Display substrate and display device

Abstract

The utility model discloses a display substrate and a display device. The high-temperature-resistant and high-humidity-resistant performance of a display product can be improved. The display substrate comprises a substrate layer, the substrate layer comprises a display area and a non-display area, the non-display area comprises a first area, a second area and a third area, the first area is located between the display area and the second area, the second area is located between the first area and the third area, and the first area is used for bending the display substrate; the pixel circuit is arranged in the display area; the electrostatic protection circuit and the test module are arranged in the second area, and the electrostatic protection circuit is electrically connected with the driving signal line; the test module is electrically connected with the pixel circuit, and the test module is located between the first area and the electrostatic protection circuit; the binding pin is arranged in the third area, the two ends of the driving signal line are electrically connected with the pixel circuit and the binding pin respectively, and the electrostatic protection circuit is located between the test module and the binding pin; the inorganic protection layer comprises a first hollow, and the orthographic projection of the first hollow on the substrate layer falls into the first area.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display substrate and a display device. Background Technology

[0002] Currently, with the continuous development of display technology, the consumer market has increasingly higher performance demands for display products. Different regions have varying environmental temperatures and humidity levels due to their geographical location, resulting in different lifespan requirements for display products. In high-temperature and high-humidity climates, display products are susceptible to corrosion and damage from moisture. Therefore, display products in high-temperature and high-humidity climates generally require higher temperature and humidity resistance to ensure that the screen can function normally and maintain good display quality and stability under harsh climatic conditions.

[0003] However, existing display products often exhibit display defects due to water and oxygen corrosion before the test cycle is completed in high temperature and high humidity reliability tests. In other words, existing products have poor resistance to water and oxygen corrosion in high temperature and high humidity reliability tests. Utility Model Content

[0004] This disclosure provides a display substrate, driving method, controller, and display device, which can improve the water and oxygen corrosion resistance of display products, thereby improving the high temperature and high humidity resistance of display products and enhancing the reliability of display products.

[0005] A first aspect of this disclosure provides a display substrate, comprising:

[0006] A substrate layer, the substrate layer including a display area and a non-display area, the non-display area including a first area, a second area and a third area, the first area being located between the display area and the second area, the second area being located between the first area and the third area, and the first area being used for bending the display substrate;

[0007] Pixel circuitry is disposed in the display area;

[0008] Drive signal lines;

[0009] An electrostatic discharge (ESD) protection circuit is disposed in the second region, and the ESD protection circuit is electrically connected to the drive signal line;

[0010] A test module is disposed in the second region, the test module is electrically connected to the pixel circuit, and the test module is located between the first region and the electrostatic protection circuit;

[0011] A bonding pin is provided in the third region. The two ends of the drive signal line are electrically connected to the pixel circuit and the bonding pin, respectively. The electrostatic protection circuit is located between the test module and the bonding pin.

[0012] An inorganic protective layer is disposed on the side of the pixel circuit, the electrostatic protection circuit and the test module away from the substrate layer. The inorganic protective layer includes a first cutout, the orthographic projection of the first cutout on the substrate layer falling into the first region.

[0013] In some embodiments, the testing module includes a pixel testing unit and a crack testing unit, the pixel testing unit being electrically connected to the pixel circuit, and the crack testing unit being electrically connected to a crack detection line located in the non-display area.

[0014] In some embodiments, the crack testing unit is located between the pixel testing unit and the electrostatic protection circuit; and / or,

[0015] The pixel testing unit includes test pins and / or a test circuit, wherein the test circuit is connected between the pixel circuit and the test pins, and the test pins are used to receive test signals provided by the test fixture; and / or

[0016] The crack testing unit includes a crack detection circuit, which is electrically connected to the crack detection line; and / or,

[0017] The drive signal lines include data signal lines.

[0018] In some embodiments, the display substrate further includes:

[0019] A drive signal line adapter via is provided, wherein the adapter via is located between the electrostatic protection circuit and the bonding pin, or the adapter via is located between the electrostatic protection circuit and the test module;

[0020] The drive signal line includes a first signal line segment and a second signal line segment. The first signal line segment and the second signal line segment are electrically connected through the drive signal line adapter via. The first signal line segment and the second signal line segment are respectively disposed on different conductive layers.

[0021] In some embodiments, the display substrate further includes:

[0022] The first constant voltage signal line and the adjustable level signal line are connected, the protection terminal of the electrostatic protection circuit is electrically connected to the drive signal line, the positive terminal of the electrostatic protection circuit is electrically connected to the first constant voltage signal line, and the negative terminal of the electrostatic protection circuit is electrically connected to the adjustable level signal line.

[0023] The voltage value of the adjustable level signal transmitted by the adjustable level signal line is used to adjust according to the voltage value of the drive signal transmitted by the drive signal line, and the voltage value of the first constant voltage signal transmitted by the first constant voltage signal line is greater than the voltage value of the adjustable level signal.

[0024] In some implementations, the adjustable level signal is positively correlated with the voltage value of the drive signal.

[0025] In some embodiments, the second region is provided with a first constant voltage connection line and an adjustable signal connection line. The electrostatic protection circuit is electrically connected to the first constant voltage signal line through the first constant voltage connection line, and the electrostatic protection circuit is electrically connected to the adjustable level signal line through the adjustable signal connection line.

[0026] The length extension direction of the first constant voltage connection line is the same as the length extension direction of the adjustable signal connection line, and the length extension direction of the first constant voltage connection line intersects with the length extension direction of at least a portion of the drive signal lines.

[0027] In some embodiments, the length extension direction of the first constant voltage connection line intersects with the length extension direction of the first constant voltage signal line;

[0028] The electrostatic discharge (ESD) protection circuit includes multiple ESD protection devices, at least some of which are located between the first constant voltage connection line and the adjustable signal connection line.

[0029] In some embodiments, the first constant voltage signal line is connected to at least two first constant voltage signal connection lines, and the electrostatic protection circuit is located between at least two first constant voltage signal connection lines; and / or,

[0030] The adjustable signal connection line is located between at least two of the first constant voltage signal connection lines.

[0031] In some embodiments, the first constant voltage signal connection line and the adjustable signal connection line are disposed on the same conductive layer; and / or,

[0032] The orthographic projection of the first constant voltage signal connection line on the substrate overlaps with the orthographic projection of the electrostatic protection circuit on the substrate; and / or,

[0033] The orthographic projection of the adjustable signal connection line on the substrate overlaps with the orthographic projection of the electrostatic protection circuit on the substrate.

[0034] In some embodiments, the electrostatic discharge (ESD) protection circuit includes a plurality of ESD protection devices, at least some of which are located between adjacent drive signal lines.

[0035] In some embodiments, the display substrate further includes:

[0036] An organic insulating layer includes a second perforation, wherein the orthographic projection of the second perforation on the substrate layer does not overlap with the orthographic projection of the electrostatic protection circuit on the substrate layer, and the inorganic protective layer covers the second perforation;

[0037] The orthographic projection of the second cutout on the substrate surrounds the orthographic projection of the electrostatic protection circuit on the substrate.

[0038] In some embodiments, the display substrate further includes:

[0039] The system includes a first constant voltage signal line, an adjustable level signal line, a first constant voltage connection line, and an adjustable signal connection line. The electrostatic protection circuit is electrically connected to the first constant voltage signal line via the first constant voltage connection line, and the electrostatic protection circuit is electrically connected to the adjustable level signal line via the adjustable signal connection line.

[0040] The orthographic projection of the second cutout on the substrate surrounds the orthographic projections of at least a portion of the first constant voltage connection line and at least a portion of the adjustable signal connection line on the substrate.

[0041] In some embodiments, the organic insulating layer includes an organic planarization layer and a pixel defining layer, and an inorganic insulating layer is disposed between the substrate layer and the organic insulating layer;

[0042] The second perforation penetrates the organic insulating layer, and the second perforation exposes at least a portion of the surface of the inorganic insulating layer.

[0043] In some embodiments, the display substrate further includes:

[0044] A first organic protective layer is disposed on the side of the inorganic protective layer away from the substrate layer, and the orthographic projection of the first organic protective layer on the substrate layer does not overlap with the first region.

[0045] A second organic protective layer covers the first region and the edge of the first organic protective layer is wrapped around it.

[0046] The thickness of the second organic protective layer is greater than the thickness of the first organic protective layer.

[0047] A display substrate, comprising:

[0048] Pixel circuit;

[0049] The drive signal line is electrically connected to the pixel circuit.

[0050] An electrostatic discharge (ESD) protection circuit, wherein the protection terminal of the ESD protection circuit is electrically connected to the drive signal line;

[0051] The first constant voltage signal line is electrically connected to the positive terminal of the electrostatic protection circuit;

[0052] An adjustable level signal line is electrically connected to the negative terminal of the electrostatic protection circuit. The voltage value of the adjustable level signal transmitted by the adjustable level signal line is used to adjust the voltage value of the drive signal transmitted by the drive signal line. The voltage value of the first constant voltage signal transmitted by the first constant voltage signal line is greater than the voltage value of the adjustable level signal.

[0053] The bonding pin is electrically connected to the drive signal line.

[0054] In some implementations, the adjustable level signal is positively correlated with the voltage value of the drive signal.

[0055] In some embodiments, the display substrate further includes: a first constant voltage connection line and an adjustable signal connection line;

[0056] The electrostatic protection circuit is electrically connected to the first constant voltage signal line through the first constant voltage connection line, and the electrostatic protection circuit is electrically connected to the adjustable level signal line through the adjustable signal connection line.

[0057] The length extension direction of the first constant voltage connection line is the same as the length extension direction of the adjustable signal connection line, and the length extension direction of the first constant voltage connection line intersects with the length extension direction of at least a portion of the drive signal line.

[0058] The length extension direction of the first constant voltage connection line intersects with the length extension direction of the first constant voltage signal line;

[0059] The electrostatic discharge (ESD) protection circuit includes multiple ESD protection devices, at least some of which are located between the first constant voltage connection line and the adjustable signal connection line.

[0060] In some embodiments, the first constant voltage signal line is connected to at least two first constant voltage signal connection lines, and the electrostatic protection circuit is located between at least two first constant voltage signal connection lines; and / or,

[0061] The adjustable signal connection line is located between at least two of the first constant voltage signal connection lines.

[0062] In some embodiments, the display substrate includes:

[0063] Substrate layer and multiple conductive layers;

[0064] The first constant voltage signal connection line and the adjustable signal connection line are disposed on the same conductive layer; and / or,

[0065] The orthographic projection of the first constant voltage signal connection line on the substrate overlaps with the orthographic projection of the electrostatic protection circuit on the substrate; and / or,

[0066] The orthographic projection of the adjustable signal connection line on the substrate overlaps with the orthographic projection of the electrostatic protection circuit on the substrate.

[0067] In some embodiments, the electrostatic discharge (ESD) protection circuit includes a plurality of ESD protection devices, at least some of which are located between adjacent drive signal lines.

[0068] In some embodiments, the display substrate includes:

[0069] A substrate layer includes a display area and a non-display area. The pixel circuit is disposed in the display area, and the non-display area surrounds the display area. The non-display area includes a first area, a second area, and a third area. The first area is located between the display area and the second area, and the second area is located between the first area and the third area. The first area is used for bending the display substrate. The electrostatic protection circuit is disposed in the second area, and the bonding pins are disposed in the third area.

[0070] The test module is electrically connected to the pixel circuit. The test module is located in the second region. The test module is located between the first region and the electrostatic discharge protection circuit. The electrostatic discharge protection circuit is located between the test module and the bonding pin.

[0071] In some embodiments, the display substrate includes:

[0072] A substrate layer, the substrate layer including a display area and a non-display area, the non-display area surrounding the display area, the pixel circuit being disposed in the display area, and the electrostatic protection circuit and the bonding pins being disposed in the non-display area;

[0073] An organic insulating layer includes a second perforation, wherein the orthographic projection of the second perforation on the substrate layer does not overlap with the orthographic projection of the electrostatic protection circuit on the substrate layer, and the orthographic projection of the second perforation on the substrate layer surrounds the orthographic projection of the electrostatic protection circuit on the substrate layer.

[0074] In some embodiments, the display substrate further includes:

[0075] An inorganic protective layer, wherein the inorganic protective layer covers the second perforation;

[0076] First constant voltage connection line and adjustable signal connection line;

[0077] The orthographic projection of the second cutout on the substrate surrounds at least a portion of the orthographic projection of the first constant voltage connection line and at least a portion of the adjustable signal connection line on the substrate.

[0078] In some embodiments, the organic insulating layer includes an organic planarization layer and a pixel defining layer, and an inorganic insulating layer is disposed between the substrate layer and the organic insulating layer;

[0079] The second perforation penetrates the organic insulating layer, and the second perforation exposes at least a portion of the surface of the inorganic insulating layer.

[0080] In some embodiments, the display substrate further includes:

[0081] An inorganic protective layer, the inorganic protective layer including a first perforation, the orthographic projection of the first perforation on the substrate layer falling into the first region;

[0082] A first organic protective layer is disposed on the side of the inorganic protective layer away from the substrate layer, and the orthographic projection of the first organic protective layer on the substrate layer does not overlap with the first region.

[0083] A second organic protective layer covers the first region and the edge of the first organic protective layer is wrapped around it.

[0084] The thickness of the second organic protective layer is greater than the thickness of the first organic protective layer.

[0085] A display substrate, comprising:

[0086] A substrate layer, the substrate layer including a display area and a non-display area;

[0087] Pixel circuitry is disposed in the display area;

[0088] Drive signal lines;

[0089] An electrostatic discharge (ESD) protection circuit is disposed in the non-display area, and the ESD protection circuit is electrically connected to the drive signal line.

[0090] A bonding pin is provided in the non-display area, and the two ends of the drive signal line are electrically connected to the pixel circuit and the bonding pin, respectively.

[0091] An organic insulating layer includes a second perforation, wherein the orthographic projection of the second perforation on the substrate layer does not overlap with the orthographic projection of the electrostatic protection circuit on the substrate layer, and the orthographic projection of the second perforation on the substrate layer surrounds the orthographic projection of the electrostatic protection circuit on the substrate layer.

[0092] In some embodiments, the display substrate further includes:

[0093] A first constant voltage signal line is provided in the non-display area;

[0094] An adjustable level signal line is provided in the non-display area;

[0095] The electrostatic protection circuit is electrically connected to the first constant voltage signal line through the first constant voltage connection line.

[0096] An adjustable signal connection line is provided, and the electrostatic protection circuit is electrically connected to the adjustable level signal line through the adjustable signal connection line.

[0097] The orthographic projection of the second cutout on the substrate surrounds at least a portion of the orthographic projection of the first constant voltage connection line and at least a portion of the adjustable signal connection line on the substrate.

[0098] In some embodiments, the organic insulating layer includes an organic planarization layer and a pixel defining layer, and an inorganic insulating layer is disposed between the substrate layer and the organic insulating layer;

[0099] The second perforation penetrates the organic insulating layer, and the second perforation exposes at least a portion of the surface of the inorganic insulating layer.

[0100] In some embodiments, the display substrate further includes:

[0101] An inorganic protective layer, which covers the second cutout and the electrostatic protection circuit;

[0102] A first organic protective layer is disposed on the side of the inorganic protective layer away from the substrate layer, and the orthographic projection of the first organic protective layer on the substrate layer does not overlap with the first region.

[0103] A second organic protective layer covers the first region and the edge of the first organic protective layer is wrapped around it.

[0104] The thickness of the second organic protective layer is greater than the thickness of the first organic protective layer.

[0105] In some embodiments, the non-display area includes a first area, a second area, and a third area, wherein the first area is located between the display area and the second area, the second area is located between the first area and the third area, the first area is used for bending the display substrate, the electrostatic protection circuit is disposed in the second area, and the bonding pin is disposed in the third area;

[0106] The display substrate further includes:

[0107] A test module is disposed in the second region. The test module is electrically connected to the pixel circuit. The test module is located between the first region and the electrostatic discharge protection circuit. The electrostatic discharge protection circuit is located between the test module and the bonding pin.

[0108] In some embodiments, the testing module includes a pixel testing unit and a crack testing unit, the pixel testing unit being electrically connected to the pixel circuit, and the crack testing unit being electrically connected to a crack detection line located in the non-display area.

[0109] In some embodiments, the crack testing unit is located between the pixel testing unit and the electrostatic protection circuit; and / or,

[0110] The pixel testing unit includes test pins and / or a test circuit, wherein the test circuit is connected between the pixel circuit and the test pins, and the test pins are used to receive test signals provided by the test fixture; and / or

[0111] The crack testing unit includes a crack detection circuit, which is electrically connected to the crack detection line; and / or,

[0112] The drive signal lines include data signal lines.

[0113] In some embodiments, the display substrate further includes:

[0114] A drive signal line adapter via is provided, wherein the adapter via is located between the electrostatic protection circuit and the bonding pin, or the adapter via is located between the electrostatic protection circuit and the test module;

[0115] The drive signal line includes a first signal line segment and a second signal line segment. The first signal line segment and the second signal line segment are electrically connected through the drive signal line adapter via. The first signal line segment and the second signal line segment are respectively disposed on different conductive layers.

[0116] In some embodiments, the display substrate further includes:

[0117] The first constant voltage signal line and the adjustable level signal line are connected, the protection terminal of the electrostatic protection circuit is electrically connected to the drive signal line, the positive terminal of the electrostatic protection circuit is electrically connected to the first constant voltage signal line, and the negative terminal of the electrostatic protection circuit is electrically connected to the adjustable level signal line.

[0118] The voltage value of the adjustable level signal transmitted by the adjustable level signal line is used to adjust according to the voltage value of the drive signal transmitted by the drive signal line, and the voltage value of the first constant voltage signal transmitted by the first constant voltage signal line is greater than the voltage value of the adjustable level signal.

[0119] In some implementations, the adjustable level signal is positively correlated with the voltage value of the drive signal.

[0120] In some embodiments, the display substrate further includes:

[0121] The electrostatic protection circuit is electrically connected to the first constant voltage signal line via the first constant voltage connection line and to the adjustable level signal line via the adjustable signal connection line.

[0122] The length extension direction of the first constant voltage connection line is the same as the length extension direction of the adjustable signal connection line, and the length extension direction of the first constant voltage connection line intersects with the length extension direction of at least a portion of the drive signal lines.

[0123] In some embodiments, the length extension direction of the first constant voltage connection line intersects with the length extension direction of the first constant voltage signal line;

[0124] The electrostatic discharge (ESD) protection circuit includes multiple ESD protection devices, at least some of which are located between the first constant voltage connection line and the adjustable signal connection line.

[0125] In some embodiments, the first constant voltage signal line is connected to at least two first constant voltage signal connection lines, and the electrostatic protection circuit is located between at least two first constant voltage signal connection lines; and / or,

[0126] The adjustable signal connection line is located between at least two of the first constant voltage signal connection lines.

[0127] In some embodiments, the first constant voltage signal connection line and the adjustable signal connection line are disposed on the same conductive layer; and / or,

[0128] The orthographic projection of the first constant voltage signal connection line on the substrate overlaps with the orthographic projection of the electrostatic protection circuit on the substrate; and / or,

[0129] The orthographic projection of the adjustable signal connection line on the substrate overlaps with the orthographic projection of the electrostatic protection circuit on the substrate.

[0130] In some embodiments, the electrostatic discharge (ESD) protection circuit includes a plurality of ESD protection devices, at least some of which are located between adjacent drive signal lines.

[0131] A second aspect of this application provides a driving method for a display substrate, used to drive the display substrate as described in the first aspect. When the display substrate includes a first constant voltage signal line and an adjustable level signal line, the driving method includes:

[0132] Obtain the drive signal on the drive signal line connected to the target electrostatic protection circuit, wherein the target electrostatic protection circuit is any electrostatic protection circuit connected to the drive signal line.

[0133] Based on the driving signal, determine the adjustable level signal;

[0134] The adjustable level signal is transmitted to the target electrostatic protection circuit through the adjustable level signal line.

[0135] A third aspect of this application provides a controller, including:

[0136] Memory, used to store computer programs;

[0137] A processor is used to implement the driving method for the display substrate as described in the second aspect during the execution of the computer program.

[0138] A fourth aspect of this application provides a display device, comprising:

[0139] The display substrate as described in the first aspect; and / or,

[0140] The controller as described in the third aspect. Attached Figure Description

[0141] Figure 1 A schematic structural diagram of a display substrate provided in an embodiment of this application;

[0142] Figure 2 A schematic cross-sectional view of a display substrate along A1-A2 provided for an embodiment of this application;

[0143] Figure 3This application provides an embodiment of a schematic structure for the regional arrangement of a display substrate.

[0144] Figure 4 A schematic structural diagram illustrating the area arrangement of another display substrate provided in an embodiment of this application;

[0145] Figure 5 A schematic structural diagram illustrating the area arrangement of another display substrate provided in an embodiment of this application;

[0146] Figure 6 A schematic connection structure diagram of an electrostatic protection circuit provided in an embodiment of this application;

[0147] Figure 7 A schematic structural diagram of an electrostatic discharge protection circuit provided in an embodiment of this application;

[0148] Figure 8 A schematic structural diagram of another electrostatic discharge protection circuit provided in an embodiment of this application;

[0149] Figure 9 This application provides a schematic structural diagram of a second region of a display substrate according to an embodiment of the present application;

[0150] Figure 10 A schematic structural diagram illustrating the area arrangement of another display substrate provided in an embodiment of this application;

[0151] Figure 11 A schematic cross-sectional view along B1-B2 of another display substrate provided in an embodiment of this application;

[0152] Figure 12 A schematic structural block diagram of a controller provided in an embodiment of this application;

[0153] Figure 13 This is a schematic structural block diagram of a display device provided in an embodiment of this application. Detailed Implementation

[0154] To better understand the technical solutions provided in the embodiments of this specification, the technical solutions of the embodiments of this specification will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the embodiments of this specification and the specific features in the embodiments are detailed descriptions of the technical solutions of the embodiments of this specification, rather than limitations on the technical solutions of this specification. In the absence of conflict, the embodiments of this specification and the technical features in the embodiments can be combined with each other.

[0155] In this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, without necessarily requiring or implying any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. The term "two or more" includes two or more cases.

[0156] Currently, with the continuous development of display technology, the consumer market has increasingly higher performance demands for display products. Different regions have varying environmental temperatures and humidity levels due to their geographical location, resulting in different lifespan requirements for display products. In high-temperature and high-humidity climates, display products are susceptible to moisture corrosion and damage. Therefore, high-temperature and high-humidity climates generally require display products with higher temperature and humidity resistance to ensure that the screen can function normally and maintain good display effects and stability under harsh climatic conditions. However, existing display products often exhibit display defects due to water and oxygen corrosion before reaching the required test cycle in high-temperature and high-humidity reliability tests, indicating poor resistance to water and oxygen corrosion in current products.

[0157] For example, mobile phones used in environments with relatively high temperatures and humidity have even stricter requirements for screen shelf life. Currently, mobile phone manufacturers require screens to operate for 20 days at 85℃ / 85% RH without developing bright lines. However, current products will show electrostatic corrosion at the bonding pin locations after 15 to 20 days of operation, resulting in vertical bright lines.

[0158] To release stress during bending, the inorganic layer is typically completely removed from the bending area of ​​the display substrate. The boundary of the bending area is defined by the inorganic layer, without a complete "encapsulation." In high-temperature and high-humidity environments, water and oxygen enter from the bending area and penetrate along the organic layer towards the electrostatic discharge (ESD) protection unit. The ESD protection unit has high and low potentials. Under high temperatures, the leakage current of the transistors in the ESD protection unit increases, causing electrochemical corrosion on both sides of the high and low potentials connected to the ESD protection unit. This corrosion breaks the data signal line at that location. If the transistor in the pixel circuit connected to the data signal line is P-type, and the P-type transistor is normally on, it drives the light-emitting device to emit light. This broken data signal line connected to the pixel circuit will drive the light-emitting device to remain constantly lit, resulting in poor brightness in the display area.

[0159] For example, in LTPO (Low Temperature Polycrystalline Oxide) display products, the passivation layer is SiOx (silicon oxide), which has weak waterproof performance. Although the traces at the electrostatic protection unit are covered by the passivation layer, they still cannot be completely blocked when moisture enters.

[0160] To further extend the screen's lifespan, the design needs to be upgraded to withstand corrosion for an extended period.

[0161] In view of the above, a first aspect of the embodiments of this application provides a display substrate. Figure 1 A schematic structural diagram of a display substrate provided in an embodiment of this application; Figure 2 This is a schematic cross-sectional view of a display substrate along line A1-A2, provided for an embodiment of this application. In some embodiments, reference is made to... Figure 1 and Figure 2 The display substrate includes a substrate layer 100, a driving layer 200, and an inorganic protective layer 300. The substrate layer 100 can be a flexible substrate. The substrate layer 100 includes a display area 110 and a non-display area 120. The non-display area 120 includes a first area 121, a second area 122, and a third area 123. The first area 121 is located between the display area 110 and the second area 122, and the second area 122 is located between the first area 121 and the third area 123. The first area 121 is used for bending the display substrate. The first area 121, the second area 122, and the third area 123 can be the lower border area of ​​the display substrate. The display substrate in the first area 121 can be bent. After the display substrate is bent, the display substrates in the second area 122 and the third area 123 will be placed on the back side of the display substrate in the display area 110. The back side of the display substrate in the display area 110 is the side away from the light-emitting side.

[0162] refer to Figure 1 and Figure 2The driving layer can have multiple conductive layers, with insulating layers between adjacent conductive layers. The driving layer 200 is disposed on one side of the substrate layer 100. Various driving circuits, signal traces, and other functional circuits, structures, and devices can be disposed within the driving layer. The driving circuits include devices such as transistors, capacitors, and resistors. The pixel circuit 201, electrostatic discharge protection circuit 202, test module 203, driving signal line 204, and bonding pin 205 can all be disposed within the driving layer 200. The two ends of the drive signal line 204 are electrically connected to the pixel circuit 201 and the bonding pin 205, respectively. The test module 203 is electrically connected to the pixel circuit 201. The electrostatic protection circuit 202 is electrically connected to the drive signal line 204. The pixel circuit 201 is located in the display area 110. The electrostatic protection circuit 202 and the test module 203 are both located in the second area 122. The bonding pin 205 is located in the third area 123. The test module 203 is located between the first area 121 and the electrostatic protection circuit 202. The electrostatic protection circuit 202 is located between the test module 203 and the bonding pin 205.

[0163] For example, the conductive layer in the driving layer can be used to set signal lines, conductive structures or device electrodes, etc. For instance, the gate and source of the transistor in the pixel circuit can be set on different conductive layers, and the gate signal line and data signal line can be set on different conductive layers. These are not listed one by one here.

[0164] For example, a light-emitting device layer can be disposed above the driving layer, and the pixel circuit is electrically connected to the anode of the light-emitting device to obtain an organic light-emitting diode display substrate.

[0165] refer to Figure 2 An inorganic protective layer 300 is disposed on the side of the driving layer 200 away from the substrate layer 100. The inorganic protective layer 300 includes a first cutout 301, the orthographic projection of which onto the substrate layer 100 falls into the first region 121. The inorganic protective layer 300 is made of a relatively hard material, and bending it can easily cause stress concentration leading to breakage or damage, which is detrimental to the bending of the display substrate. Therefore, the inorganic protective layer 300 can be hollowed out in the first region 121 to facilitate bending of the display substrate. However, hollowing out the inorganic protective layer 300 results in insufficient isolation and protection against water and oxygen, and the exposed area is easily invaded by water and oxygen. The water and oxygen intrusion path diffuses and propagates from the boundary of the first cutout 301 to the locations of the second and third regions.

[0166] Figure 3 This is a schematic structure illustrating the area arrangement of a display substrate provided in an embodiment of this application.

[0167] For example, refer to Figure 3Typically, the electrostatic discharge (ESD) protection circuit 202 is located on the side of the test module 203 away from the bonding pins. That is, the ESD protection circuit 202 is closer to the first region 121 than the test module 203. Therefore, the ESD protection circuit 202 is closer to the cut-out boundary of the inorganic protective layer 300, and the path for water and oxygen to be transmitted to the ESD protection circuit 202 is shorter, making the ESD protection circuit 202 more susceptible to corrosion by water and oxygen.

[0168] Figure 4 This is a schematic structural diagram illustrating the area configuration of another display substrate provided in an embodiment of this application.

[0169] For example, refer to Figure 3 and Figure 4 The non-display area also includes a first wiring area 124, a second wiring area 125, and a third wiring area 126. These wiring areas are used to set up connection lines, and different signal connection lines can be laid out on multiple conductive layers. The first wiring area 124 is located between the display area 110 and the first area 121; the second wiring area 125 is located between the first area 121 and the second area 122; and the third wiring area 126 is located between the second wiring area 125 and the third area 123. The test module 203 is located between the second wiring area 125 and the third wiring area 126, and the electrostatic discharge (ESD) protection circuit 202 is located between the third wiring area 126 and the third area 123. The ESD protection circuit 202 is located between the third wiring area 126 and the bonding pin 205.

[0170] For example, refer to Figure 4 If the driver chip can be integrated on a flexible circuit board, then only one set of bonding pins needs to be set on the display substrate. The flexible circuit board and the display substrate are bonded together through bonding pin 205. The driver chip is electrically connected to bonding pin 205 through the lines on the flexible circuit board, and then electrically connected to the drive signal lines of the display substrate. The drive signal lines are directly electrically connected to bonding pin 205.

[0171] Figure 5 This is a schematic structural diagram illustrating the area arrangement of another display substrate provided in an embodiment of this application.

[0172] For example, refer to Figure 5 The bonding pins include a first bonding pin 205-1 and a second bonding pin 205-2. The first bonding pin 205-1 is located between the second region 122 and the second bonding pin 205-2. The first bonding pin 205-1 can be used to bond the driver chip, and the second bonding pin 205-2 can be used to bond the flexible circuit board. The drive signal line is directly electrically connected to the first bonding pin 205-1.

[0173] For example, refer to Figure 5In the direction from the display area 110 to the third area 123, a first wiring area 124 can be provided between the display area 110 and the first area 121, a second wiring area 125 is provided between the first area 121 and the test module 203, and a third wiring area 126 is provided between the test module 203 and the electrostatic protection circuit 202. (Comparison) Figure 3 , Figure 4 and Figure 5 , Figure 4 and Figure 5 The electrostatic discharge (ESD) protection circuit 202 moves towards the bonding pin, and moves downward to below the third wiring area 126. The test module 203 moves upward to between the second wiring area 125 and the third wiring area 126, meaning the test module 203 is now above the ESD protection circuit 202. This means the ESD protection circuit 202 has moved downward by the space occupied by the test module 203 and the space occupied by the third wiring area 126. The ESD protection circuit 202 is now closer to the bonding pin, and thus closer to the driver chip, compared to the test module 203. This increases the path length for water and oxygen intruding from the inorganic protective layer boundary in the first area 121 to reach the ESD protection circuit 202. With a longer path, water and oxygen are consumed more during transmission, resulting in very little or no water and oxygen reaching the ESD protection circuit 202. This reduces or eliminates the corrosive effect of intruding water and oxygen on the ESD protection circuit 202, making it less susceptible to corrosion and preventing breakage of data signal lines or other drive signal lines, thus reducing the likelihood of display malfunctions.

[0174] The display substrate provided in this application embodiment, by placing the electrostatic discharge (ESD) protection circuit between the test module and the bonding pins, and placing the test module between the first region and the ESD protection circuit, with the ESD protection circuit positioned on the side of the test module furthest from the bonding pins, increases the distance between the ESD protection circuit and the first region, and consequently, the distance between the ESD protection circuit and the first cutout boundary of the inorganic protective layer. This lengthens the path for water and oxygen to invade from the first cutout boundary and travel to the ESD protection circuit. As the water and oxygen gradually consume during this longer transmission path, the amount reaching the ESD protection circuit is reduced or eliminated. Therefore, the ESD protection circuit is less susceptible to water and oxygen corrosion, thus preventing the drive signal lines connected to the ESD protection circuit from being broken due to water and oxygen corrosion. This reduces display defects caused by water and oxygen corrosion and improves the yield of the display substrate.

[0175] In some implementations, the testing module includes a pixel testing unit and a crack testing unit. The pixel testing unit is electrically connected to the pixel circuit, and the crack testing unit is electrically connected to a crack detection line located in a non-display area. There can be multiple pixel testing units. These units can be used to test the pixel circuit's functionality during phased production processes, such as testing the pixel circuit in the display area before the bonding process. In liquid crystal display substrates, while testing the pixel circuit, the module can also test for defects in the alignment film, liquid crystal, and color filter. In organic light-emitting diode (OLED) display substrates, the testing module can test the pixel circuit while simultaneously testing for abnormalities in the light-emitting devices. In other words, the testing module can test for defects in the pixels corresponding to the displayed image, intercepting defective products and preventing them from flowing into subsequent processes and causing material waste. There can also be multiple crack testing units. The crack detection unit can use the crack detection line to detect the presence of cracks or damage anomalies on the periphery of the display substrate. Crack detection can prevent cracks or damage from flowing into subsequent processes, avoiding material waste.

[0176] In some examples, the crack test unit is located between the pixel test unit and the electrostatic discharge (ESD) protection circuit. The crack test unit is located on the side of the ESD protection circuit away from the bonding pin, which can increase the distance between the ESD protection circuit and the first region.

[0177] In some examples, the crack testing unit includes a crack detection circuit electrically connected to a crack detection line. The crack detection circuit may include resistors or capacitors, and changes in the electrical signal within the crack detection circuit reflect changes in the electrical signal on the crack detection line. This allows for the determination of whether a crack or break exists on the crack detection line, and consequently, whether a crack or break exists on the display substrate at the location of the crack detection line. A threshold can be set for the detected electrical signal. By comparing the detected electrical signal with the threshold, it can be determined whether the product is defective or good. Defective products can be intercepted, avoiding material waste in subsequent processes.

[0178] In some examples, the pixel test unit includes test pins and / or test circuitry. The test circuitry is connected between the pixel circuitry and the test pins, which are used to receive test signals provided by a test fixture. For example, the test pins can be exposed conductive structures. During testing, a test fixture is used to attach pins to the test pins, and test signals are transmitted through the pins. After testing, the pixel test unit is no longer needed in subsequent processes. There can be multiple pixel test units to test all pixels.

[0179] In some examples, the drive signal lines include data signal lines. Data signal lines can be used to provide data signals to the pixel circuitry.

[0180] In some embodiments, the display substrate includes a drive signal line adapter via, which may be disposed in the drive layer and located between the electrostatic protection circuit and the bonding pin.

[0181] In some implementations, the adapter via is located between the electrostatic protection circuit and the test module.

[0182] In some examples, the drive signal line includes a first signal segment and a second signal segment, which are electrically connected via a drive signal line adapter via. The first and second signal segments are disposed on different conductive layers. The placement of the first and second signal segments on different conductive layers allows for bridging between these layers via the drive signal line adapter via. This arrangement of bridging the same drive signal line on different conductive layers enables layered routing, increases routing space, and avoids the problem of insufficient routing space when different drive signal lines are placed on the same conductive layer.

[0183] Figure 6 This is a schematic connection structure diagram of an electrostatic protection circuit provided in an embodiment of this application.

[0184] In some implementations, reference Figure 6 The display substrate includes a first constant voltage signal line 210 and an adjustable level signal line 220. The protection terminal 202-1 of the electrostatic discharge (ESD) protection circuit 202 is electrically connected to the drive signal line 204. The positive terminal 202-2 of the ESD protection circuit 202 is electrically connected to the first constant voltage signal line 210, and the negative terminal 202-3 of the ESD protection circuit 202 is electrically connected to the adjustable level signal line 220. The magnitude of the adjustable level signal transmitted by the adjustable level signal line 220 is adjusted according to the magnitude of the drive signal transmitted by the drive signal line 204. The first constant voltage signal transmitted by the first constant voltage signal line 210 is greater than the adjustable level signal. Both the first constant voltage signal line 210 and the adjustable level signal line 220 can be disposed on the drive layer.

[0185] For example, the first constant voltage signal transmitted by the first constant voltage signal line can be a high-level signal, which can provide a constant high-level signal to the scan driving circuit. Correspondingly, the display substrate may also include a second constant voltage signal line, which may be disposed on the driving layer. The second constant voltage signal line can transmit a second constant voltage signal, the voltage value of which is less than the voltage value of the first constant voltage signal. The second constant voltage signal can be a low-level signal, which can provide a low-level signal to the scan driving circuit. In some examples, the second constant voltage signal can also be a common signal; in the liquid crystal display substrate, the common signal is a signal applied to a common electrode.

[0186] For example, the positive terminal of the electrostatic discharge (ESD) protection circuit is connected to the first constant voltage signal line, the negative terminal of the ESD protection circuit is electrically connected to the second constant voltage signal line, and the protection terminal of the static protection circuit is electrically connected to the drive signal line. Since the second constant voltage signal is lower than the first constant voltage signal, static electricity received at the protection terminal of the ESD protection circuit can be released through the path formed by the first and second constant voltage signals, preventing static electricity from entering the drive signal line and thus avoiding damage to it. In other words, the first constant voltage signal line, the second constant voltage signal line, and the ESD protection circuit form an electrical signal transmission path, which can transmit static electricity to the lower potential of the second constant voltage signal line for release, ensuring that the drive signal line is not damaged by static electricity. In some examples, the negative terminal of the ESD protection circuit can also be grounded, which also serves to release static electricity.

[0187] For example, refer to Figure 6 The negative terminal 202-3 of the electrostatic discharge protection circuit 202 is connected to the adjustable signal line 220. The voltage value of the adjustable level signal transmitted on the adjustable signal line 220 can be adjusted according to the voltage value of the drive signal to better protect the drive signal line 204 from electrostatic damage. When a fixed electrical signal is connected to the negative terminal 202-3, the voltage difference between the protection terminal 202-1 and the negative terminal 202-3 changes with the magnitude of the drive signal, while the voltage difference between the positive terminal 202-2 and the negative terminal 202-3 remains constant. When the drive signal increases, the voltage difference between the protection terminal 202-1 and the negative terminal 202-3 increases, resulting in a larger leakage current between them. Under the influence of water and oxygen, electrochemical corrosion is more likely to occur, damaging the protection terminal 202-1 of the electrostatic discharge protection circuit 202, and consequently damaging the connected drive signal line 204, causing display defects. If the drive signal line is a data signal line, it will produce a bright line defect.

[0188] In some examples, the adjustable level signal is positively correlated with the voltage value of the drive signal.

[0189] For example, refer to Figure 6When the drive signal increases, the adjustable level signal also increases. Therefore, the voltage difference between the protection terminal 202-1 and the negative terminal 202-3 will not change significantly due to the change in the drive signal. Depending on the adjustment of the adjustable level signal, the voltage difference between the protection terminal 202-1 and the negative terminal 202-3 can even remain constant or decrease. Under the influence of the adjustment signal, the voltage difference between the protection terminal 202-1 and the negative terminal 202-3 is less affected by the drive signal, or even unaffected, thus reducing leakage current and preventing electrochemical corrosion caused by increased voltage difference. Furthermore, under the influence of the adjustable level signal, the voltage difference between the positive terminal 202-2 and the negative terminal 202-3 also decreases, reducing leakage current. This lowers the risk of electrochemical corrosion to the electrostatic protection circuit, and the impact of electrochemical corrosion on the drive signal line is reduced or eliminated, thus preventing display malfunctions.

[0190] Compared to the fixed signal of the existing second constant voltage signal, the adjustment of the adjustable level signal can be based on the voltage value of different driving signals. That is, the voltage value of the adjustable level signal is positively correlated with the voltage value of the driving signal. By adjusting the adjustable level signal accordingly, the voltage difference of the electrostatic protection circuit can be kept constant or even reduced, thereby reducing leakage current and thus reducing or eliminating the risk of electrochemical corrosion, avoiding circuit damage caused by leakage current due to voltage difference.

[0191] For example, the adjustment of the adjustable level signal transmitted by the adjustable signal line can be controlled by a display driver, which can be a program pre-stored in the display driver chip.

[0192] Figure 7 This is a schematic structural diagram of an electrostatic discharge protection circuit provided in an embodiment of this application.

[0193] For example, refer to Figure 7The electrostatic discharge (ESD) protection circuit includes a first transistor T1, a second transistor T2, a third transistor T3, and a fourth transistor T4. The source and gate of each transistor are electrically connected to form a unidirectional diode, with the source acting as the anode and the drain as the cathode. The driving signal is the data signal Vdata, the first constant voltage signal is a high-level signal VGH, and the second constant voltage signal is a low-level signal VGL. The direction of the leakage current is indicated by the dashed arrow, meaning the leakage current flows from the positive terminal 202-2 to the protection terminal 202-1 and then to the negative terminal 202-3. The magnitude of the leakage current depends on the voltage difference between the positive terminal 202-2 and the protection terminal 202-1 (first voltage difference = VGH - Vdata); the magnitude of the leakage current depends on the voltage difference between the protection terminal 202-1 and the negative terminal 202-3 (second voltage difference = Vdata - VGL); and the magnitude of the leakage current also depends on the voltage difference between the positive terminal 202-2 and the negative terminal 202-3 (third voltage difference = VGH - VGL). Changes in the data signal Vdata directly affect the magnitudes of the first, second, and third differential pressures, and consequently the magnitude of the leakage current. When VGH and VGL remain constant, the first and second differential pressures will change as Vdata increases or decreases. A larger differential pressure results in a larger leakage current and makes electrochemical corrosion more likely to occur.

[0194] Figure 8 This is a schematic structural diagram of another electrostatic discharge protection circuit provided in an embodiment of this application.

[0195] For example, refer to Figure 8 The negative terminal 202-3 of the electrostatic protection circuit is connected to an adjustable signal X. The adjustable signal X is positively correlated with the voltage value of the data signal Vdata. Therefore, if Vdata increases, X increases, resulting in the second differential pressure remaining unchanged, decreasing, or changing less than the change in Vdata. This leads to a decrease in the third differential pressure. Since the first differential pressure decreases, the leakage current decreases, preventing or reducing electrochemical corrosion. Conversely, if Vdata decreases and X decreases, the second differential pressure remains unchanged, decreases, or changes less than the change in Vdata. Although the first and third differential pressures will increase, the second differential pressure will not be as large as Vdata, thus preventing a significant increase in leakage current and avoiding electrochemical corrosion caused by leakage current.

[0196] The adjustable signal X provided in this application embodiment can replace the original low-level signal VGL. Compared with the original low-level signal VGL, the magnitude of the adjustable signal X is adjustable and can be adjusted to adapt to different driving signals, so as to reduce or eliminate electrochemical corrosion caused by large pressure difference.

[0197] For example, the adjustable signal X can be 0 or a negative value.

[0198] For example, Figure 7 and Figure 8All transistors in the circuit are P-type transistors, and the transistors for the electrostatic protection circuit can be fabricated simultaneously with the transistors for the pixel circuit and the scanning drive circuit.

[0199] For example, the transistor provided in the embodiments of this application can be a metal oxide transistor, that is, the semiconductor layer is made of metal oxide material, such as indium gallium zinc oxide.

[0200] Figure 9 This is a schematic structural diagram of a second region of a display substrate provided in an embodiment of this application.

[0201] In some implementations, reference Figure 9 The driving layer of the second region includes a first constant voltage connection line 211 and an adjustable signal connection line 221. The electrostatic discharge (ESD) protection circuit 202 is electrically connected to the first constant voltage signal line 210 via the first constant voltage connection line 211, and to the adjustable level signal line 220 via the adjustable signal connection line 221. The length extension direction of the first constant voltage connection line 211 is the same as that of the adjustable signal connection line 221, and these two length extension directions are denoted as a first direction Y1. The length extension direction of the first constant voltage connection line 211 intersects with the length extension direction of at least a portion of the driving signal line 204. The length extension direction of at least a portion of the driving signal line 204 can be denoted as a second direction Y2. The length extension direction of at least a portion of the first constant voltage signal line 210 is the same as the second direction Y2, and the length extension direction of at least a portion of the adjustable signal line 220 can also be the same as the second direction Y2. If the first direction Y1 intersects with the second direction Y2, then the length extension direction of the first constant voltage connection line 211 intersects with the length extension direction of the first constant voltage signal line 210.

[0202] In some embodiments, the electrostatic discharge (ESD) protection circuit includes multiple ESD protection devices, which may include diodes or transistors. At least some of the ESD protection devices are located between the first constant voltage connection line and the adjustable signal connection line.

[0203] In some embodiments, the first constant voltage signal line is connected to at least two first constant voltage signal connection lines, and the electrostatic protection circuit is located between the at least two first constant voltage signal connection lines.

[0204] In some implementations, in the second direction, the adjustable signal connection line is located between at least two first constant voltage signal connection lines.

[0205] In some implementations, the electrostatic discharge (ESD) protection circuit includes a plurality of ESD protection devices, with at least some of the ESD protection devices located between adjacent drive signal lines in the first direction Y1.

[0206] In some implementations, in the second direction Y2, at least a portion of the electrostatic protection device is located between the first constant voltage signal connection line and the adjustable signal connection line.

[0207] For example, refer to Figure 9 Two first constant voltage connection lines 211 are connected to a first constant voltage signal line 210, and an adjustable signal connection line 221 is located between the two first constant voltage connection lines 211. The electrostatic discharge (ESD) protection circuit 202 includes four transistors, namely T1, T2, T3, and T4. The first constant voltage connection lines 211, the drive signal line 204, and the adjustable signal connection line 221 intersect to form multiple unit regions, and each unit region can be provided with one ESD protection circuit 202. Two rows of ESD protection circuits 202 are arranged in the second direction Y2.

[0208] For example, refer to Figure 9 The drive signal line 204 may include a data signal line, the length of which extends in the second direction Y2.

[0209] For example, refer to Figure 9 Each drive signal line 204 is connected to two electrostatic discharge (ESD) protection circuits 202, and the two ESD protection circuits 202 connected to a single drive signal line 204 are located in different rows. Two ESD protection circuits 202 arranged in the same column in the second direction Y2 are connected to different drive signal lines.

[0210] For example, the electrostatic discharge protection circuit is electrically connected one-to-one with the drive signal line.

[0211] In some implementations, the first constant voltage signal connection line and the adjustable signal connection line may be disposed on the same conductive layer.

[0212] In some implementations, the components of the electrostatic discharge (ESD) protection circuit can be disposed on a different conductive layer from the first constant voltage signal line. This allows for the use of more space to arrange the components and lines, avoiding the infeasibility of fabrication due to excessively small line spacing or component spacing. The orthographic projection of the first constant voltage signal connection line on the substrate overlaps with the orthographic projection of the ESD protection circuit on the substrate. The overlapping portion can be used for connecting the circuit and the signal line.

[0213] In some implementations, the orthographic projection of the adjustable signal connection line onto the substrate overlaps with the orthographic projection of the electrostatic protection circuit onto the substrate. The overlapping portion can be used for connecting the circuit and the signal line.

[0214] Figure 10 A schematic structural diagram illustrating the area arrangement of another display substrate provided in an embodiment of this application; Figure 11This is a schematic cross-sectional view along B1-B2 of another display substrate provided in an embodiment of this application.

[0215] In some implementations, reference Figure 10 and Figure 11 The display substrate includes an organic insulating layer 230, which can be disposed within the driving layer 200. The organic insulating layer 230 includes a second cutout 231. The orthographic projection of the second cutout 231 on the substrate layer 100 does not overlap with the orthographic projection of the electrostatic protection circuit 202 on the substrate layer 100. The inorganic protective layer 300 covers the second cutout 231. The orthographic projection of the second cutout 231 on the substrate layer 100 surrounds the orthographic projection of the electrostatic protection circuit 202 on the substrate layer 100.

[0216] For example, refer to Figure 10 The second perforation 231 can be a ring-shaped perforation. The second perforation 231 can penetrate the organic insulating layer 230. The second perforation 231 surrounds all electrostatic protection circuits 202. The second perforation 231 can block the transmission of water and oxygen. Organic materials easily form water and oxygen transmission channels. By setting the second perforation 231 on the organic insulating layer 230, the water and oxygen transmission path of the organic insulating layer 230 can be cut off, thereby protecting the electrostatic protection circuit 202 from water and oxygen corrosion.

[0217] In some implementations, reference Figure 11 The display substrate includes a first constant voltage signal line, an adjustable level signal line, a first constant voltage connection line 211, and an adjustable signal connection line 221. All of these can be disposed within the driving layer 200. An electrostatic discharge (ESD) protection circuit 202 is electrically connected to the first constant voltage signal line 210 via the first constant voltage connection line 211, and to the adjustable level signal line 220 via the adjustable signal connection line 221. The orthographic projection of the second cutout 231 on the substrate layer 100 surrounds at least a portion of the orthographic projections of the first constant voltage connection line 211 and at least a portion of the adjustable signal connection line 221 on the substrate layer 100. Both the first constant voltage connection line 211 and the adjustable signal connection line 221 are electrically connected to the electrostatic protection circuit 202. The second cutout 231 surrounds at least part of the first constant voltage connection line and at least part of the adjustable signal connection line. Thus, the second cutout 231 can also act as a water and oxygen barrier for the first constant voltage connection line and the adjustable signal connection line, preventing them from being corroded by water and oxygen.

[0218] For example, the organic insulating layer includes an organic planarization layer and a pixel defining layer, the pixel defining layer being located on the side of the organic planarization layer away from the substrate. The second cutout may penetrate through the pixel defining layer and the organic planarization layer.

[0219] For example, a pixel delimiting layer may not be set in the second region, but an organic planarization layer may be set in the second region, and the second cutout may penetrate through the organic planarization layer.

[0220] For example, refer to Figure 11 The display substrate includes an inorganic insulating layer 240, which may be disposed within the driving layer 200. The inorganic insulating layer 240 is disposed between the substrate layer 100 and the organic insulating layer 230. A second cutout 231 penetrates the organic insulating layer 230, exposing at least a portion of the surface of the inorganic insulating layer 240. Since the second cutout 231 exposes a portion of the upper surface of the inorganic insulating layer 240, and the inorganic material has a water and oxygen barrier effect, the contact between the second cutout 231 and the inorganic insulating layer 240 can further block the water and oxygen transport path.

[0221] For example, the inorganic insulating layer may include a single layer of silicon nitride or a single layer of silicon oxide, and the inorganic insulating layer may include a stack of silicon nitride and silicon oxide.

[0222] For example, refer to Figure 11 The display substrate may include a first source / drain electrode layer SD1 and a second source / drain electrode layer SD2, and both the first source / drain electrode layer SD1 and the second source / drain electrode layer SD2 may be disposed within the driving layer 200. A first constant voltage connection line 211 and an adjustable signal connection line 221 may be disposed in the first source / drain electrode layer SD1; or, the first constant voltage connection line 211 and the adjustable signal connection line 221 may be disposed in the second source / drain electrode layer SD2; the first constant voltage connection line 211 and the adjustable signal connection line 221 may be disposed in different conductive layers.

[0223] For example, refer to Figure 11 The electrostatic discharge (ESD) protection circuit 202 can be disposed between the conductive layer where the first constant voltage connection line 211 is located and the substrate layer 100, that is, the ESD protection circuit 202 is disposed below the conductive layer where the first constant voltage connection line 211 is located, which can increase the wiring space and avoid the line spacing being too small. The orthographic projection of the first constant voltage connection line 211 and the adjustable signal connection line 221 on the substrate layer 100 overlaps at least partially with the orthographic projection of the ESD protection circuit 202 on the substrate layer 100.

[0224] In some implementations, reference Figure 11The display substrate further includes: a first organic protective layer 400 and a second organic protective layer 500. The first organic protective layer 400 is disposed on the side of the inorganic protective layer 300 away from the substrate layer 100, and its orthographic projection on the substrate layer 100 does not overlap with the first region 121; the first organic protective layer 400 covers the inorganic protective layer 300, which in turn covers and fills the second cutout 231. The orthographic projection of the first cutout 301 on the substrate layer 100 covers the first region 121. The second organic protective layer 500 is disposed on the side of the driving layer 200 away from the substrate layer 100, covering the first region 121 and enclosing the edge of the first organic protective layer 400; the thickness of the second organic protective layer 500 is greater than the thickness of the first organic protective layer 400. The second organic protective layer 500 can be used to protect the bent display substrate in the first region 121, and can play a role in stress relief and stress protection for the bent display substrate.

[0225] In some embodiments, the display substrate may include a pixel circuit, a drive signal line, an electrostatic discharge (ESD) protection circuit, a first constant voltage signal line, an adjustable level signal line, and bonding pins. The two ends of the drive signal line are electrically connected to the pixel circuit and the bonding pins, respectively. The protection terminal of the ESD protection circuit is electrically connected to the drive signal line, the positive terminal of the ESD protection circuit is electrically connected to the first constant voltage signal line, and the negative terminal of the ESD protection circuit is electrically connected to the adjustable level signal line. The voltage value of the adjustable level signal transmitted by the adjustable level signal line is used for adjustment according to the voltage value of the drive signal transmitted by the drive signal line. The voltage value of the first constant voltage signal transmitted by the first constant voltage signal line is greater than the voltage value of the adjustable level signal.

[0226] For example, the first constant voltage signal transmitted by the first constant voltage signal line can be a high-level signal, which can provide a constant high-level signal to the scan driving circuit. Correspondingly, the display substrate may also include a second constant voltage signal line, which can transmit a second constant voltage signal. The second constant voltage signal is lower than the first constant voltage signal, and the second constant voltage signal can be a low-level signal, which can provide a low-level signal to the scan driving circuit. In some examples, the second constant voltage signal can also be a common signal; in the liquid crystal display substrate, the common signal is a signal applied to a common electrode.

[0227] For example, the positive terminal of the electrostatic discharge (ESD) protection circuit is connected to the first constant voltage signal line, the negative terminal of the ESD protection circuit is electrically connected to the second constant voltage signal line, and the protection terminal of the static protection circuit is electrically connected to the drive signal line. Since the second constant voltage signal is lower than the first constant voltage signal, static electricity received at the protection terminal of the ESD protection circuit can be released through the path formed by the first and second constant voltage signals, preventing static electricity from entering the drive signal line and thus avoiding damage to it. In other words, the first constant voltage signal line, the second constant voltage signal line, and the ESD protection circuit form an electrical signal transmission path, which can transmit static electricity to the lower potential of the second constant voltage signal line for release, ensuring that the drive signal line is not damaged by static electricity. In some examples, the negative terminal of the ESD protection circuit can also be grounded, which also serves to release static electricity.

[0228] For example, refer to Figure 6 The negative terminal 202-3 of the electrostatic discharge protection circuit 202 is connected to the adjustable signal line 220. The magnitude of the adjustable level signal transmitted on the adjustable signal line 220 can be adjusted according to the magnitude of the drive signal to better protect the drive signal line 204 from electrostatic damage. When a fixed electrical signal is connected to the negative terminal 202-3, the voltage difference between the protection terminal 202-1 and the negative terminal 202-3 changes with the magnitude of the drive signal, while the voltage difference between the positive terminal 202-2 and the negative terminal 202-3 remains constant. When the drive signal increases, the voltage difference between the protection terminal 202-1 and the negative terminal 202-3 increases, resulting in a larger leakage current between them. Under the influence of water and oxygen, electrochemical corrosion is more likely to occur, damaging the protection terminal 202-1 of the electrostatic discharge protection circuit 202, and consequently damaging the connected drive signal line 204, causing display defects. If the drive signal line is a data signal line, it will produce a bright line defect.

[0229] In some instances, the adjustable level signal is positively correlated with the voltage value of the drive signal.

[0230] For example, refer to Figure 6When the drive signal increases, the adjustable level signal also increases. Therefore, the voltage difference between the protection terminal 202-1 and the negative terminal 202-3 will not change significantly due to the change in the drive signal. Depending on the adjustment of the adjustable level signal, the voltage difference between the protection terminal 202-1 and the negative terminal 202-3 can even remain constant or decrease. Under the influence of the adjustment signal, the voltage difference between the protection terminal 202-1 and the negative terminal 202-3 is less affected by the drive signal, or even unaffected, thus reducing leakage current and preventing electrochemical corrosion caused by increased voltage difference. Furthermore, under the influence of the adjustable level signal, the voltage difference between the positive terminal 202-2 and the negative terminal 202-3 also decreases, reducing leakage current. This lowers the risk of electrochemical corrosion to the electrostatic protection circuit, and the impact of electrochemical corrosion on the drive signal line is reduced or eliminated, thus preventing display malfunctions.

[0231] Compared to the fixed signal of the existing second constant voltage signal, the adjustment of the adjustable level signal can be adjusted according to the magnitude of different driving signals. That is, the adjustable level signal is positively correlated with the driving signal. The adjustable level signal is adjusted accordingly to keep the voltage difference of the electrostatic protection circuit constant or even reduce it, thereby reducing leakage current and thus reducing or eliminating the risk of electrochemical corrosion, avoiding circuit damage caused by voltage difference leakage current.

[0232] For example, the adjustment of the adjustable level signal transmitted by the adjustable signal line can be controlled by a display driver, which can be a program pre-stored in the display driver chip.

[0233] For example, refer to Figure 7The electrostatic discharge (ESD) protection circuit includes a first transistor T1, a second transistor T2, a third transistor T3, and a fourth transistor T4. The source and gate of each transistor are electrically connected to form a unidirectional diode, with the source acting as the anode and the drain as the cathode. The driving signal is the data signal Vdata, the first constant voltage signal is a high-level signal VGH, and the second constant voltage signal is a low-level signal VGL. The direction of the leakage current is indicated by the dashed arrow, meaning the leakage current flows from the positive terminal 202-2 to the protection terminal 202-1 and then to the negative terminal 202-3. The magnitude of the leakage current depends on the voltage difference between the positive terminal 202-2 and the protection terminal 202-1 (first voltage difference = VGH - Vdata); the magnitude of the leakage current depends on the voltage difference between the protection terminal 202-1 and the negative terminal 202-3 (second voltage difference = Vdata - VGL); and the magnitude of the leakage current also depends on the voltage difference between the positive terminal 202-2 and the negative terminal 202-3 (third voltage difference = VGH - VGL). Changes in the data signal Vdata directly affect the magnitudes of the first, second, and third differential pressures, and consequently the magnitude of the leakage current. When VGH and VGL remain constant, the first and second differential pressures will change as Vdata increases or decreases. A larger differential pressure results in a larger leakage current and makes electrochemical corrosion more likely to occur.

[0234] For example, refer to Figure 8 The negative terminal 202-3 of the electrostatic protection circuit is connected to an adjustable signal X. The adjustable signal X is positively correlated with the data signal Vdata. Therefore, if Vdata increases, X increases, resulting in the second differential pressure remaining unchanged, decreasing, or changing less than the change in Vdata. This leads to a decrease in the third differential pressure. Since the first differential pressure also decreases, the leakage current decreases, preventing or reducing electrochemical corrosion. Conversely, if Vdata decreases and X decreases, the second differential pressure remains unchanged, decreases, or changes less than the change in Vdata. Although the first and third differential pressures will increase, the second differential pressure will not be as large as Vdata, thus preventing a significant increase in leakage current and avoiding electrochemical corrosion caused by leakage current.

[0235] The adjustable signal X provided in this application embodiment can replace the original low-level signal VGL. Compared with the original low-level signal VGL, the magnitude of the adjustable signal X is adjustable and can be adjusted to adapt to different driving signals, so as to reduce or eliminate electrochemical corrosion caused by large pressure difference.

[0236] For example, the voltage value of the adjustable signal X can be 0 or negative.

[0237] For example, Figure 7 and Figure 8 All transistors in the circuit are P-type transistors, and the transistors for the electrostatic protection circuit can be fabricated simultaneously with the transistors for the pixel circuit and the scanning drive circuit.

[0238] For example, the transistor provided in the embodiments of this application can be a metal oxide transistor, that is, the semiconductor layer is made of metal oxide material, such as indium gallium zinc oxide.

[0239] For example, refer to Figure 9 The display substrate further includes: a first constant voltage connection line 211 and an adjustable signal connection line 221; an electrostatic discharge (ESD) protection circuit 202 is electrically connected to a first constant voltage signal line 210 via the first constant voltage connection line 211, and the ESD protection circuit 202 is electrically connected to an adjustable level signal line 220 via the adjustable signal connection line 221; the length extension direction of the first constant voltage connection line 211 is the same as the length extension direction of the adjustable signal connection line 221, and the length extension direction of the first constant voltage connection line 211 intersects with the length extension direction of at least a portion of the drive signal line 204; the length extension direction of the first constant voltage connection line 211 intersects with the length extension direction of the first constant voltage signal line 210; the ESD protection circuit 202 includes a plurality of ESD protection devices, at least a portion of which are located between the first constant voltage connection line 211 and the adjustable signal connection line 221. The length extension directions of the first constant voltage connection line 211 and the adjustable signal connection line 221 are represented as a first direction Y1. The length extension direction of at least a portion of the drive signal line 204 can be represented as a second direction Y2. The first direction Y1 intersects the second direction Y2. For example, the first direction Y1 is perpendicular to the second direction Y2.

[0240] In some embodiments, the electrostatic discharge (ESD) protection circuit includes multiple ESD protection devices, which may include diodes or transistors. At least some of the ESD protection devices are located between the first constant voltage connection line and the adjustable signal connection line.

[0241] In some embodiments, the first constant voltage signal line is connected to at least two first constant voltage signal connection lines, and the electrostatic protection circuit is located between the at least two first constant voltage signal connection lines.

[0242] In some implementations, in the second direction, the adjustable signal connection line is located between at least two first constant voltage signal connection lines.

[0243] In some embodiments, the display substrate includes a substrate layer and a driving layer. The driving layer is located on one side of the substrate layer and includes multiple conductive layers. A first constant voltage connection line, an adjustable signal connection line, and an electrostatic protection circuit can all be disposed on the driving layer. The first constant voltage signal connection line and the adjustable signal connection line are disposed on the same conductive layer.

[0244] In some implementations, the orthographic projection of the first constant voltage signal connection line on the substrate overlaps with the orthographic projection of the electrostatic protection circuit on the substrate.

[0245] In some implementations, the orthographic projection of the adjustable signal connection line on the substrate overlaps with the orthographic projection of the electrostatic protection circuit on the substrate.

[0246] In some implementations, the electrostatic discharge (ESD) protection circuit includes multiple ESD protection devices, with at least some of the ESD protection devices located between adjacent drive signal lines.

[0247] For example, refer to Figure 9 Two first constant voltage connection lines 211 are connected to a first constant voltage signal line 210, and an adjustable signal connection line 221 is located between the two first constant voltage connection lines 211. The electrostatic discharge (ESD) protection circuit 202 includes four transistors, namely T1, T2, T3, and T4. The first constant voltage connection lines 211, the drive signal line 204, and the adjustable signal connection line 221 intersect to form multiple unit regions, and each unit region can be provided with one ESD protection circuit 202. Two rows of ESD protection circuits 202 are arranged in the second direction Y2.

[0248] For example, refer to Figure 9 The drive signal line 204 may include a data signal line, the length of which extends in the second direction Y2.

[0249] For example, refer to Figure 9 Each drive signal line 204 is connected to two electrostatic discharge (ESD) protection circuits 202, and the two ESD protection circuits 202 connected to a single drive signal line 204 are located in different rows. Two ESD protection circuits 202 arranged in the same column in the second direction Y2 are connected to different drive signal lines.

[0250] For example, the electrostatic discharge protection circuit is electrically connected one-to-one with the drive signal line.

[0251] In some implementations, the components of the electrostatic discharge (ESD) protection circuit can be disposed on a different conductive layer from the first constant voltage signal line. This allows for the use of more space to arrange the components and lines, avoiding the infeasibility of fabrication due to excessively small line spacing or component spacing. The orthographic projection of the first constant voltage signal connection line on the substrate overlaps with the orthographic projection of the ESD protection circuit on the substrate. The overlapping portion can be used for connecting the circuit and the signal line.

[0252] In some embodiments, the display substrate includes a substrate layer and a driving layer. The substrate layer includes a display area and a non-display area. The non-display area surrounds the display area and is provided with structures such as driving circuits and signal lines. The non-display area includes a first area, a second area, and a third area. The first area is located between the display area and the second area, and the second area is located between the first area and the third area. The first area is used for bending the display substrate. After the display substrate is bent, the display substrates of the second and third areas are placed on the back side of the display substrate of the display area. The back side of the display substrate of the display area is the side away from the light-emitting side. The driving layer is disposed on one side of the substrate layer. The test module, pixel circuit, driving signal line, electrostatic discharge protection circuit, first constant voltage signal line, adjustable level signal line, and bonding pin are all disposed on the driving layer. The pixel circuit is disposed in the display area. The test module is electrically connected to the pixel circuit. The electrostatic discharge protection circuit and the test module are both disposed in the second area. The bonding pin is disposed in the third area. The test module is located between the first area and the electrostatic discharge protection circuit, and the electrostatic discharge protection circuit is located between the test module and the bonding pin.

[0253] In some embodiments, the display substrate further includes an inorganic protective layer disposed on the side of the driving layer away from the substrate layer, the inorganic protective layer including a first cutout, the orthographic projection of the first cutout on the substrate layer falling into a first region.

[0254] refer to Figure 1 and Figure 2 The driving layer 200 is disposed on one side of the substrate layer 100. The pixel circuit 201, electrostatic discharge protection circuit 202, test module 203, driving signal line 204 and bonding pin 205 can all be disposed within the driving layer 200. The two ends of the driving signal line 204 are electrically connected to the pixel circuit 201 and the bonding pin 205 respectively. The test module 203 is electrically connected to the pixel circuit 201. The electrostatic discharge protection circuit 202 is electrically connected to the driving signal line 204. The pixel circuit 201 is disposed in the display area 110. The electrostatic discharge protection circuit 202 and the test module 203 are both disposed in the second area 122. The bonding pin 205 is disposed in the third area 123. The test module 203 is located between the first area 121 and the electrostatic discharge protection circuit 202. The electrostatic discharge protection circuit 202 is located between the test module 203 and the bonding pin 205.

[0255] For example, the driving layer may include multiple conductive layers, with insulating layers between adjacent conductive layers. The conductive layers can be used to set signal lines, conductive structures, or device electrodes, etc. For instance, the gate and source of the transistor in a pixel circuit can be set on different conductive layers, and the gate signal line and data signal line can be set on different conductive layers, etc. The conductive and insulating layers within the driving layer can form circuits, devices, signal lines, etc., meaning that the pixel circuit, detection module, electrostatic protection circuit, bonding pins, and driving signal lines are all located on the driving layer.

[0256] For example, a light-emitting device layer can be disposed above the driving layer, and the pixel circuit is electrically connected to the anode of the light-emitting device to obtain an organic light-emitting diode display substrate.

[0257] refer to Figure 2 An inorganic protective layer 300 is disposed on the side of the driving layer 200 away from the substrate layer 100. The inorganic protective layer 300 includes a first cutout 301, the orthographic projection of which onto the substrate layer 100 falls into the first region 121. The inorganic protective layer 300 is made of a relatively hard material, and bending it can easily cause stress concentration leading to breakage or damage, which is detrimental to the bending of the display substrate. Therefore, the inorganic protective layer 300 can be hollowed out in the first region 121 to facilitate bending of the display substrate. However, hollowing out the inorganic protective layer 300 results in insufficient isolation and protection against water and oxygen, and the exposed area is easily invaded by water and oxygen. The water and oxygen intrusion path diffuses and propagates from the boundary of the first cutout 301 to the locations of the second and third regions.

[0258] For example, refer to Figure 3 Typically, the electrostatic discharge (ESD) protection circuit 202 is located on the side of the test module 203 away from the bonding pins. That is, the ESD protection circuit 202 is closer to the first region 121 than the test module 203. Therefore, the ESD protection circuit 202 is closer to the cut-out boundary of the inorganic protective layer 300, and the path for water and oxygen to be transmitted to the ESD protection circuit 202 is shorter, making the ESD protection circuit 202 more susceptible to corrosion by water and oxygen.

[0259] For example, refer to Figure 3 and Figure 4 The non-display area also includes a first wiring area 124, a second wiring area 125, and a third wiring area 126. These wiring areas are used to set up connection lines, and different signal connection lines can be laid out on multiple conductive layers. The first wiring area 124 is located between the display area 110 and the first area 121; the second wiring area 125 is located between the first area 121 and the second area 122; and the third wiring area 126 is located between the second wiring area 125 and the third area 123. The test module 203 is located between the second wiring area 125 and the third wiring area 126, and the electrostatic discharge (ESD) protection circuit 202 is located between the third wiring area 126 and the third area 123. The ESD protection circuit 202 is located between the third wiring area 126 and the bonding pin 205.

[0260] For example, refer to Figure 4If the driver chip can be integrated on a flexible circuit board, then only one set of bonding pins needs to be set on the display substrate. The flexible circuit board and the display substrate are bonded together through bonding pin 205. The driver chip is electrically connected to bonding pin 205 through the lines on the flexible circuit board, and then electrically connected to the drive signal lines of the display substrate. The drive signal lines are directly electrically connected to bonding pin 205.

[0261] For example, refer to Figure 5 The bonding pins include a first bonding pin 205-1 and a second bonding pin 205-2. The first bonding pin 205-1 is located between the second region 122 and the second bonding pin 205-2. The first bonding pin 205-1 can be used to bond the driver chip, and the second bonding pin 205-2 can be used to bond the flexible circuit board. The drive signal line is directly electrically connected to the first bonding pin 205-1.

[0262] For example, refer to Figure 5 In the direction from the display area 110 to the third area 123, a first wiring area 124 can be provided between the display area 110 and the first area 121, a second wiring area 125 is provided between the first area 121 and the test module 203, and a third wiring area 126 is provided between the test module 203 and the electrostatic protection circuit 202. (Comparison) Figure 3 , Figure 4 and Figure 5 , Figure 4 and Figure 5 The electrostatic discharge (ESD) protection circuit 202 moves towards the bonding pin, and moves downward to below the third wiring area 126. The test module 203 moves upward to between the second wiring area 125 and the third wiring area 126, meaning the test module 203 is now above the ESD protection circuit 202. This means the ESD protection circuit 202 has moved downward by the space occupied by the test module 203 and the space occupied by the third wiring area 126. The ESD protection circuit 202 is now closer to the bonding pin, and thus closer to the driver chip, compared to the test module 203. This increases the path length for water and oxygen intruding from the inorganic protective layer boundary in the first area 121 to reach the ESD protection circuit 202. With a longer path, water and oxygen are consumed more during transmission, resulting in very little or no water and oxygen reaching the ESD protection circuit 202. This reduces or eliminates the corrosive effect of intruding water and oxygen on the ESD protection circuit 202, making it less susceptible to corrosion and preventing breakage of data signal lines or other drive signal lines, thus reducing the likelihood of display malfunctions.

[0263] The display substrate provided in this application embodiment, by placing the electrostatic discharge (ESD) protection circuit between the test module and the bonding pins, and placing the test module between the first region and the ESD protection circuit, with the ESD protection circuit positioned on the side of the test module furthest from the bonding pins, increases the distance between the ESD protection circuit and the first region, and consequently, the distance between the ESD protection circuit and the first cutout boundary of the inorganic protective layer. This lengthens the path for water and oxygen to invade from the first cutout boundary and travel to the ESD protection circuit. As the water and oxygen gradually consume during this longer transmission path, the amount reaching the ESD protection circuit is reduced or eliminated. Therefore, the ESD protection circuit is less susceptible to water and oxygen corrosion, thus preventing the drive signal lines connected to the ESD protection circuit from being broken due to water and oxygen corrosion. This reduces display defects caused by water and oxygen corrosion and improves the yield of the display substrate.

[0264] In some implementations, the testing module includes a pixel testing unit and a crack testing unit. The pixel testing unit is electrically connected to the pixel circuit, and the crack testing unit is electrically connected to a crack detection line located in a non-display area. There can be multiple pixel testing units. These units can be used to test the pixel circuit's functionality during phased production processes, such as testing the pixel circuit in the display area before the bonding process. In liquid crystal display substrates, while testing the pixel circuit, the module can also test for defects in the alignment film, liquid crystal, and color filter. In organic light-emitting diode (OLED) display substrates, the testing module can test the pixel circuit while simultaneously testing for abnormalities in the light-emitting devices. In other words, the testing module can test for defects in the pixels corresponding to the displayed image, intercepting defective products and preventing them from flowing into subsequent processes and causing material waste. There can also be multiple crack testing units. The crack detection unit can use the crack detection line to detect the presence of cracks or damage anomalies on the periphery of the display substrate. Crack detection can prevent cracks or damage from flowing into subsequent processes, avoiding material waste.

[0265] In some implementations, the crack testing unit is located between the pixel testing unit and the electrostatic discharge (ESD) protection circuit. Positioning the crack testing unit on the side of the ESD protection circuit away from the bonding pins can increase the distance between the ESD protection circuit and the first region.

[0266] In some examples, the pixel test unit includes test pins and / or test circuitry. The test circuitry is connected between the pixel circuitry and the test pins, which are used to receive test signals provided by a test fixture. For example, the test pins can be exposed conductive structures. During testing, a test fixture is used to attach pins to the test pins, and test signals are transmitted through the pins. After testing, the pixel test unit is no longer needed in subsequent processes. There can be multiple pixel test units to test all pixels.

[0267] In some examples, the crack testing unit includes a crack detection circuit electrically connected to a crack detection line. The crack detection circuit may include resistors or capacitors, and changes in the electrical signal within the crack detection circuit reflect changes in the electrical signal on the crack detection line. This allows for the determination of whether a crack or break exists on the crack detection line, and consequently, whether a crack or break exists on the display substrate at the location of the crack detection line. A threshold can be set for the detected electrical signal. By comparing the detected electrical signal with the threshold, it can be determined whether the product is defective or good. Defective products can be intercepted, avoiding material waste in subsequent processes.

[0268] In some examples, the drive signal lines include data signal lines. Data signal lines can be used to provide data signals to the pixel circuitry.

[0269] In some embodiments, the display substrate includes a drive signal line adapter via located between the electrostatic discharge protection circuit and the bonding pin.

[0270] In some implementations, the adapter via is located between the electrostatic protection circuit and the test module.

[0271] In some embodiments, the drive signal line includes a first signal segment and a second signal segment, which are electrically connected via a drive signal line adapter via. The first and second signal segments are respectively disposed on different conductive layers. The drive signal line adapter via enables bridging between different conductive layers. This arrangement of bridging the same drive signal line on different conductive layers allows for layered routing, increasing routing space and avoiding the problem of insufficient routing space when different drive signal lines are disposed on the same conductive layer.

[0272] In some implementations, reference Figure 1 , Figure 10 and Figure 11The display substrate includes a substrate layer 100 and a driving layer 200. The substrate layer 100 includes a display area 110 and a non-display area 120, with the non-display area 120 surrounding the display area 110. The driving layer 200 is disposed on one side of the substrate layer 100. Pixel circuit 201, electrostatic discharge protection circuit 202, driving signal line 204, and bonding pin 205 can all be disposed on the driving layer 200. The two ends of the driving signal line 204 are electrically connected to the pixel circuit 201 and the bonding pin 205, respectively. The electrostatic discharge protection circuit 202 is electrically connected to the driving signal line 204. Line 204 is electrically connected. Pixel circuit 201 is disposed in display area 110. Electrostatic protection circuit 202 and bonding pin 205 are both disposed in non-display area 120. The display substrate includes an organic insulating layer 230. The organic insulating layer 230 includes a second cutout 231. The orthographic projection of the second cutout 231 on the substrate layer 100 does not overlap with the orthographic projection of the electrostatic protection circuit 202 on the substrate layer 100. The orthographic projection of the second cutout 231 on the substrate layer 100 surrounds the orthographic projection of the electrostatic protection circuit 202 on the substrate layer 100.

[0273] For example, refer to Figure 10 The second perforation 231 can be a ring-shaped perforation. The second perforation 231 can penetrate the organic insulating layer 230. The second perforation 231 surrounds all electrostatic protection circuits 202. The second perforation 231 can block the transmission of water and oxygen. Organic materials easily form water and oxygen transmission channels. By setting the second perforation 231 on the organic insulating layer 230, the water and oxygen transmission path of the organic insulating layer 230 can be cut off, thereby protecting the electrostatic protection circuit 202 from water and oxygen corrosion.

[0274] In some implementations, reference Figure 11 The display substrate includes a first constant voltage signal line 210, an adjustable level signal line 220, a first constant voltage connection line 211, and an adjustable signal connection line 221. An electrostatic discharge (ESD) protection circuit 202 is electrically connected to the first constant voltage signal line 210 via the first constant voltage connection line 211, and to the adjustable level signal line 220 via the adjustable signal connection line 221. The orthographic projection of a second cutout 231 on the substrate layer 100 surrounds at least a portion of the orthographic projections of the first constant voltage connection line 211 and at least a portion of the adjustable signal connection line 221 on the substrate layer 100. Since both the first constant voltage connection line 211 and the adjustable signal connection line 221 are electrically connected to the ESD protection circuit 202, and the second cutout 231 surrounds at least a portion of the first constant voltage connection line and at least a portion of the adjustable signal connection line, the second cutout 231 can also act as a water and oxygen barrier for the first constant voltage connection line and the adjustable signal connection line, preventing them from being corroded by water and oxygen.

[0275] In some implementations, reference Figure 11The display substrate further includes: an inorganic protective layer 300 disposed on the side of the driving layer 200 away from the substrate layer 100, the inorganic protective layer 300 covering the second cutout 231; the display substrate includes a first constant voltage connection line 211 and an adjustable signal connection line 221; the orthographic projection of the second cutout 231 on the substrate layer 100 surrounds at least a portion of the orthographic projection of the first constant voltage connection line 211 and at least a portion of the adjustable signal connection line 221 on the substrate layer 100.

[0276] In some embodiments, the organic insulating layer includes an organic planarization layer and a pixel defining layer, and the display substrate includes an inorganic insulating layer disposed between the substrate layer and the organic insulating layer. A second cutout penetrates the organic insulating layer, exposing a portion of the surface of at least one inorganic insulating layer. Since the second cutout 231 exposes a portion of the upper surface of the inorganic insulating layer 240, and the inorganic material has a water and oxygen barrier effect, the second cutout 231 contacts the inorganic insulating layer 240, further blocking the water and oxygen transport path.

[0277] For example, refer to Figure 11 The display substrate includes an inorganic insulating layer 240 disposed between the substrate layer 100 and the organic insulating layer 230. A second cutout 231 penetrates the organic insulating layer 230, exposing at least a portion of the surface of the inorganic insulating layer 240. Since the inorganic material has a water and oxygen barrier effect, the second cutout 231 contacts the inorganic insulating layer 240, further blocking the water and oxygen transport path.

[0278] For example, the inorganic insulating layer may include a single layer of silicon nitride or a single layer of silicon oxide, and the inorganic insulating layer may include a stack of silicon nitride and silicon oxide.

[0279] In some implementations, reference Figure 11 The display substrate further includes: an inorganic protective layer 300, a first organic protective layer 400, and a second organic protective layer 500. The inorganic protective layer 300 is disposed on the side of the driving layer 200 away from the substrate layer. The inorganic protective layer 300 includes a first cutout 301, and the orthographic projection of the first cutout 301 on the substrate layer falls into a first region. The first organic protective layer 400 is disposed on the side of the inorganic protective layer 300 away from the substrate layer, and the orthographic projection of the first organic protective layer 400 on the substrate layer 100 does not overlap with the first region 121. The second organic protective layer 500 is disposed on the side of the driving layer 200 away from the substrate layer 100. The second organic protective layer 500 covers the first region 121 and the second organic protective layer 500 covers the edge of the first organic protective layer 400. The thickness of the second organic protective layer 500 is greater than the thickness of the first organic protective layer 400.

[0280] In some implementations, reference Figure 10 and Figure 11 The display substrate includes a substrate layer 100 and a driving layer 200. The substrate 100 includes a display area 110 and a non-display area 120. A driving layer 200 is disposed on one side of the substrate 100. A pixel circuit 201, an electrostatic discharge protection circuit 202, a driving signal line 204, and a bonding pin 205 are all disposed on the driving layer 200. The two ends of the driving signal line 204 are electrically connected to the pixel circuit 201 and the bonding pin 205, respectively. The electrostatic discharge protection circuit 202 is electrically connected to the driving signal line 204. The pixel circuit 201 is disposed in the display area 110, and the electrostatic discharge protection circuit 202 and the bonding pin 205 are both disposed in the non-display area 120. The display substrate includes an organic insulating layer 230. The organic insulating layer 230 includes a second cutout 231. The orthographic projection of the second cutout 231 on the substrate 100 does not overlap with the orthographic projection of the electrostatic discharge protection circuit 202 on the substrate 100. The orthographic projection of the second cutout 231 on the substrate 100 surrounds the orthographic projection of the electrostatic discharge protection circuit 202 on the substrate 100.

[0281] For example, refer to Figure 10 The second perforation 231 can be a ring-shaped perforation. The second perforation 231 can penetrate the organic insulating layer 230. The second perforation 231 surrounds all electrostatic protection circuits 202. The second perforation 231 can block the transmission of water and oxygen. Organic materials easily form water and oxygen transmission channels. By setting the second perforation 231 on the organic insulating layer 230, the water and oxygen transmission path of the organic insulating layer 230 can be cut off, thereby protecting the electrostatic protection circuit 202 from water and oxygen corrosion.

[0282] In some implementations, reference Figure 11 The display substrate includes a first constant voltage signal line, an adjustable level signal line, a first constant voltage connection line 211, and an adjustable signal connection line 221. The electrostatic protection circuit 202 is electrically connected to the first constant voltage signal line through the first constant voltage connection line 211, and the electrostatic protection circuit 202 is electrically connected to the adjustable level signal line 220 through the adjustable signal connection line 221. The orthographic projection of the second cutout 231 on the substrate layer 100 surrounds at least a portion of the orthographic projections of the first constant voltage connection line 211 and at least a portion of the adjustable signal connection line 221 on the substrate layer.

[0283] In some embodiments, the organic insulating layer includes an organic planarization layer and a pixel defining layer, and the display substrate includes an inorganic insulating layer disposed between the substrate layer and the organic insulating layer; the second cutout penetrates the organic insulating layer, exposing a portion of the surface of at least one inorganic insulating layer. The second cutout 231 exposes a portion of the upper surface of the inorganic insulating layer 240. Since the inorganic material has a water and oxygen barrier effect, the second cutout 231 contacts the inorganic insulating layer 240, further blocking the water and oxygen transport path.

[0284] In some embodiments, the display substrate further includes: an inorganic protective layer 300, a first organic protective layer 400, and a second organic protective layer 500. The inorganic protective layer 300 is disposed on the side of the driving layer 200 away from the substrate layer 100, and covers the second cutout 231 and the electrostatic protection circuit 202. The first organic protective layer 400 is disposed on the side of the inorganic protective layer 300 away from the substrate layer 100, and its orthographic projection on the substrate layer 100 does not overlap with the first region 121. The second organic protective layer 500 is disposed on the side of the driving layer 200 away from the substrate layer 101, and covers the first region 121, including the edge of the first organic protective layer 400. The thickness of the second organic protective layer 500 is greater than the thickness of the first organic protective layer 400. The second organic protective layer 500 can be used to protect the display substrate from bending in the first region 121, providing stress relief and protection.

[0285] In some implementations, reference Figure 1 and Figure 2 The non-display area 120 includes a first area 121, a second area 122, and a third area 123. The first area 121 is located between the display area 110 and the second area 122, and the second area 122 is located between the first area 121 and the third area 123. The first area 121 is used for bending the display substrate. The display substrate includes a test module 203, which is electrically connected to a pixel circuit 201. The pixel circuit 201 is located in the display area 110. The electrostatic discharge protection circuit 202 and the test module 203 are both located in the second area 122. The bonding pin 205 is located in the third area 123. The test module 203 is located between the first area 121 and the electrostatic discharge protection circuit 202, and the electrostatic discharge protection circuit 202 is located between the test module 203 and the bonding pin 205.

[0286] The display substrate provided in this application embodiment, by placing the electrostatic discharge (ESD) protection circuit between the test module and the bonding pins, and placing the test module between the first region and the ESD protection circuit, with the ESD protection circuit positioned on the side of the test module furthest from the bonding pins, increases the distance between the ESD protection circuit and the first region, and consequently, the distance between the ESD protection circuit and the first cutout boundary of the inorganic protective layer. This lengthens the path for water and oxygen to invade from the first cutout boundary and travel to the ESD protection circuit. As the water and oxygen gradually consume during this longer transmission path, the amount reaching the ESD protection circuit is reduced or eliminated. Therefore, the ESD protection circuit is less susceptible to water and oxygen corrosion, thus preventing the drive signal lines connected to the ESD protection circuit from being broken due to water and oxygen corrosion. This reduces display defects caused by water and oxygen corrosion and improves the yield of the display substrate.

[0287] In some implementations, the test module includes a pixel test unit and a crack test unit. The pixel test unit is electrically connected to the pixel circuit, and the crack test unit is electrically connected to the crack detection line, which is located in the non-display area.

[0288] In some implementations, the crack testing unit is located between the pixel testing unit and the electrostatic protection circuit.

[0289] In some implementations, the pixel testing unit includes test pins and / or test circuitry, with the test circuitry connected between the pixel circuitry and the test pins, and the test pins used to receive test signals provided by the test fixture.

[0290] In some implementations, the crack testing unit includes a crack detection circuit that is electrically connected to the crack detection line.

[0291] In some implementations, the drive signal line includes a data signal line.

[0292] In some embodiments, the display substrate includes a drive signal line adapter via, which is located between the electrostatic discharge (ESD) protection circuit and the bonding pin, or between the ESD protection circuit and the test module. The drive signal line includes a first signal segment and a second signal segment, which are electrically connected through the drive signal line adapter via. The first signal segment and the second signal segment are respectively disposed on different conductive layers.

[0293] In some embodiments, the display substrate includes a first constant voltage signal line and an adjustable level signal line, the protection terminal of the electrostatic discharge (ESD) protection circuit is electrically connected to the drive signal line, the positive terminal of the ESD protection circuit is electrically connected to the first constant voltage signal line, and the negative terminal of the ESD protection circuit is electrically connected to the adjustable level signal line.

[0294] The magnitude of the adjustable level signal transmitted by the adjustable level signal line is used to adjust according to the magnitude of the drive signal transmitted by the drive signal line, and the first constant voltage signal transmitted by the first constant voltage signal line is greater than the adjustable level signal.

[0295] In some implementations, the adjustable level signal is positively correlated with the voltage value of the drive signal.

[0296] For example, refer to Figure 6When the drive signal increases, the adjustable level signal also increases. Therefore, the voltage difference between the protection terminal 202-1 and the negative terminal 202-3 will not change significantly due to the change in the drive signal. Depending on the adjustment of the adjustable level signal, the voltage difference between the protection terminal 202-1 and the negative terminal 202-3 can even remain constant or decrease. Under the influence of the adjustment signal, the voltage difference between the protection terminal 202-1 and the negative terminal 202-3 is less affected by the drive signal, or even unaffected, thus reducing leakage current and preventing electrochemical corrosion caused by increased voltage difference. Furthermore, under the influence of the adjustable level signal, the voltage difference between the positive terminal 202-2 and the negative terminal 202-3 also decreases, reducing leakage current. This lowers the risk of electrochemical corrosion to the electrostatic protection circuit, and the impact of electrochemical corrosion on the drive signal line is reduced or eliminated, thus preventing display malfunctions.

[0297] Compared to the fixed signal of the existing second constant voltage signal, the adjustment of the adjustable level signal can be adjusted according to the magnitude of different driving signals. That is, the adjustable level signal is positively correlated with the driving signal. The adjustable level signal is adjusted accordingly to keep the voltage difference of the electrostatic protection circuit constant or even reduce it, thereby reducing leakage current and thus reducing or eliminating the risk of electrochemical corrosion, avoiding circuit damage caused by voltage difference leakage current.

[0298] For example, the adjustment of the adjustable level signal transmitted by the adjustable signal line can be controlled by a display driver, which can be a program pre-stored in the display driver chip.

[0299] For example, refer to Figure 7The electrostatic discharge (ESD) protection circuit includes a first transistor T1, a second transistor T2, a third transistor T3, and a fourth transistor T4. The source and gate of each transistor are electrically connected to form a unidirectional diode, with the source acting as the anode and the drain as the cathode. The driving signal is the data signal Vdata, the first constant voltage signal is a high-level signal VGH, and the second constant voltage signal is a low-level signal VGL. The direction of the leakage current is indicated by the dashed arrow, meaning the leakage current flows from the positive terminal 202-2 to the protection terminal 202-1 and then to the negative terminal 202-3. The magnitude of the leakage current depends on the voltage difference between the positive terminal 202-2 and the protection terminal 202-1 (first voltage difference = VGH - Vdata); the magnitude of the leakage current depends on the voltage difference between the protection terminal 202-1 and the negative terminal 202-3 (second voltage difference = Vdata - VGL); and the magnitude of the leakage current also depends on the voltage difference between the positive terminal 202-2 and the negative terminal 202-3 (third voltage difference = VGH - VGL). Changes in the data signal Vdata directly affect the magnitudes of the first, second, and third differential pressures, and consequently the magnitude of the leakage current. When VGH and VGL remain constant, the first and second differential pressures will change as Vdata increases or decreases. A larger differential pressure results in a larger leakage current and makes electrochemical corrosion more likely to occur.

[0300] For example, refer to Figure 8 The negative terminal 202-3 of the electrostatic protection circuit is connected to an adjustable signal X. The adjustable signal X is positively correlated with the data signal Vdata. Therefore, if Vdata increases, X increases, resulting in the second differential pressure remaining unchanged, decreasing, or changing less than the change in Vdata. This leads to a decrease in the third differential pressure. Since the first differential pressure also decreases, the leakage current decreases, preventing or reducing electrochemical corrosion. Conversely, if Vdata decreases and X decreases, the second differential pressure remains unchanged, decreases, or changes less than the change in Vdata. Although the first and third differential pressures will increase, the second differential pressure will not be as large as Vdata, thus preventing a significant increase in leakage current and avoiding electrochemical corrosion caused by leakage current.

[0301] The adjustable signal X provided in this application embodiment can replace the original low-level signal VGL. Compared with the original low-level signal VGL, the magnitude of the adjustable signal X is adjustable and can be adjusted to adapt to different driving signals, so as to reduce or eliminate electrochemical corrosion caused by large pressure difference.

[0302] For example, the adjustable signal X can be 0 or a negative value.

[0303] For example, Figure 7 and Figure 8 All transistors in the circuit are P-type transistors, and the transistors for the electrostatic protection circuit can be fabricated simultaneously with the transistors for the pixel circuit and the scanning drive circuit.

[0304] In some embodiments, the display substrate includes a first constant voltage connection line and an adjustable signal connection line. An electrostatic discharge (ESD) protection circuit is electrically connected to a first constant voltage signal line via the first constant voltage connection line, and the ESD protection circuit is electrically connected to an adjustable level signal line via the adjustable signal connection line. The length extension direction of the first constant voltage connection line is the same as the length extension direction of the adjustable signal connection line, and the length extension direction of the first constant voltage connection line intersects with the length extension direction of at least a portion of the drive signal lines.

[0305] In some embodiments, the length extension direction of the first constant voltage connection line intersects the length extension direction of the first constant voltage signal line; the electrostatic discharge protection circuit includes a plurality of electrostatic discharge protection devices, at least some of which are located between the first constant voltage connection line and the adjustable signal connection line.

[0306] In some embodiments, the first constant voltage signal line is connected to at least two first constant voltage signal connection lines, and the electrostatic protection circuit is located between the at least two first constant voltage signal connection lines.

[0307] In some implementations, the adjustable signal connection line is located between at least two first constant voltage signal connection lines.

[0308] In some implementations, the first constant voltage signal connection line and the adjustable signal connection line are disposed on the same conductive layer.

[0309] In some implementations, the orthographic projection of the first constant voltage signal connection line on the substrate overlaps with the orthographic projection of the electrostatic protection circuit on the substrate.

[0310] In some implementations, the orthographic projection of the adjustable signal connection line on the substrate overlaps with the orthographic projection of the electrostatic protection circuit on the substrate.

[0311] In some implementations, the electrostatic discharge (ESD) protection circuit includes multiple ESD protection devices, with at least some of the ESD protection devices located between adjacent drive signal lines.

[0312] For example, refer to Figure 9 Two first constant voltage connection lines 211 are connected to a first constant voltage signal line 210, and an adjustable signal connection line 221 is located between the two first constant voltage connection lines 211. The electrostatic discharge (ESD) protection circuit 202 includes four transistors, namely T1, T2, T3, and T4. The first constant voltage connection lines 211, the drive signal line 204, and the adjustable signal connection line 221 intersect to form multiple unit regions, and each unit region can be provided with one ESD protection circuit 202. Two rows of ESD protection circuits 202 are arranged in the second direction Y2.

[0313] For example, refer to Figure 9The drive signal line 204 may include a data signal line, the length of which extends in the second direction Y2.

[0314] For example, refer to Figure 9 Each drive signal line 204 is connected to two electrostatic discharge (ESD) protection circuits 202, and the two ESD protection circuits 202 connected to a single drive signal line 204 are located in different rows. Two ESD protection circuits 202 arranged in the same column in the second direction Y2 are connected to different drive signal lines.

[0315] For example, the electrostatic discharge protection circuit is electrically connected one-to-one with the drive signal line.

[0316] In some embodiments, the electrostatic discharge (ESD) protection circuit 202 and the test module 203 of the display substrate are both disposed in the second region 122, and the bonding pin 205 is disposed in the third region 123. The test module 203 is located between the first region 121 and the ESD protection circuit 202, and the ESD protection circuit 202 is located between the test module 203 and the bonding pin 205. The inorganic protective layer 300 includes a first cutout 301, the orthographic projection of which onto the substrate layer 100 falls into the first region 121. Relative to the ESD protection circuit being disposed on the side of the test module furthest from the bonding pin, placing the ESD protection circuit between the test module and the bonding pin increases the distance between the ESD protection circuit and the first region, and also increases the distance between the ESD protection circuit and the first cutout boundary of the inorganic protective layer. This lengthens the path for water and oxygen to invade from the first cutout boundary and travel to the ESD protection circuit. As water and oxygen gradually dissipate during their long transmission path, the amount reaching the electrostatic discharge (ESD) protection circuit becomes less or nonexistent. Therefore, the ESD protection circuit is less susceptible to water and oxygen corrosion, thus preventing the drive signal lines connected to it from being broken due to corrosion. This reduces display defects caused by water and oxygen corrosion and improves the yield of the display substrate. The positive terminal 202-2 of the ESD protection circuit 202 is electrically connected to the first constant voltage signal line 210, and the negative terminal 202-3 is electrically connected to the adjustable level signal line 220. The adjustable level signal transmitted by the adjustable level signal line 220 is used to adjust the voltage based on the drive signal transmitted by the drive signal line 204. The first constant voltage signal transmitted by the first constant voltage signal line 210 is greater than the adjustable level signal. The adjustable level signal is positively correlated with the voltage value of the drive signal. The adjustable level signal can be adjusted according to the magnitude of different drive signals. Since the adjustable level signal is positively correlated with the drive signal, adjusting the adjustable level signal accordingly can maintain or even reduce the voltage difference of the electrostatic protection circuit, thereby reducing leakage current and thus reducing or eliminating the risk of electrochemical corrosion, preventing circuit damage caused by voltage difference leakage current. The display substrate includes an organic insulating layer 230, which includes a second cutout 231. The orthographic projection of the second cutout 231 on the substrate layer 100 does not overlap with the orthographic projection of the electrostatic protection circuit 202 on the substrate layer 100. An inorganic protective layer 300 covers the second cutout 231. The orthographic projection of the second cutout 231 on the substrate layer 100 surrounds the orthographic projection of the electrostatic protection circuit 202 on the substrate layer 100. The second perforation 231 surrounds all electrostatic protection circuits 202. The second perforation 231 can block the transmission of water and oxygen. Organic materials easily form water and oxygen transmission channels. By setting the second perforation 231 on the organic insulating layer 230, the water and oxygen transmission path of the organic insulating layer 230 can be cut off, thereby protecting the electrostatic protection circuit 202 from water and oxygen corrosion.

[0317] In some embodiments, a driving method for a display substrate is provided for driving the display substrate described in the above embodiments. When the display substrate includes a first constant voltage signal line and an adjustable level signal line, the driving method includes:

[0318] Obtain the drive signal on the drive signal line connected to the target electrostatic protection circuit, wherein the target electrostatic protection circuit is any electrostatic protection circuit connected to the drive signal line.

[0319] The driving method of the display substrate can acquire driving signals, such as data signals, before driving each frame of the display screen during the display phase. For example, it can acquire data signals for each column of pixel circuits.

[0320] Determine the adjustable level signal based on the drive signal.

[0321] The electrostatic discharge (ESD) protection circuit connected to the data signal line corresponding to each column pixel circuit can determine the adjustable level signal of the ESD protection circuit based on the corresponding data signal.

[0322] The adjustable level signal is transmitted to the target electrostatic protection circuit through the adjustable level signal line.

[0323] The electrostatic discharge (ESD) protection circuit provides ESD protection to the corresponding connected drive signal lines based on an adjustable level signal.

[0324] Figure 12 This is a schematic structural block diagram of a controller provided in an embodiment of this application. In some embodiments, a controller 600 is provided, including a memory 610 and a processor 620. The memory 610 is used to store a computer program; the processor 620 is used to implement the display substrate driving method provided in the above embodiments during the execution of the computer program.

[0325] Figure 13 This is a schematic structural block diagram of a display device provided in an embodiment of this application. In some embodiments, a display device includes: the display substrate 1000 described in the above embodiment.

[0326] In some embodiments, the display device includes a controller as described in the above embodiments. The controller may be integrated into a control motherboard or centralized in a driver chip.

[0327] It should be noted that the display devices provided in this disclosure may include smartphones, tablets, laptops, televisions, and smart wearable display devices, etc. Smart wearable display devices may include smartwatches, VR (augmented reality) displays, and AR (virtual reality) displays, etc. The embodiments of this disclosure are not specifically limited.

[0328] The above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit it. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

[0329] Although preferred embodiments have been described in this specification, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this specification.

[0330] Obviously, those skilled in the art can make various modifications and variations to this specification without departing from its spirit and scope. Therefore, if such modifications and variations fall within the scope of the claims and their equivalents, this specification is also intended to include such modifications and variations.

Claims

1. A display substrate, characterized in that, include: A substrate layer, the substrate layer including a display area and a non-display area, the non-display area including a first area, a second area and a third area, the first area being located between the display area and the second area, the second area being located between the first area and the third area, and the first area being used for bending the display substrate; Pixel circuitry is disposed in the display area; Drive signal lines; An electrostatic discharge (ESD) protection circuit is disposed in the second region, and the ESD protection circuit is electrically connected to the drive signal line; A test module is disposed in the second region, the test module is electrically connected to the pixel circuit, and the test module is located between the first region and the electrostatic protection circuit; A bonding pin is provided in the third region. The two ends of the drive signal line are electrically connected to the pixel circuit and the bonding pin, respectively. The electrostatic protection circuit is located between the test module and the bonding pin. An inorganic protective layer is disposed on the side of the pixel circuit, the electrostatic protection circuit and the test module away from the substrate. The inorganic protective layer includes a first cutout, the orthographic projection of which falls into the first region on the substrate.

2. The display substrate according to claim 1, characterized in that, The testing module includes a pixel testing unit and a crack testing unit. The pixel testing unit is electrically connected to the pixel circuit, and the crack testing unit is electrically connected to a crack detection line located in the non-display area.

3. The display substrate according to claim 1, characterized in that, Also includes: A drive signal line adapter via is provided, wherein the adapter via is located between the electrostatic protection circuit and the bonding pin, or the adapter via is located between the electrostatic protection circuit and the test module; The drive signal line includes a first signal line segment and a second signal line segment. The first signal line segment and the second signal line segment are electrically connected through the drive signal line adapter via. The first signal line segment and the second signal line segment are respectively disposed on different conductive layers.

4. The display substrate according to claim 1, characterized in that, Also includes: The first constant voltage signal line and the adjustable level signal line are connected, the protection terminal of the electrostatic protection circuit is electrically connected to the drive signal line, the positive terminal of the electrostatic protection circuit is electrically connected to the first constant voltage signal line, and the negative terminal of the electrostatic protection circuit is electrically connected to the adjustable level signal line. The voltage value of the adjustable level signal transmitted by the adjustable level signal line is used to adjust according to the voltage value of the drive signal transmitted by the drive signal line, and the voltage value of the first constant voltage signal transmitted by the first constant voltage signal line is greater than the voltage value of the adjustable level signal.

5. The display substrate according to claim 4, characterized in that, The adjustable level signal is positively correlated with the voltage value of the drive signal.

6. The display substrate according to claim 4, characterized in that, The second area is provided with a first constant voltage connection line and an adjustable signal connection line. The electrostatic protection circuit is electrically connected to the first constant voltage signal line through the first constant voltage connection line, and the electrostatic protection circuit is electrically connected to the adjustable level signal line through the adjustable signal connection line. The length extension direction of the first constant voltage connection line is the same as the length extension direction of the adjustable signal connection line, and the length extension direction of the first constant voltage connection line intersects with the length extension direction of at least a portion of the drive signal lines.

7. The display substrate according to claim 6, characterized in that, The length extension direction of the first constant voltage connection line intersects with the length extension direction of the first constant voltage signal line; The electrostatic discharge (ESD) protection circuit includes multiple ESD protection devices, at least some of which are located between the first constant voltage connection line and the adjustable signal connection line.

8. The display substrate according to claim 6, characterized in that, The first constant voltage signal line is connected to at least two other first constant voltage signal connection lines, and the electrostatic protection circuit is located between at least two of the first constant voltage signal connection lines; and / or, The adjustable signal connection line is located between at least two of the first constant voltage signal connection lines.

9. The display substrate according to claim 6, characterized in that, The first constant voltage signal connection line and the adjustable signal connection line are disposed on the same conductive layer; and / or, The orthographic projection of the first constant voltage signal connection line on the substrate overlaps with the orthographic projection of the electrostatic protection circuit on the substrate. And / or, The orthographic projection of the adjustable signal connection line on the substrate overlaps with the orthographic projection of the electrostatic protection circuit on the substrate.

10. The display substrate according to claim 6, characterized in that, The electrostatic discharge (ESD) protection circuit includes multiple ESD protection devices, at least some of which are located between adjacent drive signal lines.

11. The display substrate according to any one of claims 1 to 10, characterized in that, Also includes: An organic insulating layer includes a second perforation, wherein the orthographic projection of the second perforation on the substrate layer does not overlap with the orthographic projection of the electrostatic protection circuit on the substrate layer, and the inorganic protective layer covers the second perforation; The orthographic projection of the second cutout on the substrate surrounds the orthographic projection of the electrostatic protection circuit on the substrate.

12. The display substrate according to claim 11, characterized in that, Also includes: The system includes a first constant voltage signal line, an adjustable level signal line, a first constant voltage connection line, and an adjustable signal connection line. The electrostatic protection circuit is electrically connected to the first constant voltage signal line via the first constant voltage connection line, and the electrostatic protection circuit is electrically connected to the adjustable level signal line via the adjustable signal connection line. The orthographic projection of the second cutout on the substrate surrounds the orthographic projections of at least a portion of the first constant voltage connection line and at least a portion of the adjustable signal connection line on the substrate.

13. The display substrate according to claim 11, characterized in that, The organic insulating layer includes an organic planarization layer and a pixel defining layer, and an inorganic insulating layer is disposed between the substrate layer and the organic insulating layer. The second perforation penetrates the organic insulating layer, and the second perforation exposes at least a portion of the surface of the inorganic insulating layer.

14. The display substrate according to claim 11, characterized in that, Also includes: A first organic protective layer is disposed on the side of the inorganic protective layer away from the substrate layer, and the orthographic projection of the first organic protective layer on the substrate layer does not overlap with the first region. A second organic protective layer covers the first region and the edge of the first organic protective layer is wrapped around it. The thickness of the second organic protective layer is greater than the thickness of the first organic protective layer.

15. A display substrate, characterized in that, include: Pixel circuit; The drive signal line is electrically connected to the pixel circuit. An electrostatic discharge (ESD) protection circuit, wherein the protection terminal of the ESD protection circuit is electrically connected to the drive signal line; The first constant voltage signal line is electrically connected to the positive terminal of the electrostatic protection circuit; An adjustable level signal line is electrically connected to the negative terminal of the electrostatic protection circuit. The voltage value of the adjustable level signal transmitted by the adjustable level signal line is used to adjust the voltage value of the drive signal transmitted by the drive signal line. The voltage value of the first constant voltage signal transmitted by the first constant voltage signal line is greater than the voltage value of the adjustable level signal. The bonding pin is electrically connected to the drive signal line.

16. The display substrate according to claim 15, characterized in that, The adjustable level signal is positively correlated with the voltage value of the drive signal.

17. The display substrate according to claim 15, characterized in that, Also includes: First constant voltage connection line and adjustable signal connection line; The electrostatic protection circuit is electrically connected to the first constant voltage signal line through the first constant voltage connection line, and the electrostatic protection circuit is electrically connected to the adjustable level signal line through the adjustable signal connection line. The length extension direction of the first constant voltage connection line is the same as the length extension direction of the adjustable signal connection line, and the length extension direction of the first constant voltage connection line intersects with the length extension direction of at least a portion of the drive signal line. The length extension direction of the first constant voltage connection line intersects with the length extension direction of the first constant voltage signal line; The electrostatic discharge (ESD) protection circuit includes multiple ESD protection devices, at least some of which are located between the first constant voltage connection line and the adjustable signal connection line.

18. The display substrate according to claim 15, characterized in that, include: A substrate layer includes a display area and a non-display area. The pixel circuit is disposed in the display area, and the non-display area surrounds the display area. The non-display area includes a first area, a second area, and a third area. The first area is located between the display area and the second area, and the second area is located between the first area and the third area. The first area is used for bending the display substrate. The electrostatic protection circuit is disposed in the second area, and the bonding pins are disposed in the third area. The test module is electrically connected to the pixel circuit. The test module is located in the second region. The test module is located between the first region and the electrostatic discharge protection circuit. The electrostatic discharge protection circuit is located between the test module and the bonding pin.

19. The display substrate according to any one of claims 15 to 18, characterized in that, include: A substrate layer, the substrate layer including a display area and a non-display area, the non-display area surrounding the display area, the pixel circuit being disposed in the display area, and the electrostatic protection circuit and the bonding pins being disposed in the non-display area; An organic insulating layer includes a second perforation, wherein the orthographic projection of the second perforation on the substrate layer does not overlap with the orthographic projection of the electrostatic protection circuit on the substrate layer, and the orthographic projection of the second perforation on the substrate layer surrounds the orthographic projection of the electrostatic protection circuit on the substrate layer.

20. The display substrate according to claim 19, characterized in that, Also includes: An inorganic protective layer, wherein the inorganic protective layer covers the second perforation; First constant voltage connection line and adjustable signal connection line; The orthographic projection of the second cutout on the substrate surrounds at least a portion of the orthographic projection of the first constant voltage connection line and at least a portion of the adjustable signal connection line on the substrate.

21. A display substrate, characterized in that, include: A substrate layer, the substrate layer including a display area and a non-display area; Pixel circuitry is disposed in the display area; Drive signal lines; An electrostatic discharge (ESD) protection circuit is disposed in the non-display area, and the ESD protection circuit is electrically connected to the drive signal line. A bonding pin is provided in the non-display area, and the two ends of the drive signal line are electrically connected to the pixel circuit and the bonding pin, respectively. An organic insulating layer includes a second perforation, wherein the orthographic projection of the second perforation on the substrate layer does not overlap with the orthographic projection of the electrostatic protection circuit on the substrate layer, and the orthographic projection of the second perforation on the substrate layer surrounds the orthographic projection of the electrostatic protection circuit on the substrate layer.

22. The display substrate according to claim 21, characterized in that, Also includes: A first constant voltage signal line is provided in the non-display area; An adjustable level signal line is provided in the non-display area; The electrostatic protection circuit is electrically connected to the first constant voltage signal line through the first constant voltage connection line. An adjustable signal connection line is provided, and the electrostatic protection circuit is electrically connected to the adjustable level signal line through the adjustable signal connection line. The orthographic projection of the second cutout on the substrate surrounds at least a portion of the orthographic projection of the first constant voltage connection line and at least a portion of the adjustable signal connection line on the substrate.

23. The display substrate according to claim 21, characterized in that, Also includes: An inorganic protective layer, which covers the second cutout and the electrostatic protection circuit; A first organic protective layer is disposed on the side of the inorganic protective layer away from the substrate layer, and the orthographic projection of the first organic protective layer on the substrate layer does not overlap with the first region. A second organic protective layer covers the first region and the edge of the first organic protective layer is wrapped around it. The thickness of the second organic protective layer is greater than the thickness of the first organic protective layer.

24. The display substrate according to claim 21, characterized in that, The non-display area includes a first area, a second area, and a third area. The first area is located between the display area and the second area, and the second area is located between the first area and the third area. The first area is used for bending the display substrate. The electrostatic protection circuit is disposed in the second area, and the bonding pin is disposed in the third area. The display substrate further includes: A test module is disposed in the second region. The test module is electrically connected to the pixel circuit. The test module is located between the first region and the electrostatic discharge protection circuit. The electrostatic discharge protection circuit is located between the test module and the bonding pin.

25. The display substrate according to any one of claims 21 to 24, characterized in that, Also includes: The first constant voltage signal line and the adjustable level signal line are connected, the protection terminal of the electrostatic protection circuit is electrically connected to the drive signal line, the positive terminal of the electrostatic protection circuit is electrically connected to the first constant voltage signal line, and the negative terminal of the electrostatic protection circuit is electrically connected to the adjustable level signal line. The voltage value of the adjustable level signal transmitted by the adjustable level signal line is used to adjust according to the voltage value of the drive signal transmitted by the drive signal line, and the voltage value of the first constant voltage signal transmitted by the first constant voltage signal line is greater than the voltage value of the adjustable level signal.

26. The display substrate according to claim 25, characterized in that, The adjustable level signal is positively correlated with the voltage value of the drive signal.

27. The display substrate according to claim 25, characterized in that, Also includes: The electrostatic protection circuit is electrically connected to the first constant voltage signal line via the first constant voltage connection line and to the adjustable level signal line via the adjustable signal connection line. The length extension direction of the first constant voltage connection line is the same as the length extension direction of the adjustable signal connection line, and the length extension direction of the first constant voltage connection line intersects with the length extension direction of at least a portion of the drive signal lines.

28. A display device, characterized in that, include: The display substrate as described in any one of claims 1 to 27.

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