Chip temperature test experiment platform device
By introducing an adjustable-speed exhaust fan and a throttling structure into the chip temperature testing experimental platform, the dew point of the test chamber and preheating chamber is rapidly reduced using low-dew-point dry gas. This solves the problem of low dew point reduction efficiency in existing technologies and achieves efficient dew point control and gas saving.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN HUAYUE AUTOMATION EQUIP CO LTD
- Filing Date
- 2025-05-06
- Publication Date
- 2026-05-08
AI Technical Summary
Existing chip temperature testing experimental platform devices are inefficient at reducing the dew point in the test chamber and preheating chamber, and consume a large amount of gas, which cannot meet the needs of rapidly reducing the dew point.
An adjustable exhaust fan is used to connect to the regulating chamber, which is connected to the test chamber and the preheating chamber. Low dew point dry gas is introduced through the first and second cold air inlets, and the gas flow is accelerated by the throttling structure to quickly reduce the dew point of the chamber.
It achieves rapid reduction of dew point in the test chamber and preheating chamber, improves dew point reduction efficiency, saves gas consumption, and ensures that the chip does not condense after testing.
Smart Images
Figure CN224216823U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip temperature testing technology, and in particular to a chip temperature testing experimental platform device. Background Technology
[0002] Currently, chip temperature testing platforms are generally used to test the performance of chips in cold environments. Existing chip temperature testing platforms include a main body with a test chamber and a pre-temperature chamber separated by a partition structure. The test chamber is used for temperature testing of the chip. The pre-temperature chamber is used to pre-cool the chip before low-temperature testing. Specifically, during low-temperature testing, the chip is first placed in the pre-temperature chamber to pre-cool it to a preset temperature range. Then, the chip is sent to the test chamber for low-temperature testing, and after the test, the chip is removed from the test chamber. During low-temperature testing, it is necessary to lower the dew point of the chip testing environment. Currently, this is generally achieved by introducing dry compressed air below the required dew point into the test chamber and pre-temperature chamber to continuously reduce the moisture content in the environment. However, this method has low dew point reduction efficiency and consumes a large amount of air, requiring a solution. Utility Model Content
[0003] In view of this, the present invention provides a chip temperature testing experimental platform device, the main technical problem to be solved is: how to improve the efficiency of dew point reduction in the testing chamber and the preheating chamber.
[0004] To achieve the above objectives, this utility model mainly provides the following technical solutions:
[0005] An embodiment of this utility model provides a chip temperature testing experimental platform device, which includes a body, the body having a test chamber, a preheating chamber and an adjustment chamber separated by a partition structure;
[0006] The test chamber is used for temperature testing of the chip;
[0007] The pre-cooling chamber is used to pre-cool the chip when it is being tested at low temperatures.
[0008] The regulating chamber is connected to the outside of the machine body through an exhaust fan, which is an adjustable speed exhaust fan;
[0009] The test chamber is connected to the preheating chamber, the preheating chamber is connected to the regulating chamber, the test chamber is provided with a first cold air inlet, and the preheating chamber is provided with a second cold air inlet.
[0010] Preferably, the partition structure includes a partition plate, which divides the interior of the machine body into a test chamber, a preheating chamber, and a regulating chamber.
[0011] Preferably, the partition includes a first partition for separating the test chamber and the preheating chamber; the machine body includes a machine platform and a first outer cover; the first outer cover covers the machine platform, and a first chamber is formed between the two; the first partition is located above the machine platform, the first partition is located inside the first chamber, and the first chamber is divided into the test chamber and the preheating chamber;
[0012] The first partition has a first gap between itself and the machine platform, so that the test chamber and the preheating chamber can be connected through the first gap; the first cold air inlet and the second cold air inlet are both located on the machine platform and both face upwards.
[0013] Preferably, the machine body further includes a second outer cover, which covers the side of the machine platform opposite to the first outer cover, and the two form the adjustment chamber;
[0014] The machine base is provided with ventilation holes that extend through both sides, and the preheating chamber and the regulating chamber are connected through the ventilation holes.
[0015] Preferably, the first cold air inlet is provided with a first throttling structure to throttle the gas flowing into the test chamber; and / or, the second cold air inlet is provided with a second throttling structure to throttle the gas flowing into the preheating chamber.
[0016] Preferably, the first throttling structure is a first air distribution block disposed at the first cold air inlet; and / or, the second throttling structure is a second air distribution block disposed at the second cold air inlet.
[0017] Preferably, the chip temperature testing experimental platform device further includes a conveying mechanism and a temperature sensor. The conveying mechanism is used to send the chip out of the test chamber, and the temperature sensor is disposed in the test chamber and is used to detect the chip temperature in the test chamber.
[0018] The conveying mechanism is equipped with a heating device, which is used to heat the chips on the conveying mechanism.
[0019] Preferably, the conveying mechanism includes a driving mechanism and a slider, the slider being used to provide support for the chip, and the driving mechanism being used to drive the slider to move so as to deliver the chip out of the test chamber via the slider;
[0020] The heating device is disposed on the slider and is used to heat the slider so as to heat the chip through the slider.
[0021] By employing the above technical solution, the chip temperature testing experimental platform device of this utility model has at least the following beneficial effects:
[0022] 1. When it is necessary to lower the ambient temperature of the test chamber and pre-temperature chamber for low-temperature testing of the chip, low-dew-point dry gas can be introduced into the test chamber through the first cold air inlet and into the pre-temperature chamber through the second cold air inlet. The regulating chamber is a room-temperature chamber. Turning on the exhaust fan can accelerate the airflow from the test chamber to the pre-temperature chamber, and from the pre-temperature chamber to the regulating chamber. As low-dew-point dry gas is continuously introduced into the test chamber and pre-temperature chamber through both the first and second cold air inlets, the dew point in both chambers will rapidly decrease to reach the required dew point, thereby improving the efficiency of dew point reduction in the test chamber and pre-temperature chamber.
[0023] 2. When the chip is being tested for temperature in the test chamber, the temperature sensor records the chip's temperature. After the test is completed, when the conveyor sends the chip out of the test chamber, the industrial control computer can calculate the operating power of the heating device required for the chip to return to the preset temperature based on the data collected by the temperature sensor. This allows the computer to control the output power of the heating device, ensuring that the chip reaches the required temperature within a set time and preventing condensation after the chip is removed from the test chamber.
[0024] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description
[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0026] Figure 1 This is a schematic diagram of the structure of a chip temperature testing experimental platform device provided in one embodiment of the present invention;
[0027] Figure 2 yes Figure 1 Schematic diagram of the internal structure of the chip temperature testing experimental platform device;
[0028] Figure 3 yes Figure 1 A simplified structural diagram of the chip temperature testing experimental platform device;
[0029] Figure 4 This is an assembly diagram of a drive mechanism and a slider provided in one embodiment of the present invention.
[0030] Reference numerals: 1. Body; 3. Test chamber; 4. Preheating chamber; 5. Adjustment chamber; 6. Exhaust fan; 7. Second outer cover; 8. First air distribution block; 9. Second air distribution block; 10. Drive mechanism; 11. Slider; 12. Heating device; 21. Machine base; 22. First outer cover; 23. First partition; 101. First cold air inlet; 102. Second cold air inlet; 211. First gap; 212. Vent. Detailed Implementation
[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0032] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.
[0033] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0034] like Figure 1-3As shown in the figure, an embodiment of this utility model discloses a chip temperature testing experimental platform device, which includes a body 1. The body 1 has a test chamber 3, a pre-temperature chamber 4, and an adjustment chamber 5 separated by a partition structure. The test chamber 3 is used to perform temperature testing on the chip. The specific structure of the test chamber 3 for chip temperature testing is prior art and will not be described in detail here. The pre-temperature chamber 4 is used to pre-cool the chip when performing low-temperature testing. A cooling plate or similar device can be used to pre-cool the chip. The specific pre-cooling method is a common technique in the prior art and will not be described in detail here.
[0035] The aforementioned regulating chamber 5 is connected to the outside of the machine body 1 via an exhaust fan 6. The exhaust fan 6 is an adjustable speed exhaust fan. The test chamber 3 is connected to the preheating chamber 4, and the preheating chamber 4 is connected to the regulating chamber 5. The test chamber 3 is equipped with a first cold air inlet 101, and the preheating chamber 4 is equipped with a second cold air inlet 102.
[0036] In the above example, when it is necessary to lower the ambient temperature of the test chamber 3 and the pre-temperature chamber 4 for low-temperature testing of the chip, low-dew-point dry gas can be introduced into the test chamber 3 through the first cold air inlet 101 and into the pre-temperature chamber 4 through the second cold air inlet 102. The aforementioned regulating chamber 5 is a normal temperature chamber. Turning on the exhaust fan 6 can accelerate the airflow from the test chamber 3 to the pre-temperature chamber 4, and from the pre-temperature chamber 4 to the regulating chamber 5. As the first cold air inlet 101 and the second cold air inlet 102 continuously input low-dew-point dry gas into the test chamber 3 and the pre-temperature chamber 4, the dew point in both the test chamber 3 and the pre-temperature chamber 4 will be rapidly reduced to reach the required dew point, thereby improving the efficiency of dew point reduction in the test chamber 3 and the pre-temperature chamber 4.
[0037] In some implementations, such as Figure 3 As shown, the aforementioned partition structure may include a partition plate, which divides the interior of the machine body 1 into the aforementioned test chamber 3, preheating chamber 4, and regulating chamber 5. The partition plate includes a first partition plate 23 for separating the test chamber 3 and the preheating chamber 4. The machine body 1 includes a machine base 21 and a first outer cover 22. The first outer cover 22 may be composed of multiple panels joined together. The first outer cover 22 covers the machine base 21, forming a first chamber between them. The first partition plate 23 is located within the first chamber and divides the first chamber into the aforementioned test chamber 3 and preheating chamber 4. The first partition plate 23 is located above the machine base 21, and a first gap 211 exists between the first partition plate 23 and the machine base 21, allowing the test chamber 3 and the preheating chamber 4 to communicate through the first gap 211. The aforementioned first cold air inlet 101 and second cold air inlet 102 are both located on the machine base 21 and both face upwards.
[0038] In the above example, both the first cold air inlet 101 and the second cold air inlet 102 are upward-facing to facilitate the blowing of cold air to the upper parts of the test chamber 3 and the preheating chamber 4. This allows the low-dew-point dry air to push the room-temperature air in the chamber to the lower part of the chamber. After the room-temperature air in the test chamber 3 flows to the lower part, it flows into the preheating chamber 4 through the first gap 211. The preheating chamber 4 is connected to the regulating chamber 5 through its bottom. After the room-temperature air in the preheating chamber 4 is pushed to the lower part, it flows into the regulating chamber 5 from the bottom. This facilitates the flow of air between the two adjacent chambers, which helps to quickly reduce the dew point and achieve the required dew point.
[0039] In some implementations, such as Figure 3 As shown, the aforementioned first cold air inlet 101 is located on the side of the test chamber 3 away from the first partition 23, so as to facilitate the exhaust of all the room temperature air in the test chamber 3 into the preheating chamber 4.
[0040] In some implementations, such as Figure 3 As shown, the aforementioned machine body 1 also includes a second outer cover 7, which covers the side of the machine base 21 opposite to the first outer cover 22, and the two form the aforementioned adjustment chamber 5. The second outer cover 7 can be assembled from multiple plates. The machine base 21 is provided with ventilation holes 212 that penetrate both sides, and the preheating chamber 4 and the adjustment chamber 5 are connected through the ventilation holes 212.
[0041] In the above example, by setting the adjustment chamber 5 on the side of the machine tool 21 away from the preheating chamber 4, it is beneficial to make full use of the space in the height direction of the machine tool 21 and save volume.
[0042] In some implementations, such as Figure 3 As shown, the aforementioned second cold air inlet 102 is positioned close to the first partition 23 relative to the vent 212, which facilitates the complete discharge of the room temperature air in the preheating chamber 4 into the regulating chamber 5.
[0043] In some implementations, such as Figure 3 As shown, a first throttling structure can be provided at the aforementioned first cold air inlet 101 to throttle the gas flowing into the test chamber. Throttling can further reduce the temperature of the input gas, which is beneficial for rapidly lowering the dew point of the environment within the test chamber. In a specific application example, the aforementioned first throttling structure can be a first gas distribution block 8 located at the first cold air inlet 101.
[0044] In some implementations, such as Figure 3As shown, a second throttling structure can be provided at the aforementioned second cold air inlet 102 to throttle the gas flowing into the preheating chamber 4. Throttling can further reduce the temperature of the input gas, which is beneficial for rapidly lowering the dew point of the environment within the preheating chamber 4. In a specific application example, the aforementioned second throttling structure can be a second gas distribution block 9 located at the second cold air inlet 102.
[0045] In some embodiments, the aforementioned chip temperature testing experimental platform apparatus further includes a conveying mechanism and a temperature sensor. The conveying mechanism is used to deliver the chip from the test chamber 3 to the test chamber 3, and the temperature sensor is disposed inside the test chamber 3 to detect the chip temperature inside the test chamber 3. A heating device 12 is provided on the conveying mechanism to heat the chip on the conveying mechanism.
[0046] In the above example, when the chip is being tested for temperature in the test chamber 3, the temperature sensor can record the chip's temperature. After the test is completed, when the conveying mechanism sends the chip out of the test chamber 3, the industrial control computer can calculate the operating power of the heating device 12 required for the chip to return to the preset temperature based on the data collected by the temperature sensor, and thus control the output power of the heating device 12 to ensure that the chip reaches the required temperature for return within a set time, preventing condensation after the chip is output from the test chamber 3.
[0047] To achieve the aforementioned function of the conveying mechanism, in some implementations, such as Figure 4 As shown, the aforementioned conveying mechanism may include a drive mechanism 10 and a slider 11, the slider 11 being used to provide support for the chip. The drive mechanism 10 is used to drive the slider 11 to move, so as to deliver the chip out of the test chamber 3 via the slider 11. The aforementioned heating device 12 is disposed on the slider 11, and the heating device 12 is used to heat the slider 11, so as to heat the chip via the slider 11.
[0048] In the above example, the drive mechanism 10 may include a motor to drive the slider 11 to move. The aforementioned heating device 12 may be an electric heating wire or the like, and the heating device 12 may be disposed inside the slider 11, which may be made of a metal material.
[0049] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.
Claims
1. A chip temperature testing experimental platform device, characterized in that, Includes a body (1), which has a test chamber (3), a preheating chamber (4) and a regulating chamber (5) separated by a partition structure; The test chamber (3) is used to perform temperature testing on the chip; The pre-cooling chamber (4) is used to pre-cool the chip when performing low-temperature testing on the chip; The regulating chamber (5) is connected to the outside of the machine body (1) through an exhaust fan (6), and the exhaust fan (6) is an exhaust fan with adjustable speed; The test chamber (3) is connected to the preheating chamber (4), the preheating chamber (4) is connected to the regulating chamber (5), the test chamber (3) is provided with a first cold air inlet (101), and the preheating chamber (4) is provided with a second cold air inlet (102).
2. The chip temperature testing experimental platform device as described in claim 1, characterized in that, The partition structure includes a partition plate, which divides the interior of the machine body (1) into a test chamber (3), a preheating chamber (4), and an adjustment chamber (5).
3. The chip temperature testing experimental platform device as described in claim 2, characterized in that, The partition includes a first partition (23) for separating the test chamber (3) and the preheating chamber (4); the body (1) includes a machine base (21) and a first outer cover (22); the first outer cover (22) covers the machine base (21) and forms a first chamber between the two; the first partition (23) is located above the machine base (21), the first partition (23) is located inside the first chamber, and divides the first chamber into the test chamber (3) and the preheating chamber (4); The first partition (23) and the machine base (21) have a first gap (211) so that the test chamber (3) and the preheating chamber (4) are connected through the first gap (211); the first cold air inlet (101) and the second cold air inlet (102) are both located on the machine base (21) and are both facing upwards.
4. The chip temperature testing experimental platform device as described in claim 3, characterized in that, The machine body (1) also includes a second outer cover (7), which covers the side of the machine base (21) away from the first outer cover (22) and forms the adjustment chamber (5) between the two. The machine base (21) is provided with ventilation holes (212) that run through both sides, and the preheating chamber (4) and the regulating chamber (5) are connected through the ventilation holes (212).
5. The chip temperature testing experimental platform apparatus as described in any one of claims 1-4, characterized in that, The first cold air inlet (101) is provided with a first throttling structure to throttle the gas flowing into the test chamber; and / or, the second cold air inlet (102) is provided with a second throttling structure to throttle the gas flowing into the preheating chamber (4).
6. The chip temperature testing experimental platform device as described in claim 5, characterized in that, The first throttling structure is a first gas distribution block (8) disposed at the first cold air inlet (101); and / or, the second throttling structure is a second gas distribution block (9) disposed at the second cold air inlet (102).
7. The chip temperature testing experimental platform apparatus as described in any one of claims 1-4 and 6, characterized in that, It also includes a conveying mechanism and a temperature sensor. The conveying mechanism is used to send the chip out of the test chamber (3). The temperature sensor is disposed in the test chamber (3) and is used to detect the chip temperature in the test chamber (3). The conveying mechanism is equipped with a heating device (12), which is used to heat the chip on the conveying mechanism.
8. The chip temperature testing experimental platform device as described in claim 7, characterized in that, The conveying mechanism includes a drive mechanism (10) and a slider (11). The slider (11) is used to provide support for the chip, and the drive mechanism (10) is used to drive the slider (11) to move so as to send the chip out of the test chamber (3) through the slider (11). The heating device (12) is disposed on the slider (11) and is used to heat the slider (11) so as to heat the chip through the slider (11).