Sequencing chip pushing mechanism and sequencing chip pushing device
By using a combination of Z-axis and X-axis movement to drive the sequencing chip mechanism and device, the jamming problem during the sequencing chip insertion process is solved, enabling precise positioning and efficient insertion of the sequencing chip and ensuring the normal operation of the gene sequencer.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU GEENGA BIOMEDICAL ENG CO LTD
- Filing Date
- 2025-04-02
- Publication Date
- 2026-05-12
AI Technical Summary
在测序芯片插入基因测序仪插槽过程中，可能出现卡滞，导致无法沿厚度方向移动，影响插入精确性。
A sequencing chip pushing mechanism and pushing device are provided, including a base, a Z-axis adjustment component and a pushing component. The sequencing chip is precisely positioned by moving in the Z and X directions. The sequencing chip is pushed in the Z direction by first and second toggle blocks to ensure that it is inserted into the preset position of the slot.
This effectively solves the problem of sequencing chips getting stuck during insertion, ensuring that the sequencing chips can be accurately inserted into the slots of the gene sequencer, thus improving insertion accuracy and efficiency.
Smart Images
Figure CN224227062U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of high-throughput sequencing technology, and more particularly to sequencing chip driving mechanisms and sequencing chip driving devices. Background Technology
[0002] High-throughput sequencing technology, also known as "next-generation" sequencing technology, is characterized by its ability to sequence hundreds of thousands to millions of DNA molecules in parallel at once and generally shorter read lengths.
[0003] The experimental process of high-throughput sequencing includes the following steps: sample preparation, library construction, sequencing reaction, and data analysis. In the sequencing reaction step, the sequencing chip loaded with the sample needs to be inserted into the slot of the gene sequencer. Specifically, one end of the sequencing chip along its length can be pre-inserted into the slot, and then force can be applied to the other end along its length to insert the sequencing chip into the preset position in the slot.
[0004] After the sequencing chip is pre-inserted into the slot, the slot will restrict the movement of the sequencing chip in the width and thickness directions, that is, the sequencing chip can only move along the length direction, thereby ensuring that the sequencing chip is accurately inserted into the preset position of the slot, so that the gene sequencer can work normally.
[0005] In a scenario known to the inventors, during the insertion of a sequencing chip into its slot, the gene sequencer applies pressure to the surface of the sequencing chip along its thickness direction to move the chip to a predetermined position. However, the inventors have discovered that the sequencing chip may become stuck at a certain position within the slot and be unable to move along its thickness direction. Therefore, a sequencing chip pushing device is urgently needed to enable the sequencing chip to move along its thickness direction. Utility Model Content
[0006] The purpose of this disclosure is to provide a sequencing chip driving mechanism and a sequencing chip driving device that can drive the sequencing chip to move along its thickness direction to ensure that the sequencing chip can be accurately inserted into the preset position of the slot of the gene sequencer.
[0007] To achieve the above objectives, this disclosure provides a sequencing chip propulsion mechanism, including:
[0008] Base;
[0009] A Z-axis adjustment assembly, disposed on one side of the base, includes a Z-axis moving component movable along the Z-direction; and
[0010] A pushing component, fixedly disposed on the side of the Z-axis moving component away from the base, the pushing component comprising:
[0011] A pushing surface, the pushing surface being located on the side of the pushing component away from the Z-direction moving component, the pushing surface being perpendicular to the X-direction;
[0012] A first actuating block, the first actuating block extending from one end of the pushing surface in the Z direction along the X direction and away from the Z-direction moving member; and
[0013] The second actuating block extends from the pushing surface at the other end in the Z direction along the X direction and away from the Z-direction moving member.
[0014] To achieve the above objectives, this disclosure also provides a sequencing chip driving device, including:
[0015] The aforementioned sequencing chip propulsion mechanism; and
[0016] A drive mechanism, wherein the actuator of the drive mechanism is connected to the base, and the actuator has at least translational degrees of freedom along the X direction and the Z direction.
[0017] Compared with the prior art, this disclosure includes at least the following beneficial effects:
[0018] The base and the pushing component are connected by a Z-axis adjustment assembly, allowing the pushing component to move in the Z direction (i.e., the thickness direction of the sequencing chip). When adjustment of the sequencing chip is required, the base can be moved along the Z direction to allow the first or second actuating block on the pushing component to move the sequencing chip into place. Attached Figure Description
[0019] Figure 1 A schematic diagram of a gene sequencer, a sequencing chip, and a sequencing chip driving device according to an embodiment of the present disclosure is shown.
[0020] Figure 2 A schematic diagram of a chip driving mechanism according to an embodiment of the present disclosure is shown.
[0021] Figure 3 An exploded view of a chip driving mechanism according to an embodiment of the present disclosure is shown.
[0022] Figure 4 A cross-sectional view of the base and the X-axis buffer assembly according to an embodiment of the present disclosure is shown.
[0023] Figure label:
[0024] 10. Drive mechanism;
[0025] 20. Sequencing chip pushing mechanism; 21. Base; 211. X-axis channel; 22. Z-axis adjustment assembly; 221. Z-axis moving component; 222. Z-axis mounting base; 2221. First mounting block; 2222. Second mounting block; 223. Z-axis guide component; 224. Z-axis elastic component; 23. Pushing component; 231. Pushing surface; 232. First actuating block; 2321. First actuating surface; 233. Second actuating block; 2331. Second actuating surface; 24. X-axis buffer assembly; 241. X-axis moving component; 242. X-axis guide component; 243. X-axis elastic component;
[0026] 30. Gene sequencer; 31. Slot;
[0027] 40. Sequencing chip. Detailed Implementation
[0028] The technical solutions of this disclosure will be further described below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely for explaining this disclosure and not for limiting it. Furthermore, it should be noted that, for ease of description, only the parts relevant to this disclosure are shown in the accompanying drawings, not all of them.
[0029] This disclosure defines certain directional terms. Unless otherwise stated, the directional terms used, such as "up," "down," "left," "right," "inner," and "outer," are used for ease of understanding and therefore do not constitute a limitation on the scope of protection of this disclosure.
[0030] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0031] In the description of this disclosure, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure based on the specific circumstances.
[0032] like Figure 1 As shown, this disclosure relates to a sequencing chip pushing device for pushing a sequencing chip 40 into a gene sequencer 30. Specifically, the gene sequencer 30 has at least one slot 31 for inserting the sequencing chip 40 into the gene sequencer 30.
[0033] It should be noted that the structure and working principle of the gene sequencer 30 and the sequencing chip 40 are existing technologies and will not be described in detail in this disclosure.
[0034] The sequencing chip 40 is approximately cuboid in shape. In this disclosure, the length direction of the sequencing chip 40 is defined as the X direction, the width direction is defined as the Y direction, and the thickness direction is defined as the Z direction. Any two of the X, Y, and Z directions are perpendicular to each other.
[0035] like Figure 1 As shown, when the sequencing chip 40 is aligned with the slot 31 in the Y and Z directions, one end of the sequencing chip 40 in the X direction (e.g.) Figure 1 The left end of the sequencing chip 40 can be inserted into the slot 31, and by pushing the sequencing chip 40 to the other end in the X direction (e.g., Figure 1 The right end of the sequencing chip 40 can be moved along the X direction so that the sequencing chip 40 can be inserted into the preset position of the slot 31.
[0036] The inventors discovered that during the insertion of the sequencing chip 40 into the slot 31, the sequencing chip 40 can become stuck in the Z-direction. Therefore, the sequencing chip pushing device of this disclosure can move the sequencing chip 40 in the Z-direction to position it in that direction.
[0037] Specifically, such as Figure 1 As shown, the sequencing chip pushing device includes a sequencing chip pushing mechanism 20 and a driving mechanism 10. The actuator of the driving mechanism 10 is connected to the sequencing chip pushing mechanism 20, and the actuator has at least translational degrees of freedom in the X and Z directions, so that the sequencing chip pushing mechanism 20 can translate at least in the X and Z directions. By translating the sequencing chip pushing mechanism 20 in the X direction, the sequencing chip 40 can be inserted into the slot 31 in the X direction. By translating the sequencing chip pushing mechanism 20 in the Z direction, the sequencing chip 40 can be moved in the Z direction, so as to move the sequencing chip 40 into place when it is stuck.
[0038] For example, the drive mechanism 10 may be a multi-axis robot.
[0039] like Figure 2 and Figure 3As shown, the sequencing chip pushing mechanism 20 includes a base 21, a Z-axis adjustment component 22, and a pushing component 23. The base 21 is fixedly disposed at the execution end of the driving mechanism 10 so that the driving mechanism 10 drives the entire sequencing chip pushing mechanism 20 to move. The Z-axis adjustment component 22 is disposed on one side of the base 21, for example, on the side of the base 21 away from the execution end of the driving mechanism 10. The Z-axis adjustment component 22 includes a Z-axis moving component 221 that is movable in the Z direction. The pushing component 23 is fixedly disposed on the Z-axis moving component 221, and the pushing component 23 is located on the side of the Z-axis moving component 221 away from the base 21. Thus, the pushing component 23 has a translational degree of freedom in the Z direction by means of the Z-axis moving component 221, that is, the pushing component 23 can move in the Z direction relative to the base 21.
[0040] like Figure 2 As shown, the pushing component 23 includes a pushing surface 231, a first actuating block 232, and a second actuating block 233. The pushing surface 231 is located on the side of the pushing component 23 away from the Z-direction moving component 221, and the pushing surface 231 is perpendicular to the X-direction. The pushing surface 231 is used to push the sequencing chip 40 in the X-direction. The first actuating block 232 is located at one end of the pushing surface 231 in the Z-direction (e.g., ...). Figure 2 The second actuating block 233 extends along the X direction from the upper end of the pushing surface 231 and away from the Z-direction moving member 221. The second actuating block 233 extends from the other end of the pushing surface 231 in the Z direction (e.g., from the other end of the pushing surface 231 in the Z direction). Figure 2 It extends along the X direction and away from the Z-direction moving part 221 at the lower end of the middle pushing surface 231.
[0041] Thus, a pushing groove is formed on the side of the pushing component 23 away from the Z-direction moving component 221, the pushing surface 231 serves as the bottom surface of the pushing groove, and the first actuating block 232 and the second actuating block 233 serve as the sidewalls of the pushing groove.
[0042] When the drive mechanism 10 drives the base 21 to move in the X direction, the pushing surface 231 can push the sequencing chip 40 to move in the X direction. When the drive mechanism 10 drives the base 21 to move in the Z direction, the first toggle block 232 or the second toggle block 233 can toggle the sequencing chip 40 in the Z direction so that the sequencing chip 40 moves into place after being inserted into the slot 31.
[0043] like Figure 2 As shown, the first actuating block 232 has a first actuating surface 2321 on the side near the pushing surface 231. The first actuating surface 2321 serves as one of the walls of the pushing groove and is used to contact the sequencing chip 40 when the sequencing chip 40 is actuated. The first actuating surface 2321 is a horizontal plane or an inclined surface formed by rotating the horizontal plane along the Y-axis.
[0044] like Figure 2As shown, the second actuating block 233 has a second actuating surface 2331 on the side near the pushing surface 231. The second actuating surface 2331 serves as one of the walls of the pushing groove and is used to contact the sequencing chip 40 when the sequencing chip 40 is actuated. The second actuating surface 2331 is a horizontal plane or an inclined surface formed by rotating the horizontal plane along the Y-axis.
[0045] like Figure 2 and Figure 3 As shown, the Z-axis adjustment assembly 22 also includes a Z-axis mounting base 222, a Z-axis guide member 223, and a Z-axis elastic member 224. The Z-axis mounting base 222 is disposed on the base 21 so that the actuator of the drive mechanism 10 can move the Z-axis adjustment assembly 22. The Z-axis guide member 223 is fixedly disposed on the Z-axis mounting base 222 and extends along the Z direction. For example, the Z-axis guide member 223 may be a guide rod. The Z-axis moving member 221 mentioned above is movably disposed on the Z-axis guide member 223, so that the Z-axis moving member 221 can translate along the Z direction. Z-axis elastic members 224 are disposed on both sides of the Z-axis moving member 221 along the Z direction. For example, the Z-axis elastic member 224 may be a spring, which may be sleeved on the Z-axis guide member 223.
[0046] By providing Z-axis elastic members 224 on both sides of the Z-axis moving member 221, the Z-axis moving member 221 can be held in a preset position, such as the central position of the Z-axis guide member 223, when no external force is applied. When the Z-axis moving member 221 is moved by an external force, the Z-axis guide member 223 moves accordingly, thereby extending or compressing, so that when the external force is removed, the Z-axis guide member 223 drives the Z-axis moving member 221 to reset.
[0047] like Figure 3 As shown, the Z-axis mounting base 222 includes a first mounting block 2221 and a second mounting block 2222. The second mounting block 2222 is located on one side of the first mounting block 2221 along the Z-direction, for example, the second mounting block 2222 is located below the first mounting block 2221. One end of the Z-axis guide member 223 ( Figure 3 The upper middle end) is fixedly installed on the first mounting block 2221, and the other end of the Z-direction guide component 223 ( Figure 3 The lower part is fixedly disposed on the second mounting block 2222. In addition, Z-axis elastic members 224 are provided between the first mounting block 2221 and the Z-axis moving member 221, and between the second mounting block 2222 and the Z-axis moving member 221.
[0048] like Figure 2 and Figure 3As shown, the sequencing chip pushing mechanism 10 also includes an X-direction buffer component 24, which is disposed between the base 21 and the Z-direction mounting base 222, so that the Z-direction mounting base 222 and the base 21 can move relative to each other in the X direction, thereby providing a buffer in the X direction for the pushing component 23 when pushing the sequencing chip 40 to move in the X direction.
[0049] like Figure 2 and Figure 3 As shown, the X-direction buffer assembly 24 includes an X-direction moving member 241, an X-direction guiding member 242, and an X-direction elastic member 243. The X-direction moving member 241 is disposed between the Z-direction mounting base 222 and the base 21, and the Z-direction mounting base 222 is fixedly disposed on the X-direction moving member 241. The X-direction guiding member 242 (e.g., a guide rod) extends in the X direction, one end of the X-direction guiding member 242 is fixedly disposed on the X-direction moving member 241, and the other end of the X-direction guiding member 242 is movably disposed on the base 21. The X-direction elastic member 243 (e.g., a spring) is disposed between the X-direction moving member 241 and the base 21.
[0050] By providing an X-axis elastic member 243, a preset distance is established between the X-axis moving member 241 and the base 21. When the pushing member 23 is subjected to an external force, the distance between the X-axis moving member and the base 21 decreases, and the X-axis elastic member 243 is compressed. When the external force is removed, the X-axis elastic member 243 extends, restoring the distance between the X-axis moving member 241 and the base 21.
[0051] like Figure 4 As shown, in one embodiment, the base 21 is provided with an X-direction channel 211 that extends through the X direction, one end of the X-direction guide member 242 near the base 21 is movably disposed in the X-direction channel 211, and one end of the X-direction guide member 242 near the X-direction moving member 241 is fixedly disposed in the X-direction moving member 241.
[0052] like Figure 3 and Figure 4 As shown, in one embodiment, the X-direction guide member 242 is a shoulder screw, one end of which is threaded to the X-direction moving member 241, and the other end of which is movably disposed in the X-direction channel 211.
[0053] The usage of the sequencing chip driving device disclosed herein is as follows:
[0054] The sequencing chip 40 is first pre-inserted into the slot 31. Then, the actuator of the drive mechanism 10 drives the sequencing chip pushing mechanism 20 to move, so that the pushing component 23 is aligned with the sequencing chip 40 in the Y and Z directions. Then, the actuator of the drive mechanism 10 drives the sequencing chip pushing mechanism 20 to move along the X direction, so that the pushing component 23 contacts one end of the sequencing chip 40 and pushes the sequencing chip 40 to move along the X direction. If the sequencing chip 40 gets stuck in the Z direction during the movement, the actuator of the drive mechanism 10 drives the sequencing chip pushing mechanism 20 to move in the Z direction, so that the first actuating block 232 or the second actuating block 233 contacts the sequencing chip 40 and actuates the sequencing chip 40 in the Z direction.
[0055] Although this disclosure has been described in detail above with general descriptions, specific embodiments, and experiments, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, such modifications or improvements made without departing from the spirit of this disclosure are all within the scope of protection claimed by this disclosure.
Claims
1. A sequencing chip driving mechanism, characterized in that, include: Base (21); Z-axis adjustment component (22), the Z-axis adjustment component (22) is disposed on one side of the base (21), the Z-axis adjustment component (22) includes a Z-axis moving component (221) movable in the Z direction; as well as A pushing component (23) is fixedly disposed on the side of the Z-axis moving component (221) away from the base (21). The pushing component (23) includes: A pushing surface (231) is located on the side of the pushing member (23) away from the Z-direction moving member (221), and the pushing surface (231) is perpendicular to the X direction; A first actuating block (232) extends from one end of the pushing surface (231) in the Z direction along the X direction and away from the Z-direction moving member (221); and The second actuating block (233) extends from the pushing surface (231) at the other end in the Z direction along the X direction and away from the Z-direction moving member (221).
2. The sequencing chip driving mechanism according to claim 1, characterized in that, The first actuating block (232) has a first actuating surface (2321) on the side near the pushing surface (231). The first actuating surface (2321) is a horizontal surface or an inclined surface formed by rotating the horizontal surface along the Y-axis.
3. The sequencing chip driving mechanism according to claim 1, characterized in that, The second actuating block (233) has a second actuating surface (2331) on the side near the pushing surface (231). The second actuating surface (2331) is a horizontal surface or an inclined surface formed by rotating the horizontal surface along the Y-axis.
4. The sequencing chip driving mechanism according to any one of claims 1 to 3, characterized in that, The Z-axis adjustment component (22) further includes: Z-axis mounting base (222), the Z-axis mounting base (222) is disposed on the base (21); A Z-direction guide component (223) is fixedly mounted on the Z-direction mounting base (222) and extends along the Z-direction. A Z-direction moving component (221) is movably mounted on the Z-direction guide component (223). Z-direction elastic member (224), the Z-direction moving member (221) is provided with Z-direction elastic member (224) on both sides along the Z direction.
5. The sequencing chip driving mechanism according to claim 4, characterized in that, The Z-axis mounting base (222) includes: First mounting block (2221); and The second mounting block (2222) is located on one side of the first mounting block (2221) along the Z direction. One end of the Z-direction guide component (223) is fixedly disposed on the first mounting block (2221), and the other end of the Z-direction guide component (223) is fixedly disposed on the second mounting block (2222). The Z-axis elastic component (224) is provided between the first mounting block (2221) and the Z-axis moving component (221), and the Z-axis elastic component (224) is provided between the second mounting block (2222) and the Z-axis moving component (221).
6. The sequencing chip driving mechanism according to claim 4, characterized in that, The sequencing chip driving mechanism also includes: X-axis buffer assembly (24) is disposed between the base (21) and the Z-axis mounting base (222).
7. The sequencing chip driving mechanism according to claim 6, characterized in that, The X-axis buffer component (24) includes: An X-axis moving component (241) is disposed between the Z-axis mounting base (222) and the base (21), and the Z-axis mounting base (222) is fixedly disposed on the X-axis moving component (241); An X-direction guide component (242) extending along the X direction, one end of which is fixedly disposed on the X-direction moving component (241), and the other end of which is movably disposed on the base (21); and An X-axis elastic member (243) is disposed between the X-axis moving member (241) and the base (21).
8. The sequencing chip driving mechanism according to claim 7, characterized in that, The base (21) is provided with an X-direction channel (211) that runs through the X direction. The end of the X-direction guide component (242) near the base (21) is movably disposed in the X-direction channel (211), and the end of the X-direction guide component (242) near the X-direction moving component (241) is fixedly disposed in the X-direction moving component (241).
9. The sequencing chip driving mechanism according to claim 8, characterized in that, The X-direction guide component (242) is a shoulder screw, and one end of the shoulder screw near the X-direction moving component (241) is threadedly connected to the X-direction moving component (241).
10. A sequencing chip driving device, characterized in that, include: The sequencing chip driving mechanism (20) according to any one of claims 1 to 9; as well as A drive mechanism (10) is provided, the execution end of which is connected to the base (21), and the execution end has at least translational degrees of freedom along the X direction and the Z direction.