Edge calculation box

Abstract

The utility model relates to an edge computing box, which comprises a shell and a circuit board assembly arranged in the shell, a computing chip is arranged on the circuit board assembly, the computing chip is contacted with the lower surface of a top plate of the shell, a plurality of radiating fins are arranged on the top plate at least on the reverse side of a chip contact area side by side at intervals, and a plurality of radiating fins are arranged on the radiating fins. A cooling fan is arranged on the upper surface of the top plate, and an air outlet of the cooling fan faces the gaps of the multiple cooling fins. The computing chip is in direct contact with the lower surface of the top plate of the shell, so that a heat transfer path is shortened, thermal resistance is reduced, heat generated by the computing chip can be quickly transferred to the radiating fins on the top plate, the radiating fan on the upper surface of the top plate is matched, and an air outlet of the radiating fan directly faces a gap between the fins to realize active air-cooling radiating; the heat on the fins can be quickly transferred to the surrounding environment, so that the computer is quickly cooled.

Description

Technical Field

[0001] This utility model belongs to the field of edge computing technology, and in particular relates to an edge computing box. Background Technology

[0002] With the rapid development of artificial intelligence and Internet of Things technologies, edge computing devices are playing a crucial role in the intelligent upgrading of vertical industries. Among them, edge computing boxes, as the core node connecting front-end sensing devices and the cloud, have expanded their application scenarios from traditional industrial fields to multiple industries.

[0003] In the field of production safety, edge computing boxes are widely used in scenarios such as power line inspection, chemical plant monitoring, coal mine underground operation monitoring, and transportation hub safety management. Their core function is to collect video data in real time by connecting to cameras and use built-in AI algorithms to intelligently analyze the images (such as identifying equipment malfunctions, personnel violations, and environmental risks), thereby replacing manual inspections and significantly improving work efficiency and the level of intelligent safety management. Furthermore, the application scenarios of edge computing boxes extend to smart property management (such as community security monitoring), smart urban management (such as street vendor identification), smart canteens (such as food hygiene monitoring), smart construction sites (such as construction standard supervision), smart campuses (such as student safety early warning), and smart parks (such as equipment energy consumption management), becoming an important tool for promoting the digital transformation of various industries.

[0004] However, the efficient operation of edge computing boxes relies on the high-load computing power of internal computing chips (such as GPUs and NPUs), which generate a lot of heat during operation. If the heat cannot be dissipated in time, the chip temperature will rise, causing performance degradation or even failure, seriously affecting the stability and analysis efficiency of the device.

[0005] Currently, some edge computing boxes use passive heat dissipation methods based on natural cooling. For example, Chinese patent application No. 202221299247.4 (publication date August 30, 2022) discloses an image recognition edge computing box that uses the upward movement of hot air to transfer heat to the top shell, which then dissipates the heat through heat sinks. This method has very limited heat dissipation effect. When the computing chip generates heat at a rate exceeding the passive heat dissipation capacity due to high computing power requirements (such as real-time analysis of 4K video and parallel processing of data from multiple cameras), the heat dissipation effect drops significantly, failing to cool the computing chip quickly, thus affecting the continuous and stable operation of the device and the normal functioning of intelligent analysis. Utility Model Content

[0006] Based on this, an edge computing box is provided to address the aforementioned technical problems.

[0007] The technical solution adopted in this utility model is as follows:

[0008] An edge computing box includes a housing and a circuit board assembly disposed within the housing, the circuit board assembly having a computing chip, characterized in that the computing chip is in contact with the lower surface of a top plate of the housing, the top plate has a plurality of heat dissipation fins arranged side by side at intervals on at least the opposite side of the chip contact area, and a cooling fan is provided on the upper surface of the top plate, the air outlet of the cooling fan facing the gap between the plurality of heat dissipation fins.

[0009] The computing chip of this invention directly contacts the lower surface of the top plate of the casing, shortening the heat transfer path and reducing thermal resistance. This allows the heat generated by the computing chip to be quickly transferred to the heat sink fins on the top plate. Combined with the cooling fan on the upper surface of the top plate, whose exhaust vent faces the gaps between the fins, active air cooling is achieved, rapidly transferring heat from the fins to the surrounding environment, thus quickly cooling the computing system. Experimental data shows that under the same chip load conditions (such as real-time 4K video analysis and parallel processing of 8 cameras), the heat dissipation efficiency of this solution is 40%-60% higher than that of passive cooling methods. It can stably control the operating temperature of the computing chip below 70℃ (traditional passive cooling easily rises to above 90℃), effectively avoiding chip throttling or system crashes caused by overheating. Attached Figure Description

[0010] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments:

[0011] Figure 1 A three-dimensional structural diagram of an edge computing box from the front view, provided for an embodiment of this utility model;

[0012] Figure 2 A three-dimensional structural diagram of an edge computing box from a rear view, provided for an embodiment of this utility model;

[0013] Figure 3 This is a schematic diagram of the groove structure according to an embodiment of the present utility model;

[0014] Figure 4 This is an exploded view of the installation structure of the cooling fan according to an embodiment of the present utility model;

[0015] Figure 5 This is a schematic diagram of the cover plate according to an embodiment of the present utility model;

[0016] Figure 6 A schematic diagram of the internal structure of an edge computing box provided in an embodiment of this utility model;

[0017] Figure 7 This is a vertical sectional view of an embodiment of the present utility model. Detailed Implementation

[0018] The embodiments of this utility model will be described below with reference to the accompanying drawings. It should be noted that the embodiments described in this specification are not exhaustive and do not represent the only embodiments of this utility model. The following corresponding embodiments are only for clearly illustrating the utility model content of this patent and are not intended to limit its implementation. For those skilled in the art, different variations and modifications can be made based on the described embodiments. Any obvious variations or modifications that fall within the technical concept and utility model content of this utility model are also within the protection scope of this utility model.

[0019] like Figure 1 and Figure 6 As shown, this application embodiment provides an edge computing box, including a housing 1100 and a circuit board assembly 1200 disposed within the housing 1100.

[0020] like Figure 1 , Figure 2 and Figure 6 As shown, the outer shell 1100 is composed of a top plate 1110, left and right side plates 1120, a front panel 1130, a rear panel 1140 and a bottom plate 1150. The top plate 1110 and the left and right side plates 1120 are integrally connected and form an inverted U-shape. The front panel 1130, the rear panel 1140 and the bottom plate 1150 are fixed to the top plate 1110 and the left and right side plates 1120 by bolts.

[0021] The upper surface of the top plate 1110 is covered with multiple heat dissipation fins 1111. The multiple heat dissipation fins 1111 are arranged side by side and spaced apart along the left and right directions of the outer shell 1100. The length direction of the heat dissipation fins 1111 is the front and back direction of the outer shell 1100.

[0022] like Figure 3 As shown, among the multiple heat dissipation fins 1111, the front part of the middle heat dissipation fins 1111 has a break, exposing the upper surface of the top plate 1110, forming a groove 1112. The break of the multiple heat dissipation fins 1111 has a notch, thus forming a step 1112a at the top of the groove 1112, as shown. Figure 4 As shown, a cooling fan 1113 is installed in the groove 1112. The cooling fan 1113 is fixed to the top plate 1110 by bolts. A cover plate 1114 is installed on the step 1112a. The cover plate 1114 is fixed to the top plate 1110 by bolts and has an air inlet hole 1114a. See [reference needed] Figure 5 .

[0023] Among them, cooling fan 1113 is a centrifugal fan with its air inlet facing upwards, allowing air to enter through air inlet 1114a, such as Figure 4 As shown, the air outlet 1113a of the cooling fan 1113 faces the gap between the multiple cooling fins 1111 on the rear side.

[0024] Both left and right side panels 1120 have multiple heat dissipation fins arranged side-by-side at intervals, and both are fixed to mounting brackets 1121 by bolts. The mounting brackets 1121 have mounting holes. (See attached image.) Figure 1 In addition, two antenna mounts 1300 are provided on the left side plate 1120, see [reference]. Figure 2 .

[0025] like Figure 1 As shown, the front panel 1130 has a notch for mounting the display screen 1400 and exposing terminals located on the front side of the circuit board assembly 1200. The position of the notch is determined by the position of the display screen and the terminals, wherein, as... Figure 6 As shown, the display screen 1400 is fixed to a slot by the screen bracket 1410. The other slots are basically the same size and shape as the corresponding terminals to prevent a large amount of external dust from entering the device cavity.

[0026] Display screen 1400 is used to display device status information, such as IP address, system status, error codes, etc.

[0027] like Figure 2 As shown, the rear panel 1140 is provided with four antenna females 1300 and has slots for exposing the terminals located on the rear side of the circuit board assembly 1200. The slots are basically the same size and shape as the corresponding terminals to prevent a large amount of external dust from entering the device cavity.

[0028] like Figure 6 As shown, multiple limiting grooves are evenly arranged on the base plate 1150, and shock-absorbing pads 1151 are installed in the limiting grooves. These pads are made of soft rubber, which is beneficial for the shock absorption of the entire equipment.

[0029] like Figure 6 As shown, the circuit board assembly 1200 includes a PCBA baseboard 1210 and a PCBA computing board 1220.

[0030] The PCBA base plate 1210 is fixed to the top plate 1110 by bolts. It has multiple terminals, which are arranged on the front and rear sides of the base plate 1210. The types of terminals include USB, indicator light, switch, power, system debugging, reset, audio, video, network port, storage, SIM card socket, etc.

[0031] The computing board 1220 is mounted on the PCBA baseboard 1210 via a connector and forms an electrical connection. It is equipped with a computing chip 1221 and a temperature sensor, which is used to detect the temperature around the computing chip 1221.

[0032] Among them, such as Figure 7As shown, the computing chip 1221 is in contact with the lower surface of the top plate 1110. The chip contact area is located behind the groove 1112 and the cooling fan 1113. It can be seen that the groove 1112 and the chip contact area are arranged back and forth along the length of the heat dissipation fins 1111.

[0033] During operation, the computing chip 1221 starts generating heat. This heat is transferred through the chip contact area to the entire top plate 1110 and the left and right side plates 1120, especially to the heat sink fins 1111 on the reverse side of the chip contact area directly opposite the computing chip 1221. The cooling fan 1113 quickly transfers the heat from the heat sink fins 1111 to the surrounding environment, achieving rapid cooling of the computing chip 1221. The speed of the cooling fan 1113 can be intelligently adjusted based on feedback from the temperature sensor, reducing noise while ensuring effective heat dissipation. It is understandable that multiple heat sink fins 1111 could also be placed only on the reverse side of the chip contact area.

[0034] As can be seen from the above, the edge computing box provided in this application embodiment has its computing chip directly contacting the lower surface of the top plate of the casing, shortening the heat transfer path and reducing thermal resistance. This allows the heat generated by the computing chip to be quickly transferred to the heat dissipation fins on the top plate. Combined with the cooling fan on the upper surface of the top plate, whose exhaust vent faces the gaps between the fins, active air cooling is achieved, rapidly transferring the heat from the fins to the surrounding environment, thus quickly cooling the computing system. Experimental data shows that under the same chip load conditions (such as real-time 4K video analysis and parallel processing of 8 cameras), the heat dissipation efficiency of this solution is 40%-60% higher than that of passive cooling methods. It can stably control the operating temperature of the computing chip below 70℃ (traditional passive cooling easily rises to above 90℃), effectively avoiding chip frequency throttling or system crashes caused by overheating.

[0035] Meanwhile, the edge computing box provided in this application embodiment is fully functional and highly integrated, with terminals for power supply, system debugging, reset, antenna, audio, video, network port, storage, SIM card communication, USB, switch, and display screen, and has a wide range of applications; the circuit board assembly adopts a split board design, which is convenient for maintenance: when the peripheral interface on the PCBA baseboard is damaged, only the PCBA baseboard needs to be replaced, or when there is a need for customization of the shell and interface, only the corresponding PCBA baseboard needs to be customized.

[0036] In addition, it has an LCD screen display function, which facilitates product deployment and maintenance (especially the display of IP address, system status and error code intuitive prompts), while existing edge computing boxes only have LED status displays, which are not intuitive.

[0037] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. An edge computing box, comprising a housing and a circuit board assembly disposed within the housing, the circuit board assembly having a computing chip, characterized in that, The computing chip is in contact with the lower surface of the top plate of the housing. The top plate has a plurality of heat dissipation fins arranged side by side at intervals on at least the opposite side of the chip contact area. A cooling fan is provided on the upper surface of the top plate, and the air outlet of the cooling fan faces the gap between the plurality of heat dissipation fins.

2. The edge computing box according to claim 1, characterized in that, The plurality of heat dissipation fins cover the upper surface of the top plate, and grooves for accommodating the cooling fan are formed on the plurality of heat dissipation fins. The grooves and the chip contact area are arranged back and forth along the length of the heat dissipation fins, and the air inlet of the cooling fan faces upward and is fixed in the groove.

3. An edge computing box according to claim 2, characterized in that, The top of the groove has a step, and a cover plate is provided on the step. The cover plate is fixed to the top plate and has an air inlet.

4. An edge computing box according to claim 3, characterized in that, The length direction of the heat dissipation fins is the front-to-back direction of the outer shell, and the plurality of heat dissipation fins are arranged side by side at intervals along the left-to-right direction of the outer shell.

5. An edge computing box according to claim 4, characterized in that, The left and right side panels of the outer casing each have multiple heat dissipation fins arranged side by side at intervals.

6. An edge computing box according to claim 1, characterized in that, The left and right side panels of the housing are provided with mounting brackets, and one of the side panels is provided with an antenna mount.

7. An edge computing box according to claim 1, characterized in that, The front panel of the housing has a display screen and exposes terminals located on the front side of the circuit board assembly.

8. An edge computing box according to claim 1, characterized in that, The rear panel of the housing is provided with an antenna socket and exposes terminals located on the rear side of the circuit board assembly.

9. An edge computing box according to claim 1, characterized in that, Multiple shock-absorbing pads are evenly arranged on the bottom plate of the outer casing.

10. An edge computing box according to claim 1, characterized in that, The circuit board assembly includes a base plate and a computing board. The base plate has multiple terminals arranged on the front and rear sides of the base plate. The computing board is mounted on the base plate and has a computing chip and a temperature sensor on it.

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