Multi-channel high and low temperature cycle test box

Abstract

The utility model relates to a multi-channel high and low temperature cycle test box, which comprises a box body, an opening is arranged at the upper end of the box body, a temperature control mechanism is arranged inside the opening, the temperature control mechanism comprises a limiting plate, a temperature control sheet and a cold radiator which are sequentially arranged from top to bottom, a coaming is covered outside the opening, a hollow matched with the limiting plate is arranged on the coaming, and the temperature control sheet is arranged in the hollow. A plurality of chip grooves are formed in the limiting plate, a plurality of pairs of optical fiber grooves are formed in the two sides of the hollowed-out part, and a cover body is arranged on the surrounding plate. The utility model has the advantages that: a case type portable design is adopted, so that the device is convenient to move; the chip groove and the optical fiber groove are arranged, so that a plurality of chips can be tested, and tail fibers can be prevented from being mutually wound; and the radiator and the cooling fan are arranged, so that the cooling effect is good.

Description

Technical Field

[0001] This utility model relates to the field of testing device technology, and in particular to a multi-channel high and low temperature cycling test chamber. Background Technology

[0002] Currently, programmable high and low temperature cycling chambers are commonly used to test fiber-optic photonic circuits such as lithium niobate chips, but these chambers weigh over 700 kg and are inconvenient to move. Furthermore, in the reliability testing of photonic circuit chips, the chips under test are often designed with fiber optic pigtails, and real-time optical transmission testing and recording are required. When connecting the optical path, fiber length issues or connector problems can easily cause the pigtails to break or become tangled, resulting in unnecessary losses. Summary of the Invention

[0003] This invention mainly solves the above-mentioned problems by providing a multi-channel high and low temperature cycle test chamber. It adopts a chassis-type portable design, which is easy to move. By setting chip slots and fiber optic slots, it can test multiple chips and avoid the fiber optic cables from getting tangled.

[0004] The technical solution adopted by this utility model to solve its technical problem is a multi-channel high and low temperature cycle test chamber, including a chamber body. The upper end of the chamber body is provided with an opening. A temperature control mechanism is provided inside the opening. The temperature control mechanism includes a limiting plate, a temperature control plate and a cold air radiator arranged sequentially from top to bottom. The opening is covered by a surrounding plate. The surrounding plate is provided with a hollow that matches the limiting plate. The limiting plate is provided with a number of chip slots. A number of pairs of optical fiber slots are provided on both sides of the hollow. A cover is provided on the surrounding plate.

[0005] As a preferred embodiment of the above solution, a mounting beam is provided on each of the upper two sides of the inside of the box, and a support plate is erected between the two mounting beams. The temperature control mechanism is mounted on the support plate.

[0006] As a preferred embodiment of the above solution, the bearing plate has a groove in the middle, and a plurality of support columns are provided in the groove, with the cold radiator mounted on the support columns.

[0007] As a preferred embodiment of the above solution, the radiator has a flow channel inside, a flow channel interface on the side of the radiator, and a coolant interface on the side of the housing, and the coolant interface is connected to the flow channel interface.

[0008] As a preferred embodiment of the above solution, the temperature control element is a TEC element, which is electrically connected to the control circuit in the housing.

[0009] As a preferred embodiment of the above solution, a temperature sensor is provided on the side of the limiting plate corresponding to each chip slot.

[0010] As a preferred embodiment of the above solution, the enclosure is provided with a limiting block for limiting the position of the cover.

[0011] As a preferred embodiment of the above solution, the cover is provided with an inflation hole, and the limiting block corresponding to the inflation hole is provided with a through hole that communicates with the inflation hole.

[0012] As a preferred embodiment of the above solution, the perforated part of the enclosure is covered with a cover plate.

[0013] As a preferred embodiment of the above solution, a cooling fan is provided on the side of the enclosure.

[0014] The advantages of this utility model are: it adopts a chassis-type portable design, which is easy to move; it is equipped with chip slots and fiber optic slots, which can test multiple chips and avoid the pigtails from getting tangled; it is equipped with a radiator and a cooling fan, which provides good heat dissipation. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a multi-channel high and low temperature cycling test chamber.

[0016] Figure 2 This is an exploded structural diagram of the temperature control module.

[0017] Figure 3 This is a schematic diagram of the temperature control module.

[0018] Figure 4 This is a structural diagram of the enclosure panel.

[0019] 1-Box body 2-Cover body 3-Cover plate 4-Enclosure plate 5-Limiting plate 6-Temperature control plate 7-Radiator 8-Bearing plate 9-Mounting beam 11-Touch screen 12-Handle 13-Cooling fan 14-USB interface 15-Power supply 16-Coolant interface 21-Air inlet 41-Hole cutout 42-Limiting block 43-Fiber optic channel 44-Through hole 51-Temperature sensor 71-Radiator interface 81-Support column Detailed Implementation

[0020] The technical solution of this utility model will be further described below through embodiments and in conjunction with the accompanying drawings.

[0021] Example:

[0022] This embodiment describes a multi-channel high and low temperature cycling test chamber, such as... Figures 1 to 4As shown, the test chamber includes a housing 1, inside which a control circuit and a temperature control mechanism are installed. The sides of the housing are equipped with a touch screen 11, a handle 12, a cooling fan 13, a USB interface 14, a power supply 15, and a coolant interface 16. An opening is located in the center of the upper surface of the housing, and the temperature control mechanism is housed within this opening. A surrounding panel 4 covers the opening, and a cover 2 is mounted on the panel. In this embodiment, the handle 12 facilitates the transport of the multi-channel high and low temperature cycling test chamber. The cooling fan 13 dissipates heat from the interior of the housing, enabling the temperature control mechanism to better control the temperature. The USB interface 14 is used for serial port command settings or host computer program development. The coolant interface 16 provides water cooling for the temperature control mechanism.

[0023] Specifically, the upper sides of the housing are each provided with a mounting beam 9, and a support plate 8 is mounted between the two mounting beams 9. The temperature control mechanism is mounted on the support plate 8. The support plate 8 has a groove in the middle, and several support columns 81 are provided in the groove. The temperature control mechanism is mounted on the support columns. The temperature control mechanism includes a limiting plate 5, a temperature control plate 6, and a cold radiator 7 arranged sequentially from top to bottom. The limiting plate 5 has several chip slots for placing chips, and a temperature sensor 51 is provided on the side of the limiting plate corresponding to each chip slot. The temperature control plate 6 is a TEC plate with multiple temperature control channels. The control circuit performs PID control on each temperature control channel. The cold radiator 7 has a flow channel inside, and a flow channel interface 71 is provided on the side of the cold radiator. The flow channel interface 71 is connected to the coolant interface 16. In this embodiment, there are two of each of the limiting plate, temperature control plate, and cold radiator. The limiting plate has four chip slots and four temperature sensors, and the corresponding temperature control plate has four temperature control channels. The chip slots, temperature sensors, and temperature control channels correspond one-to-one. Here, the use of PID control for each channel in the PET is a current technology.

[0024] Furthermore, the enclosure 4 has a perforation 41 that matches the limiting plate 5, and several pairs of fiber optic slots are provided on both sides of the perforation. A cover 3 is also provided on the enclosure. In this embodiment, the enclosure 4 has two perforations 41, each corresponding to one of the two limiting plates 5, and four pairs of fiber optic slots 43 are provided on both sides of each perforation. A limiting block 42 for limiting the cover 3 is provided on the enclosure. During testing, nitrogen gas needs to be injected into the cover to protect the chip; therefore, the cover 2 has an inflation hole 21, and the limiting block 42 corresponding to the inflation hole 21 has a through hole 44 communicating with the inflation hole. In addition, a cover plate 3 for preventing chip displacement is also provided over the perforations of the enclosure.

[0025] The multi-channel high and low temperature cycling test chamber in this embodiment adopts a chassis design with a handle on the side for easy handling. During use, the chip under test (DUT) is placed in the chip slot of the limiting plate, and the pigtail on the DUT is placed into the corresponding fiber optic slot to avoid tangling. The fiber optic slot is open to the side of the enclosure, allowing for easy connection of the pigtail to the test circuit. The cover plate is then placed to secure the chip, followed by the enclosure body. The edges of the enclosure body are set on the enclosure, ensuring that the enclosure body does not obstruct the connection between the pigtail and the test circuit. Nitrogen gas is then introduced into the enclosure body. Finally, the corresponding temperature and time parameters are set via the touchscreen to begin the test.

[0026] The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.

Claims

1. A multi-channel high and low temperature cycling test chamber, characterized in that: The device includes a housing with an opening at the top. A temperature control mechanism is located inside the opening. The temperature control mechanism includes a limiting plate, a temperature control plate, and a cooling radiator arranged sequentially from top to bottom. The opening is covered by a surrounding plate with a cutout that matches the limiting plate. The limiting plate has several chip slots, and several pairs of fiber optic slots are located on both sides of the cutout. A cover is provided on the surrounding plate.

2. The multi-channel high and low temperature cycling test chamber according to claim 1, characterized in that: The upper part of the box is provided with a mounting beam on each side, and a support plate is erected between the two mounting beams. The temperature control mechanism is set on the support plate.

3. The multi-channel high and low temperature cycling test chamber according to claim 2, characterized in that: The bearing plate has a groove in the middle, and several support columns are provided in the groove. The cold air radiator is installed on the support columns.

4. The multi-channel high and low temperature cycling test chamber according to claim 1 or 3, characterized in that: The radiator has a flow channel inside and a flow channel interface on the side of the radiator. The coolant interface is located on the side of the housing and is connected to the flow channel interface.

5. The multi-channel high and low temperature cycling test chamber according to claim 1, characterized in that: The temperature control element is a TEC element, which is electrically connected to the control circuit in the housing.

6. The multi-channel high and low temperature cycling test chamber according to claim 1, characterized in that: Temperature sensors are provided on the side of the limiting plate for each chip slot.

7. The multi-channel high and low temperature cycling test chamber according to claim 1, characterized in that: The enclosure is equipped with limiting blocks for restricting the position of the cover.

8. The multi-channel high and low temperature cycling test chamber according to claim 7, characterized in that: The cover is provided with an inflation hole, and the limiting block corresponding to the inflation hole is provided with a through hole that communicates with the inflation hole.

9. The multi-channel high and low temperature cycling test chamber according to claim 1, characterized in that: The perforated part of the enclosure is covered with a cover plate.

10. The multi-channel high and low temperature cycling test chamber according to claim 1, characterized in that: The side of the enclosure is equipped with a cooling fan.

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