Small-sized SMD (Surface Mount Device) diode packaging structure

Abstract

The utility model discloses a small SMD diode packaging structure, which is characterized in that the small SMD diode packaging structure comprises a first pin and a second pin which are respectively and electrically connected with a chip element, the second pin is provided with a straight part exposed from the side part of a packaging body, and the straight part is provided with a near end used for being jointed with an external device. A pair of corner parts used for being matched with the near end to be fixed with a mold are arranged on the opposite side edges of the far end of the straight part. A pair of corner parts is arranged on the two sides of the far end to serve as clamping and fixing points of the mold in the plastic packaging process, and the corner parts are matched with the near end to form three-point control on the plane of the flat and straight part, so that sealing glue does not cross a set boundary, and the flat and straight part is flatly exposed.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging, and in particular to a small surface-mount diode packaging structure. Background Technology

[0002] Chinese utility model patent application CN219350224U discloses a circuit-breaking protection diode package structure. In this existing package structure, only the portions of the leads exposed on both sides of the plastic encapsulation structure are used for connection to external components.

[0003] To improve the heat dissipation performance of chip components, the inventors attempted to change the bottom of the molding compound to expose a large area of ​​leads. Considering that in previous designs, the mold fixed the leads by clamping their ends during molding, this method of fixing made it difficult to control the position of the distal ends of the leads in the new design, causing the molding compound to overflow towards the exposed portion. Utility Model Content

[0004] In order to overcome the above-mentioned defects of the prior art, the purpose of this utility model is to provide a small surface mount diode packaging structure to improve the packaging accuracy and further improve the problem of adhesive overflow in the packaging.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0006] A small surface-mount diode package structure includes a first pin and a second pin electrically connected to a chip element, the second pin having a flat portion exposed from the side of the package, the flat portion having a proximal end for engaging with an external device, and a pair of corner portions provided on opposite sides of the distal end of the flat portion for engaging the proximal end with a mold for fixing.

[0007] Furthermore, the proximal end and the pair of corner portions are located on the plane formed by the straight portion.

[0008] Furthermore, the first pin is exposed from one side of the package, also for bonding with external devices, and a sealant is arranged between the first pin and the flat portion.

[0009] Furthermore, the first pin and the flat portion are located on the same plane at the bottom of the package.

[0010] Furthermore, the encapsulation structure is SOD.

[0011] Furthermore, the operating current of the chip element is less than 5A.

[0012] Furthermore, the chip is a diode.

[0013] The beneficial effects of this utility model are as follows:

[0014] The present invention provides a small surface-mount diode packaging structure with a pair of corners on both sides of the far end, which serve as clamping and fixing points of the mold during the molding process. These corners, together with the near end, form a three-point control on the plane of the flat part, ensuring that the encapsulation does not exceed the predetermined boundary and that the flat part is exposed smoothly. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0016] Figure 1 This is a lower axial side view of the package of this utility model.

[0017] Figure 2 This is a bottom view of the present invention. Detailed Implementation

[0018] In the description of this utility model, it should be noted that the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. The above description is for the purpose of simplifying the description of this utility model and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this utility model.

[0019] Exemplary embodiments of this application will now be described with reference to the accompanying drawings. However, it should be understood that this application can be presented in many different ways and is not limited to the embodiments described below. It should also be understood that the embodiments disclosed herein can be combined in various ways to provide further additional embodiments. Throughout the drawings, the same reference numerals denote the same or functionally identical elements.

[0020] Figure 1 and Figure 2 A package structure with a fixed distal pin is shown. To improve the heat dissipation of the chip components within the encapsulation 10, the second pin 30 is designed with a straight portion 31 extending from the proximal end 30a, which connects to external components such as the PCB board, toward the distal end 30b of the first pin 20. The proximal end 30a and the distal end 30b respectively constitute the two endpoints of the straight portion 31. This straight portion 31 essentially forms part of the lower outer surface of the encapsulation 10, and the chip components are placed on top of the straight portion 31 and encapsulated by the encapsulation 10.

[0021] A pair of corner portions 32, which are clamped by the mold during the molding process, are positioned opposite each other on both sides of the distal end 30b to form the fixing point of the distal end 30b. The proximal end 30a, as the original fixing point, works in conjunction with the corner portions 32 to form three points on the plane of the flat portion 31 to firmly control the position of the second pin 30 and ensure that the sealant 10 does not cross the predetermined boundary and protrude into the flat portion 31, so that the flat portion 31 can be exposed flatly on the lower surface of the sealant 10.

[0022] It should be further noted that the first pin 20 is located on the opposite side of the package body 1 relative to the second pin 30, and the first pin 20 and the second pin 30 are insulated from each other. Therefore, the first pin 20 and the second pin 30 are specifically isolated by a sealant 10 arranged on the lower surface of the package body 1 between the first pin 20 and the flat portion 31.

[0023] In a specific embodiment, this packaging structure is used in small components with an operating current of less than 5A and a length of less than 3.7mm. The packaging structure of this component can be a small surface-mount diode package. Preferably, it is SOD123, and the encapsulant 10 is epoxy resin.

[0024] When a component is described in the specification as being "on", "fixed" to, "connected" to, or "joined" to another component, the component may be directly located on, fixed to, connected to, joined to, or in contact with the other component, or there may be an intermediate component present.

[0025] It is understood that although the terms "first," "second," etc., may be used herein to describe different elements, these elements should not be limited by these terms. These terms are merely used to distinguish one element from another. Therefore, a first element may be referred to as a second element without departing from the teachings of this application.

Claims

1. A small surface-mount diode package structure, characterized in that, It includes a first pin and a second pin that are electrically connected to the chip element, the second pin having a straight portion exposed from the side of the package, the straight portion having a proximal end for engaging with an external device, and a pair of corner portions provided on opposite sides of the distal end of the straight portion for engaging the proximal end with a mold for fixing.

2. The small surface-mount diode package structure as described in claim 1, characterized in that, The proximal end and the pair of corner portions are located on the plane formed by the straight portion.

3. The small surface-mount diode package structure as described in claim 1, characterized in that, The first pin protrudes from one side of the package and is also used for bonding with external devices. The first pin and the flat portion are coated with sealant.

4. The small surface-mount diode package structure as described in claim 3, characterized in that, The first pin and the flat portion are located on the same plane at the bottom of the package.

5. A small surface-mount diode package structure as described in any one of claims 1 to 4, characterized in that, The encapsulation structure is SOD.

6. A small surface-mount diode package structure as described in any one of claims 1 to 4, characterized in that, The operating current of the chip element is less than 5A.

7. A small surface-mount diode package structure as described in any one of claims 1 to 4, characterized in that, The chip is a diode.

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