Wafer carrying device and wafer testing equipment

Abstract

The utility model provides a wafer carrying device and wafer testing equipment, and relates to the technical field of wafer testing. According to the utility model, the rotating platform is rotatably connected with the first base, and the clamping assembly is installed on the rotating platform and is used for clamping the heat sink bearing the wafer to be tested. A driving piece and a first sliding rail of the adjusting assembly are installed on the first base, and a connecting piece is installed on the first sliding rail and connected with the driving piece. The second sliding rail is installed on the rotating platform, and the connecting rod is installed on the second sliding rail and rotationally connected with the connecting piece. Under the driving of the driving piece, when the connecting piece slides along the first sliding rail, the connecting rod is driven to rotate relative to the connecting piece, and the connecting rod is pushed to slide along the second sliding rail, so that the rotating platform is driven to rotate, and the angle of the tested wafer is adjusted. According to the technical scheme, linear motion is equivalently converted into rotation, so that the rotation angle of the tested wafer can be adjusted, and accurate contact between the test probe and the tested wafer is realized.

Description

Technical Field

[0001] This utility model relates to the field of wafer testing technology, and in particular to a wafer handling device and wafer testing equipment. Background Technology

[0002] In wafer testing, wafer handling devices are typically used to move the wafer under test. During this process, the position of the wafer may shift, affecting the accuracy of the contact between the test probes and the wafer. Therefore, there is an urgent need to design a wafer handling device capable of adjusting the angle of the wafer under test. Utility Model Content

[0003] One objective of this invention is to provide a wafer handling device that solves the technical problem in the prior art where wafers are prone to movement during handling, resulting in low contact accuracy between the test probes and the wafers.

[0004] A further objective of this invention is to improve the accuracy of wafer angle adjustment.

[0005] Another objective of this invention is to provide a wafer testing device having the aforementioned wafer handling apparatus.

[0006] Specifically, this utility model provides a wafer handling device, comprising:

[0007] First base;

[0008] A rotating platform is rotatably connected to the first base;

[0009] A clamping assembly, mounted on the rotating platform, is used to clamp a heat sink carrying the wafer under test;

[0010] The adjustment assembly includes a drive component, a first slide rail, a connector, a link, and at least one second slide rail. The drive component and the first slide rail are mounted on a first base. The connector is mounted on the first slide rail and connected to the drive component. The second slide rail is mounted on the rotating platform. The link is mounted on the second slide rail and rotatably connected to the connector.

[0011] Driven by the driving component, when the connecting member slides along the first slide rail, it drives the connecting rod to rotate relative to the connecting member, and at the same time pushes the connecting rod to slide along the second slide rail, thereby driving the rotating platform to rotate, so as to adjust the angle of the wafer being tested.

[0012] Optionally, there are two second slide rails, which are arranged in parallel.

[0013] Optionally, the connector includes a first mounting portion, and the end of the connecting rod is provided with a vertically oriented through hole; the adjusting assembly further includes:

[0014] The bearing is rotatably mounted at the first mounting portion, and the through hole is fitted around the outer periphery of the bearing.

[0015] Optionally, the driving component is a lead screw motion mechanism, which includes a nut connected to the connecting component.

[0016] Optionally, the connector further includes a second mounting portion, which defines a mounting groove, and a portion of the nut is limited within the mounting groove and connected to the second mounting portion.

[0017] Optionally, it also includes:

[0018] The crossed roller bearing has an inner ring and an outer ring, the inner ring being connected to the rotating platform and the outer ring being connected to the first base.

[0019] Optionally, the rotating platform is annular;

[0020] The clamping assembly includes a plurality of vertically arranged hooks, which are spaced apart at the inner ring of the rotating platform and connected to the rotating platform. Each hook is configured to engage with the heat sink.

[0021] Optionally, the heat sink has spaced through grooves on its sides, and the conveying device further includes:

[0022] Multiple drive mechanisms, each drive mechanism connected to one of the hooks, are configured to controllably drive the hooks to move radially along the heat sink when the heat sink moves to the position of each hook at the corresponding through slot, thereby engaging the hooks with the bottom of the heat sink.

[0023] Optionally, the heat sink has an internal air extraction channel, and the upper surface of the heat sink has a plurality of first air ports and a plurality of second air ports communicating with the air extraction channel. The plurality of second air ports are in contact with the back of the wafer. The wafer handling device further includes:

[0024] Multiple adsorption elements are spaced apart and arranged at intervals on the inner ring of the rotating platform and connected to the rotating platform. Each adsorption element is arranged corresponding to one of the first air ports to evacuate the air extraction channel, thereby allowing the wafer to adhere to the heat sink.

[0025] In particular, this utility model also includes a wafer testing device, which includes the wafer handling device described above.

[0026] In this invention, a rotating platform is rotatably connected to a first base. A clamping assembly is mounted on the rotating platform to clamp a heat sink carrying the wafer under test. The driving component and a first slide rail of the adjusting assembly are mounted on the first base. A connecting component is mounted on the first slide rail and connected to the driving component. A second slide rail is mounted on the rotating platform, and a connecting rod is mounted on the second slide rail and rotatably connected to the connecting component. Driven by the driving component, when the connecting component slides along the first slide rail, it drives the connecting rod to rotate relative to the connecting component, simultaneously pushing the connecting rod to slide along the second slide rail, thereby causing the rotating platform to rotate to adjust the angle of the wafer under test. This technical solution utilizes the principle of a slider-linkage mechanism, essentially converting linear motion into rotation, thereby adjusting the rotation angle of the wafer under test and achieving precise contact between the test probe and the wafer.

[0027] Furthermore, in this invention, there are two second slide rails arranged in parallel. This embodiment, with two parallel second slide rails, is equivalent to having only one second slide rail, which improves rigidity, prevents wobbling, and thus enhances the rotational accuracy of the rotating platform.

[0028] The above and other objects, advantages and features of this utility model will become more apparent to those skilled in the art from the following detailed description of specific embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0029] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or components. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:

[0030] Figure 1 This is a schematic structural diagram of a wafer handling device according to an embodiment of the present invention, taken from one angle.

[0031] Figure 2 yes Figure 1 A schematic enlarged view of part A shown;

[0032] Figure 3 This is a schematic structural diagram of a wafer handling device according to one embodiment of the present invention from another angle;

[0033] Figure 4 This is a schematic partial cross-sectional view of a wafer handling device according to an embodiment of the present invention;

[0034] Figure 5 yes Figure 3 A schematic enlarged view of part B shown;

[0035] Figure 6This is a schematic side view of a wafer handling device according to an embodiment of the present invention.

[0036] Figure label:

[0037] 100-Wafer handling device, 200-Wafer under test, 300-Heat sink, 310-Through groove, 10-First base, 20-Rotating platform, 30-Adjusting component, 31-Driver, 32-First slide rail, 33-Connecting rod, 311-Nut, 34-Connector, 341-First mounting part, 342-Second mounting part, 343-Mounting groove, 35-Second slide rail, 36-Bearing, 41-Adsorption component, 51-Hook, 60-Drive mechanism, 61-Cylinder, 62-Mounting component, 63-Third slide rail, 70-Cross roller bearing, 80-Second base. Detailed Implementation

[0038] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0039] In the description of this utility model, it should be understood that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0040] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature, that is, include one or more of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it encompasses, unless otherwise specifically described, this indicates that other features are not excluded and may be further included.

[0041] Unless otherwise expressly specified and limited, the terms "connection," "installation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0042] Unless otherwise specified, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0043] Figure 1 This is a schematic structural diagram of a wafer handling device 100 according to an embodiment of the present invention, taken at one angle. Figure 2 yes Figure 1 A schematic enlarged view of part A shown. Figure 3 This is a schematic structural diagram of a wafer handling device 100 according to one embodiment of the present invention from another angle.

[0044] like Figures 1 to 3 As shown, in one specific embodiment, the wafer handling device 100 includes a first base 10, a rotating platform 20, a clamping assembly, and an adjusting assembly 30. The rotating platform 20 is rotatably connected to the first base 10. The clamping assembly is mounted on the rotating platform 20 and is used to clamp the heat sink 300 carrying the wafer 200 to be tested. The adjusting assembly 30 includes a drive member 31, a first slide rail 32, a connector 34, a connecting rod 33, and at least one second slide rail 35. The drive member 31 and the first slide rail 32 are mounted on the first base 10, and the connector 34 is mounted on the first slide rail 32 and connected to the drive member 31. The second slide rail 35 is mounted on the rotating platform 20, and the connecting rod 33 is mounted on the second slide rail 35 and rotatably connected to the connector 34. Driven by the drive unit 31, when the connector 34 slides along the first slide rail 32, it drives the connecting rod 33 to rotate relative to the connector 34, and at the same time pushes the connecting rod 33 to slide along the second slide rail 35, thereby driving the rotating platform 20 to rotate to adjust the angle of the wafer 200 being tested.

[0045] This embodiment utilizes the principle of a slider-linkage mechanism, which is equivalent to converting linear motion into rotation, thereby adjusting the rotation angle of the wafer 200 under test and achieving precise contact between the test probe and the wafer 200 under test.

[0046] In some embodiments, there are two second slide rails 35, which are arranged in parallel. In other embodiments, the number of second slide rails 35 can be determined according to specific design requirements.

[0047] This embodiment sets up two parallel second slide rails 35, which is equivalent to setting only one second slide rail 35. This can improve rigidity, avoid swaying, and thus improve the rotation accuracy of the rotating platform 20.

[0048] In some embodiments, the connector 34 includes a first mounting portion 341, and the end of the connecting rod 33 has a vertically oriented through hole. The adjusting assembly 30 also includes a bearing 36, which is rotatably mounted at the first mounting portion 341, and the through hole is fitted around the outer periphery of the bearing 36. Here, the bearing 36 is mounted at the first mounting portion 341 via a rotating shaft.

[0049] In some embodiments, the drive element 31 is a lead screw mechanism, which includes a nut 311 connected to the connector 34. Alternatively, the lead screw mechanism may also include a motor and a lead screw. In other embodiments, the drive element 31 may be other components, such as a cylinder, depending on specific design requirements.

[0050] This embodiment can effectively convert linear displacement into angular displacement with high accuracy and stability.

[0051] In some embodiments, the connector 34 further includes a second mounting portion 342, which defines a mounting groove 343. A portion of the nut 311 is positioned within the mounting groove 343 and connected to the second mounting portion 342. Here, the nut 311 is connected to the second mounting portion 342 by a bolt.

[0052] Figure 4 This is a schematic partial cross-sectional view of a wafer handling device 100 according to an embodiment of the present invention. Figure 4 As shown, in some embodiments, the wafer handling device 100 further includes a crossed roller bearing 70, which has an inner ring and an outer ring. The inner ring is connected to the rotating platform 20, and the outer ring is connected to the first base 10. Here, the crossed roller bearing 70 acts as a revolute joint, the first slide rail 32 acts as a prismatic joint, and the lead screw mechanism provides the driving force, making the mechanism stable and reliable. In other embodiments, other components can be used to achieve the rotational connection between the rotating platform 20 and the first base 10.

[0053] In some embodiments, the wafer handling device 100 further includes a second base 80, which is disposed at the bottom of the rotating platform 20 and connected to the rotating platform 20.

[0054] Figure 5 yes Figure 3 A schematic enlarged view of part B shown. Figure 6 This is a schematic side view of a wafer handling device 100 according to an embodiment of the present invention. Figure 5 and Figure 6As shown, in some embodiments, the rotating platform 20 is annular. The clamping assembly includes a plurality of vertically arranged hooks 51, which are spaced apart at the inner ring of the rotating platform 20 and connected to the rotating platform 20. Each hook 51 is configured to engage with the heat sink 300.

[0055] In some embodiments, the heat sink 300 has spaced through grooves 310 on its side. The wafer handling device 100 also includes a plurality of drive mechanisms 60, each drive mechanism 60 being connected to a hook 51 and configured to controllably drive the hook 51 to move radially along the heat sink 300 when the heat sink 300 moves to the position of each hook 51 at the corresponding through groove 310, thereby engaging the hook 51 with the bottom of the heat sink 300.

[0056] In some embodiments, each drive mechanism 60 includes a cylinder 61, a third slide rail 63, and a mounting member 62. Both the cylinder 61 and the third slide rail 63 are mounted on the rotary platform 20. The third slide rail 63 is arranged radially along the rotary platform 20 and connected to a corresponding hook 51. The cylinder 61 is configured to controllably drive the mounting member 62 to move radially along the rotary platform 20, thereby causing the hook 51 to move radially along the heat sink 300, such that the hook 51 engages with the bottom of the heat sink 300. See [reference needed]. Figure 6 .

[0057] In some embodiments, the heat sink 300 has an internal air extraction channel, and the upper surface of the heat sink 300 has a plurality of first air ports and a plurality of second air ports communicating with the air extraction channel. The plurality of second air ports contact the back side of the wafer. The wafer transport device 100 also includes a plurality of adsorption members 41, which are spaced apart and arranged in the inner ring of the rotating platform 20 and connected to the rotating platform 20. Each adsorption member 41 is arranged corresponding to a first air port to extract air from the air extraction channel, thereby allowing the wafer to adhere to the heat sink 300.

[0058] This embodiment also provides a wafer testing apparatus, which includes the wafer handling device 100 of any of the above embodiments. Details regarding the wafer handling device 100 are not provided here.

[0059] Therefore, those skilled in the art should recognize that although many exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A wafer handling device, characterized in that, include: First base; A rotating platform is rotatably connected to the first base; A clamping assembly, mounted on the rotating platform, is used to clamp a heat sink carrying the wafer under test; The adjustment assembly includes a drive component, a first slide rail, a connector, a link, and at least one second slide rail. The drive component and the first slide rail are mounted on a first base. The connector is mounted on the first slide rail and connected to the drive component. The second slide rail is mounted on the rotating platform. The link is mounted on the second slide rail and rotatably connected to the connector. Driven by the driving component, when the connecting member slides along the first slide rail, it drives the connecting rod to rotate relative to the connecting member, and at the same time pushes the connecting rod to slide along the second slide rail, thereby driving the rotating platform to rotate, so as to adjust the angle of the wafer being tested.

2. The wafer handling device according to claim 1, characterized in that, There are two second slide rails, which are arranged in parallel.

3. The wafer handling device according to claim 1, characterized in that, The connector includes a first mounting portion, and the end of the connecting rod is provided with a vertically extending through hole; the adjustment assembly further includes: The bearing is rotatably mounted at the first mounting portion, and the through hole is fitted around the outer periphery of the bearing.

4. The wafer handling device according to claim 3, characterized in that, The driving component is a lead screw motion mechanism, which includes a nut and is connected to the connecting component.

5. The wafer handling device according to claim 4, characterized in that, The connector further includes a second mounting portion, which defines a mounting groove, and a portion of the nut is limited within the mounting groove and connected to the second mounting portion.

6. The wafer handling apparatus according to any one of claims 1-5, characterized in that, Also includes: The crossed roller bearing has an inner ring and an outer ring, the inner ring being connected to the rotating platform and the outer ring being connected to the first base.

7. The wafer handling apparatus according to any one of claims 1-5, characterized in that, The rotating platform is ring-shaped; The clamping assembly includes a plurality of vertically arranged hooks, which are spaced apart at the inner ring of the rotating platform and connected to the rotating platform. Each hook is configured to engage with the heat sink.

8. The wafer handling apparatus according to claim 7, characterized in that, The heat sink has spaced through slots on its sides, and the conveying device further includes: Multiple drive mechanisms, each drive mechanism connected to one of the hooks, are configured to controllably drive the hooks to move radially along the heat sink when the heat sink moves to the position of each hook at the corresponding through slot, thereby engaging the hooks with the bottom of the heat sink.

9. The wafer handling apparatus according to claim 8, characterized in that, The heat sink has an internal air extraction channel, and its upper surface has multiple first air ports and multiple second air ports communicating with the air extraction channel. The multiple second air ports are in contact with the back of the wafer. The wafer handling device further includes: Multiple adsorption elements are spaced apart and arranged at intervals on the inner ring of the rotating platform and connected to the rotating platform. Each adsorption element is arranged corresponding to one of the first air ports to evacuate the air extraction channel, thereby allowing the wafer to adhere to the heat sink.

10. A wafer testing device, characterized in that, Includes the wafer handling device as described in any one of claims 1-9.

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