Probe for spot measurement of semiconductor chip, probe clamp and spot measurement device

Abstract

The utility model relates to the technical field of chip testing, and discloses a probe for semiconductor chip spot measurement, a probe clamp and a spot measurement device, the probe comprises a main probe and a secondary probe, the head part of the secondary probe is connected with the main probe; the head part of the main needle is provided with a needle head, the included angle between the needle head and the needle body of the main needle is an obtuse angle, the tail part of the main needle and the tail part of the secondary needle are respectively provided with a needle tail, and the included angle between the needle body of the main needle and the needle body of the secondary needle is an acute angle. According to the utility model, the problem that the existing probe is large in resistance is solved, so that the voltage result of a large-current product is more stable.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a probe, probe fixture and testing device for spot testing of semiconductor chips. Background Technology

[0002] The mainstream pressure measurement methods currently used on testing equipment are the constant current two-wire pressure measurement method and the four-wire pressure measurement method (Kelvin method). The two-wire pressure measurement method, for example... Figure 1 As shown, the method of testing a single chip using two wire probes can simultaneously test four chips on an existing 8-probe machine, resulting in high production efficiency. However, the two-wire voltage testing method is highly unstable when measuring high-current chip products due to the influence of line resistance and probe contact resistance. The four-wire voltage testing method, as shown... Figure 2 As shown, a four-wire probe method is used to test one core chip. This method can greatly reduce the influence of line resistance and contact resistance, thus resulting in accurate measurement results. However, the four-wire voltage testing method on an 8-probe machine can only test two core chips simultaneously. When the machine is idle, two current sources are used, reducing production efficiency by half compared to the two-wire voltage testing method, leading to capacity bottlenecks and waste. Furthermore, as... Figure 3 As shown, existing probe fixtures occupy a large space in the chuck, resulting in a narrow testing space that is difficult to apply in practice. Utility Model Content

[0003] Purpose of the utility model: To address the problems existing in the prior art, this utility model provides a probe, probe holder, and testing device for semiconductor chip point testing. This utility model can solve the problem of high resistance in existing probes, resulting in more stable voltage measurement results for high-current products.

[0004] Technical solution: In a first aspect, this utility model provides a probe for spot testing of semiconductor chips, comprising: a main needle and a secondary needle, wherein the head of the secondary needle is connected to the main needle; the head of the main needle has a needle tip, the included angle D between the needle tip and the needle body of the main needle is an obtuse angle, the tail of the main needle and the tail of the secondary needle both have needle tails, and the included angle α between the needle body of the main needle and the needle body of the secondary needle is an acute angle.

[0005] Conventional four-wire methods use two independent single needles, with voltage and current measured in parallel via two parallel lines. Two-wire methods use a single series line for voltage and current measurement. Voltage measurements can be inaccurate due to increased current and line resistance. This invention addresses this by using a point-testing probe with a main and secondary needle connected to the needle tip. Before the connection point of the main and secondary needles, voltage and current are measured in parallel via two parallel lines. The line resistance is reduced to the portion from the needle tip to the connection point, thus mitigating the problem of high line resistance in two-wire voltage measurement. The circuit diagrams for four-wire, two-wire, and probe measurements using this invention are shown below. Figure 11 .

[0006] Furthermore, current two-wire systems use 8 pins to test 4 chips, with four series connections, primarily for testing low-current products; four-wire systems use 8 pins to test 2 chips, with two parallel connections, primarily for testing high-current products. Therefore, each time a product is switched, the wires from the ESD discharge box to the probe section need to be unplugged and replaced (the wires from the current source to the ESD discharge box remain unchanged). During this process, personnel can easily mistakenly connect the wires between the four chips (e.g., the wires for testing the third chip and the wires for testing the fourth chip are reversed). This invention, by setting up a point-testing probe with a main pin and a secondary pin connected to the pin head, enables the use of 8 pins to test 4 chips for all products, eliminating the need for wire-changing when switching products, thus avoiding the problem of incorrect wiring.

[0007] Furthermore, the included angle α between the main needle body and the secondary needle body is 10°±1°.

[0008] Furthermore, the distance I between the connection point of the main needle and the secondary needle and the head of the main needle is ≤ 1.9 mm.

[0009] The connection point between the main needle and the secondary needle is left at a certain distance from the head of the main needle to make it easier to replace the probe.

[0010] Furthermore, the included angle D between the needle tip and the body of the main needle is 120°±2°.

[0011] Preferably, the included angle E between the needle tail and the needle body of the main needle is 90°±1°;

[0012] The angle G between the needle tail and the needle body of the secondary needle is 90°±1°.

[0013] Furthermore, the height B of the needle is 3±0.2mm, and the taper is 7±1.

[0014] Secondly, this utility model provides a probe holder for accommodating the probe described in any of the above claims, and is provided with a clamp for placing the probe, the clamp having a positioning hole that matches the tail of the probe, and the probe being fixed to the clamp by fasteners.

[0015] Furthermore, the clamp includes a first clamp and a second clamp for respectively placing the main needle and the secondary needle. The main needle is fixed to the first clamp by a first fastener, and the secondary needle is fixed to the second clamp by a second fastener.

[0016] Furthermore, the first fastener and the second fastener are symmetrically arranged with respect to the central axis of the clamp;

[0017] Alternatively, the first fastener and the second fastener may be misaligned relative to the central axis of the clamp.

[0018] Thirdly, this utility model provides a point-testing device for measuring the electrical parameters of a semiconductor chip, including the probe fixture described in any of the above claims.

[0019] Beneficial effects: Compared with the prior art, the specific beneficial effects of this utility model are as follows:

[0020] 1. The probe of this utility model adopts a main needle and secondary needle design, and the head of the secondary needle is welded to the main needle, which reduces the problem of large normal resistance of two-wire voltage measurement and makes the voltage measurement results of high current products more stable.

[0021] 2. The fasteners in the probe fixture of this utility model can adopt a staggered design, which saves test space and can be compatible with normal measurement of core particles of different sizes;

[0022] 3. This utility model can avoid wiring errors caused by switching between two-wire and four-wire products, thus avoiding the risk of customer complaints;

[0023] 4. This utility model adopts a two-wire voltage measurement method, which makes full use of equipment resources and doubles the production efficiency of high-current products, increasing production capacity by 35%+. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the two-wire pressure measurement method;

[0025] Figure 2 This is a schematic diagram of the four-wire pressure measurement method;

[0026] Figure 3 This is a schematic diagram of a probe clamp in the prior art;

[0027] Figure 4 This is a schematic diagram of the probe structure for semiconductor chip point testing in Implementation 1, where (a) is a side view and (b) is a top view;

[0028] Figure 5 The diagram shows a schematic of the probe clamp part in Embodiment 1 (left) and a detailed view of the probe clamp part in Embodiment 1 (right).

[0029] Figure 6 This is a schematic diagram of the probe fixture in Implementation Method 1;

[0030] Figure 7 This is a schematic diagram of the probe structure for semiconductor chip point testing in Embodiment 2, where (a) is a side view and (b) is a top view;

[0031] Figure 8 The diagram shows a schematic of the probe clamp part in Embodiment 2 (left) and a detailed view of the probe clamp part in Embodiment 2 (right).

[0032] Figure 9This is a schematic diagram of the probe fixture in Implementation Method 2;

[0033] Figure 10 This is a perspective view of the probe for spot testing of a semiconductor chip in Embodiment 1, wherein (a) is a top view and (b) is a side view;

[0034] Figure 11 A schematic diagram of the timing device circuit for four-wire measurement (left), two-wire measurement (middle), and probe measurement designed in this invention (right);

[0035] Diagram description: 1. Main needle; 2. Secondary needle; 3. Connection point; 4. Needle tail; 5. Needle tip; 6. First fastener; 7. Second fastener; 8. First chuck; 9. Second chuck; 10. First positioning hole; 11. Second positioning hole. Detailed Implementation

[0036] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0037] Implementation method 1:

[0038] This embodiment provides a probe for spot testing of a semiconductor chip, such as... Figure 4 As shown, the details are as follows:

[0039] The probe for semiconductor chip testing is made of silver-copper-palladium alloy and includes a main probe 1 and a secondary probe 2. The head of the secondary probe 2 is welded to the body of the main probe 1 to form a connection point 3. The distance between the connection point 3 and the head of the main probe 1 is I = 1.9 mm. The angle α between the body of the secondary probe 2 and the body of the main probe 1 is 10°±1°. The length of the main probe 1 is A = 14.2±0.2 mm. The head of the main probe 1 has a needle tip 5. The angle D between the needle tip 5 and the body of the main probe 1 is 120°±2°. The height of the needle tip 5 is B = 3±0.2 mm. The taper of the needle tip 5 is 7. ±1; The main needle 1 has a needle tail 4 at its tail end, with an angle E = 90°±1° between the needle tail 4 and the main needle 1 body, and a height C = 1.8±0.2mm; The secondary needle 2 has a body length F = 12.5±0.2mm, a needle tail 4 at its tail end, with an angle G = 90°±1° between the needle tail 4 and the secondary needle 2 body, and a height H = 1.8±0.2mm; The radii of the secondary needle 2 and the main needle 1 are both 0.5±0.05mm.

[0040] This embodiment also provides a probe holder, such as Figure 5-6The probe holder is made of brass and includes a first clamp 8 and a second clamp 9 for holding the main needle 1 and the secondary needle 2 respectively. The first clamp 8 is provided with a first fastener 6 and a first positioning hole 10, and the second clamp 9 is provided with a second fastener 7 and a second positioning hole 11. The first fastener 6 and the second fastener 7 are symmetrically arranged with respect to the central axis of the clamp. The main needle 1 is fastened to the first clamp 8 by the first fastener 6 and the main needle tail 4 is inserted into the first positioning hole 10. The secondary needle 2 is fastened to the second clamp 9 by the second fastener 7 and the secondary needle tail 4 is inserted into the second positioning hole 11, thereby fixing the probe on the probe holder.

[0041] Optionally, the first fastener 6 and the second fastener 7 are fixing screws, both located at the upper part of the chuck, with a fixing screw width L=3mm and a fixing screw length M=5.4mm.

[0042] This embodiment also provides a spot testing device for spot testing the electrical parameters of a semiconductor chip. The probe clamp is fastened in the spot testing device by fasteners. When spot testing the semiconductor chip, the probe tip faces the electrode of the chip to be tested.

[0043] Implementation Method 2:

[0044] This embodiment provides a probe for spot testing of a semiconductor chip, such as... Figure 7 As shown, the details are as follows:

[0045] The probe for semiconductor chip testing is made of silver-copper-palladium alloy and includes a main probe 1 and a secondary probe 2. The head of the secondary probe 2 is welded and fixed to the head of the main probe 1. The angle α between the body of the secondary probe 2 and the body of the main probe 1 is 10°±1°. The body length of the main probe 1 is A = 14.2±0.2mm. The head of the main probe 1 has a needle tip 5. The angle D between the needle tip 5 and the body of the main probe 1 is 120°±2°. The height of the needle tip 5 is B = 3±0.2mm, and the taper of the needle tip 5 is 7. ±1; The main needle 1 has a needle tail 4 at its tail end, with an angle E = 90°±1° between the needle tail 4 and the main needle 1 body, and a height C = 1.8±0.2mm; The secondary needle 2 has a body length F = 14.2±0.2mm, a needle tail 4 at its tail end, with an angle G = 90°±1° between the needle tail 4 and the secondary needle 2 body, a height H = 1.8±0.2mm, and a body length F = 12.5±0.2mm; The radii of the secondary needle 2 and the main needle 1 are both 0.5±0.05mm.

[0046] This embodiment also provides a probe holder, such as Figure 8-9It is largely the same as embodiment 1, except that in this embodiment, the first fastener 6 and the second fastener 7 are offset relative to the central axis of the clamp; optionally, the first fastener 6 and the second fastener 7 are fixing screws, the first fastener 6 is located at the top of the first chuck 8, and the second fastener 7 is located at the middle of the second chuck 9.

[0047] Apart from the above, this implementation method is exactly the same as implementation method 1, and will not be described again here.

[0048] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent transformations or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. A probe for spot testing of a semiconductor chip, characterized in that, include: The primary needle and the secondary needle are provided, with the head of the secondary needle connected to the primary needle. The head of the primary needle has a needle tip, and the angle D between the needle tip and the body of the primary needle is an obtuse angle. The tails of both the primary needle and the secondary needle have needle tails, and the angle α between the body of the primary needle and the body of the secondary needle is an acute angle.

2. The probe for spot testing of semiconductor chips according to claim 1, characterized in that: The angle α between the main needle and the secondary needle is 10°±1°.

3. The probe for spot testing of semiconductor chips according to claim 1, characterized in that: The distance I between the connection point of the main needle and the secondary needle and the head of the main needle is ≤ 1.9 mm.

4. The probe for spot testing of semiconductor chips according to claim 1, characterized in that: The included angle D between the needle tip and the body of the main needle is 120°±2°.

5. The probe for spot testing of a semiconductor chip according to claim 1, characterized in that: The included angle E between the needle tail and the needle body of the main needle is 90°±1°; The angle G between the needle tail and the needle body of the secondary needle is 90°±1°.

6. The probe for spot testing of a semiconductor chip according to claim 1, characterized in that: The height of the needle is B = 3 ± 0.2 mm, and the taper is 7 ± 1.

7. A probe holder, characterized in that, For accommodating the probe according to any one of claims 1-5, a clamp is provided for placing the probe, the clamp having a positioning hole that matches the tail of the probe, and the probe is fixed to the clamp by fasteners.

8. The probe holder according to claim 7, characterized in that: The clamp includes a first clamp and a second clamp for respectively holding the main needle and the secondary needle. The main needle is fixed to the first clamp by a first fastener, and the secondary needle is fixed to the second clamp by a second fastener.

9. The probe holder according to claim 8, characterized in that: The first fastener and the second fastener are symmetrically arranged with respect to the central axis of the clamp; Alternatively, the first fastener and the second fastener may be misaligned relative to the central axis of the clamp.

10. A point measurement device, characterized in that, The probe holder includes any one of claims 7-9.

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