Simple testing device for mechanical property of electronic device in room-temperature / low-temperature environment

Abstract

The utility model discloses a simple testing device for mechanical properties of an electronic device in a room-temperature / low-temperature environment. The simple testing device comprises a tensile testing machine, a heat preservation barrel, a sample clamp and a probe fixing clamp, the tensile testing machine is fixed on the ground, a tensile head of the tensile testing machine is connected with a fixed disc, and the tensile testing machine applies tensile force through the fixed disc; the heat preservation barrel is placed on the tensile testing machine base, and the bottom of the heat preservation barrel is fixedly connected with the tensile testing machine base; the sample clamp comprises an upper clamp and a lower clamp, the upper end of the upper clamp is connected with the fixed disc through a pull rod, and the lower end of the upper clamp is connected with a tested sample; the lower end of the lower clamp extends into the heat preservation barrel and is fixedly connected with the bottom of the heat preservation barrel; the upper end of the lower clamp is clamped and connected with a tested sample; the probe fixing clamp is fixed to the bottom of the heat preservation barrel, the low-temperature probe is used for shooting a tested sample and connected with a locking knob, and the position of the low-temperature probe is fixed by rotating the locking knob.

Description

Technical Field

[0001] This utility model patent relates to the field of testing electromagnetic smart materials under room temperature / low temperature environments, specifically a simple testing device for the mechanical properties of electronic devices under room temperature / low temperature environments. Background Technology

[0002] With the continuous advancement of deep space exploration missions, the reliability of electromagnetic smart materials in extreme low-temperature environments has become a critical issue. Deep space spacecraft operating on the surfaces of celestial bodies such as the Moon and Mars face extreme low-temperature environments. For example, the diurnal temperature range on the lunar surface can reach 330°C, with daytime temperatures reaching 150°C and nighttime temperatures plummeting to -180°C. Such extreme temperature variations pose a severe challenge to the mechanical properties of electromagnetic smart materials. Researching the mechanical properties of electromagnetic smart materials under low-temperature conditions is of great significance for improving the reliability and lifespan of deep space probes.

[0003] Furthermore, an increasing number of materials are being deployed in extreme cryogenic environments, such as superconducting materials and cryogenic ceramics. Under cryogenic conditions, the mechanical, electrical, and thermal properties of these materials undergo significant changes, affecting operational stability. Therefore, accurately measuring these changes in material properties while subjecting them to deformation loading at cryogenic temperatures has become a pressing technical challenge. However, existing integrated cryogenic equipment is often expensive, subject to multiple limitations in terms of site and equipment conditions, and its overall operation is cumbersome. Therefore, designing a cost-effective, easy-to-operate, and easily disassembled cryogenic deformation loading and testing device for superconducting materials is of great significance for in-depth research into the electromechanical properties of materials under extreme cryogenic conditions. Utility Model Content

[0004] This invention aims to address the shortcomings of the prior art by proposing a simple testing device for the mechanical properties of electronic devices under room temperature / low temperature conditions. This device can easily perform tensile and compressive loading on the sample under low temperature conditions and measure the changes in its related mechanical properties.

[0005] Therefore, the present invention adopts the following technical solution:

[0006] A simple testing device for the mechanical properties of electronic devices under room temperature / low temperature conditions includes a tensile testing machine, an insulated container, a sample clamp, and a probe fixing clamp;

[0007] The tensile testing machine is fixed on the ground, and a fixed plate is connected to the tensile head of the tensile testing machine. The tensile testing machine applies tensile force through the fixed plate.

[0008] The heat-insulating bucket is placed on the base of the tensile testing machine, and the bottom of the heat-insulating bucket is fixedly connected to the base of the tensile testing machine;

[0009] The sample clamp includes an upper clamp and a lower clamp. The upper end of the upper clamp is connected to a fixed plate via a pull rod, and the lower end of the upper clamp clamps and connects to the sample to be tested. The lower end of the lower clamp extends into the insulation barrel and is fixedly connected to the bottom of the insulation barrel, and the upper end of the lower clamp clamps and connects to the sample to be tested.

[0010] The probe fixing clamp is fixed to the bottom of the insulation barrel. The probe fixing clamp is T-shaped and includes a vertical section and a horizontal section. The horizontal section is fixed to the insulation barrel. The vertical section is connected to the horizontal section through a sliding groove structure. The distance between the vertical section and the sample to be tested is adjusted by the sliding groove structure. A low-temperature probe is slidably connected to the vertical section. The low-temperature probe is used to photograph the sample to be tested. A locking knob is connected to the low-temperature probe. Rotating the locking knob fixes the position of the low-temperature probe.

[0011] Furthermore, the upper clamp includes an upper clamp interface, an upper clamp base, and an upper clamp fixing block. The upper clamp interface is connected to a pull rod at the top and to a vertical upper clamp base at the bottom. The upper clamp fixing block is bolted to one side of the upper clamp base. The sample to be tested is clamped between the upper clamp base and the upper clamp fixing block.

[0012] Furthermore, the lower clamp includes a lower clamp interface, a lower clamp base, and a lower clamp fixing block. The lower clamp interface is horizontally fixed to the bottom of the insulation barrel, the lower clamp base is vertically connected to the lower clamp base, and the lower clamp fixing block is bolted to one side of the lower clamp base. The sample to be tested is clamped between the lower clamp base and the lower clamp fixing block.

[0013] Furthermore, the insulated bucket is a double-layered stainless steel bucket, with insulation cotton filling the space between the two layers.

[0014] In theory, an ideal loading device should meet the following criteria:

[0015] ① Adjustability of mechanical deformation: The loading device should be able to accurately control the mechanical deformation for different materials and have wide applicability.

[0016] ② Temperature controllability: The device should be able to achieve a wide temperature range from room temperature to 4.2K with small temperature fluctuations to meet different experimental requirements.

[0017] ③ Portability of the device: The device should be easy to install and disassemble and easy to carry, and should be able to effectively apply stress under different environmental conditions.

[0018] ④ Ease of operation: The device should be easy to use and operate, and even non-professionals can perform the experiment.

[0019] ⑤ Accuracy of mechanical deformation testing: The mechanical deformation probe of the device can monitor displacement, strain and other information in real time. At the same time, it can combine various testing methods such as strain gauges and optical fibers to achieve accurate measurement of material deformation and other information.

[0020] The detailed structure of this utility model is as follows:

[0021] The tensile testing machine is a mechanical loading testing machine that can meet the testing requirements of loading forces from 0-200kN. The crossbeam movement speed can be precisely adjusted within the range of 0.05-500mm / min. By precisely controlling the movement of the crossbeam, this tensile testing machine can apply continuous loads to the specimen under low-temperature conditions to simulate the mechanical loading conditions in actual applications. The tensile testing machine achieves the application of mechanical loads by moving the crossbeam up and down in the Y direction. A fixed plate is located below the crossbeam of the tensile testing machine. The fixed plate is fixed to the stainless steel groove below by special bolts. The stainless steel groove has a T-shaped groove. The top of the tie rod has the same T-shaped structure as the groove. The two are riveted together by a mortise and tenon structure, and then the external fixing bolts are tightened to achieve the transfer of mechanical loads.

[0022] The insulated container has a bottom diameter of 60cm and a height of 80cm, and both the inner and outer layers are made of stainless steel. Temperature control from room temperature to a cryogenic environment is achieved by filling the container with liquid nitrogen or liquid helium. Insulation material is filled between the two layers of the container to maintain a stable internal temperature. A slot at the bottom of the container allows it to connect with the base of a tensile testing machine; a drain port on the side of the bottom allows for the discharge of liquid nitrogen or helium, enabling the recycling of liquid nitrogen. An insulated lid is fitted to the top of the container to prevent the leakage of liquid nitrogen and avoid temperature fluctuations. An opening at the top of the lid allows the connecting wires of the tensile testing machine's loading rod and cryogenic probe to pass through.

[0023] The insulated container contains a sample clamp for fixing the test sample and the low-temperature probe. The sample clamp consists of an upper clamp and a lower clamp, which are fixed to the middle of the upper and lower bases with bolts. The sample is then secured between the upper and lower clamps and their corresponding fixing blocks via bolts. A frosted gasket is added between the clamps and the fixing blocks to enhance friction with the sample. A probe clamp is installed directly opposite the surface of the test sample. To ensure the stability of the probe clamp, a stainless steel support plate is added to the back of the probe clamp.

[0024] The beneficial effects of this invention are as follows: The electromagnetic intelligent material mechanical property testing device under room temperature / low temperature conditions can conveniently realize the loading and control of materials under different temperature environments and different deformation conditions. This device is easy to install and carry, simple to operate, and can be directly used to monitor key information such as strain and displacement during the deformation process of materials at different temperatures in real time. Both the applied stress and deformation are adjustable, making it widely applicable to electromagnetic intelligent materials. The method of use is simple, enabling effective stress loading and unloading under different environments. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0026] Figure 2 Schematic diagram of the device for fixing and loading mechanical deformation of the testing equipment inside the thermal insulation barrel;

[0027] In the diagram: 1-Tensile testing machine, 2-Fixed plate, 3-Stainless steel slot, 4-Pull rod, 5-Upper interface of clamp, 6-Insulation barrel, 7-Upper base of clamp, 8-Upper clamp, 9-Sample to be tested, 10-Probe fixing clamp, 11-Lower clamp, 12-Lower base of clamp, 13-Lower interface of clamp, 14-Slot, 15-Discharge port, 16-Insulation barrel bracket, 17-Upper clamp fixing block, 18-Locking knob, 19-Low temperature probe, 20-Stainless steel fixing plate, 21-Sliding slot, 22-Lower clamp fixing block. Detailed Implementation

[0028] like Figure 1 and 2 As shown, a simple testing device for the mechanical properties of electronic devices under room temperature / low temperature conditions is provided.

[0029] The method of using this utility model is as follows:

[0030] Before the experiment begins, first align the slot 14 below the insulation bucket 6 with the interface above the base of the tensile testing machine 1, and fix them with bolts. Next, fix the sample 9 to be tested on the lower clamp 11 inside the insulation bucket 6. After fixing the lower clamp 11 and the lower clamp fixing block 22 with bolts, place the lower clamp interface 13 on the lower base 12 of the clamp onto the fixing post above the insulation bucket and fix it with bolts. Then, fix the upper part of the sample to be tested with the upper clamp 8 and the upper clamp fixing block 17. After the sample to be tested is installed, the probe fixing clamp 10 is installed in the sliding slot 21 in the lower base 12 of the clamp. The distance between the probe fixing clamp 10 and the sample 9 to be tested is adjusted by moving the probe fixing clamp 10 in the sliding slot 21 to ensure that the low temperature probe 19 can clearly observe the surface morphology of the sample 9 to be tested. The probe fixing clamp 10 is fixed to the lower base 12 of the clamp with bolts. Then, the locking knob 18 on the top of the probe fixing clamp 10 is rotated to adjust the height of the low temperature probe 19 so that it can observe the surface morphology of the sample 9 to be tested, thereby realizing real-time monitoring of the surface information of the sample to be tested during the loading process.

[0031] Then, by adjusting the height of the movable crossbeam above the tensile testing machine 1, the base 7 of the clamp of the material fixing fixture below is connected to the tensile testing machine pull rod 4. Above the pull rod 4 is a stainless steel slot 3 with a T-shaped groove. The stainless steel slot 3 is connected to the fixing block of the fixing plate 2 of the tensile testing machine by fixing bolts. The stainless steel fixing block 3 is connected to the tensile testing machine 1 by bolts above, so as to realize the transfer of load from the tensile testing machine 1 to the pull rod 4 to the fixing fixture 8 to the sample 9 under test.

[0032] Subsequently, the positions of the test sample 9 and the cryogenic probe 19 are installed and adjusted, and the test leads of the cryogenic probe 19 are led to the outside of the container for real-time monitoring and data acquisition. After the test sample 9 and the cryogenic probe 19 are installed, the drain port 15 on the container is closed, and liquid nitrogen (liquid helium) is poured into the insulated container. After the internal temperature of the insulated container stabilizes, a cryogenic thermometer is used to measure the internal temperature of the insulated container to determine whether the experimental conditions have been met. Once the temperature stabilizes, the insulated lid is closed to prevent the evaporation of liquid nitrogen (liquid helium) inside the insulated container. Then, the tensile testing machine 1 is started to apply mechanical loading to the test sample 9. After the experiment is completed, the tensile testing machine 1 is closed, and the drain port 15 is opened to drain the liquid nitrogen (liquid helium) inside the insulated container for recovery and reuse. After the liquid nitrogen (liquid helium) inside the insulated container is completely drained, the insulated lid is opened, and the internal temperature of the insulated container is allowed to return to room temperature. Different experiments can then be conducted by changing the test sample.

Claims

1. A simple testing device for the mechanical properties of electronic devices under room temperature / low temperature conditions, characterized in that, Includes a tensile testing machine (1), an insulated container (6), a specimen clamp, and a probe fixing clamp (10); The tensile testing machine (1) is fixed on the ground. A fixed plate (2) is connected to the tensile head of the tensile testing machine (1). The tensile testing machine (1) applies tensile force through the fixed plate (2). The heat preservation bucket (6) is placed on the base of the tensile testing machine (1), and the bottom of the heat preservation bucket (6) is fixedly connected to the base of the tensile testing machine (1); The sample clamp includes an upper clamp (8) and a lower clamp (11). The upper end of the upper clamp (8) is connected to the fixed plate (2) via a pull rod (4), and the lower end of the upper clamp (8) clamps and connects to the sample to be tested (9). The lower end of the lower clamp extends into the heat preservation barrel (6) and is fixedly connected to the bottom of the heat preservation barrel (6). The upper end of the lower clamp clamps and connects to the sample to be tested (9). The probe fixing clamp (10) is fixed to the bottom of the heat preservation barrel (6). The probe fixing clamp (10) is T-shaped and includes a vertical section and a horizontal section. The horizontal section is fixed on the heat preservation barrel (6). The vertical section is connected to the horizontal section through a sliding groove structure. The distance between the vertical section and the sample (9) to be tested is adjusted through the sliding groove structure. A low temperature probe is slidably connected on the vertical section. The low temperature probe is used to photograph the sample (9) to be tested. A locking knob (18) is connected on the low temperature probe. Rotating the locking knob (18) fixes the position of the low temperature probe.

2. The simplified testing device for the mechanical properties of electronic devices under room temperature / low temperature conditions according to claim 1, characterized in that, The upper clamp (8) includes an upper clamp interface (5), an upper clamp base (7), and an upper clamp fixing block (17). The upper clamp interface (5) is connected to a pull rod (4) at the top and to a vertical upper clamp base (7) at the bottom. The upper clamp fixing block (17) is bolted to one side of the upper clamp base (7). The sample to be tested (9) is clamped between the upper clamp base (7) and the upper clamp fixing block (17).

3. The simplified testing device for the mechanical properties of electronic devices under room temperature / low temperature conditions according to claim 1, characterized in that, The lower clamp includes a lower clamp interface (13), a lower clamp base (12), and a lower clamp fixing block (22). The lower clamp interface (13) is horizontally fixed to the bottom of the heat preservation barrel (6). The lower clamp base (12) is vertically connected to the lower clamp base (12). The lower clamp fixing block (22) is bolted to one side of the lower clamp base (12). The sample to be tested (9) is clamped between the lower clamp base (12) and the lower clamp fixing block (22).

4. The simplified testing device for the mechanical properties of electronic devices under room temperature / low temperature conditions according to claim 1, characterized in that, The insulated bucket (6) is a double-layered stainless steel bucket with insulation cotton filling between the two layers.

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