Substrate configuration structure based on ventilation and base material protection
By setting a ventilated area and a protective strip on the substrate, the problem of warping and sticking of the substrate during high-temperature baking is solved, and uniform heating of the substrate and improvement of finished product quality are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 孙诗斐
- Filing Date
- 2025-05-08
- Publication Date
- 2026-04-28
AI Technical Summary
In the prior art, the substrate is prone to warping or sticking to adjacent steel strips during high-temperature baking due to airflow blowing directly towards the edges, affecting processing quality and finished product stability.
The substrate configuration structure employs a breathable zone and a protective strip. By setting protrusions and protective strips on the substrate, a breathable zone is formed to uniformly heat the substrate, and the protective strip is used to prevent warping and sticking, ensuring the flatness and stability of the substrate.
It achieves uniform heating and flatness of the substrate during high-temperature processing, avoiding warping and sticking, and improving the quality and precision of the finished product.
Smart Images
Figure CN224170625U_ABST
Abstract
Description
[Technical Field]
[0001] This invention provides a substrate configuration structure based on breathability and substrate protection, particularly a structure in which protrusions and protective strips are provided on the substrate to allow lateral ventilation during stacking, and the protective strips can be used to protect the substrate to prevent airflow from causing the substrate to warp or stick, thereby improving the stability and quality of the finished product. [Background Technology]
[0002] Sheet-shaped substrates are typically wound onto a strip of steel, which facilitates storage, stacking, and transportation. If the substrate needs to be exported for processing, curing, or heat treatment, it is exported along with the strip. The substrate can then be separated from the strip for further applications. Therefore, this process is often used for intermediate products such as printed circuit boards.
[0003] The existing bonding method for the substrate and steel strip usually involves setting protrusions on both sides of the steel strip, then attaching the substrate to the back of the steel strip, and setting side strips on both sides of the substrate corresponding to the steel strip so that after winding, the protrusions can allow for ventilation, and the side strips can raise the winding stack of the steel strip to prevent the substrate from sticking to the adjacent steel strip.
[0004] To improve heating efficiency, the substrate is usually heated by a high-temperature airflow during high-temperature baking. During the heating process, the substrate will soften and undergo molecular recombination due to its material properties, resulting in changes such as ripening or cyclization. When it softens, the airflow often blows directly towards its edges, causing the substrate to be lifted, warped, or peeled off by the steel strip, resulting in unevenness. There is also the concern that warping may cause it to stick to adjacent steel strips, which will seriously affect the quality of subsequent processing and finished products.
[0005] In view of this, this invention specifically studies and improves the protection and breathability configuration of the substrate, aiming to improve the above-mentioned problems with a better design. [Utility Model Content]
[0006] To address the aforementioned problems and achieve the above objectives, this invention provides a substrate configuration structure based on breathability and substrate protection, comprising: a substrate having a breathable area defined on both sides of a long end face and a load-bearing area defined on a long end face; the breathable area having a plurality of protrusions with gaps formed between dissimilar protrusions; a carrier correspondingly disposed in the load-bearing area; a substrate correspondingly disposed at one end of the carrier relative to the substrate; and two protective strips at least partially covering the side edge or top edge of the carrier, with the protective strips at least partially opposite the protrusions, so that when the substrate is in a wound state, the protrusions can at least partially abut against the protective strips.
[0007] According to the above-described substrate configuration structure based on breathability and substrate protection, the breathable area and the load-bearing area are located at different end faces of the substrate, and the load-bearing area is located at the middle of the substrate.
[0008] The substrate configuration structure based on breathability and substrate protection described above further includes two side strips, which correspond to the breathable area respectively and at least partially press against the protective strip on one side of the substrate.
[0009] According to the above-described substrate configuration structure based on breathability and substrate protection, the total thickness of the edge strip, the protective strip, and the protrusion is equal to or greater than the total thickness of the carrier and the substrate.
[0010] The substrate configuration structure based on breathability and substrate protection described above further includes two side strips, which correspond to the breathable area respectively. The protective strip is disposed at one end face of the side strip relative to the carrier, and the protective strip protrudes laterally from the side strip and correspondingly covers the upper edge of the side end of the carrier.
[0011] According to the above-described substrate configuration structure based on breathability and substrate protection, the substrate is smaller than the carrier in the short end direction of the substrate, so that a stepped surface is formed on both sides of the carrier in the long end direction, and the protective strip is correspondingly shielded at the stepped surface of the carrier.
[0012] The substrate configuration structure described above, based on breathability and substrate protection, wherein the substrate is a steel strip.
[0013] According to the above-described substrate configuration structure based on breathability and substrate protection, the carrier is copper foil.
[0014] According to the above-described substrate configuration structure based on breathability and substrate protection, the substrate is copper foil, aluminum, polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyethylene (PE), polyimide (PI), or liquid crystal polymer (LCP).
[0015] According to the above-described substrate configuration structure based on breathability and substrate protection, the protective strip is a PI (Polyimide) film, copper foil, or aluminum foil.
[0016] Based on the above explanation and settings, it is evident that this creation possesses the following main advantages and effects, which are detailed below:
[0017] 1. The design of this invention allows the substrate to form ventilated areas at both ends in the lateral direction. The carrier and substrate can be disposed on one end face of the substrate in the ventilated area. The protective strip can be pressed against both sides of the carrier at least partially. Finally, the protective strip can be pressed against the edge strip or the protrusion of the adjacent substrate. With this configuration, when the substrate is heated (e.g., cured, circulated, or annealed), the substrate assembled into a roll, together with the edge strip, carrier, substrate and protective strip, can be directly baked at high temperature. The hot airflow during baking can directly contact the substrate through the ventilated area of the rolled-up substrate, so that the substrate can be heated evenly. The setting of the protective strip can prevent the hot airflow from causing warping and unevenness on the edges of the carrier and substrate, or causing adhesion to adjacent substrates due to warping. This can ensure the flatness and stability of the substrate during the heating process, and improve the quality and precision of the finished product. [Attached Image Description]
[0018] Figure 1 This is a top-down view of the artwork.
[0019] Figure 2 This is a cross-sectional view of Figure 1 at position A-A.
[0020] Figure 3 This is a cross-sectional view and usage diagram of the work created on a stack.
[0021] Figure 4 This is a cross-sectional schematic diagram of another embodiment of the invention.
[0022] Figure 5 This is a cross-sectional view and usage diagram of another embodiment of this invention in a stack.
[0023] [Symbol Explanation]
[0024] 1:Substrate
[0025] 11: Breathable area
[0026] 111: Togaki
[0027] 12: Passenger Area
[0028] 2: Carrier
[0029] 21: Step surface
[0030] 3: Substrate
[0031] 4: Protective strip
[0032] 5: Edge strip
Detailed Implementation Methods
[0033] This invention discloses a substrate configuration structure based on breathability and substrate protection. Its implementation methods, characteristics and effects are described in detail below with several preferred embodiments and accompanying drawings, so that you can understand and agree with this invention.
[0034] First, please refer to Figure 1 and Figure 2 As shown, this invention discloses a substrate configuration structure based on breathability and substrate protection, which includes:
[0035] A substrate 1 has a ventilation area 11 defined on both sides of a long end face, and a loading area 12 defined on a long end face. The ventilation area 11 is provided with a plurality of protrusions 111, and gaps are formed between different protrusions 111. The protrusions 111 can be formed by injection, extrusion or dotting, and can be formed into a conical, columnar, arc-shaped, sheet-like or geometric shape as required. Preferably, they are columnar or arc-shaped. In one embodiment, the substrate 1 can be configured as a strip and can be wound and stacked. For example, it can be configured as a steel strip. This is only an example and is not intended to limit the scope.
[0036] A carrier 2 is correspondingly disposed in the carrying area 12; in a specific embodiment, the carrying area 12 may be located between the venting areas 11, and may be located on the same end face of the venting areas 11, or may be located on the end face opposite to the venting areas 11. Preferably, the venting areas 11 and the carrying area 12 are located on different end faces of the substrate 1, and the carrying area 12 is located in the middle of the substrate 1, while the carrier 2 may be disposed within the carrying area 12.
[0037] A substrate 3 is disposed at one end of the carrier 2 relative to the substrate 1. In one embodiment, the substrate 3 can be any material that needs to undergo a property change through heating (e.g., aging, cyclization, annealing, etc.) and can be output or produced after heating for use as a final or intermediate product. Therefore, the substrate 3 can be a metal or polymer material, such as copper foil, aluminum, polyethylene terephthalate (PET), polyvinyl chloride (PVC), polyethylene (PE), polyimide (PI), or liquid crystal polymer (LCP), etc. This is only an example and is not intended to limit the application. The substrate 3 is mainly supported by the carrier 2, and the carrier 2 can be configured with a corresponding material according to the material of the substrate 3. In one embodiment, the carrier 2 can be copper foil, which has high heat resistance and facilitates the loading and removal of the substrate 3 after processing. This is only an example and is not intended to limit the application.
[0038] Two protective strips 4, which at least partially cover the side edge or the upper edge of both sides of the carrier 2, and the protective strips 4 are at least partially opposite the protrusions 111, so that when the substrate 1 is in a wound state, the protrusions 111 can at least partially abut against the protective strips 4; and the protective strips 4 in one embodiment can be configured as PI (Polyimide) film, copper foil or aluminum foil, which is only an example and is not limited;
[0039] In this way, such as Figure 2 and Figure 3 As shown, substrate 1, carrier 2, substrate 3, and protective strip 4 can be transferred through a winding device (not shown) to form a structure as shown. Figure 2 The structure shown, after being wound up in multiple layers, can be stacked as follows: Figure 3 As shown, after being wound and stacked, the substrate 3 can be placed in an oven (not shown) for high-temperature baking, thereby allowing the substrate 3 to undergo property changes such as curing, cyclization, and annealing as described above. Due to the flow of high-temperature gas inside the oven, and in accordance with the design of the protrusion 111, the airflow can enter laterally between the stacked substrates 1 through the ventilation area 11, allowing it to directly contact the surface of the substrate 3. This allows the substrate 3 to be heated evenly and improves the efficiency of air convection. Furthermore, it can be heated or cooled evenly during or after the heating process, preventing the substrate 3 from becoming uneven due to uneven heating or cooling. In addition, because the protective strip 4 covers the side edge of the carrier 2, the airflow cannot directly act on the side of the carrier 2 during flow, effectively preventing the carrier 2 from causing the substrate 3 to warp and become uneven due to the flow force of the airflow, or causing it to stick to the adjacent substrate 1 due to warping. This effectively maintains the quality, flatness, and integrity of the substrate 3.
[0040] Regarding the thickness configuration of the protective strip 4, to prevent the substrate 3 from sticking to the adjacent substrate 1 during stacking, the total thickness of the protrusion 111 and the protective strip 4 is greater than the total thickness of the carrier 2 and the substrate 3. Furthermore, to facilitate the protective strip 4 in shielding the carrier 2 without shielding the substrate 3, thus avoiding uneven heating of the substrate 3, the substrate 3 is smaller than the carrier 2 at the short end of the substrate 1, thereby forming a stepped surface 21 on both sides of the carrier 2 at the long end. The protective strip 4 correspondingly shields the stepped surface 21 of the carrier 2. The thickness of the protective strip 4 can be selectively configured according to requirements or the thickness of the substrate 3. In one embodiment, the thickness of the protective strip 4 can be equal to, greater than, or less than the thickness of the substrate 3, so that when the airflow passes through, it does not directly act on the side of the substrate 3, preventing the substrate 3 from warping against the carrier 2 and causing unevenness or sticking, thus ensuring the quality of the substrate 3.
[0041] Regarding the shielding of the carrier 2 by the protective strip 4, to prevent the protective strip 4 itself from warping due to airflow, it is understood that in one embodiment, the protective strip 4 can be directly pressed and positioned by the protrusion 111. In a preferred embodiment, the invention further provides two side strips 5, which correspond to the ventilation area 11 respectively and at least partially press against the side of the protective strip 4 relative to the substrate 3. Similarly, to prevent the substrate 3 from sticking during winding, the total thickness of the side strips 5, the protective strip 4, and the protrusion 111 is equal to or greater than the total thickness of the carrier 2 and the substrate 3. In this way, when the substrate 1 is wound and stacked, the protective strip 4 can be reliably pressed against by the side strips 5, so regardless of the size of the airflow, there is no... The method allows the protective strip 4 to be lifted or warped under force. In addition, the edge strip 5 also serves as a guide, preventing it from directly acting on the side of the substrate 3. This ensures that the protective strip 4, substrate 3, and carrier 2 will not warp or stick in the oven. This not only improves the processing quality, flatness, and integrity of the substrate 3, but also ensures that the substrate 3, carrier 2, and protective strip 4 can be separated effectively and reliably without deviation caused by warping during separation and winding. This ensures that the substrate 1, carrier 2, and protective strip 4 can be accurately positioned for subsequent reuse, improving the accuracy of subsequent repeated processing, and enhancing the smoothness and stability of the overall process, as well as the quality and precision of the finished product.
[0042] In another embodiment, such as Figure 4 , 5 As shown, the protective strip 4 is disposed on one end face of the edge strip 5 relative to the carrier 2, and the protective strip 4 protrudes laterally from the edge strip 5, correspondingly covering the upper edge of the side end of the carrier 2. Therefore, in one embodiment, the width of the protective strip 4 can be greater than the width of the edge strip 5, so that the protective strip 4 is located at the stepped surface 21. In this embodiment, the protective strip 4 does not directly contact the carrier 2, but is located at the upper edge of the side end of the carrier 2. This arrangement is as follows: Figure 5 As shown, the protective strip 4 can guide the airflow and prevent the airflow from directly acting on the edge of the carrier 2. Even if the edge of the carrier 2 is lifted, it can still be blocked by the protective strip 4, so that the substrate 3 will not be lifted by the carrier 2 and cause the substrate 3 to warp or stick. In this way, the quality of the finished product can be ensured.
[0043] The above description is only a preferred embodiment of this invention and should not be construed as limiting the scope of this invention. All equivalent changes and modifications made in accordance with the scope of the patent application and the contents of the specification of this invention should still fall within the scope of the patent application of this invention.
Claims
1. A substrate configuration structure based on breathability and substrate protection, characterized in that, Include: A substrate has a venting area defined on both sides of a long end face and a loading area defined on a long end face; the venting area is provided with a plurality of protrusions, and gaps are formed between different protrusions. A carrier, which is correspondingly located in the passenger area; A substrate, which is disposed at one end of the carrier relative to the substrate; and Two protective strips, each at least partially covering the side or top edge of the carrier, and at least partially opposite the protrusion, so that when the substrate is in a wound state, the protrusion can at least partially abut against the protective strip.
2. The substrate configuration structure based on breathability and substrate protection as described in claim 1, characterized in that, The venting area and the carrying area are located at opposite end faces of the substrate, and the carrying area is located in the middle of the substrate.
3. The substrate configuration structure based on breathability and substrate protection as described in claim 1, characterized in that, It further includes two side strips, each corresponding to the breathable area, and at least partially pressing against one side of the protective strip relative to the substrate.
4. The substrate configuration structure based on breathability and substrate protection as described in claim 3, characterized in that, The combined thickness of the edge strip, the protective strip, and the protrusion is equal to or greater than the combined thickness of the carrier and the substrate.
5. The substrate configuration structure based on breathability and substrate protection as described in claim 1, characterized in that, It also includes two side strips, which correspond to the breathable area respectively. The protective strip is disposed at one end face of the side strip relative to the carrier, and the protective strip protrudes laterally from the side strip and covers the upper edge of the side end of the carrier.
6. The substrate configuration structure based on breathability and substrate protection as described in claim 1, characterized in that, The substrate is smaller than the carrier in the short end direction of the substrate, so that a stepped surface is formed on both sides of the carrier in the long end direction, and the protective strip is correspondingly covered on the stepped surface of the carrier.
7. The substrate configuration structure based on breathability and substrate protection as described in any one of claims 1 to 6, characterized in that, The substrate is made of steel strip.
8. The substrate configuration structure based on breathability and substrate protection as described in any one of claims 1 to 6, characterized in that, The carrier is copper foil.
9. The substrate configuration structure based on breathability and substrate protection as described in any one of claims 1 to 6, characterized in that, The substrate can be copper foil, aluminum, polyethylene terephthalate, polyvinyl chloride, polyethylene, polyimide, or liquid crystal polymer.
10. The substrate configuration structure based on breathability and substrate protection as described in any one of claims 1 to 6, characterized in that, The protective strip is made of polyimide, film, copper foil, or aluminum foil.