Energy-saving heating module of wafer processing baking equipment

Abstract

The utility model relates to the technical field of wafer drying, and discloses an energy-saving heating module of wafer processing baking equipment, which comprises a plurality of wafer bodies to be dried and a wafer storage assembly for storing the plurality of wafer bodies, one side of the wafer storage assembly is provided with a drying and heating mechanism used for heating and drying a plurality of wafer bodies in the wafer storage assembly, and one side of the drying and heating mechanism is provided with a reciprocating lifting mechanism used for driving the wafer storage assembly to vertically move up and down in a reciprocating manner. The drying heating mechanism ensures uniform distribution of heat and improves the drying efficiency through the synergistic effect of an electric heating module, an air interaction fan and a heat pipe, the wafer storage assembly provides a stable placement platform through an anti-skid counterweight disc and a positioning column, air circulation is ensured through ventilation holes, the uniform heating effect of wafers is improved, and the drying efficiency is improved. The whole system has the advantages of being compact, accurate and capable of saving energy, the drying efficiency is effectively improved, and the wafer machining quality is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of wafer drying technology, specifically to an energy-saving heating module for wafer processing baking equipment. Background Technology

[0002] Wafer baking equipment is used in semiconductor manufacturing to dry the surface of wafers with ultrapure water. In wafer processing, ultrapure water is often used to clean impurities and residues on the wafer surface. After cleaning, the water needs to be removed through baking to prevent it from affecting subsequent processes. This equipment usually has a precise temperature control system and airflow control to ensure uniform heating of the wafer surface and complete evaporation of water during the drying process, while avoiding damage to the wafer caused by temperature fluctuations. The design of wafer baking equipment requires high precision and high purity to meet the strict requirements of the semiconductor industry for clean environment and process precision.

[0003] Traditional wafer processing baking equipment in the prior art typically uses a method of arranging wafers horizontally and neatly for heating and drying. While this method can meet basic drying requirements to some extent, it has several significant drawbacks. First, because the wafers need to be arranged neatly, the equipment design often requires a large footprint. This not only results in a large overall size of the equipment but also requires a larger production space to accommodate it, increasing the cost of factory construction and maintenance. Second, the large size and complex structure of the equipment often make its installation, commissioning, and maintenance more cumbersome. In addition, the heating areas of the equipment are usually relatively dispersed, which may lead to insufficient heating efficiency, thus affecting overall production efficiency. In the long run, the wasted space and increased maintenance costs will also lead to increased operating costs. Therefore, those skilled in the art provide an energy-saving heating module for wafer processing baking equipment to solve the problems mentioned in the background art. Utility Model Content

[0004] The purpose of this invention is to provide an energy-saving heating module for wafer processing baking equipment, which solves the problem that traditional wafer processing baking equipment in the prior art usually uses the method of arranging wafers horizontally and neatly for heating and drying. Although this method can meet the basic drying requirements to a certain extent, it has some significant shortcomings. First, because the wafers need to be arranged neatly, the design of the equipment often requires a large footprint. This not only results in a large overall size of the equipment, but also requires a larger production space to accommodate these devices, increasing the cost of factory construction and maintenance. Second, the large size and complex structure of the equipment often make its installation, debugging and maintenance more cumbersome. In addition, the heating area of ​​the equipment is usually relatively dispersed, which may result in insufficient heating efficiency, thereby affecting the overall production efficiency. In the long run, the waste of equipment space and the increase in maintenance costs will also lead to an increase in operating costs.

[0005] This utility model provides the following technical solution: an energy-saving heating module for wafer processing baking equipment, comprising multiple wafer bodies to be dried and a wafer storage assembly for storing the multiple wafer bodies. A drying heating mechanism for heating and drying the multiple wafer bodies within the wafer storage assembly is provided on one side of the wafer storage assembly. A reciprocating lifting mechanism for driving the wafer storage assembly to move vertically up and down is provided on one side of the drying heating mechanism. A driving mechanism for driving the reciprocating lifting mechanism and the drying heating mechanism to rotate around the outside of the wafer storage assembly is provided at the lower end of the reciprocating lifting mechanism. The driving mechanism is also used to start the reciprocating lifting mechanism.

[0006] As a preferred embodiment of the above technical solution, the driving mechanism includes a support plate, and a plurality of first support columns are arranged and fixedly connected in a ring at the upper center of the support plate near the edge. A chassis is fixedly connected to the upper end of the plurality of first support columns. A rotating ring is rotatably sleeved at the inner center of the chassis through a bearing, and an external toothed ring is fixedly sleeved at the lower outer side of the rotating ring.

[0007] As a preferred embodiment of the above technical solution, a protective frame for protecting the outer gear ring is fixedly connected to the lower center of the chassis near the edge, and a protective plate for protecting the outer gear ring is fixedly connected to the lower end of the protective frame. A drive motor is fixedly connected to the lower center of the protective plate near one side. The output end of the drive motor passes through the lower end of the protective plate and extends to the upper end of the protective plate. A drive gear is fixedly sleeved on the outer side of the output end near the upper end of the protective plate. The drive gear and the outer gear ring are engaged by gear meshing.

[0008] As a preferred embodiment of the above technical solution, an internal toothed ring is fixedly connected to the upper center of the chassis near the edge, and multiple second support columns are fixedly connected in a ring arrangement near the upper center of the protective plate. An anti-slip placement tray is fixedly connected to the upper end of the multiple second support columns, and multiple positioning holes are arranged in a ring arrangement on the upper inner edge of the anti-slip placement tray.

[0009] As a preferred embodiment of the above technical solution, the reciprocating lifting mechanism includes a rotating bottom ring, which is sleeved on the outer side of the rotating ring near the center. The lower end of the rotating bottom ring and the upper end of the inner toothed ring are in mutual sliding contact. Three guide rods are fixedly connected in a fan-shaped arrangement near one side of the upper center of the rotating bottom ring. A support plate is fixedly connected to one side of the rotating bottom ring. The support plate has multiple air flow holes that are equally spaced and penetrate through it. A connecting plate is fixedly connected to the upper center of the support plate near the rotating bottom ring.

[0010] As a preferred embodiment of the above technical solution, an arc-shaped positioning strip is fixedly connected to the side of the connecting plate away from the support plate. The outer upper part of the three guide rods is vertically fixedly sleeved inside the arc-shaped positioning strip. A reciprocating screw is rotatably sleeved on the side of the inner center of the rotating bottom ring near the support plate via a bearing. The outer upper part of the reciprocating screw is vertically rotatably sleeved inside the connecting plate via a bearing. A reciprocating sleeve is threaded onto the outer side of the reciprocating screw. A mating plate is fixedly connected to the side of the reciprocating sleeve away from the support plate. A synchronous gear is fixedly sleeved on the lower part of the outer center of the reciprocating screw. The synchronous gear is located at the lower end of the rotating bottom ring, and the synchronous gear and the internal gear ring are engaged by gear meshing transmission.

[0011] As a preferred embodiment of the above technical solution, the drying and heating mechanism includes a positioning frame, which is fixedly connected to the side of the docking plate away from the reciprocating sliding sleeve. Four internal threaded sleeves are arranged and fixedly connected at both ends of the positioning frame near the docking plate. Two air exchange fans are sleeved on the outer sides of the four internal threaded sleeves on one side and the four internal threaded sleeves on the other side. All eight internal threaded sleeves are threaded with fastening bolts. The bolt heads of the eight fastening bolts abut against the sides of the two air exchange fans that are close to each other. Multiple heat-spreading fins are arranged horizontally inside the positioning frame.

[0012] As a preferred embodiment of the above technical solution, heat pipes are fitted inside the multiple heat-spreading fins. Both ends of the heat pipes on one side penetrate the inner wall of the positioning frame and extend to the outside of the positioning frame. Electric heating modules are fixedly fitted on the outer sides of both ends of the heat-spreading fins on one side. The electric heating modules have built-in electric heating wires. The electric heating modules and the positioning frame are fixedly connected on the side that is close to each other. A protective cover plate is fixedly connected to the side of the positioning frame away from the two air interaction fans. Multiple first ventilation slots are longitudinally arranged and opened through the center of the protective cover plate.

[0013] As a preferred embodiment of the above technical solution, an air guide hood is fixedly fitted on the outer side of the protective cover plate. Inside the air guide hood, three guide pillars are fixedly fitted in a fan shape. The three guide pillars are respectively slidably fitted on the outer side of the three guide rods. A fan-shaped protective cover is fixedly connected to the concave arc surface of the air guide hood. Multiple second ventilation slots are longitudinally arranged and opened through the center of the fan-shaped protective cover. The concave arc surface of the fan-shaped protective cover is close to the wafer storage assembly.

[0014] As a preferred embodiment of the above technical solution, the wafer storage assembly includes an anti-slip counterweight tray, which is disposed on the upper end of an anti-slip placement tray, and the lower surface of the anti-slip counterweight tray is in contact with the upper surface of the anti-slip placement tray. The anti-slip counterweight tray and the anti-slip placement tray are detachably connected. Multiple positioning posts are arranged in a ring and fixedly connected to the lower center of the anti-slip counterweight tray near the edge. The multiple positioning posts are slidably fitted inside multiple positioning holes, and the multiple positioning posts and the multiple positioning holes are detachably connected. A load-bearing rod is fixedly connected to the upper center of the anti-slip counterweight tray near one side. A connecting piece is fixedly connected to the top of the load-bearing rod, and a handle is fixedly connected to the upper center of the connecting piece. Multiple wafer placement trays are rotatably fitted to the outer side of the load-bearing rod through a bearing arrangement. Multiple ventilation holes are filled and arranged in a row inside the wafer placement trays. Multiple wafer bodies are placed on the upper ends of multiple wafer placement trays.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] The energy-saving heating module of this wafer processing baking equipment is powered by a drive mechanism, which drives the reciprocating lifting mechanism to move up and down, ensuring that the drying heating mechanism heats the wafer body from all directions. The drive mechanism, through gear transmission and cooperation with the reciprocating lifting mechanism, ensures the precision and efficiency of the movement.

[0017] The drying and heating mechanism ensures uniform heat distribution and improves drying efficiency through the synergistic effect of electric heating modules, air exchange fans, and heat pipes. The wafer storage component provides a stable placement platform through anti-slip counterweights and positioning columns, and ensures air circulation through ventilation holes, thereby improving the uniform heating effect of the wafers. The entire system has the advantages of being compact, precise, and energy-saving, which not only effectively improves drying efficiency but also ensures wafer processing quality. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of an energy-saving heating module for wafer processing baking equipment;

[0019] Figure 2 A three-dimensional structural diagram of an energy-saving heating module for wafer processing baking equipment from another perspective;

[0020] Figure 3 This is a three-dimensional disassembled structural diagram of an energy-saving heating module for wafer processing baking equipment;

[0021] Figure 4 A three-dimensional split-structure diagram of an energy-saving heating module for wafer processing baking equipment from another perspective;

[0022] Figure 5 A schematic diagram of the three-dimensional disassembled structure of the drive mechanism;

[0023] Figure 6 A three-dimensional split-structure diagram of the drive mechanism from another perspective;

[0024] Figure 7 This is a three-dimensional disassembled structural diagram of the reciprocating lifting mechanism;

[0025] Figure 8 A three-dimensional disassembled structural diagram of the reciprocating lifting mechanism from another perspective;

[0026] Figure 9 A three-dimensional disassembled structural diagram of the drying and heating mechanism;

[0027] Figure 10 This is a schematic diagram of the three-dimensional structure of a wafer storage component;

[0028] Figure 11 This is a schematic diagram of the three-dimensional split structure of the wafer storage components from another perspective.

[0029] Legend:

[0030] 1. Drive mechanism; 101. Support plate; 102. First support column; 103. Chassis; 104. Rotary ring; 105. External gear ring; 106. Protective frame; 107. Protective plate; 108. Drive motor; 109. Drive gear; 1010. Internal gear ring; 1011. Second support column; 1012. Anti-slip placement tray; 1013. Positioning hole; 2. Reciprocating lifting mechanism; 201. Rotating bottom ring; 202. Guide rod; 203. Support plate; 204. Air flow hole; 205. Connecting plate; 206. Arc-shaped positioning strip; 207. Reciprocating lead screw; 208. Reciprocating sliding sleeve; 209. Connecting plate; 2010 1. Synchronous gear; 3. Drying and heating mechanism; 301. Positioning frame; 302. Internal threaded sleeve; 303. Air exchange fan; 304. Fastening bolt; 305. Heat dissipation fins; 306. Heat pipe; 307. Electric heating module; 308. Protective cover plate; 309. First ventilation slot; 3010. Air guide hood; 3011. Guide post; 3012. Fan-shaped protective cover; 3013. Second ventilation slot; 4. Wafer storage assembly; 401. Anti-slip counterweight plate; 402. Positioning post; 403. Load-bearing rod; 404. Connecting piece; 405. Handle; 406. Wafer placement tray; 407. Ventilation hole; 5. Wafer body. Detailed Implementation

[0031] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0032] Please see Figures 1-4As shown, this utility model provides a technical solution: an energy-saving heating module for wafer processing baking equipment, including multiple wafer bodies 5 to be dried and a wafer storage assembly 4 for storing the multiple wafer bodies 5. A drying heating mechanism 3 for heating and drying the multiple wafer bodies 5 inside the wafer storage assembly 4 is provided on one side of the wafer storage assembly 4. A reciprocating lifting mechanism 2 for driving the wafer storage assembly 4 to move vertically up and down is provided on one side of the drying heating mechanism 3. A driving mechanism 1 for driving the reciprocating lifting mechanism 2 and the drying heating mechanism 3 to rotate around the outside of the wafer storage assembly 4 is provided at the lower end of the reciprocating lifting mechanism 2. The driving mechanism 1 is also used to drive the reciprocating lifting mechanism 2 to start operation.

[0033] This wafer processing baking equipment is powered by a drive mechanism 1, which drives a reciprocating lifting mechanism 2 to move up and down, ensuring that the drying and heating mechanism 3 heats the wafer body 5 from all directions. The drive mechanism 1, through gear transmission and the cooperation between the reciprocating lifting mechanism 2, ensures precise and efficient movement. The drying and heating mechanism 3, through the synergistic effect of the electric heating module 307, the air exchange fan 303, and the heat pipe 306, ensures uniform heat distribution and improves drying efficiency. The wafer storage component 4 provides a stable placement platform through the anti-slip counterweight plate 401 and the positioning column 402, and ensures air circulation through the ventilation holes 407, improving the uniform heating effect of the wafer. The entire system has the advantages of being compact, precise, and energy-saving, effectively improving drying efficiency and ensuring wafer processing quality.

[0034] As one implementation method in this embodiment, please refer to Figures 5-6 As shown, the drive mechanism 1 includes a support plate 101. Multiple first support columns 102 are arranged in a ring and fixedly connected to the upper center of the support plate 101 near its edge. A base 103 is fixedly connected to the upper ends of the multiple first support columns 102. A rotating ring 104 is rotatably sleeved at the center of the base 103 via a bearing. An external toothed ring 105 is fixedly sleeved on the lower outer side of the rotating ring 104. A protective frame 106 for protecting the external toothed ring 105 is fixedly connected to the lower center of the base 103 near its edge. A protective plate 107 for protecting the external toothed ring 105 is fixedly connected to the lower end of the protective frame 106. A drive motor is fixedly connected to the lower center of the protective plate 107 near one side. The output end of the drive motor 108 passes through the lower end of the protection plate 107 and extends to the upper end of the protection plate 107. A drive gear 109 is fixedly sleeved on the outer side of the output end near the upper end of the protection plate 107. The drive gear 109 and the external gear ring 105 are meshed and transmitted. An internal gear ring 1010 is fixedly connected to the upper center near the edge of the chassis 103. Multiple second support columns 1011 are fixedly connected in a ring at the upper center near the edge of the protection plate 107. An anti-slip placement tray 1012 is fixedly connected to the upper end of the multiple second support columns 1011. Multiple positioning holes 1013 are arranged in a ring near the upper inner edge of the anti-slip placement tray 1012.

[0035] The main function of the drive mechanism 1 is to provide the power required by the system, enabling the various components to work together. Its central part is the support plate 101. Multiple first support columns 102 are arranged in a ring at the center of the upper end of the support plate 101. The upper ends of the multiple first support columns 102 are connected to the chassis 103. The chassis 103 is connected to the rotating ring 104 through bearings. An external gear ring 105 is installed on the outer side of the rotating ring 104. The protective frame 106 and the protective plate 107 at the lower end of the chassis 103 work together to protect the external gear ring 105. The drive motor 108 meshes with the external gear ring 105 through the drive gear 109 to provide rotational power, causing the rotating ring 104 to rotate around its center, thereby driving the operation of the entire mechanism. In addition, the internal gear ring 1010 at the upper end of the chassis 103 provides power support for the subsequent reciprocating lifting mechanism 2. This structure is compact and can effectively transmit power to the upper reciprocating lifting mechanism 2 and the drying and heating mechanism 3, ensuring the efficient operation of the system.

[0036] As one implementation method in this embodiment, please refer to Figures 7-8 As shown, the reciprocating lifting mechanism 2 includes a rotating bottom ring 201, which is sleeved on the outer center of the rotating ring 104. The lower end of the rotating bottom ring 201 and the upper end of the internal gear ring 1010 are in sliding contact with each other. Three guide rods 202 are fixedly connected in a fan-shaped arrangement on one side of the upper center of the rotating bottom ring 201. A support plate 203 is fixedly connected to one side of the rotating bottom ring 201. The support plate 203 has multiple air flow holes 204 that are evenly filled and penetrated inside. A connecting plate 205 is fixedly connected to the upper center of the support plate 203 near the rotating bottom ring 201. An arc-shaped positioning strip 206 is fixedly connected to the side of the connecting plate 205 away from the support plate 203. The three guide rods 202 are fixedly connected to the rotating bottom ring 201. The upper outer side of rod 202 is vertically fixed inside the arc-shaped positioning strip 206. The reciprocating screw 207 is rotatably sleeved on the side of the rotating bottom ring 201 near the support plate 203 via a bearing. The upper outer side of the reciprocating screw 207 is vertically rotatably sleeved inside the connecting plate 205 via a bearing. The reciprocating slide sleeve 208 is threaded on the outer side of the reciprocating screw 207. The mating plate 209 is fixedly connected on the side of the reciprocating slide sleeve 208 away from the support plate 203. The lower outer center of the reciprocating screw 207 is fixedly sleeved with a synchronous gear 2010. The synchronous gear 2010 is located at the lower end of the rotating bottom ring 201, and the synchronous gear 2010 and the internal gear ring 1010 are gear meshing transmissions.

[0037] The cooperation between the reciprocating lifting mechanism 2 and the drive mechanism 1 is achieved through the rotating bottom ring 201. The rotating bottom ring 201 is fixedly sleeved on the outside of the rotating ring 104, and its lower surface slides against the upper surface of the inner gear ring 1010. The outer gear ring 105 and the rotating ring 104 are driven to rotate by the drive gear 109, and the rotating bottom ring 201 is rotated by the transmission of the rotating ring 104. Multiple guide rods 202 are fixedly connected to the upper end of the rotating bottom ring 201. These guide rods 202 are combined with the arc-shaped positioning strip 206 to ensure the smoothness and accuracy of the up and down movement of the drying and heating mechanism 3. At the same time, the rotating bottom ring 201 generates the transmission effect of up and down movement through the cooperation of the reciprocating screw 207 and the reciprocating sliding sleeve 208. The reciprocating sliding sleeve 208 is connected to the docking plate 209 to drive the drying and heating mechanism 3 to move up and down reciprocally. This structural design allows the wafer body 5 to be heated from all directions, improving the drying efficiency.

[0038] As one implementation method in this embodiment, please refer to Figure 9 As shown, the drying and heating mechanism 3 includes a positioning frame 301, which is fixedly connected to the docking plate 209 on the side away from the reciprocating sliding sleeve 208. Four internally threaded sleeves 302 are fixedly connected to both the upper and lower ends of the positioning frame 301 near the docking plate 209. Two air exchange fans 303 are fitted onto the outer sides of the four internally threaded sleeves 302 on one side and the four internally threaded sleeves 302 on the other side. Each of the eight internally threaded sleeves 302 is threaded with a fastening bolt 304, and the bolt heads of the eight fastening bolts 304 abut against the sides of the two air exchange fans 303 that are close to each other. Multiple heat-spreading fins 305 are horizontally arranged inside the positioning frame 301, and heat pipes 306 are fitted inside the multiple heat-spreading fins 305. Both ends of the heat pipes 306 on one side penetrate through an inner wall of the positioning frame 301 and extend to the outside of the positioning frame 301. The outer sides of the two ends of the heat-spreading fins 305 on one side are fixed. An electric heating module 307 is installed, with an electric heating wire inside. The electric heating module 307 is fixedly connected to the side of the positioning frame 301 that is close to each other. A protective cover plate 308 is fixedly connected to the side of the positioning frame 301 away from the two air interaction fans 303. Multiple first ventilation slots 309 are longitudinally arranged and opened through the center of the protective cover plate 308. An air guide cover 3010 is fixedly installed on the outside of the protective cover plate 308. Three guide posts 3011 are fixedly installed in a fan shape inside the air guide cover 3010. The three guide posts 3011 are respectively longitudinally slidably installed on the outside of the three guide rods 202. A fan-shaped protective cover 3012 is fixedly connected to the concave arc surface of the air guide cover 3010. Multiple second ventilation slots 3013 are longitudinally arranged and opened through the center of the fan-shaped protective cover 3012. The concave arc surface of the fan-shaped protective cover 3012 is close to the wafer storage assembly 4.

[0039] The drying and heating mechanism 3 is installed and fixed by the positioning frame 301 to ensure its stability during operation. The positioning frame 301 has multiple internal threaded sleeves 302 distributed inside, which, combined with the air exchange fan 303, can promote airflow and improve the drying effect. The electric heating module 307 has built-in electric heating wires to effectively heat the wafer body 5. The electric heating module 307 and the heat spreader fins 305 work together, and the heat pipe 306 further optimizes the heat transfer to ensure drying uniformity. The protective cover plate 308 and the air guide shroud 3010 are used to protect the multiple heat spreader fins 305 to avoid overheating or uneven heat distribution, ensuring safety and efficiency. These designs can ensure precise temperature control of the wafer body 5 during the heating process, further improving the wafer processing quality.

[0040] As one implementation method in this embodiment, please refer to Figures 10-11 As shown, the wafer storage assembly 4 includes an anti-slip counterweight plate 401, which is disposed on the upper end of the anti-slip placement tray 1012. The lower surface of the anti-slip counterweight plate 401 is in contact with the upper surface of the anti-slip placement tray 1012. The anti-slip counterweight plate 401 and the anti-slip placement tray 1012 are detachably connected. Multiple positioning posts 402 are arranged in a ring and fixedly connected near the edge of the lower center of the anti-slip counterweight plate 401. The multiple positioning posts 402 are slidably fitted inside multiple positioning holes 1013. The connection between the anti-slip counterweight plate 401 and the multiple positioning holes 1013 is detachable. A load-bearing rod 403 is fixedly connected to one side of the upper center of the anti-slip counterweight plate 401. A connecting piece 404 is fixedly connected to the top of the load-bearing rod 403. A handle 405 is fixedly connected to the upper center of the connecting piece 404. Multiple wafer placement trays 406 are longitudinally arranged and rotatably sleeved on the outside of the load-bearing rod 403 through bearings. Multiple ventilation holes 407 are opened through the interior of the wafer placement trays 406 in a filled row. Multiple wafer bodies 5 are placed on the upper end of the multiple wafer placement trays 406 respectively.

[0041] The wafer storage assembly 4 is combined with the anti-slip counterweight plate 401 and the anti-slip placement tray 1012 to form a stable placement platform. The detachable connection between the anti-slip counterweight plate 401 and the anti-slip placement tray 1012 facilitates disassembly, replacement and maintenance. Multiple positioning posts 402, combined with positioning holes 1013, ensure that the wafer body 5 can be stably placed on the wafer placement tray 406. The wafer placement tray 406 is further stabilized by the load-bearing rod 403. The ventilation holes 407 in each wafer placement tray 406 allow air to circulate freely, ensuring that the wafer body 5 is heated evenly during the drying process. This design improves the stability of wafer placement and the uniformity of drying, avoiding wafer damage caused by instability.

[0042] Operating Principle: The main function of the drive mechanism 1 is to provide the power required by the system, enabling the various components to work together. Its central part is a support plate 101. Multiple first support columns 102 are arranged in a ring at the upper center of the support plate 101. The upper ends of the multiple first support columns 102 are connected to the chassis 103. The chassis 103 is connected to the rotating ring 104 via bearings. An external gear ring 105 is mounted on the outer side of the rotating ring 104. The protective frame 106 and protective plate 107 at the lower end of the chassis 103 work together to protect the external gear ring 105. The drive motor 108 meshes with the external gear ring 105 through a drive gear 109, providing rotational power, causing the rotating ring 104 to rotate around its center, thereby driving the operation of the entire mechanism. In addition, the internal gear ring 1010 at the upper end of the chassis 103 provides power support for the subsequent reciprocating lifting mechanism 2. This compact structural design effectively transmits power to the upper reciprocating lifting mechanism 2 and the drying and heating mechanism 3, ensuring the system's operation. The efficient operation of the reciprocating lifting mechanism 2 and the drive mechanism 1 is achieved through the rotating bottom ring 201. The rotating bottom ring 201 is fixedly sleeved on the outside of the rotating ring 104, and its lower surface slides against the upper surface of the inner gear ring 1010. The outer gear ring 105 and the rotating ring 104 are driven to rotate by the drive gear 109, and the rotating bottom ring 201 is rotated by the transmission of the rotating ring 104. Multiple guide rods 202 are fixedly connected to the upper end of the rotating bottom ring 201. These guide rods 202 are combined with the arc-shaped positioning strip 206 to ensure the smoothness and precision of the up and down movement of the drying and heating mechanism 3. At the same time, the rotating bottom ring 201 generates the transmission effect of up and down movement through the cooperation of the reciprocating screw 207 and the reciprocating sliding sleeve 208. The reciprocating sliding sleeve 208 is connected to the docking plate 209 to drive the drying and heating mechanism 3 to move up and down reciprocally. This structural design allows the wafer body 5 to be heated from all directions, improving the drying efficiency.

[0043] The drying and heating mechanism 3 is installed and fixed via a positioning frame 301 to ensure stability during operation. Multiple internally threaded sleeves 302 are distributed inside the positioning frame 301, which, in conjunction with the air exchange fan 303, promote airflow and improve drying efficiency. The electric heating module 307, with its built-in heating wire, effectively heats the wafer body 5. The electric heating module 307 and the heat spreader fins 305 work synergistically, and the heat pipe 306 further optimizes heat transfer, ensuring uniform drying. A protective cover 308 and an air guide shroud 3010 protect the multiple heat spreader fins 305, preventing overheating or uneven heat distribution, ensuring safety and efficiency. These designs ensure precise temperature control of the wafer body 5 during the heating process. To improve wafer processing quality, the wafer storage assembly 4 is combined with the anti-slip counterweight plate 401 and the anti-slip placement tray 1012 to form a stable placement platform. The detachable connection between the anti-slip counterweight plate 401 and the anti-slip placement tray 1012 facilitates disassembly, replacement, and maintenance. Multiple positioning posts 402, combined with positioning holes 1013, ensure that the wafer body 5 can be stably placed on the wafer placement tray 406. The wafer placement tray 406 is further stabilized by the load-bearing rod 403. The ventilation holes 407 in each wafer placement tray 406 allow air to circulate freely, ensuring that the wafer body 5 is heated evenly during the drying process. This design improves the stability of wafer placement and the uniformity of drying, avoiding wafer damage caused by instability.

[0044] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.

Claims

1. An energy-saving heating module for wafer processing baking equipment, characterized in that: The device includes multiple wafer bodies (5) to be dried and a wafer storage assembly (4) for storing the multiple wafer bodies (5). A drying heating mechanism (3) for heating and drying the multiple wafer bodies (5) in the wafer storage assembly (4) is provided on one side of the wafer storage assembly (4). A reciprocating lifting mechanism (2) for driving the wafer storage assembly (4) to move vertically up and down is provided on one side of the drying heating mechanism (3). A driving mechanism (1) for driving the reciprocating lifting mechanism (2) and the drying heating mechanism (3) to rotate around the outside of the wafer storage assembly (4) is provided at the lower end of the reciprocating lifting mechanism (2). The driving mechanism (1) is also used to drive the reciprocating lifting mechanism (2) to start operation.

2. The energy-saving heating module for wafer processing baking equipment according to claim 1, characterized in that: The drive mechanism (1) includes a support plate (101). Multiple first support columns (102) are fixedly connected in a ring at the upper center of the support plate (101) near the edge. A chassis (103) is fixedly connected to the upper end of the multiple first support columns (102). A rotating ring (104) is rotatably sleeved at the center of the chassis (103) through a bearing. An external toothed ring (105) is fixedly sleeved on the lower outer side of the rotating ring (104).

3. The energy-saving heating module for wafer processing baking equipment according to claim 2, characterized in that: A protective frame (106) for protecting the external gear ring (105) is fixedly connected to the lower center of the chassis (103) near the edge. A protective plate (107) for protecting the external gear ring (105) is fixedly connected to the lower end of the protective frame (106). A drive motor (108) is fixedly connected to the lower center of the protective plate (107) near one side. The output end of the drive motor (108) passes through the lower end of the protective plate (107) and extends to the upper end of the protective plate (107). A drive gear (109) is fixedly sleeved on the outer side of the upper output end of the protective plate (107). The drive gear (109) and the external gear ring (105) are engaged by gear meshing.

4. The energy-saving heating module for wafer processing baking equipment according to claim 3, characterized in that: An internal toothed ring (1010) is fixedly connected to the upper center near the edge of the chassis (103). Multiple second support columns (1011) are fixedly connected in a ring at the upper center near the edge of the protective plate (107). An anti-slip placement tray (1012) is fixedly connected to the upper end of the multiple second support columns (1011). Multiple positioning holes (1013) are arranged in a ring on the upper inner edge of the anti-slip placement tray (1012).

5. The energy-saving heating module for wafer processing baking equipment according to claim 4, characterized in that: The reciprocating lifting mechanism (2) includes a rotating bottom ring (201), which is sleeved on the outer center of the rotating ring (104) and the lower end of the rotating bottom ring (201) and the upper end of the internal toothed ring (1010) are in mutual sliding contact. Three guide rods (202) are fixedly connected in a fan shape on one side of the upper center of the rotating bottom ring (201). A support plate (203) is fixedly connected on one side of the rotating bottom ring (201). Multiple air flow holes (204) are equidistantly filled and penetrated inside the support plate (203). A connecting plate (205) is fixedly connected on the upper center of the side of the support plate (203) near the rotating bottom ring (201).

6. The energy-saving heating module for wafer processing baking equipment according to claim 5, characterized in that: An arc-shaped positioning strip (206) is fixedly connected to the side of the connecting plate (205) away from the support plate (203). The outer upper part of the three guide rods (202) is vertically fixedly sleeved inside the arc-shaped positioning strip (206). A reciprocating screw (207) is rotatably sleeved on the side of the rotating bottom ring (201) near the support plate (203) via a bearing. The outer upper part of the reciprocating screw (207) is vertically rotatably sleeved inside the connecting plate (205) via a bearing. The reciprocating screw (207) is threaded with a reciprocating sleeve (208) on its outer side. The reciprocating sleeve (208) is fixedly connected to a mating plate (209) on the side away from the support plate (203). A synchronous gear (2010) is fixedly sleeved at the lower center of the outer side of the reciprocating screw (207). The synchronous gear (2010) is located at the lower end of the rotating bottom ring (201), and the synchronous gear (2010) and the internal gear ring (1010) are engaged by gear meshing.

7. The energy-saving heating module for wafer processing baking equipment according to claim 6, characterized in that: The drying and heating mechanism (3) includes a positioning frame (301), which is fixedly connected to the side of the docking plate (209) away from the reciprocating sliding sleeve (208). Four internal threaded sleeves (302) are fixedly connected at both ends of the positioning frame (301) near the docking plate (209). Two air exchange fans (303) are sleeved on the outside of the four internal threaded sleeves (302) on one side and the four internal threaded sleeves (302) on the other side. All eight internal threaded sleeves (302) are threaded with fastening bolts (304). The screw heads of the eight fastening bolts (304) abut against each other on the side of the two air exchange fans (303) that are close to each other. Multiple heat-spreading fins (305) are arranged horizontally inside the positioning frame (301).

8. The energy-saving heating module for wafer processing baking equipment according to claim 7, characterized in that: Heat pipes (306) are fitted inside the heat-dampening fins (305). The two ends of the heat pipes (306) on one side pass through the inner wall of the positioning frame (301) and extend to the outside of the positioning frame (301). Electric heating modules (307) are fixedly fitted on the outer sides of the two ends of the heat-dampening fins (305) on one side. The electric heating modules (307) have built-in electric heating wires. The electric heating modules (307) and the positioning frame (301) are fixedly connected on the side that is close to each other. A protective cover plate (308) is fixedly connected on the side of the positioning frame (301) away from the two air interaction fans (303). Multiple first ventilation slots (309) are longitudinally arranged and opened through the center of the protective cover plate (308).

9. The energy-saving heating module for wafer processing baking equipment according to claim 8, characterized in that: An air guide hood (3010) is fixedly fitted on the outside of the protective cover plate (308). Three guide pillars (3011) are fixedly fitted inside the air guide hood (3010) in a fan shape. The three guide pillars (3011) are respectively slidably fitted on the outside of the three guide rods (202). A fan-shaped protective cover (3012) is fixedly connected to the concave arc surface of the air guide hood (3010). Multiple second ventilation slots (3013) are longitudinally arranged and opened through the center of the fan-shaped protective cover (3012). The concave arc surface of the fan-shaped protective cover (3012) is close to the wafer storage assembly (4).

10. The energy-saving heating module for wafer processing baking equipment according to claim 4, characterized in that: The wafer storage assembly (4) includes an anti-slip counterweight tray (401), which is disposed on the upper end of the anti-slip placement tray (1012). The lower surface of the anti-slip counterweight tray (401) is in contact with the upper surface of the anti-slip placement tray (1012). The anti-slip counterweight tray (401) and the anti-slip placement tray (1012) are detachably connected. A plurality of positioning posts (402) are arranged in a ring and fixedly connected at the lower center of the anti-slip counterweight tray (401) near the edge. The plurality of positioning posts (402) are slidably sleeved inside a plurality of positioning holes (1013). The multiple positioning holes (1013) are detachably connected. A load-bearing rod (403) is fixedly connected to one side of the upper center of the anti-slip counterweight plate (401). A connecting piece (404) is fixedly connected to the top of the load-bearing rod (403). A handle (405) is fixedly connected to the upper center of the connecting piece (404). Multiple wafer placement trays (406) are longitudinally arranged and rotatably sleeved on the outside of the load-bearing rod (403) through bearings. Multiple ventilation holes (407) are opened through the interior of the wafer placement tray (406) in a filled row. Multiple wafer bodies (5) are placed on the upper end of multiple wafer placement trays (406).

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