Power assembly busbar heat dissipation device

Abstract

The utility model discloses a power assembly busbar heat dissipation device, and relates to the technical field of power electronic devices. The device comprises a busbar, a water cooling plate and a power assembly, the busbar comprises a first busbar and a second busbar, the water-cooling plate comprises a first water-cooling plate and a second water-cooling plate, the first water-cooling plate is arranged between the power assembly and the first busbar, and the second water-cooling plate is arranged between the second busbar and the first busbar. According to the power assembly busbar heat dissipation device provided by the utility model, through the arrangement of the busbar and the water cooling plate, the busbar is directly contacted with the water cooling plate, so that the heat dissipation efficiency of the busbar can be accelerated; the water cooling plate is close to the power assembly at the same time, and direct heat dissipation of the power assembly can be accelerated.

Description

A power component busbar heat dissipation device Technical Field

[0001] This utility model relates to the field of power electronic device technology, and in particular to a power component busbar heat dissipation device. Background Technology

[0002] A busbar, also known as a power line or busbar, is a conductive metal bar or conduit used for centralized distribution of electrical energy. It is typically made of conductive materials such as copper or aluminum. Busbars are used in power systems to connect multiple electrical devices and centrally distribute current. They are widely used in power, industry, data centers, and transportation sectors.

[0003] Busbars used in high-power power electronic equipment are prone to overheating or burnout in some enclosed systems due to high operating temperatures, especially at the point of contact between the busbar and the device.

[0004] Currently, some cooling methods involve installing a water-cooled plate at the bottom of the power module. However, this method only provides a small heat dissipation area for the device, resulting in limited cooling effectiveness. Therefore, there is an urgent need for a power module busbar cooling device to solve the power module heat dissipation problem at a lower cost. Summary of the Invention

[0005] To address the aforementioned technical problems, this utility model proposes a power component busbar heat dissipation device, which enhances the heat dissipation effect of the top of the power component and the busbar by installing a water-cooled plate under the busbar.

[0006] The objective of this utility model is achieved through the following technical solution:

[0007] A power component busbar heat dissipation device is provided, including a busbar, a water-cooled plate, and a power component; the busbar includes a first busbar and a second busbar, the water-cooled plate includes a first water-cooled plate and a second water-cooled plate, the first water-cooled plate is disposed between the power component and the first busbar, and the second water-cooled plate is disposed between the second busbar and the first busbar.

[0008] Furthermore, the power component is a capacitor module.

[0009] Preferably, an opening is made at the terminals of the capacitor module to ensure adequate insulation.

[0010] Furthermore, the power component busbar heat dissipation device also includes insulating paper, which is disposed between the first busbar and the second water-cooled plate.

[0011] Furthermore, the power component busbar heat dissipation device also includes an epoxy fixing plate, which is disposed between the power component and the first water-cooling plate.

[0012] The epoxy fixing plate, which is used to assist in fixing the position of the power components, is made of insulating material.

[0013] Furthermore, the first water-cooled plate is provided with a first cooling water channel.

[0014] Furthermore, the first water-cooled plate is provided with a first water inlet and a first water outlet, and the two ends of the first cooling water channel are respectively connected to the first water inlet and the first water outlet.

[0015] The cooling water flows from the first inlet through the first cooling water channel to the first outlet to cool the top of the power components and the first busbar.

[0016] Furthermore, the first water inlet and the first water outlet are located on the same side or opposite side of the first water-cooling plate.

[0017] Furthermore, the second water-cooled plate is provided with a second cooling water channel.

[0018] Furthermore, the second water-cooled plate is provided with a second water inlet and a second water outlet, and the two ends of the second cooling water channel are respectively connected to the second water inlet and the second water outlet.

[0019] The cooling water is supplied to the second busbar through the second cooling water channel from the second inlet to the second outlet.

[0020] Furthermore, the second water inlet and the second water outlet are located on the same side or opposite side of the second water-cooling plate.

[0021] This utility model provides a power component busbar heat dissipation device, which has the following beneficial effects:

[0022] 1. By setting up the busbar and water-cooled plate, the busbar is in direct contact with the water-cooled plate, which can accelerate the heat dissipation efficiency of the busbar;

[0023] 2. Placing the water-cooled plate close to the power components can also accelerate the direct heat dissipation of the power components. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 is a partial hierarchical schematic diagram of the power component busbar heat dissipation device according to an embodiment of the present invention;

[0026] Figure 2 is a schematic diagram of the stacked heat dissipation device of the power component busbar in an embodiment of the present invention;

[0027] Figure 3 is a front view of the power component busbar heat dissipation device according to an embodiment of the present invention;

[0028] Figure 4 is a structural schematic diagram of the first water-cooled plate according to an embodiment of the present invention;

[0029] Figure 5 is a structural schematic diagram of the first busbar and the first water-cooled plate in an embodiment of this utility model;

[0030] Explanation of the markings in the image:

[0031] 1-Power component; 2-First busbar; 3-Second busbar; 4-First water-cooled plate; 5-Second water-cooled plate; 6-Insulating paper; 7-Epoxy fixing plate; 8-First water inlet; 9-First water outlet. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0033] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0034] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0035] It should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0036] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0037] Example

[0038] Please refer to Figures 1-5 for the power component busbar heat dissipation device, which includes a busbar, a water-cooled plate, and a power component 1. The busbar includes a first busbar 2 and a second busbar, and the water-cooled plate includes a first water-cooled plate 3 and a second water-cooled plate 5. The first water-cooled plate 3 is disposed between the power component 1 and the first busbar 2, and the second water-cooled plate 5 is disposed between the second busbar and the first busbar 2. The first water-cooled plate 3 is attached to the lower surface of the first busbar 2, and the second water-cooled plate 5 is attached to the lower surface of the second busbar. In this embodiment, the power component 1 is a capacitor module. Openings are made at the terminals of the capacitor module to ensure sufficient insulation.

[0039] It should be noted that this embodiment uses a thinner water-cooled plate to better fit the busbar and power component 1, and also to reduce its space occupation.

[0040] The power component busbar heat dissipation device further includes insulating paper 6, which is disposed between the first busbar 2 and the second water-cooling plate 5. The power component busbar heat dissipation device also includes an epoxy fixing plate 7, which is disposed between the power component 1 and the first water-cooling plate 3. The epoxy fixing plate 7, made of insulating material, is used to assist in fixing the position of the power component 1.

[0041] The first water-cooled plate 3 is provided with a first cooling water channel. The first water-cooled plate 3 has a first water inlet 8 and a first water outlet 9, and the two ends of the first cooling water channel are respectively connected to the first water inlet 8 and the first water outlet 9. Cooling water flows from the first water inlet 8 through the first cooling water channel to the first water outlet 9 to cool the top of the power component 1 and the first busbar 2. In this embodiment, the first water inlet 8 and the first water outlet 9 are located on opposite sides (respective sides) of the first water-cooled plate 3.

[0042] The second water-cooled plate 5 is provided with a second cooling water channel. The second water-cooled plate 5 has a second water inlet and a second water outlet, and the two ends of the second cooling water channel are respectively connected to the second water inlet and the second water outlet. Cooling water flows from the second water inlet through the second cooling water channel to the second water outlet to cool the second busbar. In this embodiment, the second water inlet and the second water outlet are located on opposite sides (respective sides) of the second water-cooled plate 5.

[0043] This utility model provides a power component busbar heat dissipation device, which has the following beneficial effects:

[0044] 1. By setting up the busbar and water-cooled plate, the busbar is in direct contact with the water-cooled plate, which can accelerate the heat dissipation efficiency of the busbar;

[0045] 2. Placing the water-cooled plate close to the power components can also accelerate the direct heat dissipation of the power components.

[0046] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A power component busbar heat dissipation device, characterized in that, It includes a busbar, a water-cooled plate, and a power component; the busbar includes a first busbar and a second busbar, the water-cooled plate includes a first water-cooled plate and a second water-cooled plate, the first water-cooled plate is disposed between the power component and the first busbar, and the second water-cooled plate is disposed between the second busbar and the first busbar.

2. The power assembly busbar heat sink of claim 1, wherein, The power component mentioned is a capacitor module.

3. The power assembly busbar heat sink of claim 2, wherein, It also includes insulating paper, which is disposed between the first busbar and the second water-cooled plate.

4. The power assembly busbar heat sink of claim 3, wherein, It also includes an epoxy fixing plate, which is disposed between the power component and the first water-cooling plate.

5. The power assembly busbar heat sink of claim 1, wherein, The first water-cooled plate is provided with a first cooling water channel.

6. The power component busbar heat dissipation device as described in claim 5, characterized in that, The first water-cooled plate is provided with a first water inlet and a first water outlet, and the two ends of the first cooling water channel are respectively connected to the first water inlet and the first water outlet.

7. The power assembly busbar heat sink of claim 6, wherein, The first water inlet and the first water outlet are located on the same side or opposite side of the first water-cooled plate.

8. The power assembly busbar heat sink of claim 1, wherein, The second water-cooled plate is provided with a second cooling water channel.

9. The power assembly busbar heat sink of claim 8, wherein, The second water-cooled plate is provided with a second water inlet and a second water outlet, and the two ends of the second cooling water channel are respectively connected to the second water inlet and the second water outlet.

10. The power assembly busbar heat sink of claim 9, wherein, The second water inlet and the second water outlet are located on the same side or opposite side of the second water-cooled plate.

Images