Accumulated water monitoring device

Abstract

The utility model relates to an accumulated water monitoring device which comprises a contact type water sensor, an ultrasonic water depth sensor, a temperature sensor, an MCU microprocessor, a 4G communication module and a power supply module. Wherein the output end of the contact type water sensor is connected with the ADC signal input end of the MCU microprocessor, the data output end of the ultrasonic water depth sensor is connected with the UART data receiving interface of the MCU microprocessor, the I2C data output end of the temperature sensor is connected with the I2C bus interface of the MCU microprocessor, and the data output end of the MCU microprocessor is connected with the UART instruction input end of the 4G communication module. The power module supplies power. According to the accumulated water monitoring device, a stepped contact structure is formed by the contact type water sensor and the ultrasonic water depth sensor, and deep dormancy control of the low-power-consumption main control chip is matched, so that high-accuracy, environment condition interference-resistant and low-power-consumption running accumulated water dynamic monitoring is realized.

Description

Technical Field

[0001] This utility model relates to the field of water accumulation monitoring devices, and specifically to a water accumulation monitoring device. Background Technology

[0002] Existing road flooding monitoring devices mostly use single-point threshold alarm water immersion sensors, which have significant drawbacks such as low monitoring accuracy, poor environmental adaptability, and high power consumption. Moreover, these sensors are easily affected by raindrops and floating objects, leading to distorted echo signals, and long-term exposure to humid environments can cause false triggering due to contact oxidation or material corrosion. Therefore, some flooding detection devices use ultrasonic sensors. Although these sensors have high accuracy and good environmental adaptability, they require the ultrasonic module to be continuously turned on to maintain monitoring functionality, which dramatically increases power consumption. Utility Model Content

[0003] The technical problem to be solved by this utility model is to overcome the shortcomings of existing technologies, such as low accuracy, great susceptibility to environmental conditions, and excessive energy consumption, and to provide a water accumulation monitoring device. This device forms a stepped contact structure with a contact-type water immersion sensor and an ultrasonic water depth sensor, and is combined with the deep sleep control of a low-power main control chip to achieve dynamic monitoring of water accumulation with high accuracy, resistance to environmental interference, and low power consumption.

[0004] This water accumulation monitoring device includes a contact-type water immersion sensor, an ultrasonic water depth sensor, a temperature sensor, an MCU microprocessor, a 4G communication module, and a power supply module. The output of the contact-type water immersion sensor is connected to the ADC signal input of the MCU microprocessor; the data output of the ultrasonic water depth sensor is connected to the UART data receiving interface of the MCU microprocessor; the I2C data output of the temperature sensor is connected to the I2C bus interface of the MCU microprocessor; the data output of the MCU microprocessor is connected to the UART command input of the 4G communication module; and the power supply module supplies power to the contact-type water immersion sensor, the ultrasonic water depth sensor, the temperature sensor, the MCU microprocessor, and the 4G communication module.

[0005] Furthermore, the aforementioned contact-type water immersion sensor adopts a stainless steel contact structure, and its output terminal is connected to the ADC pin PA14 of the MCU microprocessor through a voltage divider circuit.

[0006] Furthermore, the ultrasonic water depth sensor is a DYP_L02 ultrasonic liquid level sensor, and the UART interface of the DYP_L02 ultrasonic liquid level sensor is connected to the TXD / RXD pins PA0 / PA1 of the MCU microprocessor.

[0007] Furthermore, the MCU microprocessor uses the FM33L025 processing chip.

[0008] Furthermore, the 4G communication module is an EC800E module, which is connected to the UART0_TX / UART0_RX / 4G_PYKEY / 4G_PWR pins PA2 / PA3 / PA7 / PA9 of the MCU microprocessor.

[0009] Furthermore, it also includes an Internet of Things (IoT) platform, with the 4G communication module having a bidirectional data connection to the IoT platform.

[0010] This utility model discloses a water accumulation monitoring device that overcomes the shortcomings of existing technologies, such as low accuracy, great susceptibility to environmental conditions, and excessive energy consumption. It achieves dynamic monitoring of water accumulation with high accuracy, resistance to environmental interference, and low power consumption by forming a stepped contact structure with a contact-type water immersion sensor and an ultrasonic water depth sensor, combined with the deep sleep control of a low-power main control chip. Attached Figure Description

[0011] The following description, in conjunction with the accompanying drawings, further illustrates a water accumulation monitoring device according to this utility model:

[0012] Figure 1 This is a wireframe diagram illustrating the logic structure and connection principle of this water accumulation monitoring device;

[0013] Figure 2 This is an external structural diagram of the water accumulation monitoring device;

[0014] Figure 3 This is a circuit diagram of the MCU microprocessor and its peripheral circuits described in this water accumulation monitoring device;

[0015] Figure 4 This is a circuit diagram of the 4G communication module and its peripheral circuits described in this water accumulation monitoring device.

[0016] In the picture:

[0017] 1-Contact immersion sensor, 2-Ultrasonic water depth sensor, 3-Temperature sensor, 4-MCU microprocessor, 5-4G communication module, 6-Power supply module. Detailed Implementation

[0018] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0019] In the description of this utility model, it should be understood that the terms "left", "right", "front", "rear", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0020] The present invention will be further described below with specific embodiments, but the scope of protection of the present invention is not limited to the following embodiments.

[0021] Implementation method 1: such as Figures 1 to 4 As shown, this water accumulation monitoring device includes a contact-type water immersion sensor 1, an ultrasonic water depth sensor 2, a temperature sensor 3, an MCU microprocessor 4, a 4G communication module 5, and a power supply module 6. The output terminal of the contact-type water immersion sensor 2 is connected to the ADC signal input terminal of the MCU microprocessor 4; the data output terminal of the ultrasonic water depth sensor 2 is connected to the UART data receiving interface of the MCU microprocessor 4; the I2C data output terminal of the temperature sensor 3 is connected to the I2C bus interface of the MCU microprocessor 4; the data output terminal of the MCU microprocessor 4 is connected to the UART command input terminal of the 4G communication module 5; and the power supply module 6 supplies power to the contact-type water immersion sensor 1, the ultrasonic water depth sensor 2, the temperature sensor 3, the MCU microprocessor 4, and the 4G communication module 5. The contact-type water immersion sensor 1 triggers the ultrasonic water depth sensor 2 to start up through a voltage drop threshold of 3.6V to 2.7V. The MCU microprocessor 4 maintains a deep sleep mode when the contact-type sensor has no alarm, realizing low power consumption operation of the entire device. After detecting water immersion, the ultrasonic sensor is woken up to perform water depth measurement in the range of 10cm-300cm. The temperature sensor 3 compensates for the ambient temperature of the ultrasonic ranging data, which solves the high power consumption problem caused by the continuous operation of the ultrasonic sensor in the existing equipment, as well as the false alarm defect of a single sensor under the interference of raindrops and floating objects.

[0022] Implementation method 2: such as Figure 1As shown, the contact-type water immersion sensor 1 of this water accumulation monitoring device adopts a stainless steel contact structure. Its output terminal is connected to the ADC pin PA14 of the MCU microprocessor 4 through a voltage divider circuit. The water immersion data acquisition function is AD acquisition. The AD acquisition chip assists in reading the voltage across the stainless steel contacts of the device. When the device is in normal condition, the voltage is 3.6V. When the device is submerged in water, the voltage drops as a circuit is formed at the water immersion contacts. According to test calculations, a voltage below 2.7V is considered a water immersion alarm. At this time, the two-stage ultrasonic water depth detection function is activated to read the water depth data and report it to the platform. The stainless steel contact structure avoids metal corrosion caused by long-term water immersion. The voltage divider circuit converts the contact on / off state into a voltage signal range that the MCU can recognize. The physical isolation between the water immersion signal and the ultrasonic signal is achieved through independent pin allocation, which solves the problem of false triggering caused by contact oxidation failure and signal cross-interference in traditional sensors. The ultrasonic water depth sensor 2 is a DYP_L02 ultrasonic level sensor. The UART interface of the DYP_L02 ultrasonic level sensor is connected to the TXD / RXD pins PA0 / PA1 of the MCU microprocessor 4. The prerequisite for activating the ultrasonic water depth detection function is a water immersion alarm. At this time, the device needs to promptly read the current water level above the device and compare it with a pre-set threshold. If the alarm condition is met, an ultrasonic water depth alarm will be generated to alert the user to any abnormal water depth in the current area, allowing the user to take appropriate measures. The DYP_L02 sensor filters invalid echoes through an anti-raindrop interference algorithm, combined with the MCU's temperature compensation processing, thus solving the technical defect of abnormal fluctuations in water level data under rainy conditions. The remaining structures and components are as described in Embodiment 1 and will not be repeated.

[0023] Implementation method 3: such as Figure 3 As shown, the MCU microprocessor 4 of this water accumulation monitoring device uses the FM33L025 processing chip. The Fudan Microelectronics FM33L025 processing chip maintains voltage monitoring of the contact sensor in deep sleep mode, and the FLASH memory connected to the SPI bus caches abnormal water level data, solving the problem of data loss during communication interruptions and achieving low-power operation of the entire device. The remaining structures and components are as described in Embodiment 1 and will not be repeated.

[0024] Implementation method 4: such as Figure 4As shown, the 4G communication module 5 of this water accumulation monitoring device is an EC800E module. The EC800E module is connected to the UART0_TX / UART0_RX / 4G_PYKEY / 4G_PWR pins PA2 / PA3 / PA7 / PA9 of the MCU microprocessor 4. The Quectel EC800E module establishes a persistent connection with the IoT platform through the MQTT protocol, supports a data retransmission mechanism in weak signal environments, and solves the communication interruption problem of existing devices in signal blind spots. The remaining structures and components are as described in Embodiment 1 and will not be described again.

[0025] Implementation method 5: such as Figure 1 As shown, this waterlogging monitoring device also includes an Internet of Things (IoT) platform, and the 4G communication module 5 is bidirectionally connected to the IoT platform. The 4G communication module 5 is directly connected to the IoT platform via the MQTT protocol, and the MCU microprocessor 4 uploads water level data at adjustable intervals. The remaining structures and components are as described in Embodiment 1 and will not be described again.

[0026] During operation: In the initial state, the FM33L025 MCU microprocessor is in deep sleep mode. The contact-type water immersion sensor monitors the environmental status in real time through stainless steel contacts 11. When water accumulation causes the contacts to conduct, the output voltage of the voltage divider circuit drops from 3.6V to below 2.7V, triggering the MCU to wake up and start the ultrasonic water depth sensor DYP_L02. The DYP_L02 ultrasonic sensor filters out invalid echoes caused by raindrops and floating objects, and combines the ambient temperature data collected by the temperature sensor to compensate for the ranging value in real time, obtaining accurate water level information. The MCU uploads the processed data to the IoT platform via the MQTT protocol through the 4G communication module EC800E.

[0027] This water accumulation monitoring device overcomes the shortcomings of existing technologies, such as low accuracy, susceptibility to environmental conditions, and excessive energy consumption. It achieves dynamic monitoring of water accumulation with high accuracy, resistance to environmental interference, and low power consumption by forming a stepped contact structure with a contact-type immersion sensor and an ultrasonic water depth sensor, combined with the deep sleep control of a low-power main control chip.

[0028] The above description illustrates the main features, basic principles, and advantages of this utility model. It will be apparent to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments or examples described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the above embodiments or examples should be considered exemplary and not restrictive. The scope of this utility model is defined by the appended claims rather than the foregoing description, and therefore all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this utility model. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0029] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A water accumulation monitoring device, characterized in that: It includes a contact-type water immersion sensor (1), an ultrasonic water depth sensor (2), a temperature sensor (3), an MCU microprocessor (4), a 4G communication module (5), and a power supply module (6); among which, The output terminal of the contact-type water immersion sensor (1) is connected to the ADC signal input terminal of the MCU microprocessor (4). The data output terminal of the ultrasonic water depth sensor (2) is connected to the UART data receiving interface of the MCU microprocessor (4). The I2C data output terminal of the temperature sensor (3) is connected to the I2C bus interface of the MCU microprocessor (4). The data output terminal of the MCU microprocessor (4) is connected to the UART instruction input terminal of the 4G communication module (5). The power supply module (6) supplies power to the contact-type water immersion sensor (1), the ultrasonic water depth sensor (2), the temperature sensor (3), the MCU microprocessor (4), and the 4G communication module (5).

2. The water accumulation monitoring device according to claim 1, characterized in that: The contact-type water immersion sensor (1) adopts a stainless steel contact structure, and its output terminal is connected to the ADC pin PA14 of the MCU microprocessor (4) through a voltage divider circuit.

3. The water accumulation monitoring device according to claim 2, characterized in that: The ultrasonic water depth sensor (2) is a DYP_L02 ultrasonic liquid level sensor. The UART interface of the DYP_L02 ultrasonic liquid level sensor is connected to the TXD / RXD pins PA0 / PA1 of the MCU microprocessor (4).

4. The water accumulation monitoring device according to claim 3, characterized in that: The MCU microprocessor (4) uses the FM33L025 processing chip.

5. The water accumulation monitoring device according to claim 4, characterized in that: The 4G communication module (5) is an EC800E module, which is connected to the UART0_TX / UART0_RX / 4G_PYKEY / 4G_PWR pins PA2 / PA3 / PA7 / PA9 of the MCU microprocessor (4).

6. The water accumulation monitoring device according to claim 5, characterized in that: It also includes an Internet of Things (IoT) platform, and the 4G communication module (5) is bidirectionally connected to the IoT platform.

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