Multilayer combined keyboard backlight module

Abstract

The utility model relates to the field of keyboards, in particular to a multi-layer combined keyboard backlight module. The backlight module comprises a circuit board and key caps, a light-emitting chip is installed on the circuit board, a reflecting layer and packaging layers are printed on the board surface of the circuit board, the reflecting layer and the light-emitting chip are wrapped between the circuit board and the packaging layers, and a shading layer is arranged between every two adjacent packaging layers. According to the utility model, the packaging of the light-emitting chip is completed through the printing packaging layer, and the area corresponding to the keycap is synchronously covered; and meanwhile, the shading layer is printed at the gap position between the packaging areas, so that the situation that the thickness of a product is increased due to the use of the light guide sheet and the shading sheet is avoided.

Description

Technical Field

[0001] This utility model relates to the field of keyboards, and in particular to a multi-layer composite keyboard backlight module. Background Technology

[0002] With the development of electronic products, users have increasingly higher requirements for the appearance and functionality of keyboards. As an important function to enhance the keyboard user experience, the keyboard backlight module can help users easily identify key characters in low-light environments. At the same time, the keyboard backlight module is required to have colorful light changes to enhance the visual effect of the keyboard.

[0003] Existing keyboard backlight modules use light-emitting chips as the light source. Although they can achieve colorful light changes, they need to be paired with light guides to make the keycap area light up. At the same time, light shields are placed on the light guides to prevent the area between the keycaps from lighting up.

[0004] The addition of light guides and light shields increases the product's thickness and weight. Utility Model Content

[0005] The technical problem this invention aims to solve is: to address the technical problems described in the background section, this invention provides a multi-layer combined keyboard backlight module. The light-emitting chip is encapsulated through a printed encapsulation layer, simultaneously covering the area corresponding to the keycaps; at the same time, a light-shielding layer is printed in the gaps between the encapsulation areas, thereby avoiding the increase in product thickness due to the use of light guide sheets and light-shielding sheets.

[0006] The technical solution adopted by this utility model to solve its technical problem is:

[0007] A multi-layer composite keyboard backlight module includes a circuit board and keycaps. A light-emitting chip is mounted on the circuit board. A reflective layer and an encapsulation layer are printed on the surface of the circuit board. The reflective layer and the light-emitting chip are wrapped between the circuit board and the encapsulation layer. A light-shielding layer is provided between adjacent encapsulation layers.

[0008] Specifically, the circuit board is fixed with pads, and the light-emitting chip is provided with P-type semiconductor electrodes and N-type semiconductor electrodes. The P-type semiconductor electrodes and N-type semiconductor electrodes are respectively soldered on different pads, and the P-type semiconductor electrodes and N-type semiconductor electrodes face the circuit board below.

[0009] Specifically, the reflective layer is a white ink layer.

[0010] Specifically, the encapsulation layer is a resin layer or a silicone layer.

[0011] Specifically, the light-shielding layer is a light-shielding ink layer.

[0012] Specifically, a separate encapsulation layer is located directly beneath the keycap.

[0013] The beneficial effects of this utility model are as follows: This utility model provides a multi-layer combined keyboard backlight module. The light-emitting chip is encapsulated through a printed encapsulation layer, simultaneously covering the area corresponding to the keycap; at the same time, a light-shielding layer is printed in the gap between the encapsulation areas, thereby avoiding the increase in product thickness due to the use of light guide sheets and light-shielding sheets. Attached Figure Description

[0014] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] In the diagram: 2. Circuit board, 3. Reflective layer, 4. Light-emitting chip, 5. Encapsulation layer, 6. Light-shielding layer, 7. Keycap.

[0017] 21. Pad, 41. P-type semiconductor electrode, 42. N-type semiconductor electrode. Detailed Implementation

[0018] The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, illustrating only the basic structure of the present invention, and therefore only show the components relevant to the present invention.

[0019] Figure 1 This is a schematic diagram of the structure of this utility model.

[0020] As attached Figure 1 As shown, a multi-layer combined keyboard backlight module includes a circuit board 2 and keycaps 7. A light-emitting chip 4 is installed on the circuit board 2. A reflective layer 3 and an encapsulation layer 5 are printed on the surface of the circuit board 2. The reflective layer 3 and the light-emitting chip 4 are wrapped between the circuit board 2 and the encapsulation layer 5. A light-shielding layer 6 is provided between adjacent encapsulation layers 5.

[0021] When the light-emitting chip 4 emits light, the light will shine out from the area between the two light-shielding layers 6, providing illumination for the keycap 7.

[0022] The circuit board 2 is fixed with pads 21. The light-emitting chip 4 is provided with P-type semiconductor electrode 41 and N-type semiconductor electrode 42. The P-type semiconductor electrode 41 and N-type semiconductor electrode 42 are respectively soldered on different pads 21. The P-type semiconductor electrode 41 and N-type semiconductor electrode 42 face the circuit board 2 downward.

[0023] The reflective layer 3 is a white ink layer. White ink has good light reflection properties and can reflect the light emitted by the light-emitting chip 4.

[0024] Encapsulation layer 5 is a resin layer or a silicone layer.

[0025] The light-shielding layer 6 is a light-shielding ink layer. The light-shielding layer 6 is used to block light and prevent halos or stray light from being generated in areas of the keyboard where light is not needed, thereby making the light output of the keycaps 7 more uniform.

[0026] The encapsulation layer 5, the reflective layer 3, and the light-shielding layer 6 are combined to propagate and reflect light, achieving uniform light emission in the keycap area 7.

[0027] There is a separate encapsulation layer 5 directly below the keycap 7.

[0028] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A multi-layer composite keyboard backlight module, comprising a circuit board (2) and keycaps (7), characterized in that, A light-emitting chip (4) is installed on the circuit board (2). A reflective layer (3) and an encapsulation layer (5) are printed on the surface of the circuit board (2). The reflective layer (3) and the light-emitting chip (4) are wrapped between the circuit board (2) and the encapsulation layer (5). A light-shielding layer (6) is provided between adjacent encapsulation layers (5).

2. The multi-layer combined keyboard backlight module according to claim 1, characterized in that: The circuit board (2) is fixed with pads (21), and the light-emitting chip (4) is provided with a P-type semiconductor electrode (41) and an N-type semiconductor electrode (42). The P-type semiconductor electrode (41) and the N-type semiconductor electrode (42) are respectively soldered on different pads (21), and the P-type semiconductor electrode (41) and the N-type semiconductor electrode (42) face the circuit board (2) downward.

3. The multi-layer combined keyboard backlight module according to claim 1, characterized in that: The reflective layer (3) is a white ink layer.

4. The multi-layer combined keyboard backlight module according to claim 1, characterized in that: The encapsulation layer (5) is a resin layer or a silicone layer.

5. The multi-layer combined keyboard backlight module according to claim 1, characterized in that: The light-shielding layer (6) is a light-shielding ink layer.

6. The multi-layer combined keyboard backlight module according to claim 1, characterized in that: A separate encapsulation layer (5) is located directly below the keycap (7).

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