Semiconductor lead frame processing dust removal device
By designing adjustable dust collection components and sealing structures, the problem of dust pollution in semiconductor lead frame processing was solved, achieving efficient dust removal and sealing, and improving product cleanliness and yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NINGBO MINGLIAN ELECTRONIC TECH CO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-05-01
AI Technical Summary
During the semiconductor lead frame manufacturing process, dust is dispersed in the air and falls onto the frame, resulting in a decrease in production yield. Existing dust removal devices have problems with poor adaptability and insufficient sealing.
A dust removal device is designed, comprising a fixed base, an adjustment component, a dust collection component, and a sealing component. The position of the dust collection component is adjusted by a servo motor and a lead screw, and efficient dust removal is achieved by using a vacuum pump and a filter bucket. The sealing component ensures airtightness and prevents dust from entering the filter bucket.
It improves the cleanliness of the semiconductor lead frame surface, enhances the adaptability and sealing of the device, reduces dust adhesion, and improves the yield rate.
Smart Images
Figure CN224181638U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor lead frame processing technology, specifically a dust removal device for semiconductor lead frame processing. Background Technology
[0002] Leadframes are a key basic material in semiconductor packaging. As the carrier of integrated circuit chips, they undertake multiple functions such as electrical connection, mechanical support and heat dissipation.
[0003] Dust is generated during the processing of semiconductor leadframes. This dust, dispersed in the air, settles on the semiconductor leadframes, leading to a decrease in the yield rate during semiconductor leadframe production. Dust removal of leadframes is a critical step in semiconductor packaging processes, directly affecting product reliability and yield. Its core objective is to quickly remove dust from the leadframe surface and microstructures by precisely controlling parameters such as temperature, humidity, and airflow, while preventing oxidation, deformation, or damage.
[0004] Therefore, this utility model provides a dust removal device for semiconductor lead frame processing. Utility Model Content
[0005] In order to overcome the shortcomings of the prior art, at least one technical problem raised in the background art is solved.
[0006] The technical solution adopted by this utility model to solve its technical problem is as follows: The semiconductor lead frame processing dust removal device of this utility model includes a fixed base; the side wall of the fixed base is provided with an adjustment component; the fixed base is provided with a dust suction component through the adjustment component; the fixed base is provided with a sealing component through the dust suction component; multiple sets of fixing bolts are provided in the middle of the fixed base; through the above structure, the dust suction component covers the semiconductor lead frame and performs dust removal, forming a semiconductor lead frame processing dust removal structure, realizing the function of dust removal on the surface of the semiconductor lead frame, solving the problem of dust in the air falling on the semiconductor lead frame and causing the semiconductor lead frame to become dirty, improving the cleanliness of the semiconductor lead frame surface, and reducing the situation where dust adheres to the semiconductor lead frame and causes a decrease in the yield of the semiconductor lead frame.
[0007] Preferably, the adjustment assembly includes a sliding plate, a first servo motor, a first lead screw, a second servo motor, and a second lead screw; the first servo motor is fixedly connected to the top of the fixed base; the first lead screw is fixedly connected to the transmission end of the first servo motor; the first lead screw is rotatably connected to the middle of the fixed base; the sliding plate is slidably connected to the middle of the fixed base near the first lead screw; the sliding plate cooperates with the lead screw nut pair of the first lead screw; the second servo motor is fixedly connected to the end of the sliding plate near the first servo motor; the second lead screw is fixedly connected to the transmission end of the second servo motor; the second lead screw is rotatably connected inside the sliding plate; the second lead screw cooperates with the lead screw nut pair of the dust collection assembly, and the dust collection assembly is slidably connected inside the sliding plate; through the above structure, the rotation of the first lead screw and the second lead screw drives the adjustment of the position of the dust collection assembly, forming a dust collection assembly position adjustment structure, realizing the function of adjusting the position of the dust collection assembly, solving the problem of incompatibility of the dust collection assembly caused by different thicknesses or different positions of the semiconductor lead frame on the transmission device, improving the adaptability of the device, and reducing the situation where the dust collection assembly and the semiconductor lead frame cannot be aligned, resulting in a decrease in dust removal effect.
[0008] Preferably, the dust collection assembly includes a slider, a suction pipe, and a filter bucket; the slider is slidably connected to the inner wall of a sliding plate; the slider is engaged with a second lead screw nut pair; the suction pipe is fixedly connected to the middle of the slider; the filter bucket is fixedly connected to the bottom of the slider; the suction pipe passes through the middle of the slider and communicates with the filter bucket; a limiting component is provided on the inner wall of the sliding plate near the first lead screw; through the above structure, the vacuum pump extracts air and dust from the filter bucket through the suction pipe, forming a semiconductor lead frame dust removal structure, realizing the function of dust removal on the surface of the semiconductor lead frame, solving the problem of dust in the external air entering the filter bucket during semiconductor lead frame dust removal, reducing the amount of dust adhering to the surface of the semiconductor lead frame, and improving the cleanliness of the semiconductor lead frame surface.
[0009] Preferably, the sealing assembly includes a fixing ring, a top rod, a spring, a pressure ring, and an airbag ring; the fixing ring is fixedly connected to the bottom of the filter hopper; the top rod is slidably connected to the middle of the fixing ring; multiple sets of top rods are arranged in the middle of the fixing ring and are evenly distributed in the middle of the fixing ring; the pressure ring is fixedly connected to the bottom end of the multiple sets of top rods; the spring is sleeved on the outer wall of the top rod away from the pressure ring; the airbag ring is fixedly connected to the bottom of the pressure ring; a leak-proof component is provided between the top rod and the pressure ring; a stabilizing component is provided at the top of the fixing ring; through the above structure, the spring reacts to the top rod and the pressure ring to press the airbag ring against the surface of the conveying equipment, forming a sealing structure at the bottom of the filter hopper, realizing the function of sealing between the filter hopper and the conveying equipment, solving the problem of poor sealing at the bottom when the filter hopper cover is around the semiconductor lead frame, reducing the entry of dust in the outside air into the filter hopper, and improving the sealing performance when the bottom of the filter hopper contacts the conveying equipment.
[0010] Preferably, the stabilizing component includes a fixing plate and a fixing rod; the fixing plate is fixedly connected to the bottom of the slider; a pair of fixing plates are provided at the bottom of the slider and are symmetrically arranged; the fixing rod is fixedly connected to the bottom of the fixing plate away from the slider; the bottom end of the fixing rod is fixedly connected to the top of the fixing ring; through the above structure, the fixing plate and the fixing rod connect the fixing ring and the slider to form a filter bucket stabilizing structure, reducing the deformation of the filter bucket due to pressure, and reducing the area of the filter bucket in contact with the outside air due to deformation.
[0011] Preferably, the limiting component includes a limiting block; the limiting block is installed on the inner side wall of the sliding plate near the first lead screw; the limiting block is provided with a buffer component on the side wall near the slider; through the above structure, the limiting block limits the slider when it moves inside the sliding plate, forming a slider movement limiting structure, reducing the situation where the filter bucket is squeezed when the slider moves closer to the fixed seat.
[0012] Preferably, the buffer assembly includes a gasket; the gasket is fixedly connected to the side wall of the limiting block near the slider; the gasket is made of rubber; through the above structure, the arrangement of the slider contacting the gasket when it approaches the limiting block forms a slider buffer structure, reducing the abnormal wear of parts caused by the slider hitting the limiting block.
[0013] Preferably, the leak-proof component includes an elastic ring; the top of the elastic ring is fixedly connected to the bottom of the fixed ring near the filter hopper; the outer side of the elastic ring away from the fixed ring is fixedly connected to the inner side wall of the pressure ring; the elastic ring is made of a flexible material; the elastic ring is positioned between the fixed ring and the pressure ring to seal between them; when the pressure ring and the fixed ring move relative to each other, the elastic ring deforms, improving the sealing performance of the bottom of the filter hopper, reducing air leakage at the bottom when the filter hopper covers the semiconductor lead frame, and improving the dust removal effect of the semiconductor lead frame.
[0014] The beneficial effects of this utility model are as follows:
[0015] 1. The semiconductor lead frame processing dust removal device of this utility model covers the semiconductor lead frame with a dust collection component and performs dust removal, forming a semiconductor lead frame processing dust removal structure. This realizes the function of dust removal on the surface of the semiconductor lead frame, solves the problem of dust in the air falling on the semiconductor lead frame and causing the semiconductor lead frame to become dirty, improves the cleanliness of the semiconductor lead frame surface, and reduces the situation where dust adheres to the semiconductor lead frame, resulting in a decrease in the yield of semiconductor lead frames.
[0016] 2. The dust removal device for semiconductor lead frame processing described in this utility model, through the rotation of the first lead screw and the second lead screw, drives the adjustment of the position of the dust collection component, forming a dust collection component position adjustment structure. This realizes the function of adjusting the position of the dust collection component, solves the problem of incompatibility of the dust collection component caused by different thicknesses or different positions of the semiconductor lead frame on the transmission device, improves the adaptability of the device, and reduces the situation where the dust collection component and the semiconductor lead frame cannot be aligned, resulting in a decrease in dust removal effect. Attached Figure Description
[0017] The present invention will be further described below with reference to the accompanying drawings.
[0018] Figure 1 This is a perspective view of the present invention;
[0019] Figure 2 This is a schematic diagram of the structure of the slider and the sliding plate in this utility model;
[0020] Figure 3 This is a schematic diagram of the structure of the filter bucket and the airbag ring in this utility model;
[0021] Figure 4 This is a schematic diagram of the structure of the fixed ring and the pressure ring in this utility model.
[0022] In the diagram: 1. Fixed base; 11. Sliding plate; 12. First servo motor; 13. First lead screw; 14. Second servo motor; 15. Second lead screw; 2. Slider; 21. Inhalation pipe; 22. Filter hopper; 3. Fixed ring; 31. Top rod; 32. Spring; 33. Pressure ring; 34. Airbag ring; 4. Fixed plate; 41. Fixed rod; 5. Limiting block; 6. Gasket; 7. Elastic ring. Detailed Implementation
[0023] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.
[0024] like Figures 1 to 4 As shown in the figure, a dust removal device for semiconductor lead frame processing according to an embodiment of the present invention includes a fixed base 1; an adjusting component is provided on the side wall of the fixed base 1; a dust suction component is provided on the fixed base 1 through the adjusting component; a sealing component is provided on the fixed base 1 through the dust suction component; and multiple sets of fixing bolts are provided in the middle of the fixed base 1. During operation, the fixed base 1 is installed on the semiconductor lead frame conveying equipment through the fixing bolts. The adjusting component drives the dust suction component to move. When the semiconductor lead frame moves to the bottom of the dust suction component, the adjusting component drives the dust suction component and the sealing component downward to cover the semiconductor lead frame, sealing the top of the semiconductor lead frame and simultaneously activating the dust suction component. The dust collection component removes dust adhering to the semiconductor lead frame. After dust removal, the adjusting component moves the dust collection component and the sealing component away from the semiconductor lead frame. Through the above structure, the dust collection component covers the semiconductor lead frame and performs dust removal, forming a dust removal structure for semiconductor lead frame processing. This achieves the function of removing dust from the surface of the semiconductor lead frame, solving the problem of dust falling on the semiconductor lead frame and causing contamination, improving the cleanliness of the semiconductor lead frame surface, and reducing the decrease in semiconductor lead frame yield caused by dust adhering to the semiconductor lead frame.
[0025] like Figure 1 and Figure 2As shown, the adjustment assembly includes a sliding plate 11, a first servo motor 12, a first lead screw 13, a second servo motor 14, and a second lead screw 15. The first servo motor 12 is fixedly connected to the top of the fixed base 1. The first lead screw 13 is fixedly connected to the transmission end of the first servo motor 12. The first lead screw 13 is rotatably connected to the middle of the fixed base 1. The sliding plate 11 is slidably connected to the middle of the fixed base 1 near the first lead screw 13. The sliding plate 11 and the first lead screw 13 are engaged with a screw-nut pair. The second servo motor 14 is fixedly connected to the end of the sliding plate 11 near the first servo motor 12. The second lead screw 15 is fixedly connected to the transmission end of the second servo motor 14. The second lead screw 15 is rotatably connected inside the sliding plate 11. The second lead screw 15 is engaged with a screw-nut pair of the dust collection assembly, and the dust collection assembly is slidably connected inside the sliding plate 11. During operation, the first servo motor 12 is started, and the first servo motor 12 drives the first lead screw 13 to rotate. The first lead screw 13 drives the sliding plate 11 to slide on the side wall of the fixed base 1. The sliding plate 11 drives the dust collection component to move up and down, adapting to semiconductor lead frames of different thicknesses. The second servo motor 14 is started, and the second servo motor 14 drives the second lead screw 15 to rotate. The second lead screw 15 drives the dust collection component to move away from or closer to the fixed base 1. The position of the dust collection component is adjusted according to the position of the semiconductor lead frame, so that the center of the dust collection component is aligned with the center of the semiconductor lead frame. Through the above structure, the setting of the first lead screw 13 and the second lead screw 15 rotating to drive the dust collection component to adjust its position forms a dust collection component position adjustment structure, realizing the function of adjusting the position of the dust collection component. This solves the problem of mismatch between the dust collection component and the semiconductor lead frame due to different thicknesses or different positions of the semiconductor lead frame on the transmission device, improves the adaptability of the device, and reduces the situation where the dust collection component and the semiconductor lead frame cannot be aligned, resulting in a decrease in dust removal effect.
[0026] like Figures 1 to 3As shown, the dust collection assembly includes a slider 2, a suction pipe 21, and a filter hopper 22. The slider 2 is slidably connected to the inner wall of the sliding plate 11. The slider 2 is engaged with the second lead screw 15. The suction pipe 21 is fixedly connected to the middle of the slider 2. The filter hopper 22 is fixedly connected to the bottom of the slider 2. The suction pipe 21 passes through the middle of the slider 2 and communicates with the filter hopper 22. A limiting component is provided on the inner wall of the sliding plate 11 near the first lead screw 13. During operation, after the second lead screw 15 moves the slider 2 to a suitable position, a vacuum pump is connected to the suction pipe 21. After the semiconductor lead frame is moved to the bottom of the filter hopper 22 through a transmission device, the first lead screw 13 moves the sliding plate 11 downward. The sliding plate 11 moves the slider 2 and the filter hopper 22 downward. The filter hopper 22 covers the semiconductor lead frame. The vacuum pump extracts the air from inside the filter hopper 22 through the suction pipe 21, and the dust in the air is removed. As air is extracted, a negative pressure is created inside the filter hopper 22. External air enters the filter hopper 22 through it and is filtered. This airflow within the filter hopper 22 causes dust adhering to the semiconductor lead frame to be picked up and extracted by the suction pipe 21. After dust removal, the first lead screw 13 drives the sliding plate 11 to rise, moving the filter hopper 22 away from the semiconductor lead frame. Through this structure, the vacuum pump extracts air and dust from the filter hopper 22 through the suction pipe 21, forming a semiconductor lead frame dust removal structure. This achieves the function of dust removal from the surface of the semiconductor lead frame, solving the problem of dust from the outside air entering the filter hopper 22 during semiconductor lead frame dust removal, reducing dust adhesion to the surface of the semiconductor lead frame, and improving the cleanliness of the semiconductor lead frame surface.
[0027] like Figure 3 and Figure 4As shown, the sealing assembly includes a fixed ring 3, a push rod 31, a spring 32, a pressure ring 33, and an airbag ring 34. The fixed ring 3 is fixedly connected to the bottom of the filter hopper 22. The push rod 31 is slidably connected to the middle of the fixed ring 3. Multiple sets of push rods 31 are arranged in the middle of the fixed ring 3 and are evenly distributed in the middle of the fixed ring 3. The pressure ring 33 is fixedly connected to the bottom end of the multiple sets of push rods 31. The spring 32 is sleeved on the outer wall of the push rod 31 away from the pressure ring 33. The airbag ring 34 is fixedly connected to the bottom of the pressure ring 33. A leak-proof assembly is provided between the push rod 31 and the pressure ring 33. A stabilizing assembly is provided at the top of the fixed ring 3. During operation, when the first lead screw 13 drives the sliding plate 11 and the filter hopper 22 to move downward, it drives the sealing assembly to move downward. The airbag ring 34 contacts the top of the transmission equipment and is squeezed and deformed, releasing air. The bladder ring 34 drives the pressure ring 33 upward, which in turn drives the push rod 31 upward. The spring 32 is stretched, and the spring 32 reacts with the push rod 31, causing the push rod 31 to drive the pressure ring 33 downward, pressing the bladder ring 34 onto the surface of the conveying equipment and sealing the bottom of the filter hopper 22. Through the above structure, the spring 32 reacts with the push rod 31 and the pressure ring 33 to press the bladder ring 34 onto the surface of the conveying equipment, forming a bottom sealing structure for the filter hopper 22. This achieves the function of sealing between the filter hopper 22 and the conveying equipment, solving the problem of poor sealing at the bottom when the filter hopper 22 is covered around the semiconductor lead frame, reducing the entry of dust from the outside air into the filter hopper 22, and improving the sealing performance when the bottom of the filter hopper 22 contacts the conveying equipment.
[0028] like Figure 1 and Figure 3 As shown, the stabilizing component includes a fixing plate 4 and a fixing rod 41; the fixing plate 4 is fixedly connected to the bottom of the slider 2; a pair of fixing plates 4 are provided at the bottom of the slider 2 and are arranged symmetrically; the fixing rod 41 is fixedly connected to the bottom of the fixing plate 4 away from the slider 2; the bottom end of the fixing rod 41 is fixedly connected to the top of the fixing ring 3; during operation, the fixing plate 4 and the fixing rod 41 connect the fixing ring 3 and the slider 2 together, increasing the stability between the fixing ring 3 and the slider 2; through the above structure, the fixing plate 4 and the fixing rod 41 connect the fixing ring 3 and the slider 2 to form a stable structure for the filter bucket 22, reducing the deformation of the filter bucket 22 due to pressure, and reducing the area of the filter bucket 22 in contact with the outside air due to deformation.
[0029] like Figure 1 and Figure 2As shown, the limiting component includes a limiting block 5; the limiting block 5 is installed on the inner side wall of the sliding plate 11 near the first lead screw 13; the limiting block 5 is provided with a buffer component on the side wall near the slider 2; during operation, when the slider 2 slides inside the sliding plate 11, when the slider 2 approaches the fixed seat 1, the limiting block 5 limits the slider 2; through the above structure, the limiting block 5 limits the slider 2 when it moves inside the sliding plate 11, forming a slider 2 movement limiting structure, reducing the situation where the filter bucket 22 is squeezed when the slider 2 approaches the fixed seat 1.
[0030] like Figure 1 and Figure 2 As shown, the buffer assembly includes a pad 6; the pad 6 is fixedly connected to the side wall of the limiting block 5 near the slider 2; the pad 6 is made of rubber; during operation, when the slider 2 contacts the limiting block 5, the pad 6 is placed between the slider 2 and the limiting block 5 to play a buffering role; through the above structure, the arrangement of the slider 2 contacting the pad 6 when it approaches the limiting block 5 forms a buffer structure for the slider 2, reducing the abnormal wear of parts caused by the slider 2 hitting the limiting block 5.
[0031] like Figure 4 As shown, the leak-proof assembly includes an elastic ring 7; the top of the elastic ring 7 is fixedly connected to the bottom of the fixed ring 3 near the filter hopper 22; the outer side wall of the elastic ring 7 away from the fixed ring 3 is fixedly connected to the inner side wall of the pressure ring 33; the elastic ring 7 is made of a flexible material; during operation, the elastic ring 7 is positioned between the fixed ring 3 and the pressure ring 33 to seal between them. When the pressure ring 33 and the fixed ring 3 move relative to each other, the elastic ring 7 deforms, improving the sealing performance of the bottom of the filter hopper 22, reducing air leakage at the bottom when the filter hopper 22 covers the semiconductor lead frame, and improving the dust removal effect of the semiconductor lead frame.
[0032] During operation, the fixed base 1 is installed on the semiconductor lead frame conveying equipment via fixing bolts. The adjusting component drives the dust collection component to move. When the semiconductor lead frame moves to the bottom of the dust collection component, the adjusting component drives the dust collection component and the sealing component downwards to cover the semiconductor lead frame and seal the top of the semiconductor lead frame. At the same time, the dust collection component is activated, sucking away the dust adhering to the semiconductor lead frame. After dust removal, the adjusting component drives the dust collection component and the sealing component away from the semiconductor lead frame. The first servo motor 12 is activated, which drives the first lead screw 13 to rotate. The first lead screw 13 drives the sliding plate 11 to slide on the side wall of the fixed base 1. The sliding plate 11 drives the dust collection component to move up and down, adjusting for different thicknesses. The semiconductor lead frame is adapted, and the second servo motor 14 is started. The second servo motor 14 drives the second lead screw 15 to rotate. The second lead screw 15 moves the dust collection component away from or towards the fixed base 1. The position of the dust collection component is adjusted according to the position of the semiconductor lead frame, so that the center of the dust collection component is aligned with the center of the semiconductor lead frame. After the second lead screw 15 moves the slider 2 to the appropriate position, the suction pipe 21 is connected to the vacuum pump. After the semiconductor lead frame is moved to the bottom of the filter hopper 22 through the transmission device, the first lead screw 13 drives the sliding plate 11 downward. The sliding plate 11 drives the slider 2 and the filter hopper 22 downward. The filter hopper 22 covers the semiconductor lead frame. The vacuum pump empties the contents of the filter hopper 22 through the suction pipe 21. As air is drawn out, dust particles in the air are extracted along with the air, creating a negative pressure inside the filter hopper 22. External air enters the filter hopper 22 through it and is filtered. This airflow within the filter hopper 22 causes dust adhering to the semiconductor lead frame to be picked up and extracted by the suction pipe 21. After dust removal, the first lead screw 13 drives the sliding plate 11 to rise, moving the filter hopper 22 away from the semiconductor lead frame. When the first lead screw 13 moves the sliding plate 11 and the filter hopper 22 downward, it also moves the sealing assembly downward. The airbag ring 34 contacts the top of the transmission equipment and is compressed and deformed. The airbag ring 34 drives the pressure ring 33 upward, which in turn drives the top rod 31 upward. The spring 32... When stretched, spring 32 reacts with push rod 31, causing push rod 31 to drive pressure ring 33 downward to press airbag ring 34 onto the surface of the transmission equipment, sealing the bottom of filter bucket 22; fixed plate 4 and fixed rod 41 connect fixed ring 3 and slider 2 together, increasing the stability between fixed ring 3 and slider 2; when slider 2 slides inside sliding plate 11, when slider 2 approaches fixed seat 1, limit block 5 limits slider 2; when slider 2 contacts limit block 5, gasket 6 is placed between slider 2 and limit block 5 to buffer; elastic ring 7 is placed between fixed ring 3 and pressure ring 33 to seal between fixed ring 3 and pressure ring 33, and elastic ring 7 deforms when pressure ring 33 and fixed ring 3 move relative to each other.
[0033] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A dust removal device for semiconductor lead frame processing, comprising a fixing base (1); characterized in that: The fixed seat (1) has an adjustment component on its side wall; the fixed seat (1) has a dust suction component through the adjustment component; the fixed seat (1) has a sealing component through the dust suction component; and the fixed seat (1) has multiple sets of fixing bolts in its middle.
2. The dust removal device for semiconductor lead frame processing according to claim 1, characterized in that: The adjustment assembly includes a sliding plate (11), a first servo motor (12), a first lead screw (13), a second servo motor (14), and a second lead screw (15); the first servo motor (12) is fixedly connected to the top of the fixed base (1); the first lead screw (13) is fixedly connected to the transmission end of the first servo motor (12); the first lead screw (13) is rotatably connected to the middle of the fixed base (1); the sliding plate (11) is slidably connected to the middle of the fixed base (1) near the first lead screw (13); the sliding plate (11) cooperates with the lead screw nut pair of the first lead screw (13); the second servo motor (14) is fixedly connected to the end of the sliding plate (11) near the first servo motor (12); the second lead screw (15) is fixedly connected to the transmission end of the second servo motor (14); the second lead screw (15) is rotatably connected inside the sliding plate (11); the second lead screw (15) cooperates with the lead screw nut pair of the dust collection assembly, and the dust collection assembly is slidably connected inside the sliding plate (11).
3. The dust removal device for semiconductor lead frame processing according to claim 2, characterized in that: The dust collection assembly includes a slider (2), a suction pipe (21), and a filter (22); the slider (2) is slidably connected to the inner wall of the sliding plate (11); the slider (2) is engaged with the screw nut of the second lead screw (15); the suction pipe (21) is fixedly connected to the middle of the slider (2); the filter (22) is fixedly connected to the bottom of the slider (2); the suction pipe (21) passes through the middle of the slider (2) and communicates with the filter (22); the inner wall of the sliding plate (11) near the first lead screw (13) is provided with a limiting component.
4. The dust removal device for semiconductor lead frame processing according to claim 3, characterized in that: The sealing assembly includes a fixed ring (3), a top rod (31), a spring (32), a pressure ring (33), and an airbag ring (34); the fixed ring (3) is fixedly connected to the bottom of the filter hopper (22); the top rod (31) is slidably connected to the middle of the fixed ring (3); multiple sets of top rods (31) are provided in the middle of the fixed ring (3), and are evenly distributed in the middle of the fixed ring (3); the pressure ring (33) is fixedly connected to the bottom end of multiple sets of top rods (31); the spring (32) is sleeved on the outer wall of the top rod (31) away from the pressure ring (33); the airbag ring (34) is fixedly connected to the bottom of the pressure ring (33); a leak-proof assembly is provided between the top rod (31) and the pressure ring (33); a stabilizing assembly is provided on the top of the fixed ring (3).
5. The dust removal device for semiconductor lead frame processing according to claim 4, characterized in that: The stabilizing component includes a fixing plate (4) and a fixing rod (41); the fixing plate (4) is fixedly connected to the bottom of the slider (2); a pair of fixing plates (4) are provided at the bottom of the slider (2) and are arranged symmetrically; the fixing rod (41) is fixedly connected to the bottom of the fixing plate (4) away from the slider (2); the bottom end of the fixing rod (41) is fixedly connected to the top of the fixing ring (3).
6. The dust removal device for semiconductor lead frame processing according to claim 3, characterized in that: The limiting component includes a limiting block (5); the limiting block (5) is installed on the inner side wall of the sliding plate (11) near the first lead screw (13); the side wall of the limiting block (5) near the slider (2) is provided with a buffer component.
7. The dust removal device for semiconductor lead frame processing according to claim 6, characterized in that: The buffer assembly includes a pad (6); the pad (6) is fixedly connected to the side wall of the limiting block (5) near the slider (2); the pad (6) is made of rubber.
8. The dust removal device for semiconductor lead frame processing according to claim 4, characterized in that: The leak-proof component includes an elastic ring (7); the top of the elastic ring (7) is fixedly connected to the bottom of the fixed ring (3) near the filter hopper (22); the outer side wall of the elastic ring (7) away from the fixed ring (3) is fixedly connected to the inner side wall of the pressure ring (33); the elastic ring (7) is made of a flexible material.