Novel photoelectric radio frequency device shell

Abstract

The utility model relates to a novel photoelectric radio frequency device shell, which comprises an annular frame, a bottom plate, a ceramic block and a lead frame, the ceramic blocks comprise a first ceramic block and a second ceramic block, and the lead frames comprise a first lead frame and a second lead frame; the first lead frame and the second lead frame are respectively welded on the first ceramic block and the second ceramic block; grooves matched with the ceramic blocks are formed in the left side and the right side of the annular frame, and a boss is arranged in the middle of the bottom plate. The ceramic block and the lead frame are placed in the annular frame groove; and the groove of the ring frame is matched with the boss of the bottom plate, and is fixed by a clamp and brazed to form the photoelectric radio frequency device shell. According to the utility model, the ceramic structure is simplified; product processing, assembling and electroplating processes can be realized; and good air tightness and reliability of the product can be realized.

Description

Technical Field

[0001] This utility model relates to the field of optoelectronic device housing technology, and specifically to a novel optoelectronic radio frequency device housing. Background Technology

[0002] The housing of optoelectronic devices provides electrical signal transmission channels and optical coupling interfaces, as well as mechanical support and hermetic protection. With the increasing integration and radio frequency (RF) requirements of optoelectronic devices, more and more device housings are being designed from the outset, replacing single-core glass with a monolithic ceramic block as the insulating medium. Through printed circuitry and localized metallization, densely packed solder pads are achieved within a very small space. Furthermore, due to the inherent RF performance of ceramic, RF transmission functionality can be achieved without special design. However, the following problems arise in practical applications:

[0003] 1. As the number of ceramic optoelectronic devices with side-lead structures gradually increases, considering the insulation performance between the printed circuit on the ceramic surface and the housing, the ceramic body often adopts internal wiring. Since the ceramic block is rectangular, mounting holes need to be drilled in the side wall of the housing using precision machining methods such as slow wire EDM. Precision machining methods often result in long processing time, increased component costs, and problems such as difficulty in positioning the ceramic structure and poor welding effect during assembly.

[0004] 2. To achieve a high degree of integration, electrical signals are transmitted by arranging circuitry on a single ceramic block. In conventional ceramic structures, considering the insulation withstand voltage between the ceramic surface circuitry and the housing, the printed circuitry is often placed inside the ceramic block at the contact point with the housing, resulting in a complex ceramic structure. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by designing a novel housing for optoelectronic radio frequency devices. This design simplifies the ceramic structure, allows for easy product processing, assembly, and electroplating, and enables the product to achieve excellent airtightness and reliability. The specific technical solution adopted is as follows:

[0006] A novel optoelectronic radio frequency device housing includes a ring frame, a base plate, a ceramic block, and a lead frame. The ceramic block includes a first ceramic block and a second ceramic block, and the lead frame includes a first lead frame and a second lead frame. The first lead frame and the second lead frame are respectively welded to the first ceramic block and the second ceramic block. The left and right sides of the ring frame are provided with grooves that match the ceramic blocks, and the base plate is provided with a boss in the center. The ceramic block and the lead frame are placed in the grooves of the ring frame. The grooves of the ring frame match the boss of the base plate, and are fixed by a clamp and brazed to form the optoelectronic radio frequency device housing.

[0007] Preferably, the ceramic block is composed of a beam block and a base block, which are stacked together. The thickness of the beam block is consistent with the thickness of the side wall of the ring frame. The upper surface of the base block is provided with a printed circuit, and the printed circuit on the upper surface of the base block is insulated from the ring frame.

[0008] Preferably, a light guide is provided on the lower side of the ring frame.

[0009] Preferably, mounting flanges are provided on the upper and lower sides of the base plate.

[0010] Preferably, the ring frame, base plate, ceramic block, and lead frame are electroplated with gold.

[0011] Compared with the closest existing technology, the technical solution provided by this utility model has the following beneficial effects:

[0012] 1. The photoelectric radio frequency device housing of this utility model achieves precise machining and low cost by processing the housing into two parts: a base plate and a ring frame.

[0013] 2. The bottom plate of the optoelectronic radio frequency device housing of this utility model is provided with a mounting flange structure. When the ring frame is assembled and welded, the mounting flange is higher than the upper surface of the bottom plate, and the ring frame is tightly fastened in the mounting flange, which ensures the positional accuracy and reliability of the ring frame and the bottom plate during the welding process.

[0014] 3. The ceramic block of the optoelectronic radio frequency device housing of this utility model stacks the beam block and the bottom block together, adopting a multi-layer structure. The ceramic structure achieves circuit printing through metallization in the first layer. Then, a second layer of ceramic sheet is stacked on top of the first layer. The thickness of the second layer is adjusted to meet the insulation withstand voltage requirements. Thus, the mutual conduction between the inside and outside of the ceramic structure and the insulation withstand voltage requirements between the printed circuit and the housing are achieved in a simple structure. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of the optoelectronic radio frequency device housing of this utility model;

[0016] Figure 2 This is an enlarged schematic diagram of point A on the housing of the optoelectronic radio frequency device of this utility model;

[0017] Figure 3 This is a schematic diagram of the ceramic block structure of this utility model;

[0018] Figure 4 This is a schematic diagram of the printed circuit structure of this utility model;

[0019] Among them: 1. Ring frame; 2. Base plate; 3. First ceramic block; 4. Second ceramic block; 5. First lead frame; 6. Second lead frame; 31. Beam block; 32. Base block; 321. Printed circuit. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figures 1-4 This utility model provides a technical solution:

[0022] like Figure 1 As shown, a novel optoelectronic radio frequency device housing includes a ring frame 1, a base plate 2, ceramic blocks, and lead frames. The ceramic blocks include a first ceramic block 3 and a second ceramic block 4, and the lead frames include a first lead frame 5 and a second lead frame 6. The first lead frame 5 and the second lead frame 6 are respectively welded to the first ceramic block 3 and the second ceramic block 4. A light guide is provided on the lower side of the ring frame 1. The ring frame 1 is made of an expansion alloy and integrally formed with the light guide for fiber optic installation and fixation. Grooves matching the ceramic blocks are provided on the left and right sides of the ring frame 1, and the ceramic blocks and lead frames are placed in the grooves of the ring frame 1. A boss is provided in the center of the base plate 2 for chip positioning and mounting. The grooves of the ring frame 1 match the boss of the base plate 2, and the housing is fixed by a clamp and brazed at high temperature to form the optoelectronic radio frequency device housing, achieving connection and ensuring the airtightness of the housing. This optoelectronic radio frequency device housing achieves precise machining and low cost by processing the housing into two parts, the base plate 2 and the ring frame 1.

[0023] like Figure 3 As shown, the ceramic block further comprises a beam block 31 and a base block 32, which are stacked together. The thickness of the beam block 31 is consistent with the sidewall thickness of the ring frame 1, mainly used to achieve mutual insulation between the printed circuit 321 on the upper surface of the base block 32 and the ring frame 1. The printed circuit 321 is fabricated by local metallization on the upper surface of the base block 32 for the transmission of electrical signals inside and outside the housing. Metallization is applied to the upper surface, left and right sides, and bottom surface of the overall ceramic structure to achieve solderability of the ceramic structure surface. After all metallization is completed, the beam block 31 and the base block 32 are stacked and co-fired, followed by chemical plating. Because of the process of welding the lead frame and ceramic structure before gold plating, conduction between the printed circuits 321 can be achieved without additional metallization series connection. The above structure is the innovation of this utility model. By stacking the beam block 31 and the bottom block 32, the mutual insulation between the printed circuit 321 and the frame 1 is achieved in a simple structure. By first welding it to the lead frame and then electroplating it, the mutual conduction between the printed circuits 321 is achieved. Multiple paths are integrated on the surface of the ceramic block 3 and provide mutual conduction channels for electroplating.

[0024] Furthermore, to facilitate the positioning of the ceramic block on the side, after the lead wires are soldered to the metallized layer of the ceramic structure, the ceramic structure is first soldered to the metal ring frame, and finally the ring frame and the base plate are soldered together. This solves the problems of difficult positioning of the ceramic structure and poor welding effect during assembly.

[0025] Furthermore, mounting flanges are provided on the upper and lower sides of the base plate 2. The base plate 2 and the mounting flanges are integrally formed and used to fix the housing of optoelectronic radio frequency devices during use. Because there are mounting flange structures at the front and rear positions of the base plate 2, when the ring frame 1 is assembled and welded, the mounting flanges are higher than the upper surface of the base plate 2, and the ring frame 1 is tightly fastened inside the mounting flanges, ensuring the positional accuracy and reliability of the ring frame 1 and the base plate 2 during the welding process.

[0026] Furthermore, the ring frame 1 and the base plate 2 are machined by machining, the first lead frame 5 and the second lead frame 6 are etched, and the ceramic block is formed by stacking and co-firing multiple layers of ceramic sheets.

[0027] The working principle of the optoelectronic radio frequency device housing of this utility model is as follows: First, after the first ceramic block 3, the second ceramic block 4, the first lead frame 5, and the second lead frame 6 are welded together, they are placed into the groove of the ring frame 1. Then, the base plate 2 is placed below the ring frame 1, and after being fixed in place by a clamp, it is brazed at high temperature to form a whole. Finally, surface treatment is performed, and the ring frame 1, the base plate 2, the ceramic block, and the lead frame are electroplated with gold. When the user uses it, the circuit and optical fiber are installed inside the optoelectronic radio frequency device housing, and then tinned and sealed. Finally, the lead frame is wire-cut. The above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to the above embodiments, those skilled in the art can still make modifications or equivalent substitutions to the specific implementation of this utility model. Any modifications or equivalent substitutions that do not depart from the spirit and scope of this utility model are within the protection scope of the claims of this utility model pending approval.

Claims

1. A novel optoelectronic radio frequency device housing, comprising a ring frame and a base plate, characterized in that: It also includes a ceramic block and a lead frame; the ceramic block includes a first ceramic block and a second ceramic block, and the lead frame includes a first lead frame and a second lead frame; the first lead frame and the second lead frame are respectively welded to the first ceramic block and the second ceramic block; the left and right sides of the ring frame are provided with grooves that match the ceramic blocks, and the bottom plate is provided with a boss in the center; the ceramic block and the lead frame are placed in the grooves of the ring frame; the grooves of the ring frame match the bosses of the bottom plate, and are fixed by a clamp and brazed to form the housing of the optoelectronic radio frequency device.

2. The novel optoelectronic radio frequency device housing according to claim 1, characterized in that: The ceramic block consists of a beam block and a base block, which are stacked together. The thickness of the beam block is consistent with the thickness of the side wall of the ring frame. The upper surface of the base block is provided with a printed circuit, which is insulated from the ring frame.

3. The novel optoelectronic radio frequency device housing according to claim 1, characterized in that: A light guide is provided on the lower side of the ring frame.

4. The novel optoelectronic radio frequency device housing according to claim 1, characterized in that: Mounting flanges are provided on the upper and lower sides of the base plate.

5. The novel optoelectronic radio frequency device housing according to claim 1, characterized in that: The ring frame, base plate, ceramic block, and lead frame are electroplated with gold.

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