Temperature control test board and test device

Abstract

The utility model relates to a temperature control test board and a test device. The temperature control test board comprises a bearing mechanism, a test seat and a test board. The temperature control gas flowing along the gas supply channel can enter the pit from the bottom of the test seat through the gas guide hole and the hollow groove and is blown to the probe, so that the probe can be pre-heated, and the temperature of the probe can reach the target temperature in advance. Therefore, when the pre-heated electronic component to be tested is placed in the pit and is in contact with the probe, the temperature difference between the electronic component to be tested and the probe is extremely small, so that heat transfer does not occur, and both the probe and the electronic component to be tested can rapidly reach the target temperature, thereby ensuring relatively high test precision. Moreover, the temperature control gas can be introduced from the bottom of the test seat only by punching holes in the test seat and the test plate, and a complicated flow channel structure does not need to be formed in the test seat, so that the test seat is also suitable for the working condition that the thickness of the test seat is relatively small.

Description

Technical Field

[0001] This utility model relates to the field of testing equipment technology, and in particular to a temperature-controlled testing bench and testing device. Background Technology

[0002] Electronic components, such as chips, need to undergo performance testing at different temperatures before leaving the factory to ensure product quality. Because electronic components are typically highly sensitive to temperature, and their performance varies significantly at different temperatures, the temperature during testing must maintain high stability and accuracy.

[0003] Testing of electronic components is typically performed on a temperature-controlled test bench, which is equipped with probes. During testing, the test area of ​​the electronic component comes into contact with the probes. Due to the temperature difference between the probes and the electronic component under test, heat transfer occurs at the moment of contact, causing fluctuations in the test temperature of the electronic component. The test temperatures of the electronic component and the probes need time to reach the target temperature together, thus affecting the test accuracy. Utility Model Content

[0004] Therefore, it is necessary to provide a temperature-controlled testing platform and testing device that can ensure high testing accuracy to address the above problems.

[0005] A temperature-controlled testing station, comprising:

[0006] The supporting mechanism has a gas supply channel through which temperature-controlled gas flows;

[0007] A test socket, mounted on the support mechanism, has a recess for supporting the electronic component under test, the bottom wall of which has a perforated groove; and

[0008] A test plate is installed on the side of the test seat facing away from the recess. The test plate has an air guide hole, and the air supply channel is connected to the hollow groove through the air guide hole.

[0009] The test stand is provided with multiple probes, which pass through the bottom wall of the recess, with one end of each probe extending into the recess and the other end extending to the test plate.

[0010] In one embodiment, a through hole is formed on the support mechanism, the test seat is mounted on one end of the through hole, and a test groove for accommodating the electronic component under test is formed between the recess and the inner wall of the through hole.

[0011] In one embodiment, the support mechanism includes a sealing ring disposed at the edge of the through hole away from the test seat and extending circumferentially along the through hole.

[0012] In one embodiment, the supporting mechanism further forms an exhaust channel through which temperature-controlled gas flows, the exhaust channel being connected to the recess.

[0013] In one embodiment, the interior of the test seat has an exhaust channel with one end connected to the exhaust channel, and the opening of the exhaust channel at the end away from the exhaust channel is located on the side wall of the recess.

[0014] In one embodiment, the supporting mechanism includes a base and a gas distribution assembly, the gas distribution assembly being installed on the base, and the gas distribution assembly having the gas supply channel and the exhaust channel formed therein.

[0015] In one embodiment, the air distribution assembly includes an air intake block, an air distribution block, and an exhaust block. The air intake block, the air distribution block, and the exhaust block are respectively formed with an air intake channel, an air distribution channel, and an exhaust channel. The air intake channel and the air distribution channel are interconnected and together constitute the air supply channel. The air distribution channel is connected to the hollowed-out groove through the air guide hole.

[0016] In one embodiment, the support mechanism is provided with at least two test seats, and the temperature-controlled gas enters the gas supply channel through the gas inlet channel and is distributed to each of the test seats by the gas distribution channel.

[0017] In one embodiment, the interior of the test seat has an air blowing channel with one end connected to the air supply channel, and the opening of the air blowing channel at the end away from the air supply channel is located on the side wall of the recess.

[0018] A testing apparatus comprising a temperature-controlled testing bench as described in any of the preferred embodiments above.

[0019] The aforementioned temperature-controlled test bench and testing device allow temperature-controlled gas flowing along the gas supply channel to enter the recess from the bottom of the test base through the air guide holes and perforated slots, and then blow it onto the probe. This preheats the probe, ensuring it reaches the target temperature ahead of time. When the preheated electronic component under test is placed in the recess and comes into contact with the probe, the temperature difference between them is minimal, preventing significant heat transfer. Therefore, both the probe and the electronic component under test can quickly reach the target temperature, ensuring high testing accuracy. Furthermore, since only holes need to be drilled in the test base and test plate to introduce the temperature-controlled gas from the bottom of the test base, without the need for a complex flow channel structure within the test base, it is also suitable for applications with a relatively thin test base. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the temperature control test bench in one embodiment of the present invention;

[0022] Figure 2 for Figure 1 The top view of the temperature control test bench shown;

[0023] Figure 3 for Figure 2 The temperature control test bench shown is a cross-sectional view along AA.

[0024] Figure 4 for Figure 3 A magnified schematic diagram of part B in the temperature control test bench shown;

[0025] Figure 5 for Figure 1 A schematic diagram of the test stand and test plate in the temperature control test bench shown;

[0026] Figure 6 for Figure 2 The temperature control test bench shown is a simplified cross-sectional view with some components omitted.

[0027] Figure 7 for Figure 6 The simplified structure shown is a cross-sectional view along CC. Detailed Implementation

[0028] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0029] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0031] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0032] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0033] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0034] Please see Figure 1 and Figure 2 This utility model provides a temperature-controlled testing platform 100 and a testing device (not shown in the figure). The testing device includes the temperature-controlled testing platform 100.

[0035] The temperature-controlled test bench 100 is used to hold the electronic component under test and to control its temperature, thereby maintaining a preset test temperature during the test. For ease of description, the electronic component in this embodiment is referred to as chip 20 (see...). Figure 3 For example, electronic components can be other electronic components that require temperature control during performance testing.

[0036] In addition, the aforementioned testing device generally also includes a pressure head (not shown) and a refrigerant mechanism (not shown). The refrigerant mechanism generates a temperature-controlled gas at a preset temperature, and the temperature-controlled test bench 100 uses the temperature-controlled gas output by the refrigerant mechanism to control the temperature of the chip 20. The pressure head presses the chip 20, which is mounted on the temperature-controlled test bench 100, against multiple probes 125 (see figure). Figure 5 ), to perform testing on chip 20.

[0037] Please refer to the following: Figure 3 and Figure 4 In one embodiment of the present invention, the temperature control test bench 100 includes a support mechanism 110, a test base 120, and a test plate 130.

[0038] The support mechanism 110 has a gas supply channel 101 through which temperature-controlled gas flows. The air inlet (not shown in the figure) of the gas supply channel 101 generally extends to the outer surface of the support mechanism 110, and the temperature-controlled gas output by the refrigerant mechanism can enter the gas supply channel 101 through the air inlet.

[0039] Specifically, in this embodiment, the supporting mechanism 110 includes a base 111 and an air distribution assembly 112. The air distribution assembly 112 is mounted on the base 111, and an air supply channel 101 is formed within the air distribution assembly 112. The base 111 can be a plate-shaped structure formed of metal, typically rectangular. The base 111 is pre-drilled with holes for mounting the air distribution assembly 112 to facilitate its assembly.

[0040] The base 111 and the air distribution assembly 112 are designed as separate units to facilitate processing. Obviously, in other embodiments, provided that the processing difficulty is acceptable, the base 111 and the air distribution assembly 112 can be designed as an integral structure, and an integral air supply channel 101 can be machined by milling grooves inside.

[0041] Please refer to the following: Figure 5 The test socket 120 is mounted on the support mechanism 110 and has a recess 121 for supporting the electronic component under test, such as the chip 20. The test board 130 is mounted on the side of the test socket 120 facing away from the recess 121. Specifically, the test socket 120 can be fixedly mounted to the base 111 by threaded fasteners, and the test board 130 can also be fixedly mounted to the test socket 120 by threaded fasteners. The test socket 120 is also provided with multiple probes 125, which pass through the bottom wall of the recess 121 and extend into the recess 121. The bottom wall of the recess 121 generally has through holes (not shown in the figure), and the probes 125 pass through the corresponding through holes and extend into the recess 121.

[0042] The test board 130 is a circuit board with an interface for electrical connection to the probe 125. The other end of the probe 125, away from the recess 121, extends to the test board 130 and is plugged into or soldered to the corresponding interface to transmit electrical signals.

[0043] During testing, chip 20 is first placed in recess 121, and then, under the action of pressure head 210, the tops of multiple probes 125 are brought into contact with the test area on the bottom surface of chip 20, thereby enabling the test board 130 to test chip 20. In this embodiment, the test area of ​​chip 20 is distributed at the edge of the bottom surface, so the multiple probes 125 are arranged in a ring around the test area of ​​chip 20.

[0044] Furthermore, a perforated groove 122 is formed on the bottom wall of the recess 121, and a vent hole 1311 is formed on the test board 130. The air supply channel 101 is connected to the perforated groove 122 through the vent hole 1311. In this way, the temperature-controlled gas flowing along the air supply channel 101 can enter the recess 121 from the bottom of the test base 120 through the vent hole 1311 and the perforated groove 122. The edge of the perforated groove 122 can support the chip 20. The chip 20 in the recess 121 is supported on the edge of the perforated groove 122, that is, the bottom surface of the chip 20 faces the perforated groove 122. Therefore, the temperature-controlled gas entering from the perforated groove 122 can be directly blown onto the bottom surface of the chip 20.

[0045] Furthermore, because the test area of ​​chip 20 is in contact with probe 125, a gap exists between the test area and the edge of the cutout groove 122. Therefore, the temperature-controlled gas entering through the cutout groove 122 can diffuse into this gap and blow towards probe 125, thus preheating probe 125 so that its temperature reaches the target temperature (i.e., the test temperature) ahead of time. When the preheated electronic component under test is placed in the recess 121 and comes into contact with probe 125, the temperature difference between the two is minimal, and no significant heat transfer occurs. Therefore, both probe 125 and the electronic component under test can quickly reach the target temperature, ensuring high test accuracy.

[0046] Since only holes need to be drilled in the test socket 120 and the test plate 130 to introduce the temperature control gas from the bottom of the test socket 120, there is no need to form a complex flow channel structure inside the test socket 120. Therefore, even if the thickness of the test socket 120 is small, it does not affect the introduction of the temperature control gas from its bottom. Moreover, the drilling operation is less difficult than forming a flow channel structure inside the test socket 120, which also helps to reduce costs.

[0047] Please refer to it again. Figure 4 In this embodiment, the interior of the test base 120 has an air blowing channel 123, one end of which is connected to the air supply channel 101. The opening of the air blowing channel 123 away from the air supply channel 101 is located on the side wall of the recess 121. Therefore, the temperature-controlled gas flowing along the air supply channel 101 can also enter the air blowing channel 122 and then enter the recess 121 through the air blowing channel 123. In other words, the temperature-controlled gas can not only enter the recess 121 from the bottom of the test base 120, but also be blown into the recess 121 from the side of the test base 120.

[0048] When chip 20 is pressed down into recess 121, it covers the cutout groove 122. This prevents the temperature-controlled gas introduced from the bottom of test socket 120 from effectively diffusing to the upper surface of chip 20, affecting the temperature control effect on chip 20. However, the opening of the air blowing channel 123 is generally located above the upper surface of chip 20, so the temperature-controlled gas blown from the side of test socket 120 can effectively flow across the upper surface of chip 20. The combination of temperature-controlled gas blown from the bottom and side of test socket 120 ensures sufficient contact between chip 20 and the temperature-controlled gas, thus maintaining a stable temperature of chip 20 during testing.

[0049] In this embodiment, the supporting mechanism 110 also has an exhaust channel 103 for the flow of temperature-controlled gas, and the exhaust channel 103 is connected to the recess 121. Specifically, the exhaust channel 103 may also be formed within the gas distribution assembly 112.

[0050] After the temperature-controlled gas is introduced into the recess 121 through the gas supply channel 101, it can also enter the exhaust channel 103 through the recess 121. The outlet of the exhaust channel 103 (not shown in the figure) generally extends to the outer surface of the supporting mechanism 110, through which the temperature-controlled gas can be discharged. The outlet of the exhaust channel 103 can be connected to the refrigerant mechanism, thereby enabling the temperature-controlled gas to circulate among the gas supply channel 101, the recess 121, and the exhaust channel 103. On the one hand, this allows for the reuse of the temperature-controlled gas; on the other hand, it accelerates the flow efficiency of the temperature-controlled gas and allows for timely adjustment of the temperature of the temperature-controlled gas, thereby ensuring that the temperature of the temperature-controlled gas in the recess 12 can be maintained near the target temperature.

[0051] Specifically, in this embodiment, the interior of the test seat 120 has an exhaust channel 124 that is connected to the exhaust channel 103 at one end, and the opening of the exhaust channel 124 away from the exhaust channel 103 is located on the side wall of the recess 121. That is, the exhaust channel 103 is connected to the recess 121 through the exhaust channel 124.

[0052] Furthermore, in this embodiment, a through hole 102 is formed on the support mechanism 110, and a test base 120 is installed at one end of the through hole 102. A test groove (not shown) is formed between the recess 121 and the inner wall of the through hole 102 to accommodate the electronic component under test, i.e., the chip 20. The opening of the through hole 102 away from the test base 120 constitutes the opening of the test groove, which facilitates the placement and removal of the chip 20. Because the test groove is relatively deep, the temperature control gas is not easy to flow out from the opening of the test groove, and can stay in the test groove for a longer time and form turbulence, thereby making the temperature distribution in the test groove uniform and consistent with the target temperature.

[0053] Specifically, a through hole 102 is formed on the base 111. The through hole 102 is generally a rectangular hole that penetrates the base 111 along its thickness direction. The support mechanism 110 is generally provided with at least two test seats 120, and each test seat 120 corresponds to a test plate 130. Therefore, more than two chips 20 can be tested simultaneously on the temperature control test bench 100 to improve testing efficiency. Correspondingly, at least two through holes 102 need to be provided on the base 111 to cooperate with at least two test seats 120 to form detection slots.

[0054] Furthermore, in this embodiment, the bearing mechanism 110 includes a sealing ring 113, which is disposed on the edge of the through hole 102 away from the test seat 120 and extends circumferentially along the through hole 102.

[0055] When the pressure head presses the chip 20 in the detection slot onto the probe 125, the pressure head can cover the opening of the through hole 102 away from the test seat 120 (i.e., the opening of the detection slot). Furthermore, the pressure head can also press the sealing ring 113, thereby sealing the opening of the detection slot. In this way, the detection slot is isolated from the outside, thus helping to create a constant temperature environment inside. Specifically, an annular step (not shown) can be provided circumferentially along the pressure head. The radial dimension of the annular step is larger than the inner diameter of the through hole 102, so the annular step can mate with the sealing ring 112.

[0056] Please refer to it again. Figures 2 to 4 See also Figure 6 In this embodiment, the air distribution assembly 112 includes an air intake block 1121, an air distribution block 1122, and an exhaust block 1123. The air intake block 1121, the air distribution block 1122, and the exhaust block 1123 are respectively formed with an air intake channel (not shown in the figure), an air distribution channel (not shown in the figure), and an exhaust channel 103. The air intake channel and the air distribution channel are interconnected and together form an air supply channel 101. The air distribution channel is connected to the hollow groove 122 through the air guide hole 1311.

[0057] The air inlet block 1121, air distributor block 1122, and exhaust block 1123 can be metal block structures with internally machined flow channels, and are generally installed on the base 111 by threaded fasteners. The separate arrangement of the air inlet block 1121, air distributor block 1122, and exhaust block 1123 facilitates processing; the flow channels can be machined separately and then assembled to obtain the complete air supply channel 101 and exhaust channel 103. The air inlet of the air supply channel 101 is generally located at the end of the air inlet channel away from the air distributor channel. The temperature-controlled gas generated by the refrigerant mechanism enters the air supply channel 101 through the air inlet channel, and can be divided into multiple paths through the air distributor channel, which then enter the recess 121 of the test holder 120 respectively. The multiple temperature-controlled gases converge in the recess 121 and enter the exhaust channel 103, and are finally discharged from the outlet at the end of the exhaust channel 103. In cases where at least two test seats 120 are provided, the temperature-controlled gas enters the gas supply channel 101 through the gas inlet channel and is then evenly distributed to each test seat 120 by the gas distribution channel.

[0058] Please refer to the following: Figure 7 Taking this embodiment with two test seats 120 as an example, four air distribution blocks 1122 are provided, namely one first air distribution block a, one second air distribution block b, and two third air distribution blocks c. The first air distribution block a and the second air distribution block b are stacked and connected along the thickness direction of the base 111, and the first air distribution block a is directly connected to the air inlet block 1121; the two third air distribution blocks c are located on the side of the second air distribution block b facing away from the first air distribution block a and extend to the bottom of the corresponding test seat 120.

[0059] The direction of temperature-controlled gas flow is as follows Figure 7As shown by the middle arrow, after entering the first gas distribution block a through the air intake channel, the gas is divided into four paths. All four temperature-controlled gases enter the second gas distribution block b. Two of the temperature-controlled gases enter the blowing channels 123 of the two test seats 120 directly from the second gas distribution block b and are blown from the side of the test seats 120 towards the pit 121. The other two temperature-controlled gases enter the two third gas distribution blocks c from the second gas distribution block b respectively, and then enter the pit 121 from the bottom of the test seat 120 through the gas distribution channels in the third gas distribution block c.

[0060] The temperature-controlled test bench 100 and test device described above allow the temperature-controlled gas flowing along the gas supply channel 101 to enter the recess 121 from the bottom of the test base 120 through the air guide hole 1311 and the perforated groove 122, and then blow it toward the probe 125. This preheats the probe 125, allowing it to reach the target temperature ahead of time. When the preheated electronic component under test is placed in the recess 121 and comes into contact with the probe 125, the temperature difference between them is minimal, resulting in minimal heat transfer. Therefore, both the probe 125 and the electronic component under test can quickly reach the target temperature, ensuring high test accuracy. Furthermore, since only holes need to be drilled in the test base 120 and the test plate 130 to introduce the temperature-controlled gas from the bottom of the test base 120, without the need for a complex flow channel structure within the test base 120, it is also suitable for applications where the test base 120 is relatively thin.

[0061] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0062] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A temperature-controlled testing platform, characterized in that, include: The supporting mechanism has a gas supply channel through which temperature-controlled gas flows; The test socket is mounted on the support mechanism and has a recess for supporting the electronic component under test. The bottom wall of the recess has a hollowed-out groove. and A test plate is installed on the side of the test seat facing away from the recess. The test plate has an air guide hole, and the air supply channel is connected to the hollow groove through the air guide hole. The test stand is provided with multiple probes, which pass through the bottom wall of the recess, with one end of each probe extending into the recess and the other end extending to the test plate.

2. The temperature control testing platform according to claim 1, characterized in that, The support mechanism has a through hole, the test seat is installed at one end of the through hole, and a test groove for accommodating the electronic component under test is formed between the recess and the inner wall of the through hole.

3. The temperature control testing platform according to claim 2, characterized in that, The bearing mechanism includes a sealing ring disposed at the edge of the through hole away from the test seat and extending circumferentially along the through hole.

4. The temperature control testing platform according to claim 1, characterized in that, The supporting mechanism also forms an exhaust channel for temperature-controlled gas to flow through, and the exhaust channel is connected to the recess.

5. The temperature control testing bench according to claim 4, characterized in that, The interior of the test seat has an exhaust channel that is connected to the exhaust channel at one end, and the opening of the exhaust channel at the end away from the exhaust channel is located on the side wall of the recess.

6. The temperature control testing bench according to claim 4, characterized in that, The supporting mechanism includes a base and an air distribution assembly. The air distribution assembly is installed on the base, and the air supply channel and the exhaust channel are formed within the air distribution assembly.

7. The temperature control test bench according to claim 6, characterized in that, The air distribution assembly includes an air intake block, an air distribution block, and an exhaust block. The air intake block, the air distribution block, and the exhaust block each have an air intake channel, an air distribution channel, and an exhaust channel, respectively. The air intake channel and the air distribution channel are interconnected and together constitute the air supply channel. The air distribution channel is connected to the hollowed-out groove through the air guide hole.

8. The temperature control testing bench according to claim 7, characterized in that, The support mechanism is provided with at least two test seats. Temperature-controlled gas enters the gas supply channel through the gas inlet channel and is then distributed to each test seat by the gas distribution channel.

9. The temperature control testing bench according to claim 1, characterized in that, The test seat has an air blowing channel formed inside, one end of which is connected to the air supply channel. The opening of the air blowing channel at the end away from the air supply channel is located on the side wall of the recess.

10. A testing apparatus, characterized in that, Including the temperature control test bench as described in any one of claims 1 to 9 above.

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