a lower die base, a lower die pad, and a die. The lower die assembly has a lower die base at the bottom, and a lower die pad is fixedly connected to the upper end of the lower die base. A die is fixedly connected to the upper end of the lower die pad. The die position corresponds to the punch position. Several second placement slots are provided at other positions on the upper surface of the die, and stamping depth control blocks can be placed in the second placement slots.

[0006] Furthermore, other elastic elements can be placed inside the storage hole, and elastic elements of different sizes can be placed inside.

[0007] Furthermore, a first storage groove is provided on the top surface of the pressure ring, in which a stamping depth control block can be placed.

[0008] Furthermore, the stamping depth control blocks placed in the first and second storage slots can be selected at different heights.

[0009] Furthermore, a guide post is provided on the lower surface of the upper mold base, and a guide sleeve is provided on the upper surface of the lower mold base. The inner diameter of the guide sleeve is larger than the diameter of the guide post, and the two are coaxially arranged.

[0010] Compared with the prior art, this utility model has the following advantages:

[0011] (1) The connecting plate of this utility model is provided with a storage hole, which can hold elastic elements of different sizes. The elastic elements can be selected with different diameters, different lengths, or different elastic moduli. When the upper die assembly is controlled to move downward by the stamping device, it drives the upper die base and the upper die pad to move downward. The upper die pad applies pressure to the connecting plate. If the pressure ring is connected by a hard connection, the pressure ring will transmit the pressure to the workpiece in a fixed manner. If the transmitted force is too large, it may hinder the workpiece from moving into the die cavity and cause damage. Therefore, by controlling the pressure of different parts of the pressure ring by the elastic element, it is possible to change the magnitude of the force applied to the local area by the punch during stamping, thereby changing the local thickness of the workpiece and protecting the workpiece from damage.

[0012] (2) The first placement groove on the pressure ring and the second placement groove on the die of this utility model can be used to place a stamping depth control block. The height of the stamping depth control block is different. Different heights of stamping depth control blocks can be selected according to different needs. This will also enable the punch to stop moving downward after reaching the top height of the stamping depth control block during stamping, thereby controlling the overall height of the workpiece and thus achieving the purpose of changing the local thickness of the workpiece. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of a stamping device.

[0014] Figure 2 This is an exploded view of the stamping device.

[0015] Figure 3 This is a schematic diagram of the upper die pad, connecting plate, pressure ring, and punch.

[0016] Figure 4 This is a schematic diagram of the limiting groove and the limiting post.

[0017] Figure 5 This is a perspective view of the connecting plate.

[0018] The components include: upper mold assembly 100, upper mold base 110, guide post 111, upper mold pad 120, limiting groove 121, connecting plate 130, placement hole 131, pressure ring 140, limiting post 141, first placement groove 142, punch 150, lower mold assembly 200, lower mold base 210, guide sleeve 211, lower mold pad 220, die 230, and second placement groove 231. Detailed Implementation

[0019] The purpose of this utility model is to address the shortcomings of existing technologies by providing a stamping device, specifically achieved through the following technical solution:

[0020] Reference Figure 1This embodiment provides a stamping device, including an upper die assembly 100 and a lower die assembly 200. The upper die assembly 100 is disposed above the lower die assembly 200, and the top of the upper die assembly 100 and the bottom of the lower die assembly 200 can be connected to a stamping device driving device. The stamping device driving device can drive the upper die assembly 100 to move downward or drive the lower die assembly 200 to move upward, so that the upper die assembly 100 and the lower die assembly 200 extrude the workpiece and complete the stamping operation.

[0021] Reference Figure 2 , Figure 3 , Figure 4 , Figure 5 The upper die assembly 100 includes an upper die base 110, an upper die pad 120, a connecting plate 130, a pressure ring 140, and a punch 150. The upper die base 110 is located at the top of the upper die assembly 100 for fixation and to withstand the pressure during the stamping process. The upper die pad 120 is fixedly connected to the lower end of the upper die base 110 for support and cushioning, preventing deformation of components such as the punch 150. The punch 150 is located below the upper die pad 120 and is fixedly connected to the upper die pad 120. The bottom of the upper die pad 120... The pressure ring 140 is fixedly connected to the limiting grooves 121 on both sides. Limiting posts 141 are provided on both sides of the top of the pressure ring 140 at positions corresponding to the projections of the limiting grooves 121. The pressure ring 140 and the limiting posts 141 are connected by bolts. The top diameter of the limiting posts 141 is relatively large, and the top of the limiting posts 141 is confined within the limiting grooves 121. The bottom opening diameter of the limiting groove 121 is larger than the bottom interface diameter of the limiting posts 141, but smaller than the top diameter of the limiting posts 141. The pressure ring 140 is slidably connected to the limiting grooves 121 through the limiting posts 141.

[0022] Therefore, the limiting post cannot disengage from the limiting groove 121. Consequently, the pressure ring 140, fixedly connected to the limiting post 141, can only be slidably connected to the upper mold pad 120 via the limiting post 141 and the limiting groove 121. That is, when the upper mold assembly 100 is not in contact with the lower mold assembly 200, the pressure ring 140 is suspended by the limiting post 141. When the upper mold assembly 100 moves relative to the lower mold assembly 200, the pressure ring 140 contacts the lower mold assembly 200, and the limiting post 141 begins to slide inside the limiting groove 121, causing the pressure ring 140 to open. The punch 150 begins to move upwards relative to the upper die pad 120, and the blank holder 140 ensures that the force applied by the stamping device when stamping the edge of the workpiece better meets the mold design requirements. The blank holder 140 has a through hole through which the punch 150 passes. A connecting plate 130 is provided above the blank holder 140 and below the upper die pad 120, and the connecting plate 130 is detachably connected to the upper die pad 120. The connecting plate 130 has a through hole with the same projection as the through hole on the blank holder 140, allowing the punch 150 to pass through. The connecting plate 130 is also provided with several storage holes 131. Springs can be placed inside the storage holes 131, and other elastic elements can also be placed inside the storage holes 131. When the upper mold assembly 100 moves relative to the lower mold assembly 200, the lower end of the elastic element placed inside the storage hole 131 protrudes from the connecting plate 130, and the lower end of the elastic element first contacts the pressure ring 140, applying pressure to the pressure ring 140. At this time, its upper end does not contact the upper mold pad 120. When the upper mold assembly 100 continues to move downward, the elastic element placed inside the storage hole 131... The upper end of the elastic element transmits an upward force to the mold pad 120. Elastic elements of different positions and sizes can transmit the pressure that the elastic element can transmit to different areas of the pressure ring 140. This allows for localized changes in the pressure on the workpiece. For example, when it is necessary to change the thickness of a certain area of ​​the workpiece, the required elastic element can be placed in the corresponding placement hole 131. According to the required thickness of the workpiece, the corresponding elastic element is used to achieve the effect of locally changing the thickness of the workpiece, without the need to re-open the mold, which greatly reduces the production cost.

[0023] Reference Figure 5The storage hole 131 can accommodate elastic elements of different sizes. These elastic elements include, but are not limited to, springs, rubber rods, nitrogen springs, pneumatic or hydraulic devices, and metals with a certain degree of elasticity. Different sizes of elastic elements can be selected for use inside the storage hole 131 at different positions, such as elastic elements of different lengths, diameters, or elastic moduli. When the upper die assembly 100 is driven downwards by the stamping device, it drives the upper die base 110 and the upper die pad 120 downwards. The upper die pad 120 applies pressure to the connecting plate 130. At this time, the different sizes of the elastic elements within the connecting plate 130 will transmit different forces to the pressure ring 140. For example, when the diameters of the elastic elements at different positions are different, the downward force they can transmit is also different. When the elastic modulus of the elastic element is larger, the downward force it can transmit is also larger. That is, when the downward force applied by the stamping device cannot compress the elastic element, then the elastic element transmits downward force... The magnitude of the force is the value of the force generated by the deformation of the elastic element in that area. This can change the local force on the pressure ring 140, thereby changing the pressure transmitted to the workpiece below. That is, the different motion resistances result in different metal flow capabilities in different parts of the workpiece into the gap between the punch and die, leading to different thicknesses in different parts of the workpiece. When a local area of ​​the workpiece needs to be thicker, an elastic element with a smaller elastic modulus is placed in the placement hole 131 in its vertical position. This elastic element can transmit less force downward, so the local pressure applied to the pressure ring 140 is also smaller, which in turn makes the local pressure applied to the workpiece smaller, resulting in a thicker local area of ​​the stamped workpiece. Conversely, when a local area of ​​the workpiece needs to be relatively thin, an elastic element with a larger elastic modulus can be used. By adjusting the elastic body, the thickness of the easily damaged parts of the workpiece can be controlled and increased, improving product quality. In a localized manner, the effect of reducing pressure can be achieved, thereby changing the local thickness of the workpiece.

[0024] The lower die assembly 200 includes a lower die base 210, a lower die pad 220, and a die cavity 230. The lower die base 210 is provided at the bottom of the lower die assembly 200, and the lower die pad 220 is fixedly connected to the upper end of the lower die base 210 for support and buffering to prevent the die cavity 230 from being deformed under pressure. The die cavity 230 is fixedly connected above the lower die pad 220. The die cavity 230 is positioned corresponding to the position of the punch 150. Several second placement slots 231 are provided at other positions on the upper surface of the die cavity 230. The stamping depth control block can be placed in the second placement slots 231. When the components in the upper die assembly 100, such as the pressure ring 140, come into contact with the depth control block, they cannot continue to press down. Therefore, the depth control block can control the stamping depth of the punch 150, thereby controlling the apparent height of the product and the overall apparent height of the stamped workpiece.

[0025] Reference Figure 3The top surface of the pressure ring 140 is also provided with a first storage groove 142, in which a stamping depth control block can be placed. The principle of placing the stamping depth control block in this position is the same as that of the second storage groove 231. Placing the stamping depth control block can control the depth of each stamping by the stamping device, that is, it can control the apparent height of the workpiece to be stamped.

[0026] Reference Figure 2 , Figure 3 The stamping depth control blocks placed in the first storage slot 142 and the second storage slot 231 can be selected at different heights, and the apparent height of the workpiece to be stamped will also change accordingly.

[0027] Reference Figure 1 , Figure 2 The upper mold base 110 has a guide post 111 on its lower surface and a guide sleeve 211 on its upper surface. The inner diameter of the guide sleeve 211 is larger than the outer diameter of the guide post 111, and the two are coaxially arranged to ensure that the upper mold assembly 100 and the lower mold assembly 200 are precisely aligned during the stamping process and to reduce errors.

[0028] Example 1: Elastic elements of different sizes, such as springs, are placed in the storage hole 131 of the connecting plate 130 as needed. After placement, the connecting plate 130 is fixedly connected to the upper die pad 120 with bolts. Then, the pressure ring 140 is connected to the limiting post 141 with bolts, thereby achieving a sliding connection between the pressure ring 140 and the upper die pad 120 through the limiting groove 121 and the limiting post 141. At this time, the lower end of the elastic element placed in the storage hole 131 protrudes from the connecting plate 130 and contacts the pressure ring 140. At this time, stamping depth control blocks of different or the same size are placed in the first storage groove 142 and the second storage groove 231. After completion, the top of the upper die assembly 100 is connected to the stamping device drive equipment. The workpiece to be stamped is placed on the die 230 of the lower die assembly 200, and the stamping device drive equipment is started to complete the stamping.

[0029] Example 2: Elastic elements of different sizes, such as springs, are placed in the storage hole 131 of the connecting plate 130 as needed. After placement, the connecting plate 130 is fixedly connected to the upper die pad 120 with bolts. Then, the pressure ring 140 is connected to the limiting post 141 with bolts, thereby achieving a sliding connection between the pressure ring 140 and the upper die pad 120 through the limiting groove 121 and the limiting post 141. At this time, the lower end of the elastic element placed in the storage hole 131 protrudes from the connecting plate 130 and contacts the pressure ring 140. At this time, no stamping depth control blocks are placed in the first storage groove 142 or the second storage groove 231. After completion, the top of the upper die assembly 100 is connected to the stamping device drive equipment. The workpiece to be stamped is placed on the die 230 of the lower die assembly 200, and the stamping device drive equipment is started to complete the stamping.

[0030] Example 3: Without placing an elastic element in the placement hole 131 of the connecting plate 130, the connecting plate 130 is fixedly connected to the upper die pad 120 by bolts, and then the pressure ring 140 is connected to the limiting post 141 by bolts. Thus, the pressure ring 140 and the upper die pad 120 are slidably connected through the limiting groove 121 and the limiting post 141. At this time, the required stamping depth control blocks of different or the same size are placed in the first placement groove 142 and the second placement groove 231. After completion, the top of the upper die assembly 100 is connected to the stamping device drive equipment, the workpiece to be stamped is placed on the die 230 of the lower die assembly 200, the stamping device drive equipment is started, and the stamping is completed.

Claims

1. A stamping device, comprising: The upper die assembly (100) and the lower die assembly (200) are provided. The upper die assembly (100) is positioned above the lower die assembly (200), and both the top of the upper die assembly (100) and the bottom of the lower die assembly (200) can be connected to a stamping device drive. The device is characterized by further including a connecting plate (130) and a pressure ring (140). The upper mold assembly (100) includes an upper mold pad (120), a bottom sliding connection limiting post (141) of the upper mold pad (120), a pressure ring (140) that moves up and down along the limiting post (141), a connecting plate (130) is provided below the upper mold pad (120), a pressure ring (140) is provided below the connecting plate (130), and the connecting plate (130) is detachably connected to the upper mold pad (120). The connecting plate (130) is also provided with several storage holes (131), and elastic elements can be placed inside the storage holes (131). The lower die assembly (200) includes a lower die pad (220) and a die cavity (230). The die cavity (230) is fixedly connected above the lower die pad (220). Several second placement slots (231) are provided at other positions of the die cavity (230). The stamping depth control block can be placed in the second placement slots (231).

2. The apparatus according to claim 1, characterized in that, The upper die assembly (100) also includes an upper die holder (110) and a punch (150), wherein, The upper mold base (110) is fixedly connected to the lower end of the upper mold base (120). A punch (150) is fixedly installed below the upper mold base (120). Limiting grooves (121) are fixedly connected to both sides of the bottom of the upper mold base (120). Limiting posts (141) are provided on both sides of the top of the pressure ring (140) at positions corresponding to the projection of the limiting grooves (121). The top of the limiting posts (141) is restricted within the limiting grooves (121), and the pressure ring (140) is slidably connected to the limiting grooves (121) through the limiting posts (141). A through hole is provided on the pressure ring (140), and a through hole with the same projection as the through hole on the pressure ring (140) is provided on the connecting plate (130). The punch (150) passes through the through hole.

3. The apparatus according to claim 2, characterized in that, The lower die assembly (200) also includes a lower die base (210), wherein a lower die pad (220) is fixedly connected to the upper end of the lower die base (210), and the die position (230) corresponds to the position of the punch (150).

4. The apparatus according to claim 1, characterized in that, The storage hole (131) can accommodate elastic elements with different cross-sectional diameters and lengths.

5. The apparatus according to claim 1, characterized in that, The top surface of the pressure ring (140) is also provided with a first storage groove (142), in which a stamping depth control block can be placed.

6. The apparatus according to claim 1 or 5, characterized in that, The stamping depth control blocks placed in the first storage slot (142) and the second storage slot (231) can be selected at different heights.

7. The apparatus according to claim 1, characterized in that, The lower surface of the upper mold base (110) is provided with a guide post (111), and the upper surface of the lower mold base (210) is provided with a guide sleeve (211). The inner diameter of the guide sleeve (211) is larger than the diameter of the guide post (111), and the two are coaxially arranged.

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