OLED display panel and display device

Abstract

The utility model provides an OLED display panel and a display device, and belongs to the technical field of display. The OLED display panel comprises a driving backboard, the driving backboard is provided with a display area and a peripheral area, and the peripheral area is arranged around the display area; the light-emitting unit is arranged on one side of the driving back plate; the packaging layer is arranged on one side, deviating from the driving back plate, of the light emitting unit; and the conductive wire is arranged in the peripheral area and is partially exposed, at least part of the conductive wire is not covered by the packaging layer, and the conductive wire is connected with a grounding metal pattern in the driving backboard. According to the OLED display panel, the electrostatic protection capability of the OLED display panel can be improved.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to an OLED display panel and display device. Background Technology

[0002] The basic structure of an organic light-emitting diode (OLED) device includes a cathode, an anode, and an organic electroluminescent material between them. To enhance the light-emitting performance of OLED devices, non-organic materials can be added to improve various performance indicators. In an OLED device, either the cathode or anode must be transparent / semi-transparent in the visible light region. When a bias voltage is applied to the OLED device, electrons and holes are injected into the organic light-emitting layer from the cathode and anode, respectively. Electrons and holes form excitons in the organic light-emitting layer; these excitons are excited-state electrons. The excitons recombine in the organic light-emitting layer, releasing energy in the form of light.

[0003] With the technological development of silicon-based Micro-OLED, Micro-OLED is gradually being widely used in industries such as VR (virtual reality) / AR (augmented reality), night vision, and targeting. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide an OLED display panel and display device that can improve the electrostatic protection capability of the OLED display panel.

[0005] To solve the above-mentioned technical problems, the embodiments of this utility model provide the following technical solutions:

[0006] On the one hand, an OLED display panel is provided, comprising:

[0007] A driving backplate having a display area and a peripheral area, the peripheral area being arranged around the display area;

[0008] The light-emitting unit is disposed on one side of the drive back plate;

[0009] An encapsulation layer is disposed on the side of the light-emitting unit opposite to the driving backplate;

[0010] The conductive traces are partially exposed in the peripheral area, at least a portion of which are not covered by the encapsulation layer, and are connected to the ground metal pattern in the drive backplane.

[0011] In some embodiments, the peripheral area is provided with one or more loops of conductive traces surrounding the display area.

[0012] In some embodiments, the thickness of the first portion of the conductive trace not covered by the encapsulation layer is less than the thickness of the second portion covered by the encapsulation layer.

[0013] In some embodiments, the width of a first portion of the conductive trace not covered by the encapsulation layer is greater than the width of a second portion covered by the encapsulation layer.

[0014] In some embodiments, the light-emitting unit includes an anode, an organic light-emitting layer, and a cathode arranged sequentially in a direction away from the driving backplate, and the conductive traces are disposed in the same layer and material as the anode.

[0015] In some embodiments, the thickness of the conductive trace is 100-200 angstroms.

[0016] In some embodiments, the conductive traces are connected to the grounding metal pattern through a plurality of vias penetrating the drive backplane.

[0017] In some embodiments, the OLED display panel further includes a color filter layer located on the side of the light-emitting unit opposite to the driving backplate, the color filter layer including a plurality of filter units, the plurality of filter units including a red filter unit, a green filter unit and a blue filter unit.

[0018] In some embodiments, the OLED display panel further includes a lens layer located on the side of the color filter layer opposite to the driving backplate, the lens layer including a plurality of spaced-apart lens units, wherein each lens unit corresponds to each filter unit.

[0019] In some embodiments, the driving backplane is a silicon-based backplane.

[0020] An embodiment of this utility model also provides a display device, including an OLED display panel as described above, and a flexible circuit board (FPC) bonded to the OLED display panel. The FPC is provided with a grounding point, and the grounding metal pattern is electrically connected to the grounding point.

[0021] An embodiment of this utility model also provides a method for manufacturing an OLED display panel, comprising:

[0022] A driving backplane is formed, the driving backplane having a display area and a peripheral area, the peripheral area being disposed around the display area, and conductive traces being formed in the peripheral area;

[0023] A light-emitting unit is formed on the driving backplate;

[0024] An encapsulation layer is formed to cover the light-emitting unit, and the encapsulation layer is etched to expose the conductive traces.

[0025] In some embodiments, the light-emitting unit includes an anode, an organic light-emitting layer, and a cathode arranged sequentially in a direction away from the driving backplate, and the conductive traces are formed by:

[0026] The anode and the conductive traces are formed through a single patterning process.

[0027] The embodiments of this utility model have the following beneficial effects:

[0028] In the above solution, the peripheral area of ​​the OLED display panel has exposed conductive traces that are not covered by the encapsulation layer. These conductive traces are connected to the grounding metal pattern in the driving backplane. This allows the exposed conductive traces to attract static electricity and release it to the grounding metal pattern, preventing charge from flowing into the OLED display panel and causing damage to internal components. This significantly improves the electrostatic discharge (ESD) protection capability of the OLED display panel. On the one hand, it reduces product failures caused by ESD during the manufacturing process of the OLED display panel, improving product yield; on the other hand, it reduces product failures caused by ESD during user use, improving the user experience. Attached Figure Description

[0029] Figure 1 and Figure 2 This is a schematic diagram of the structure of an existing OLED display panel;

[0030] Figure 3 This is a schematic diagram illustrating the conductive traces arranged around the display area according to an embodiment of the present invention;

[0031] Figure 4 and Figure 5 This is a schematic diagram of the structure of an OLED display panel according to an embodiment of the present invention.

[0032] Figure Labels

[0033] S1 Display Area

[0034] S2 surrounding area

[0035] 10 Silicon-based substrates

[0036] 11 Conductive pillars

[0037] 12 First Insulation Layer

[0038] 13 Conductive layer

[0039] 14 Anode layer

[0040] 15 Second Insulation Layer

[0041] 16 Organic light-emitting layer

[0042] 17 Third Insulation Layer

[0043] 18 First encapsulation layer

[0044] 19 Second encapsulation layer

[0045] 201 Blue Filter Units

[0046] 202 Black Matrix

[0047] 203 red filter units

[0048] 204 Green Filter Unit

[0049] 21 Etching barrier layer

[0050] 22 lens units

[0051] 23 Filler adhesive

[0052] 24 Package cover

[0053] 30 Conductive traces

[0054] 31 Via

[0055] 32 Grounding Metal Pattern Detailed Implementation

[0056] To make the technical problems, technical solutions and advantages of the embodiments of this utility model clearer, a detailed description will be given below in conjunction with the accompanying drawings and specific embodiments.

[0057] Figure 1 and Figure 2 A schematic diagram of the structure of an existing OLED display panel, such as... Figure 1 As shown, existing OLED display substrates are encapsulated using a substrate + filler 23 + encapsulation cover 24. The substrate can be a silicon-based substrate 10, such as... Figure 1 As shown, S1 is the display area. Figure 2 As shown, when the substrate is a silicon substrate 10, a first insulating layer 12, a conductive layer 13, a light-emitting unit, a second insulating layer 15, a third insulating layer 17, and a first encapsulation layer 18 are disposed on the silicon substrate 10. The light-emitting unit includes an anode layer 14, an organic light-emitting layer 16, and a cathode layer (not shown). The anode layer 14 can be made of a transparent conductive material such as ITO or IZO. The anode layer 14 is in contact with the conductive layer 13. The conductive layer 13 can be a multilayer structure of Ti / TiN / Al / TiN. The conductive layer 13 is connected to the circuit inside the silicon substrate 10 through conductive pillars 11.

[0058] When the light emitted by the organic light-emitting layer is white light, a color filter layer is also provided on the first encapsulation layer 18. The color filter layer may include a blue filter unit 201, a red filter unit 203 and a green filter unit 204. A second encapsulation layer 19 is also provided on the side of the color filter layer away from the silicon substrate 10. A filler adhesive 23 and an encapsulation cover plate 24 are provided on the side of the second encapsulation layer 19 away from the silicon substrate 10.

[0059] Existing OLED display panels are protected against electrostatic discharge and moisture through filler adhesive 23 and encapsulation layer. However, during the production and use of OLED display panels, there is still a problem that static electricity can penetrate the filler adhesive 23 and encapsulation layer around the OLED display panel and enter the interior of the OLED display panel, causing product failure. This affects both product yield and user experience.

[0060] This utility model provides a silicon-based display panel, its manufacturing method, and a display device, which can improve the electrostatic protection capability of the silicon-based display panel.

[0061] An embodiment of this utility model provides an OLED display panel, comprising:

[0062] A driving backplate having a display area and a peripheral area, the peripheral area being arranged around the display area;

[0063] The light-emitting unit is disposed on one side of the drive back plate;

[0064] An encapsulation layer is disposed on the side of the light-emitting unit opposite to the driving backplate;

[0065] The conductive traces are partially exposed in the peripheral area, at least a portion of which are not covered by the encapsulation layer, and are connected to the ground metal pattern in the drive backplane.

[0066] In this embodiment, the peripheral area of ​​the OLED display panel has exposed conductive traces that are not covered by the encapsulation layer. These conductive traces are connected to the grounding metal pattern in the driving backplane. This allows the exposed conductive traces to attract static electricity and release it to the grounding metal pattern, preventing charge from flowing into the OLED display panel and causing damage to internal components. This significantly improves the electrostatic discharge (ESD) protection capability of the OLED display panel. On the one hand, it reduces product failures caused by ESD during the manufacturing process of the OLED display panel, improving product yield; on the other hand, it reduces product failures caused by ESD during user operation, improving the user experience.

[0067] like Figure 3 and Figure 4As shown, the OLED display panel of this embodiment includes a display area S1 and a peripheral area S2 surrounding the display area S1. Exposed conductive traces 30 are provided in the peripheral area S2, and the conductive traces 30 are connected to a grounded metal pattern 32 in the driving backplane through vias 31. To ensure the electrostatic discharge (ESD) protection capability of the OLED display panel, the conductive traces 30 can be connected to the grounded metal pattern 32 in the driving backplane through multiple vias 31, and the multiple vias 31 can be evenly distributed along the extension direction of the conductive traces 30.

[0068] In this embodiment, the peripheral area S2 may be provided with one or more turns of the conductive trace 30 surrounding the display area S1. The number of turns of the conductive trace 30 can be set according to the width of the peripheral area S2. When the width of the peripheral area S2 is large, multiple turns of conductive trace 30 can be provided in the peripheral area S2, which can further improve the electrostatic protection capability of the OLED display panel.

[0069] Figure 5 This is a schematic diagram of the structure of an OLED display panel according to an embodiment of the present invention, as shown below. Figure 5 As shown, the OLED display panel includes a driving backplane and light-emitting units and encapsulation layers located on the driving backplane. The driving backplane can be a silicon-based backplane, meaning the substrate of the OLED display panel can be a silicon substrate 10. Driving circuits and conductive pillars 11 are fabricated inside the silicon substrate 10. The conductive pillars 11 can be made of tungsten. The driving circuit includes a ground metal pattern 32. Additionally, a first insulating layer 12 and a conductive layer 13 are disposed on the silicon substrate 10. The first insulating layer 12 can be made of silicon oxide, and the conductive layer 13 can be made of a reflective conductive material, such as a multilayer structure of Ti / TiN / Al / TiN. The conductive layer 13 is connected to the circuitry inside the silicon substrate 10 through the conductive pillars 11. When the conductive layer 13 uses a reflective conductive material, it can reflect the light emitted by the light-emitting units to the light-emitting side of the OLED display panel, improving the light utilization efficiency of the OLED display panel.

[0070] like Figure 5As shown, the light-emitting unit includes an anode layer 14, an organic light-emitting layer 16, and a cathode layer (not shown) arranged sequentially along the direction away from the driving backplate. The anode layer 14 can be made of a transparent conductive material such as ITO or IZO, and covers and is electrically connected to the conductive layer 13. The organic light-emitting layer 16 includes a hole injection layer (HIL), an electron injection layer (EIL), a hole transport layer (HTL), an electron transport layer (ETL), an electron blocking layer (EBL), a hole blocking layer (HBL), and a light-emitting layer (EML). The cathode layer is located on the side of the organic light-emitting layer 16 away from the driving backplate, and covers the organic light-emitting layer 16, forming a single layer. In specific implementations, the thickness of the cathode layer can range from 700 angstroms to 900 angstroms, and the specific thickness range can be set according to actual application needs, and is not limited here.

[0071] A second insulating layer 15 and a third insulating layer 17 are spaced between the anode layer 14 and the organic light-emitting layer 16. The second insulating layer 15 may be made of silicon oxide, and the third insulating layer 17 may be made of multiple stacked insulating film layers. The multiple stacked insulating film layers may include alternating stacked silicon oxide film layers and silicon nitride film layers. In a specific example, the third insulating layer 17 includes two silicon oxide film layers and one silicon nitride film layer. The thicknesses of the two silicon oxide film layers may be approximately 100 angstroms and 200 angstroms, respectively, and the thickness of the silicon nitride film layer may be approximately 600 angstroms.

[0072] In this embodiment, in order to ensure the electrostatic protection capability of the OLED display panel and enable the conductive trace 30 to effectively conduct away the charge, the thickness of the conductive trace 30 can be 100-200 angstroms.

[0073] In this embodiment, the conductive trace includes a first part not covered by the encapsulation layer and a second part covered by the encapsulation layer, and the thickness of the first part is less than the thickness of the second part. This can prevent the conductive trace from being completely exposed and falling off, thus improving structural stability.

[0074] In some embodiments, the width of the first portion of the conductive trace not covered by the encapsulation layer is greater than the width of the second portion covered by the encapsulation layer, which can improve the electrostatic discharge protection effect.

[0075] In this embodiment, an additional film layer can be used to fabricate the conductive trace 30. To save on patterning steps, the conductive trace 30 can also be fabricated simultaneously with the anode layer, meaning the conductive trace 30 and the anode are in the same layer and made of the same material. The conductive trace 30 is electrically connected to the grounding metal pattern 32 via conductive posts 11. Each loop of the conductive trace 30 can be electrically connected to the grounding metal pattern 32 via multiple conductive posts 11, which improves the reliability of the connection between the conductive trace 30 and the grounding metal pattern 32.

[0076] In this embodiment, the conductive trace 30 is made of the same material as the anode. Since the anode is made of a transparent conductive material, the conductive trace 30 is also made of a transparent conductive material, so as not to affect the display of the OLED display panel.

[0077] In some embodiments, such as Figure 5 As shown, the OLED display panel also includes a color filter layer located on the side of the light-emitting unit opposite to the driving backplate. The color filter layer includes multiple filter units, including a red filter unit 203, a green filter unit 204, and a blue filter unit 201. In this embodiment, a black matrix 202 is provided between adjacent color filter units, and the orthographic projection of the black matrix 202 on the silicon substrate 10 covers the orthographic projection of the boundary between adjacent pixels on the silicon substrate 10. The black matrix 202 can block light leakage between pixels, reduce light leakage in the pixel edge area, and to a certain extent avoid color mixing between pixels, thereby improving the color purity of the OLED display panel.

[0078] Furthermore, such as Figure 5 As shown, the black matrix 202 does not overlap with the adjacent color filter unit. The surface of the black matrix 202 away from the silicon substrate 10 can be flush with the surface of the color filter unit away from the silicon substrate 10. This can form a flat surface on the one hand, and avoid color shift at large viewing angles on the other hand. When viewing the OLED display panel at a large viewing angle, the light emitted by the pixels will not show color shift, which can improve the color purity of the OLED display panel.

[0079] In some embodiments, such as Figure 5 As shown, the OLED display panel also includes a first encapsulation layer 18 located between the light-emitting unit and the color filter layer. The first encapsulation layer 18 can ensure the structural stability of the OLED display panel. In addition, it can encapsulate the OLED display panel to prevent water and oxygen from entering the interior of the OLED display panel.

[0080] In some embodiments, such as Figure 5 As shown, the OLED display panel also includes a lens layer located on the side of the color filter layer opposite to the driving backplate. The lens layer includes a plurality of lens units 22 spaced apart, wherein each lens unit 22 is configured in one-to-one correspondence with each filter unit, that is, in one-to-one correspondence with each pixel.

[0081] In the embodiments of this utility model, each pixel is self-illuminating, and each pixel corresponds one-to-one with a lens unit 22. That is, each lens unit 22 can converge the light emitted by the corresponding pixel, thereby increasing the brightness of the light emitted by each pixel. This enables the OLED display panel to meet the brightness requirements of the virtual reality display device when applied to a virtual reality display device.

[0082] The lens unit 22 can be made of organic resin or other materials, and the lens layer can be formed on the second encapsulation layer 19 through different processes such as imprinting, photolithography, thermal melting, and printing.

[0083] Furthermore, the distance between the center of any pixel and the principal optical axis of the lens unit 22 corresponding to that pixel is ≤0.5 micrometers.

[0084] In embodiments of this invention, the size of the light-emitting area can be adjusted by controlling the pixel aperture size on the electroluminescent device. The pixel aperture size and the aperture of the lens unit 22 can be adjusted according to the resolution requirements of the OLED display panel. The distance between the center of any pixel and the principal optical axis of the lens unit 22 corresponding to that pixel is ≤0.5 micrometers. Optionally, the center of any pixel is on the principal optical axis of the lens unit 22 corresponding to that pixel. This enhances the light-gathering effect of the lens unit 22 and ensures the display effect of the OLED display panel.

[0085] Furthermore, the focal length of the lens unit 22 is greater than or equal to 1.7 times the aperture of the lens unit 22.

[0086] In the embodiments of this utility model, the focal length of the lens unit 22 is greater than or equal to 1.7 times the aperture of the lens unit 22. This reduces the processing difficulty of the lens unit 22, ensures that the lens unit 22 can converge light and increase the brightness of the light, and facilitates the processing and manufacturing of the display panel.

[0087] In some embodiments, such as Figure 5 As shown, the OLED display panel also includes a second encapsulation layer 19 located between the lens layer and the color filter layer. The second encapsulation layer 19 can ensure the structural stability of the OLED display panel. In addition, it can encapsulate the OLED display panel to prevent water and oxygen from entering the interior of the OLED display panel.

[0088] In some embodiments, such as Figure 5 As shown, the OLED display panel also includes an etch barrier layer 21 located on the side of the lens layer away from the silicon substrate 10. The etch barrier layer 21 can protect the lens unit 22 and prevent the lens unit 22 from being damaged during the production process.

[0089] In some embodiments, such as Figure 5 As shown, the OLED display panel also includes a filler 23 and an encapsulation cover 24. The filler 23 can encapsulate the encapsulation cover 24 with the display substrate. In addition, the filler 23 can also provide electrostatic protection and moisture protection for the OLED display panel.

[0090] In this embodiment, the refractive index of the filler 23 can be less than that of the lens unit 22. In this way, the light emitted by the light-emitting unit can be further focused by the refractive index difference between the filler 23 and the lens unit 22, thereby improving the light output efficiency of the OLED display panel.

[0091] An embodiment of this utility model also provides a display device, such as... Figure 3 As shown, it includes an OLED display panel as described above, and also includes a flexible circuit board (FPC) bonded to the OLED display panel. The FPC is provided with a ground point GND, and the ground metal pattern is electrically connected to the ground point GND.

[0092] In the display device of this embodiment, exposed conductive traces are provided in the peripheral area. The conductive traces are not covered by the encapsulation layer. The conductive traces are electrically connected to the grounding point through the grounding metal pattern. In this way, static electricity can be attracted to the grounding point by the exposed conductive traces, preventing the charge from flowing into the display device and causing damage to the internal components, thereby significantly improving the electrostatic protection capability of the display device.

[0093] The display device includes, but is not limited to, components such as: a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, and a power supply. Those skilled in the art will understand that the above-described structure of the display device does not constitute a limitation on the display device; the display device may include more or fewer of the aforementioned components, or combine certain components, or arrange different components. In embodiments of this utility model, the display device includes, but is not limited to, a monitor, a mobile phone, a tablet computer, a television set, a wearable electronic device, and a navigation display device.

[0094] The display device can be any product or component with display function, such as a television, monitor, digital photo frame, mobile phone, or tablet computer. The display device also includes a flexible circuit board, a printed circuit board, and a backplate.

[0095] An embodiment of this utility model also provides a method for manufacturing an OLED display panel, comprising:

[0096] A driving backplane is formed, the driving backplane having a display area and a peripheral area, the peripheral area being disposed around the display area, and conductive traces being formed in the peripheral area;

[0097] A light-emitting unit is formed on the driving backplate;

[0098] An encapsulation layer is formed to cover the light-emitting unit, and the encapsulation layer is etched to expose the conductive traces.

[0099] In this embodiment, exposed conductive traces are formed in the peripheral area of ​​the OLED display panel. These conductive traces are not covered by the encapsulation layer and are connected to the grounding metal pattern in the driving backplane. This allows the exposed conductive traces to attract static electricity and release it to the grounding metal pattern, preventing charge from flowing into the OLED display panel and causing damage to internal components. This significantly improves the electrostatic discharge (ESD) protection capability of the OLED display panel. On the one hand, it reduces product failures caused by ESD during the manufacturing process of the OLED display panel, improving product yield; on the other hand, it reduces product failures caused by ESD during user use, improving the user experience.

[0100] like Figure 3 and Figure 4 As shown, the OLED display panel of this embodiment includes a display area S1 and a peripheral area S2 surrounding the display area S1. Exposed conductive traces 30 are provided in the peripheral area S2, and the conductive traces 30 are connected to a grounded metal pattern 32 in the driving backplane through vias 31. To ensure the electrostatic discharge (ESD) protection capability of the OLED display panel, the conductive traces 30 can be connected to the grounded metal pattern 32 in the driving backplane through multiple vias 31, and the multiple vias 31 can be evenly distributed along the extension direction of the conductive traces 30.

[0101] In this embodiment, the peripheral area S2 may be provided with one or more turns of the conductive trace 30 surrounding the display area S1. The number of turns of the conductive trace 30 can be set according to the width of the peripheral area S2. When the width of the peripheral area S2 is large, multiple turns of conductive trace 30 can be provided in the peripheral area S2, which can further improve the electrostatic protection capability of the OLED display panel.

[0102] like Figure 5 As shown, the OLED display panel of this embodiment includes a driving backplane and light-emitting units and encapsulation layers located on the driving backplane. The driving backplane can be a silicon-based backplane, that is, the substrate of the OLED display panel can be a silicon-based substrate 10, which can realize a high pixel density OLED display panel.

[0103] In some embodiments, the method for manufacturing the OLED display panel of this embodiment includes the following steps:

[0104] Step 1, as follows Figure 5 As shown, a silicon substrate 10 is provided;

[0105] A driving circuit and conductive pillars 11 are fabricated inside the silicon substrate 10. The conductive pillars 11 can be made of tungsten, and the driving circuit includes a grounded metal pattern 32. Additionally, a first insulating layer 12 and a conductive layer 13 are disposed on the silicon substrate 10. The first insulating layer 12 can be made of silicon oxide, and the conductive layer 13 can be made of a reflective conductive material, such as a multilayer structure of Ti / TiN / Al / TiN. The conductive layer 13 is connected to the circuitry inside the silicon substrate 10 via the conductive pillars 11. When the conductive layer 13 is made of a reflective conductive material, it can reflect the light emitted by the light-emitting unit to the light-emitting side of the OLED display panel, thereby improving the light utilization efficiency of the OLED display panel.

[0106] Step 2: Form light-emitting units and conductive traces 30 on the silicon substrate 10;

[0107] The light-emitting unit includes an anode layer 14, an organic light-emitting layer 16, and a cathode layer (not shown) arranged sequentially along the direction away from the driving backplate. The anode layer 14 can be made of a transparent conductive material such as ITO or IZO, and covers and is electrically connected to the conductive layer 13. The organic light-emitting layer 16 includes a hole injection layer (HIL), an electron injection layer (EIL), a hole transport layer (HTL), an electron transport layer (ETL), an electron blocking layer (EBL), a hole blocking layer (HBL), and a light-emitting layer (EML). The cathode layer is located on the side of the organic light-emitting layer 16 away from the driving backplate, and covers the organic light-emitting layer 16, forming a single layer. In specific implementations, the thickness of the cathode layer can range from 700 angstroms to 900 angstroms, and the specific thickness range can be set according to actual application needs, and is not limited here.

[0108] In this embodiment, the conductive trace 30 is fabricated simultaneously with the anode layer. That is, the conductive trace 30 and the anode are placed in the same layer and made of the same material, forming both the conductive trace 30 and the anode in the same patterning process. This saves on the number of patterning processes and reduces production costs. The conductive trace 30 is electrically connected to the grounding metal pattern 32 via conductive posts 11. Each loop of the conductive trace 30 can be electrically connected to the grounding metal pattern 32 via multiple conductive posts 11, which improves the reliability of the connection between the conductive trace 30 and the grounding metal pattern 32.

[0109] Furthermore, a second insulating layer 15 and a third insulating layer 17 can be formed between the anode layer 14 and the organic light-emitting layer 16. The second insulating layer 15 can be made of silicon oxide, and the third insulating layer 17 can be made of multiple stacked insulating film layers. The multiple stacked insulating film layers can include alternating stacked silicon oxide film layers and silicon nitride film layers. In a specific example, the third insulating layer 17 includes two silicon oxide film layers and one silicon nitride film layer. The thicknesses of the two silicon oxide film layers can be about 100 angstroms and 200 angstroms, respectively, and the thickness of the silicon nitride film layer can be about 600 angstroms.

[0110] Step 3: Form a first encapsulation layer 18 and a color filter layer on the side of the light-emitting unit away from the driving backplate;

[0111] The first encapsulation layer 18 can ensure the structural stability of the OLED display panel. In addition, it can encapsulate the OLED display panel to prevent water and oxygen from entering the interior of the OLED display panel.

[0112] The color filter layer includes multiple filter units, including a red filter unit 203, a green filter unit 204, and a blue filter unit 201. In this embodiment, a black matrix 202 is also formed between adjacent color filter units, and the orthographic projection of the black matrix 202 on the silicon substrate 10 covers the orthographic projection of the boundary between adjacent pixels on the silicon substrate 10. The black matrix 202 can block light leakage between pixels, reduce light leakage in the pixel edge area, and to a certain extent avoid color mixing between pixels, thereby improving the color purity of the OLED display panel.

[0113] Furthermore, such as Figure 5 As shown, the black matrix 202 does not overlap with the adjacent color filter unit. The surface of the black matrix 202 away from the silicon substrate 10 can be flush with the surface of the color filter unit away from the silicon substrate 10. This can form a flat surface on the one hand, and avoid color shift at large viewing angles on the other hand. When viewing the OLED display panel at a large viewing angle, the light emitted by the pixels will not show color shift, which can improve the color purity of the OLED display panel.

[0114] Step 4: Form a second encapsulation layer 19 and a lens layer on the side of the color filter layer facing away from the drive backplate;

[0115] The second encapsulation layer 19 can ensure the structural stability of the OLED display panel. In addition, it can encapsulate the OLED display panel to prevent water and oxygen from entering the interior of the OLED display panel.

[0116] The lens layer includes a plurality of lens units 22 spaced apart, wherein each lens unit 22 is configured in a one-to-one correspondence with each filter unit, that is, in a one-to-one correspondence with each pixel.

[0117] In the embodiments of this utility model, each pixel is self-illuminating, and each pixel corresponds one-to-one with a lens unit 22. That is, each lens unit 22 can converge the light emitted by the corresponding pixel, thereby increasing the brightness of the light emitted by each pixel. This enables the OLED display panel to meet the brightness requirements of the virtual reality display device when applied to a virtual reality display device.

[0118] The lens unit 22 can be made of organic resin or other materials, and the lens layer can be formed on the second encapsulation layer 19 through different processes such as imprinting, photolithography, thermal melting, and printing.

[0119] Step 5: Form an etch barrier layer 21 covering the lens layer;

[0120] In this embodiment, in order to protect the lens layer, an etching barrier layer 21 is formed on the side of the lens layer away from the silicon substrate 10. The etching barrier layer 21 can be made of an inorganic insulating material.

[0121] Step 6: Etch the organic and inorganic film layers above the conductive trace 30 to expose the conductive trace 30;

[0122] Step 7: Form the filler adhesive 23 and the encapsulation cover plate 24. The encapsulation cover plate 24 is encapsulated together with the display substrate by the filler adhesive 23. In addition, the filler adhesive 23 can also provide electrostatic protection and moisture protection for the OLED display panel.

[0123] In this embodiment, the refractive index of the filler 23 can be less than that of the lens unit 22. In this way, the light emitted by the light-emitting unit can be further focused by the refractive index difference between the filler 23 and the lens unit 22, thereby improving the light output efficiency of the OLED display panel.

[0124] In the various method embodiments of this utility model, the sequence number of each step is not used to limit the order of each step. For those skilled in the art, changes in the order of each step are also within the protection scope of this utility model without creative effort.

[0125] It should be noted that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, since the embodiments are basically similar to the product embodiments, the descriptions are relatively simple, and the relevant parts can be referred to the descriptions of the product embodiments.

[0126] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0127] It is understandable that when a component such as a layer, film, region, or substrate is referred to as being "above" or "below" another component, the component may be "directly" located "above" or "below" the other component, or there may be intermediate components present.

[0128] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0129] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims. 。

Claims

1. An OLED display panel, characterized in that, include: A driving backplate having a display area and a peripheral area, the peripheral area being arranged around the display area; The light-emitting unit is disposed on one side of the drive back plate; An encapsulation layer is disposed on the side of the light-emitting unit opposite to the driving backplate; The conductive traces are partially exposed in the peripheral area, at least a portion of which are not covered by the encapsulation layer, and are connected to the ground metal pattern in the drive backplane.

2. The OLED display panel according to claim 1, characterized in that, The peripheral area is provided with one or more circles of conductive traces surrounding the display area.

3. The OLED display panel according to claim 1, characterized in that, The light-emitting unit includes an anode, an organic light-emitting layer, and a cathode arranged sequentially in a direction away from the driving backplate, and the conductive traces are arranged in the same layer and material as the anode.

4. The OLED display panel according to claim 1, characterized in that, The thickness of the conductive trace is 100-200 angstroms.

5. The OLED display panel according to claim 1, characterized in that, The conductive traces are connected to the grounding metal pattern through multiple vias penetrating the drive backplate.

6. The OLED display panel according to claim 1, characterized in that, The thickness of the first portion of the conductive trace not covered by the encapsulation layer is less than the thickness of the second portion covered by the encapsulation layer.

7. The OLED display panel according to claim 1, characterized in that, The width of the first portion of the conductive trace not covered by the encapsulation layer is greater than the width of the second portion covered by the encapsulation layer.

8. The OLED display panel according to any one of claims 1-7, characterized in that, It also includes a color filter layer located on the side of the light-emitting unit away from the driving backplate, the color filter layer including multiple filter units, the multiple filter units including a red filter unit, a green filter unit and a blue filter unit.

9. The OLED display panel according to claim 8, characterized in that, It also includes a lens layer located on the side of the color filter layer opposite to the drive back plate. The lens layer includes a plurality of spaced-apart lens units, wherein each lens unit corresponds to each filter unit.

10. The OLED display panel according to any one of claims 1-7, characterized in that, The drive backplane is a silicon-based backplane.

11. A display device, characterized in that, The OLED display panel includes any one of claims 1-10, and further includes a flexible circuit board (FPC) bonded to the OLED display panel, wherein the FPC is provided with a grounding point and the grounding metal pattern is electrically connected to the grounding point.

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