Packaging structure for improving parallel sealing and welding yield

Abstract

The utility model discloses a packaging structure capable of improving parallel sealing and welding yield, which comprises a base, a sealing ring mounted on the base, a cover plate mounted on the sealing ring, a planar sealing surface arranged on the sealing ring, a plurality of longitudinal sealing surfaces arranged on the lower end surface of the cover plate, and a plurality of longitudinal sealing surfaces connected to the planar sealing surface at one end far away from the sealing ring. A welding grid is jointly defined by the two adjacent longitudinal sealing-in faces and the two adjacent plane sealing-in faces, a first-stage sealing-in welding layer and a second-stage sealing-in welding layer are arranged between the longitudinal sealing-in faces and the plane sealing-in faces respectively, and the first-stage sealing-in welding layer and the second-stage sealing-in welding layer are jointly used for enhancing the sealing-in sealing performance of the cover plate and the sealing-in ring. The problem of air leakage of a product caused by poor welding between welding spots during first sealing welding is solved, and the sealing performance of the product is enhanced.

Description

Technical Field

[0001] This utility model relates to the field of motor device packaging technology, and in particular to a packaging structure that improves the yield of parallel sealing and soldering. Background Technology

[0002] Driven by both market economic growth and policy support, China's semiconductor industry has developed rapidly. Parallel sealing technology is a key technology in electronic device packaging, mainly used in the sealing processes of electronic products such as ceramic chip packaging and metal cavity packaging. Parallel sealing is a type of resistance welding process in electronic device packaging. Its principle is that an electrode wheel contacts the edge of the metal cover plate of the electronic component, and the instantaneous high-current discharge of the electrode wheel melts the metal of the cover plate at the contact point. The molten metal acts as solder, welding the cover plate to the welding ring on the component base. At the same time, the electrode wheel rolls to the next position and discharges again, thus forming individual solder beads. Multiple solder beads are connected to complete the sealing of the entire electronic device.

[0003] In the prior art, Chinese patent document CN118478078A discloses a clamping and fixing device for parallel sealing welding, including a clamp base with a limiting groove at the center of the upper surface of the clamp base; a spring array is provided in the limiting groove, the spring array including multiple uniformly distributed springs; a row of stop fixing holes is provided along the edge of the limiting groove; the row of stop fixing holes is composed of multiple parallel first screw holes, wherein the distance between the centers of every two adjacent first screw holes is L>0; a positioning stop and a limiting wrench are also fixed on the upper surface of the clamp base; the device proposed in this utility model ensures stable clamping of the lead-pin housing through the positioning stop and the limiting wrench, and the spring provided at the bottom of the limiting groove can compensate for the unevenness of the base caused by the machining error of the lead-pin housing, ensuring full contact between the electrode wheel and the cover plate. By improving the clamping device, the welding consistency is improved, but it still cannot completely solve the problem of weld bead connection defects.

[0004] Because the connection between a single solder ball and its adjacent solder balls is prone to being loose, it may lead to insufficient sealing of the contact surface between the solder points, resulting in air leakage in the overall structure. Utility Model Content

[0005] To address the aforementioned technical problems, this utility model provides a packaging structure that improves the yield of parallel sealing products.

[0006] This utility model is achieved through the following technical solution.

[0007] This utility model provides a packaging structure for improving the yield of parallel sealing and welding, including a base, a sealing ring mounted on the base, a cover plate mounted on the sealing ring, a planar sealing surface on the sealing ring, and multiple longitudinal sealing surfaces on the lower end face of the cover plate. The ends of the multiple longitudinal sealing surfaces away from the sealing ring are all connected to the planar sealing surface. Adjacent longitudinal sealing surfaces and planar sealing surfaces together form a welding grid. A primary sealing welding layer and a secondary sealing welding layer are respectively provided between the longitudinal sealing surfaces and the planar sealing surfaces. The primary sealing welding layer and the secondary sealing welding layer are used together to enhance the sealing performance of the cover plate and the sealing ring.

[0008] Preferably, the welding area of ​​the secondary sealing weld layer is greater than the welding area of ​​the primary sealing weld layer.

[0009] Preferably, the longitudinal sealing surface and the cover plate are integrally formed.

[0010] Preferably, the cover plate is made of iron alloy material.

[0011] Preferably, the longitudinal sealing surface is made of an iron alloy material.

[0012] Preferably, the planar sealing surface is made of an iron alloy material.

[0013] Preferably, the sealing ring has a gold plating layer on its surface.

[0014] The beneficial effects of this utility model are as follows: the cover plate and the sealing ring are sealed twice, and the electrode wheel contacts the cover plate at a different angle each time, so that the weld points formed by the two sealing welds are different in size. The area of ​​the second sealing weld is larger than that of the first sealing weld. The weld points formed by the second sealing weld cover the contact surface between the weld points formed by the first sealing weld again, which solves the problem of product leakage caused by poor welding between the weld points during the first sealing weld, strengthens the sealing performance of the product, thereby improving the yield of parallel sealing welds of electronic products and achieving the goal of high reliability of parallel sealing welds of electronic products. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This utility model is mainly used to show the structural schematic diagram of the primary sealing and welding layer;

[0017] Figure 3 This utility model is mainly used to show the structural schematic diagram of the primary sealing welding layer and the secondary sealing welding layer;

[0018] In the diagram: 1-base; 2-sealing ring; 3-cover plate; 4-longitudinal sealing surface; 5-planar sealing surface; 6-primary sealing welding layer; 7-secondary sealing welding layer; 8-electrode wheel. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0021] In this embodiment, refer to Figure 1 and Figure 2 It includes a base 1, a sealing ring 2 installed on the base 1, a cover plate 3 connected to the sealing ring 2, a flat sealing surface 5 on the sealing ring 2, and multiple longitudinal sealing surfaces 4 on the lower end face of the cover plate 3. The ends of the multiple longitudinal sealing surfaces 4 away from the sealing ring 2 are all connected to the flat sealing surface 5, and two adjacent longitudinal sealing surfaces 4 and the flat sealing surface 5 together form a welding grid.

[0022] In this embodiment, refer to Figure 1 , Figure 2 and Figure 3 A primary sealing welding layer 6 and a secondary sealing welding layer 7 are respectively provided between the longitudinal sealing surface 4 and the planar sealing surface 5. The welding area of ​​the secondary sealing welding layer 7 is larger than that of the primary sealing welding layer 6. The primary sealing welding layer 6 and the secondary sealing welding layer 7 are used together to enhance the sealing performance of the cover plate 3 and the sealing ring 2.

[0023] When the electrode wheel 8 contacts the edge of the cover plate 3, the electrode wheel 8 discharges instantaneously, causing the temperature at the contact point between the electrode wheel 8 and the cover plate 3 to rise. This melts the material at that location on the cover plate 3, forming a weld bead. The weld bead fills and solidifies into the welding grid, thus welding the cover plate 3 and the sealing ring 2. By rolling the electrode wheel 8, it moves to the next position on the edge of the cover plate 3, repeating the discharge process to form a new weld bead that fills and solidifies into the welding grid. The new weld bead is welded together with the previous weld bead. This action is repeated to form a welding line, ultimately forming the first-level sealing welding layer 6.

[0024] During the secondary sealing process, the electrode wheel 8 is brought into point contact with another position on the edge of the cover plate 3. By reducing the contact angle between the electrode wheel 8 and the cover plate 3, the discharge contact area is expanded, thereby forming a larger weld bead. The above operation steps are repeated to obtain the secondary sealing welding layer 7. The large weld bead formed by the secondary sealing is used to cover the weld between the small weld beads formed by the first sealing. The secondary sealing welding layer 7 covers the primary sealing welding layer 6, strengthening the sealing connection between the cover plate 3 and the sealing ring 2, increasing the welding surface path, improving the welding yield, and increasing the reliability of parallel sealing welding.

[0025] The welding grid facilitates the positioning of the contact points between the electrode wheel 8 and the cover plate 3, making the distribution of welding beads more uniform, thereby enhancing the sealing tightness of the primary sealing welding layer 6 and the secondary sealing welding layer 7.

[0026] In this embodiment, refer to Figure 1 and Figure 2 The longitudinal sealing surface 4 and the cover plate 3 are integrally formed. The cover plate 3 is made of iron alloy material, and the longitudinal sealing surface 4 is also made of iron alloy material. This facilitates the electrode wheel 8 to perform high-frequency instantaneous discharge on the cover plate 3 to generate high temperature, so that the cover plate 3 forms welding beads and welds with the longitudinal sealing surface 4. This helps to strengthen the welding seal between them and reduce the possibility of air leakage at the sealing position.

[0027] In this embodiment, the planar sealing surface 5 is made of iron alloy material, which enhances the welding fusion with the planar sealing surface 5 and the welding ball, thereby enhancing the sealing performance at the sealing position.

[0028] In this embodiment, the sealing ring 2 has a gold plating layer on its surface, which helps to quickly weld the planar sealing surface 5 to the sealing ring 2, making the connection between the two more stable.

[0029] The above are merely preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the concept of this utility model and the contents of the specification and drawings of this utility model, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.

Claims

1. A packaging structure for improving the yield of parallel soldering, characterized in that: Includes a base (1), a sealing ring (2) installed on the base (1), a cover plate (3) installed on the sealing ring (2), a flat sealing surface (5) on the sealing ring (2), and multiple longitudinal sealing surfaces (4) on the lower end of the cover plate (3). The ends of the multiple longitudinal sealing surfaces (4) away from the sealing ring (2) are all connected to the flat sealing surface (5). Two adjacent longitudinal sealing surfaces (4) and the flat sealing surface (5) together form a welding grid. A primary sealing welding layer (6) and a secondary sealing welding layer (7) are respectively provided between the longitudinal sealing surface (4) and the flat sealing surface (5). The primary sealing welding layer (6) and the secondary sealing welding layer (7) are used together to strengthen the sealing performance of the cover plate (3) and the sealing ring (2).

2. The packaging structure for improving parallel soldering yield as described in claim 1, characterized in that: The welding area of ​​the secondary sealing welding layer (7) is greater than the welding area of ​​the primary sealing welding layer (6).

3. The packaging structure for improving parallel soldering yield as described in claim 1, characterized in that: The longitudinal sealing surface (4) and the cover plate (3) are integrally formed.

4. The packaging structure for improving parallel soldering yield as described in claim 1, characterized in that: The cover plate (3) is made of iron alloy.

5. The packaging structure for improving parallel soldering yield as described in claim 1, characterized in that: The longitudinal sealing surface (4) is made of iron alloy material.

6. The packaging structure for improving parallel soldering yield as described in claim 1, characterized in that: The planar sealing surface (5) is made of iron alloy material.

7. The packaging structure for improving parallel soldering yield as described in claim 1, characterized in that: The sealing ring (2) has a gold plating layer on its surface.

Images