Frame type packaging structure comprising passive element

Abstract

The utility model provides a frame type packaging structure comprising a passive element, the frame type packaging structure comprises an LGA packaging body, an integrated circuit chip and a metal frame, the LGA packaging body is configured to comprise a passive element and a substrate, a substrate bonding pad is configured on one surface of the substrate, and the passive element is arranged on the substrate bonding pad. The passive element is configured to be adhered to the surface, opposite to the substrate bonding pad, of the substrate; the LGA packaging body and the integrated circuit chip are configured to be pasted on the frame carrier, and a substrate bonding pad of the LGA and a bonding pad of the integrated circuit chip are arranged in a face-up mode; and the substrate bonding pad, the bonding pad of the integrated circuit chip and the frame pin are interconnected through a routing process.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a frame-type packaging structure containing passive components. Background Technology

[0002] The primary purpose of chip packaging is to expose the internal functional signals of the chip, enabling communication with the outside world, while also providing fixation, sealing, and protection for the chip. Packaging technologies and types are diverse. Based on the type of chip carrier, they can be divided into frame-based packaging and substrate-based packaging. Frame-based packaging forms mainly include Small Outline Package (SOP), Quad Flat Package (QFP), and Quad Flat No-lead Package (QFN), while substrate-based packaging forms mainly include Land Grid Array (LGA), Ball Grid Array Package (BGA), and Pin Grid Array (PGA). Frame-based packaging has a simple manufacturing process, lower production cost, and a wide range of applications, from low-end to high-end electronic products. Substrate-based packaging has higher integration, more complex manufacturing processes, and higher production costs, and is mainly used in electronic products with more complex functions.

[0003] Passive components are common electronic components and an important class of microwave and radio frequency devices. Passive components are those that can exhibit their characteristics without an external power supply, and are mainly classified into resistors, inductors, and capacitors. These passive components typically use ceramic packages with solder faces at both ends. The metal forming these solder faces can be tin, and surface mount technology (SMT) is used to solder the solder faces of the passive component to the pads on the PCB board. Because the solder faces of passive components are small, both solder reliability and short circuit prevention must be considered when connecting the passive component to the outside world. This requires the carrier for soldering the passive component to have precise openings. Therefore, only carriers with precise openings on the surface, such as substrates, can be packaged with passive components. This results in passive components usually being packaged with the substrate and rarely with the frame.

[0004] However, for some frame-packaged products, if the number of passive components such as capacitors, resistors, and inductors integrated inside the integrated circuit chip is insufficient, or if some special passive components are required, it is necessary to package the integrated circuit chip and passive components on a frame carrier. How to achieve the interconnection between the integrated circuit chip and the passive components becomes a key issue. Because the shell of the passive components is made of ceramic, the solder face is made of tin, and the soldering area is small, direct wire bonding interconnection between the integrated circuit chip and the passive components is not possible. Therefore, it is necessary to explore a packaging structure that enables the interconnection between the integrated circuit chip and the passive components and encapsulates them onto a frame carrier. Utility Model Content

[0005] One aspect of this invention proposes a frame-like packaging structure containing passive components. By encapsulating the passive components on a substrate carrier to form an LGA package, the LGA package pads are then attached to a frame with the LGA package pads facing upwards. Simultaneously, an integrated circuit chip is attached to the frame. Because the LGA package pads are suitable for wire bonding, the LGA pads and chip pads can be connected via wire bonding, thereby achieving co-encapsulation of the integrated circuit chip and passive components onto the frame carrier.

[0006] According to one aspect of the present invention, a frame-type package structure including passive components is provided, comprising an LGA package, an integrated circuit chip, and a metal frame, wherein the LGA package is configured to include passive components and a substrate, a substrate pad is disposed on one surface of the substrate, and the passive component is configured to be attached to the surface of the substrate opposite to the substrate pad; the metal frame includes a frame carrier and frame pins; the LGA package and the integrated circuit chip are configured to be attached to the frame carrier, wherein the substrate pads of the LGA and the pads of the integrated circuit chip are arranged facing upwards; the substrate pads, the pads of the integrated circuit chip, and the frame pins are interconnected by a wire bonding process.

[0007] According to one aspect of the present invention, a frame-like packaging structure including a passive component is provided, wherein the passive component includes a solder end face, and the substrate includes a through hole, through which the solder end face and the substrate pad are connected.

[0008] According to one aspect of the present invention, a frame-like packaging structure including passive components is provided, wherein the area of ​​the substrate pads is configured to be larger than the area of ​​the solder end face.

[0009] According to one aspect of the present invention, a frame-type package structure including passive components is provided, wherein the LGA package further includes a plastic encapsulation shell disposed on the surface of a substrate opposite to the substrate pads to cover the package shell of the passive components.

[0010] According to one aspect of the present invention, a frame-type package structure including passive components is provided, wherein the passive components are attached to the surface of a substrate opposite to the substrate pads by surface mount technology, and wherein the LGA package and the integrated circuit chip are attached to the frame carrier by adhesive.

[0011] According to one aspect of the present invention, a frame-like package structure including passive components is provided, wherein the frame-like package structure further includes a protective housing configured as epoxy molding compound to cover the frame carrier and to be connected to the outside via frame pins.

[0012] According to one aspect of the present invention, a frame-like encapsulation structure including passive components is provided, wherein the frame carrier is configured as a copper frame carrier.

[0013] According to one aspect of the present invention, a frame-like package structure including passive components is provided, wherein the frame-like package structure includes a QFN package.

[0014] According to one aspect of the present invention, a frame-like packaging structure including passive components is provided, wherein the welding end face is a tin-welded end face.

[0015] According to one aspect of the present invention, a frame-type package structure including passive components is provided, wherein the substrate pads are configured as electroless nickel-palladium-gold plated pads, wherein the thickness of nickel is 0.3~0.5um, the thickness of palladium is at least 0.1um, and the thickness of gold is at least 0.1um. Attached Figure Description

[0016] Figure 1 This is a schematic diagram showing the external shape of a passive element according to an embodiment of the present invention;

[0017] Figure 2 This is a schematic diagram illustrating the welding process between a passive component and a substrate according to an embodiment of the present invention;

[0018] Figure 3 This is a schematic diagram showing the external shape of an LGA package formed after the passive component and substrate are packaged according to an embodiment of the present invention;

[0019] Figure 4 This shows a cross-sectional view of the LGA package along AA according to an embodiment of the present invention;

[0020] Figure 5 This is a schematic diagram showing an integrated circuit chip and an LGA-packaged passive component being simultaneously attached to a metal frame according to an embodiment of the present invention.

[0021] Figure 6 This is a schematic diagram showing the external shape of a QFN package according to an embodiment of the present invention;

[0022] Figure 7 This is a schematic diagram illustrating the process of encapsulating an integrated circuit chip and passive components into a frame according to an embodiment of the present invention. Detailed Implementation

[0023] Before proceeding with the detailed description below, it may be advantageous to define certain words and phrases used throughout this utility model document. The terms “coupled,” “connected,” and their derivatives refer to any direct or indirect communication between two or more elements, regardless of whether those elements are physically in contact with each other. The terms “transmit,” “receive,” and “communicate,” and their derivatives cover both direct and indirect communication. The terms “comprising” and “including,” and their derivatives refer to, but are not limited to, those including, those including, those including. The term “or” is inclusive, meaning and / or. The phrase “associated with,” and its derivatives refer to, including, being contained within, interconnected, containing, being included in, connected or connected to, coupled or coupled to, communicating with, cooperating, intertwined, juxtaposed, proximate, bound or bound to, having, having attributes, having a relationship or being related to, etc. The term “controller” refers to any device, system, or part thereof that controls at least one operation. Such a controller may be implemented in hardware, or a combination of hardware and software and / or firmware. The functionality associated with any particular controller may be centralized or distributed, local or remote. The phrase "at least one" when used with a list of items means that different combinations of one or more of the listed items may be used, and that only one item from the list may be required. For example, "at least one of A, B, and C" includes any of the following combinations: A, B, C, A and B, A and C, B and C, A and B and C.

[0024] Definitions of other specific words and phrases are provided throughout this utility model document. Those skilled in the art will understand that, in many cases, if not most, such definitions apply to the prior and future use of the words and phrases thus defined.

[0025] In this utility model document, the application combination of circuit blocks and the division of sub-circuit blocks are for illustrative purposes only. Without departing from the scope of this disclosure, the application combination of circuit blocks and the division of sub-circuit blocks can be done in different ways.

[0026] The following discussion Figures 1 to 7 The various embodiments described in this utility model document are for illustrative purposes only and should not be construed as limiting the scope of this disclosure in any way. Those skilled in the art will understand that the principles of this disclosure can be implemented in any suitably arranged system or device.

[0027] Figure 1 This is a schematic diagram showing the external shape of a passive element according to an embodiment of the present invention.

[0028] refer to Figure 1 The passive component includes a package housing 1 and solder facets 2, wherein the solder facets 2 are disposed at both ends of one surface of the package housing 1. According to an embodiment of the present invention, the passive component is configured as a ceramic package, wherein the package housing 1 can be configured as a ceramic housing, and the solder facets 2 are configured as metal solder facets, including tin solder facets. Those skilled in the art should understand that the solder facets 2 can have multiple ports, configured according to the properties of the passive component. For example, the solder facets of the passive component can be located on both sides of the package body; the solder facets can be disposed on the same surface (e.g., the bottom surface); the solder facets can be disposed on two surfaces of the package body (e.g., the bottom surface and one side surface); or the solder facets can be disposed on five surfaces of the package body (e.g., the bottom surface and four side surfaces).

[0029] Figure 2 This is a schematic diagram illustrating the welding process between a passive component and a substrate according to an embodiment of the present invention.

[0030] refer to Figure 2 The substrate 3 is configured to include substrate pads 4, which are positioned corresponding to the soldering end face 2 of the passive component. The passive component is fixed to the substrate 3 by bonding the soldering end face 2 to the surface opposite to the substrate pads 4. According to an embodiment of the present invention, the substrate 3 is configured with two substrates, each 150 μm thick. The metal surface of the substrate (substrate pads 4) is treated with electroless nickel-palladium-gold plating, wherein the thickness of nickel is 0.3~0.5 μm, the thickness of palladium is at least 0.1 μm, and the thickness of gold is at least 0.1 μm. Different surfaces of the substrate 3 are connected via through-holes 6. Preferably, the area of ​​the substrate 3 is configured to be larger than the area of ​​the surface of the passive component having the soldering end face 2. According to an embodiment of the present invention, the passive component can be soldered onto the substrate using surface mount technology (SMT). Those skilled in the art should understand that the substrate 3 can also be configured as a substrate with other layers, such as a four-layer board, a six-layer board, etc., depending on the number of copper layers inside. In the substrate, different copper layers are connected through vias to conduct electrical signals.

[0031] Figure 3 This is a schematic diagram showing the external shape of an LGA package formed after the passive component and substrate are packaged according to an embodiment of the present invention. Figure 4 This is a cross-sectional view of the LGA package along AA according to an embodiment of the present invention.

[0032] refer to Figure 3 An LGA package is formed by forming a molding compound 5 around the passive component. The molding compound 5 is configured to be formed using epoxy resin. Preferably, the molding compound 5 is disposed on the surface of the substrate 3 to cover the package housing 1 of the passive component. The pads (substrate pads 4) of the LGA package are treated with a surface treatment to be electroless nickel-palladium-gold plated pads.

[0033] The substrate pads 4 of the substrate 3 are disposed on the surface opposite to the solder end face 2, and the substrate pads 4 and the solder end face 2 are connected through through holes 6. By distributing the external pads 4 to be larger than the area of ​​the solder end face 2, the area of ​​the solder end face 2 connected to the outside can be effectively increased to facilitate interconnection with the outside through wire bonding process.

[0034] Figure 5 This is a schematic diagram showing the simultaneous attachment of an integrated circuit chip and the passive component of an LGA package to a metal frame according to an embodiment of the present invention.

[0035] refer to Figure 5 The metal frame includes a copper frame carrier 8 and frame pins 9. An integrated circuit chip 7 and an LGA package are configured to be bonded to the upper surface of the copper frame carrier 8, wherein the pads of the integrated circuit chip 7 and the substrate pads 4 of the LGA package are arranged facing upwards. The copper frame pins 9 are disposed around the copper frame carrier 8 and are connected to the pads of the integrated circuit chip 7, the external pads 4, and the copper frame pins 9 via a wire bonding process. According to an embodiment of the present invention, the LGA package and the integrated circuit chip are bonded to the copper frame carrier 8 using adhesive (e.g., silver paste). According to an embodiment of the present invention, the pads of the integrated circuit chip 7, the external pads 4, and the copper frame pins 9 are connected via a wire bonding process including ultrasonic thermoforming. According to an embodiment of the present invention, the copper frame pins 9 include pins P1-P20; however, those skilled in the art should understand that the frame-type package structure according to the embodiments of the present invention can have different numbers of pins. Those skilled in the art should understand that although in Figure 5 In the example shown, the metal frame includes a copper frame carrier 8 and copper frame pins 9, but the metal frame can also be formed using other types of metal frames.

[0036] According to an embodiment of this utility model, the metal frame is formed by stamping copper foil. After stamping, the copper foil is configured in a hollow shape. The portion for carrying the chip is configured as the frame carrier, and the portion for connecting to the outside (or to wire bonding) is configured as the frame pins. The frame carrier and the frame pins are connected by metal ribs, wherein the metal ribs are configured to be removed in a subsequent step after the chip bonding process. For example, they can be removed after packaging.

[0037] Figure 6 This is a schematic diagram showing the external shape of a QFN package according to an embodiment of the present invention.

[0038] refer to Figure 6 A QFN package is formed by injection molding over a copper frame carrier 8. For example, the metal frame is placed into a specific mold, and a fluid molding compound is injected from the mold's injection port to cover the metal frame for curing. The molding compound is configured to cover the metal frame from above, so that the metal surfaces of the metal frame (i.e., the frame carrier and frame leads) are exposed after cutting. According to an embodiment of the present invention, a protective housing is formed by injection molding using epoxy molding compound (EMC) to secure the frame carrier and frame leads. Furthermore, a single QFN package is formed by cutting the metal frame, wherein the cut is performed at positions corresponding to the frame leads to form L-shaped frame leads. According to an embodiment of the present invention, the QFN package has an external dimension of 4×4×0.85mm, and internally encapsulates an integrated circuit chip and a passive component (e.g., an inductor). The integrated circuit chip is 1.8×1.2×0.2mm in size, and the original size of the inductor is 1.0×0.5×0.5mm. The chip and the inductor are interconnected by a wire bonding process using 20um gold-palladium-copper wires.

[0039] According to embodiments of this invention, the resulting QFN package is a general-purpose package that can be placed in a common fixture for testing and can also be attached to a PCB board to realize the functionality of the entire package. Embodiments of this invention achieve a frame-like package structure that encapsulates the integrated circuit chip and external passive components onto a frame. Those skilled in the art should understand that the QFN package is merely an example, and other types of packages can be used without departing from the scope of this invention.

[0040] Figure 7 This is a schematic diagram illustrating a process for encapsulating an integrated circuit chip and passive components into a frame according to an embodiment of the present invention.

[0041] refer to Figure 7In step S701, a double-layer substrate 3 is formed, and substrate pads 4 are disposed on one surface of the double-layer substrate 3. The substrate 3 is configured as a double-layer substrate with a thickness of 150 μm. The metal surface of the substrate (substrate pads 4) is surface-treated to be electroless nickel-palladium-gold plated pads, with a nickel thickness of 0.3~0.5 μm, a palladium thickness of at least 0.1 μm, and a gold thickness of at least 0.1 μm. In step S702, a passive component is attached to the substrate 3, wherein the solder end face 2 of the passive component is attached to the surface of the substrate 3 opposite to the substrate pads 4 to form an LGA package. The solder end face 2 is connected via through-holes 6. The process involves attaching passive components to a substrate 3 using an SMT process; in step S703, attaching an integrated circuit chip and an LGA package to a frame carrier using adhesive, wherein the surface of the integrated circuit chip with pads and the surface of the LGA package with substrate pads 4 are positioned upwards, and the adhesive is silver paste; in step S704, connecting the pads of the integrated circuit chip and the substrate pads 4 using a wire bonding process including ultrasonic thermoforming to interconnect the passive components of the integrated circuit chip and the LGA package; and in step S705, molding the frame to form a frame-like package.

[0042] Those skilled in the art should understand that the above steps are merely examples, and the order of the above steps can be adjusted, decomposed, and combined without departing from the scope of this utility model.

[0043] Although this disclosure has been described with reference to exemplary embodiments, various changes and modifications may be suggested to those skilled in the art. This disclosure is intended to cover such changes and modifications that fall within the scope of the appended claims.

[0044] Any description in this utility model should not be construed as implying that any particular element, step, or function is essential and must be included within the scope of the claims. The scope of the utility model is defined only by the claims.

Claims

1. A frame-like package structure containing passive components, comprising an LGA package, an integrated circuit chip, and a metal frame, characterized in that, The LGA package is configured to include a passive component and a substrate, wherein substrate pads are disposed on one surface of the substrate, and the passive component is configured to be attached to a surface of the substrate opposite to the substrate pads. The metal frame includes a frame carrier and frame pins; The LGA package and the integrated circuit chip are configured to be attached to a frame carrier, with the substrate pads of the LGA and the pads of the integrated circuit chip facing upwards. The substrate pads, integrated circuit chip pads, and frame pins are interconnected using a wire bonding process.

2. The frame-like encapsulation structure containing passive components according to claim 1, characterized in that, The passive component includes a solder end face, and the substrate includes through holes that connect the solder end face and the substrate pads.

3. The frame-like encapsulation structure containing passive components according to claim 2, characterized in that, The area of ​​the substrate pads is configured to be larger than the area of ​​the welding end face.

4. The frame-like encapsulation structure containing passive components according to claim 1, characterized in that, The LGA package also includes a plastic encapsulation shell disposed on the surface of the substrate opposite to the substrate pads to cover the package of the passive component.

5. The frame-like encapsulation structure containing passive components according to claim 1, characterized in that, The passive component is attached to the surface of the substrate opposite to the substrate pads using surface mount technology. The LGA package and integrated circuit chip are attached to the frame carrier using adhesive.

6. The frame-like encapsulation structure containing passive components according to claim 1, characterized in that, The frame-like packaging structure also includes a protective housing configured as epoxy molding compound to cover the frame carrier and to connect to the outside via frame pins.

7. The frame-like encapsulation structure containing passive components according to claim 1, characterized in that, The frame carrier is configured as a copper frame carrier.

8. The frame-like encapsulation structure containing passive components according to claim 1, characterized in that, The framework class encapsulation structure includes a QFN encapsulation.

9. The frame-like encapsulation structure containing passive components according to claim 2, characterized in that, The substrate pads are configured as electroless nickel-palladium-gold plated pads, with a nickel thickness of 0.3~0.5µm, a minimum palladium thickness of 0.1µm, and a minimum gold thickness of 0.1µm.

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