ITO photoetching wiring liquid crystal display connecting device based on multi-mode regulation and control

Abstract

The utility model relates to the technical field of liquid crystal display screens, and discloses an ITO photoetching wiring liquid crystal display connecting device based on multi-mode regulation and control, which comprises a screen frame and a connecting block, the inner wall of the screen frame is provided with an ITO wiring mechanism, the front side of the screen frame is fixedly connected with a connecting wire board, and the inner wall of the connecting block is provided with a clamping mechanism; the ITO wiring mechanism comprises a flexible screen plate, the outer wall of the flexible screen plate is arranged in the middle of the inner wall of the screen frame, the top of the flexible screen plate is fixedly connected with an ITO thin film layer, and the top of the ITO thin film layer is fixedly connected with a photoresist layer. According to the utility model, the annular resistance heater and the flexible printing heating film are started, the heater is rapidly heated, local temperature control is carried out on the flexible screen plate, the phase change energy storage layer absorbs heat to stabilize the temperature, and the photoresist layer is ensured to react at the optimal temperature, so that the photoetching development precision of the ITO film layer is optimized, and reversible switching between rigid and flexible states is realized.

Description

Technical Field

[0001] This utility model relates to the field of liquid crystal display technology, and in particular to a liquid crystal display connection device based on ITO photolithography traces and multimodal modulation. Background Technology

[0002] In the field of liquid crystal display technology, ITO photolithography traces are a key structure connecting driving signals and pixel units. Their accuracy and stability directly affect the display effect. With the development of flexible display and high-resolution display technologies, a liquid crystal display connection device based on multi-modal control of ITO photolithography traces has been developed. By integrating temperature control and electric field control modules, it optimizes the photoresist exposure and development process and ITO ion distribution. Combined with composite substrate structure design, it improves the trace resolution, uniformity and mechanical reliability, providing an efficient and stable signal connection solution for rigid and flexible display devices.

[0003] A search revealed Chinese Patent Publication No. CN218767702U, which discloses a liquid crystal display panel and a liquid crystal display device. The liquid crystal display panel includes a liquid crystal cell, a touch function layer, a light-shielding layer, and a first optical adhesive layer. The touch function layer is located on the light-emitting side of the liquid crystal cell. The touch function layer includes touch electrodes and / or touch traces. The touch electrodes are located in the display area, and the touch traces are located at least in the non-display area. The touch electrodes and touch traces are electrically connected. The light-shielding layer is located at least on the side of the touch function layer away from the liquid crystal cell and is located in the non-display area. The orthographic projection of the touch traces on the liquid crystal cell is within the orthographic projection range of the light-shielding layer on the liquid crystal cell. The first optical adhesive layer is located at least on the side of the light-shielding layer away from the liquid crystal cell. The first optical adhesive layer covers the touch function layer in the display area and the light-shielding layer in the non-display area. The technical solution of this utility model can solve the problem of reflection on the edge lines of the liquid crystal display panel and improve the user experience. However, in actual use, traditional ITO conductive materials face insufficient mechanical strength and insufficient conductivity stability when used as traces, which leads to screen flickering or black lines when the liquid crystal screen is in use. Utility Model Content

[0004] To overcome the above shortcomings, this utility model provides an ITO photolithography trace liquid crystal display connection device based on multimodal control, which aims to improve the problems of insufficient mechanical strength and insufficient conductivity stability of traditional ITO conductive materials when used as traces in the prior art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: an ITO lithography trace liquid crystal display connection device based on multimodal control, comprising a screen frame and a connecting block, wherein an ITO trace mechanism is provided on the inner wall of the screen frame, a connecting wire plate is fixedly connected to the front side of the screen frame, and a locking mechanism is provided on the inner wall of the connecting block.

[0006] The ITO wiring mechanism includes a flexible screen panel. The outer wall of the flexible screen panel is located in the middle of the inner wall of the screen frame. An ITO thin film layer is fixedly connected to the top of the flexible screen panel. A photoresist layer is fixedly connected to the top of the ITO thin film layer. A substrate assembly is located in the middle of the bottom end of the flexible screen panel. An annular resistance heater is fixedly connected to the bottom of the flexible screen panel. A uniform heat conduction component is located at the bottom end of the annular resistance heater.

[0007] The above technical solution involves energizing the annular resistance heater and the flexible printed heating film. The annular resistance heater heats up rapidly, while the phase change energy storage layer absorbs heat and stabilizes the temperature to ensure that the photoresist layer is at the optimal reaction temperature. This optimizes the photolithography and development accuracy of the ITO thin film layer. Furthermore, the ITO thin film layer forms micron-level traces through photolithography, and low-resistance signal transmission is achieved through the elastic conductive adhesive layer, protecting the ITO traces from damage when the flexible screen is bent.

[0008] As a further description of the above technical solution:

[0009] The engaging mechanism includes multiple limiting strips, the outer walls of which are respectively fixedly connected to the upper and lower ends of the inner wall of the connecting block. U-shaped blocks are slidably connected to adjacent sides of the two limiting strips on the left and right sides. Rollers are rotatably connected to the inner wall of the U-shaped blocks. Compression springs are fixedly connected to the outer wall of the U-shaped blocks. The other end of the compression springs is fixedly connected to the inner wall of the connecting block. Inclined grooves are provided on the left and right sides of the outer wall of the connecting plate.

[0010] The above technical solution works as follows: when the connector plate is inserted into the connector block, the roller rolls along the inclined groove, the compression spring is compressed first, and then during the release of elastic potential energy, it pushes the U-shaped blocks on both sides to move relative to each other, ensuring that the connector plate and the connector block are in stable contact. The limiting strip restricts the displacement range of the U-shaped block to prevent excessive compression from causing poor contact. Thus, under the push of the compression spring, the connector plate and the connector block are firmly connected together.

[0011] As a further description of the above technical solution:

[0012] The substrate assembly includes an elastic conductive adhesive layer, the top of which is fixedly connected to the middle of the bottom end of the flexible screen panel, and a phase change energy storage layer is fixedly connected to the bottom end of the elastic conductive adhesive layer.

[0013] Through the above technical solutions: the elastic conductive adhesive layer enables low-resistance signal transmission, protects the ITO traces from damage when the flexible screen is bent, and when used in flexible scenarios, the phase change energy storage layer cools and cures, enhancing the rigidity of the substrate.

[0014] As a further description of the above technical solution:

[0015] The uniform heat conduction component includes a flexible printed heating film, the top end of which is fixedly connected to the bottom end of the flexible screen, and a honeycomb buffer plate is fixedly connected to the middle of the top end of the flexible printed heating film.

[0016] Through the above technical solution: the flexible printed heating film generates heat evenly through graphene conductive ink, thereby achieving local temperature control of the flexible screen panel, and the honeycomb buffer plate can disperse stress.

[0017] As a further description of the above technical solution:

[0018] The top of the connecting plate is fixedly connected with multiple reinforcing columns, and the front end of the connecting block is provided with a heat dissipation vent.

[0019] Through the above technical solutions: the reinforcing column is used to enhance the mechanical strength of the connection between the connecting board and the screen frame, improve the overall structural reliability, and the heat dissipation port provides a heat dissipation channel for the electronic components inside the connecting block, accelerates air convection, and avoids the accumulation of heat in the connector components due to long-term operation, which affects the conductivity and service life.

[0020] As a further description of the above technical solution:

[0021] A connector is fixedly connected to the bottom front side of the connecting plate, and the outer wall dimension of the connecting plate is the same as the inner wall dimension of the connecting block.

[0022] The above technical solution provides a terminal interface for signal transmission, ensuring reliable connection to external circuits or driver chips. The outer wall dimensions of the connector board are consistent with the inner wall dimensions of the connector block, guaranteeing precise alignment between the connector board and the connector block and preventing jamming or poor contact due to dimensional deviations.

[0023] As a further description of the above technical solution:

[0024] The outer wall of the honeycomb buffer plate is fixedly connected to the bottom of the inner wall of the annular resistance heater, and the top of the photoresist layer is fixedly connected to the top of the inner wall of the screen frame.

[0025] Through the above technical solution: the outer wall of the honeycomb buffer plate is fixedly connected to the bottom of the inner wall of the annular resistance heater, forming an elastic buffer layer between the annular resistance heater and the flexible screen panel to absorb the thermal stress generated during the heating process. The top of the photoresist layer is fixedly connected to the top of the inner wall of the screen frame to fix the position of the photoresist layer and ensure that the photoresist layer does not shift or fall off during the etching process of the ITO thin film layer.

[0026] As a further description of the above technical solution:

[0027] The outer wall of the roller engages with the inner wall of the inclined groove, and the inner wall size of the connecting block is the same as the outer wall size of the U-shaped block.

[0028] Through the above technical solution: the outer wall of the roller engages with the inner wall of the inclined groove, converting the axial force when the connecting plate is inserted into the rolling friction force of the roller, reducing the insertion resistance. The inner wall size of the connecting block is the same as the outer wall size of the U-shaped block, ensuring that the elastic force of the compression spring is evenly applied to the connecting plate, avoiding loosening of the connection due to excessive gap or jamming due to insufficient gap.

[0029] This utility model has the following beneficial effects:

[0030] 1. In this utility model, by activating the annular resistance heater and the flexible printed heating film, the heater rapidly heats up, thereby controlling the local temperature of the flexible screen. The phase change energy storage layer absorbs heat to stabilize the temperature, ensuring that the photoresist layer reacts at the optimal temperature. The ITO thin film layer forms micron-level traces through photolithography. The elastic conductive adhesive layer enables low-resistance signal transmission. The honeycomb buffer plate disperses stress and protects the ITO traces. The phase change energy storage layer and the elastic conductive adhesive layer work together to optimize the photolithography and development accuracy of the ITO thin film layer, thereby achieving reversible switching between rigid and flexible states.

[0031] 2. In this utility model, when the connecting plate is inserted into the connecting block, the roller rolls in the inclined groove, compressing the compression spring. When the compression spring is released, it pushes the U-shaped block to move, ensuring stable contact between the connecting plate and the connecting block. The limiting strip restricts the movement of the U-shaped block to avoid excessive compression, thereby ensuring a firm connection between the connecting plate and the connecting block. Attached Figure Description

[0032] Figure 1 This is a perspective view of an ITO lithography-based liquid crystal display connection device based on multimodal modulation proposed in this utility model.

[0033] Figure 2 This is a front view of an ITO lithography-based liquid crystal display connection device based on multimodal modulation proposed in this utility model;

[0034] Figure 3 This is a cross-sectional view of an ITO lithography-based liquid crystal display connection device based on multimodal modulation proposed in this utility model.

[0035] Figure 4 for Figure 3 A magnified view of point A;

[0036] Figure 5 This is a cross-sectional view of the ITO routing mechanism of an ITO photolithography routing liquid crystal display connection device based on multimodal control proposed in this utility model.

[0037] Figure 6This is an exploded view of the ITO routing mechanism of an ITO photolithography routing liquid crystal display connection device based on multimodal control proposed in this utility model.

[0038] Figure 7 This is a cross-sectional view of a flexible screen panel of an ITO lithography-based liquid crystal display connection device based on multimodal control, as proposed in this utility model.

[0039] Legend:

[0040] 1. Screen frame; 2. ITO wiring mechanism; 201. Photoresist layer; 202. ITO thin film layer; 203. Substrate assembly; 2031. Elastic conductive adhesive layer; 2032. Phase change energy storage layer; 204. Ring resistance heater; 205. Uniform heat conduction component; 2051. Flexible printed heating film; 2052. Honeycomb buffer plate; 206. Flexible screen panel; 3. Clamping mechanism; 301. Limiting strip; 302. U-shaped block; 303. Roller; 304. Compression spring; 305. Inclined groove; 4. Connecting block; 5. Connecting board; 6. Reinforcing column; 7. Heat dissipation vent; 8. Wiring connector. Detailed Implementation

[0041] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0042] Reference Figure 1 , Figure 5 and Figure 7This utility model provides an embodiment of an ITO photolithography-based liquid crystal display connection device, comprising a screen frame 1 and a connecting block 4. An ITO wiring mechanism 2 is provided on the inner wall of the screen frame 1, and a connecting line plate 5 is fixedly connected to the front side of the screen frame 1. A locking mechanism 3 is provided on the inner wall of the connecting block 4. The ITO wiring mechanism 2 includes a flexible screen panel 206, the outer wall of which is located in the middle of the inner wall of the screen frame 1. An ITO thin film layer 202 is fixedly connected to the top of the flexible screen panel 206. The ITO thin film layer 202 forms micron-level wiring through photolithography, and low-resistance signal transmission is achieved through an elastic conductive adhesive layer 2031. A photoresist layer 201 is fixedly connected to the top of the ITO thin film layer 202. A substrate assembly 203 is provided in the middle of the bottom end of the flexible screen panel 206, and a ring-shaped resistance heater 204 is fixedly connected to the bottom of the flexible screen panel 206. A uniform heat-conducting component 2 is provided at the bottom end of the ring-shaped resistance heater 204. 05. When the annular resistance heater 204 and the flexible printed heating film 2051 are energized, the annular resistance heater 204 heats up rapidly. At this time, the flexible printed heating film 2051 heats up uniformly through the graphene conductive ink, and together they perform local temperature control on the flexible screen 206. The substrate assembly 203 includes an elastic conductive adhesive layer 2031. The top of the elastic conductive adhesive layer 2031 is fixedly connected to the middle of the bottom end of the flexible screen 206. The elastic conductive adhesive layer 2031 maintains signal conduction through its own deformation. A phase change energy storage layer 2032 is fixedly connected to the bottom end of the elastic conductive adhesive layer 2031. The phase change energy storage layer 2032 absorbs heat and stabilizes the temperature to ensure that the photoresist layer 201 is at the optimal reaction temperature. The uniform heat conduction assembly 205 includes a flexible printed heating film 2051. The top of the flexible printed heating film 2051 is fixedly connected to the bottom end of the flexible screen 206. A honeycomb buffer plate 2052 is fixedly connected to the middle of the top of the flexible printed heating film 2051.

[0043] Specifically, when the annular resistance heater 204 and the flexible printed heating film 2051 are energized, the annular resistance heater 204 heats up rapidly. At this time, the flexible printed heating film 2051 heats up uniformly through the graphene conductive ink, jointly controlling the local temperature of the flexible screen 206. The phase change energy storage layer 2032 absorbs heat and stabilizes the temperature to ensure that the photoresist layer 201 is at the optimal reaction temperature, thereby optimizing the photolithography and development accuracy of the ITO thin film layer 202. Furthermore, the ITO thin film layer 202 forms micron-level traces through photolithography, and low-resistance signal transmission is achieved through the elastic conductive adhesive layer 2031. The honeycomb buffer plate 2052 can disperse stress and protect the ITO traces from damage when the flexible screen 206 is bent. When used in a flexible environment, the phase change energy storage layer 2032 cools down and solidifies, enhancing the rigidity of the substrate. The elastic conductive adhesive layer 2031 maintains signal conduction through its own deformation. When it is necessary to restore the rigid state, the phase change energy storage layer 2032 absorbs heat and softens, and the substrate regains its flexibility, thereby achieving reversible switching between rigid and flexible states.

[0044] Reference Figure 3 and Figure 4 The engaging mechanism 3 includes multiple limiting strips 301. The outer walls of the multiple limiting strips 301 are fixedly connected to the upper and lower ends of the inner wall of the connecting block 4. U-shaped blocks 302 are slidably connected to the adjacent sides of the two limiting strips 301 on the left and right sides. Rollers 303 are rotatably connected to the inner walls of the U-shaped blocks 302. Compression springs 304 are fixedly connected to the outer walls of the U-shaped blocks 302. When the connecting plate 5 is inserted into the connecting block 4, the rollers 303 roll along the inclined grooves 305. The compression springs 304 are compressed first, and then, during the release of elastic potential energy, they push the U-shaped blocks 302 on both sides to move relative to each other, ensuring that the connecting plate 5 and the connecting block 4 are in stable contact. The other end of the compression springs 304 is fixedly connected to the inner wall of the connecting block 4. Inclined grooves 305 are provided on the left and right sides of the outer wall of the connecting plate 5.

[0045] Specifically, when the connecting plate 5 is inserted into the connecting block 4, the roller 303 rolls along the inclined groove 305, the compression spring 304 is compressed first, and then during the release of elastic potential energy, it pushes the U-shaped blocks 302 on both sides to move relative to each other, ensuring that the connecting plate 5 and the connecting block 4 are in stable contact. The limiting strip 301 will limit the displacement range of the U-shaped block 302 to prevent excessive compression from causing poor contact. Thus, under the push of the compression spring 304, the connecting plate 5 and the connecting block 4 are firmly connected together.

[0046] Reference Figure 2 , Figure 5 and Figure 6 The top of the connecting plate 5 is fixedly connected with multiple reinforcing columns 6, which are used to enhance the mechanical strength of the connection between the connecting plate 5 and the screen frame 1. The front end of the connecting block 4 is provided with a heat dissipation vent 7, which provides a heat dissipation channel for the electronic components inside the connecting block 4. The bottom front end of the connecting plate 5 is fixedly connected with a connector 8, which is the terminal interface for signal transmission. The outer wall size of the connecting plate 5 is the same as the inner wall size of the connecting block 4 to ensure precise alignment between the connecting plate 5 and the connecting block 4. The outer wall of the honeycomb buffer plate 2052 is connected to the annular resistance heating element. The bottom of the inner wall of the device 204 is fixedly connected to form an elastic buffer layer between the annular resistance heater 204 and the flexible screen 206. The top of the photoresist layer 201 is fixedly connected to the top of the inner wall of the screen frame 1 to fix the position of the photoresist layer 201. The outer wall of the roller 303 engages with the inner wall of the inclined groove 305 to convert the axial force when the connecting plate 5 is inserted into the rolling friction force of the roller 303. The inner wall size of the connecting block 4 is the same as the outer wall size of the U-shaped block 302 to ensure that the elastic force of the compression spring 304 is evenly applied to the connecting plate 5.

[0047] Specifically, the reinforcing column 6 is used to enhance the mechanical strength of the connection between the connecting plate 5 and the screen frame 1, preventing the connecting plate 5 from breaking or falling off due to external pulling, and improving the overall structural reliability. The heat dissipation vent 7 provides a heat dissipation channel for the electronic components inside the connecting block 4, accelerates air convection, and avoids the accumulation of heat generated by the connector 8 during long-term operation, which would affect the conductivity and service life. The connector 8 is the terminal interface for signal transmission and can be reliably connected to external circuits or driver chips. The outer wall size of the connecting plate 5 is consistent with the inner wall size of the connecting block 4, ensuring precise alignment between the connecting plate 5 and the connecting block 4 and avoiding jamming or poor contact due to size deviation. The outer wall of the honeycomb buffer plate 2052 is fixedly connected to the bottom of the inner wall of the annular resistance heater 204. An elastic buffer layer is formed between the annular resistance heater 204 and the flexible screen panel 206 to absorb the thermal stress generated during the heating process. The top of the photoresist layer 201 is fixedly connected to the top of the inner wall of the screen frame 1 to fix the position of the photoresist layer 201 and ensure that the photoresist layer 201 does not shift or fall off during the etching process of the ITO thin film layer 202. The outer wall of the roller 303 engages with the inner wall of the inclined groove 305 to convert the axial force when the connecting plate 5 is inserted into the rolling friction force of the roller 303, thereby reducing the insertion resistance. The inner wall size of the connecting block 4 is the same as the outer wall size of the U-shaped block 302 to ensure that the elastic force of the compression spring 304 is evenly applied to the connecting plate 5, avoiding loosening of the connection due to excessive gap or jamming due to insufficient gap.

[0048] Working principle: First, when current is applied to the annular resistance heater 204 and the flexible printed heating film 2051, the annular resistance heater 204 rapidly increases its temperature. Simultaneously, the flexible printed heating film 2051 achieves uniform heating with the help of graphene conductive ink. The two work together to control the local temperature of the flexible screen 206. The phase change energy storage layer 2032 absorbs heat and stabilizes its temperature, ensuring that the photoresist layer 201 is at the ideal reaction temperature. This improves the photolithography accuracy of the ITO thin film layer 202. After the photolithography process, the ITO... The ITO thin film layer 202 forms micron-level traces, and the elastic conductive adhesive layer 2031 enables low-resistance signal transmission. The honeycomb buffer plate 2052 can disperse stress and protect the ITO traces from damage when the flexible screen panel 206 is bent. In flexible application scenarios, the phase change energy storage layer 2032 enhances the rigidity of the substrate by cooling and curing; the elastic conductive adhesive layer 2031 maintains signal conduction through its own deformation. When it is necessary to restore the rigid state, the phase change energy storage layer 2032 absorbs heat and softens, and the substrate restores its flexibility, thereby realizing the reversible switching between rigid and flexible states.

[0049] Furthermore, through the engaging mechanism 3, during the process of inserting the connecting plate 5 into the connecting block 4, the roller 303 rolls along the inclined groove 305, causing the compression spring 304 to be compressed. Subsequently, during the release of the elastic potential energy of the compression spring 304, it pushes the U-shaped blocks 302 on both sides to move relative to each other, ensuring stable contact between the connecting plate 5 and the connecting block 4. The limiting strip 301 restricts the displacement range of the U-shaped block 302 to prevent excessive compression from causing poor contact. Thus, under the push of the compression spring 304, the connecting plate 5 and the connecting block 4 are firmly connected together.

[0050] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A liquid crystal display connection device based on multimodal modulation and ITO lithography traces, comprising a screen frame (1) and a connection block (4), characterized in that: The inner wall of the screen frame (1) is provided with an ITO wiring mechanism (2), the front side of the screen frame (1) is fixedly connected with a connecting plate (5), and the inner wall of the connecting block (4) is provided with a locking mechanism (3). The ITO wiring mechanism (2) includes a flexible screen panel (206). The outer wall of the flexible screen panel (206) is located in the middle of the inner wall of the screen frame (1). An ITO thin film layer (202) is fixedly connected to the top of the flexible screen panel (206). A photoresist layer (201) is fixedly connected to the top of the ITO thin film layer (202). A substrate assembly (203) is located in the middle of the bottom end of the flexible screen panel (206). An annular resistance heater (204) is fixedly connected to the bottom of the flexible screen panel (206). A uniform heat conduction component (205) is located at the bottom end of the annular resistance heater (204).

2. The ITO lithography-based liquid crystal display connection device based on multimodal modulation according to claim 1, characterized in that: The locking mechanism (3) includes multiple limiting strips (301). The outer walls of the multiple limiting strips (301) are respectively fixedly connected to the upper and lower ends of the inner wall of the connecting block (4). A U-shaped block (302) is slidably connected to the adjacent side of the two limiting strips (301) on the left and right sides. A roller (303) is rotatably connected to the inner wall of the U-shaped block (302). A compression spring (304) is fixedly connected to the outer wall of the U-shaped block (302). The other end of the compression spring (304) is fixedly connected to the inner wall of the connecting block (4). Inclined grooves (305) are opened on the left and right sides of the outer wall of the connecting plate (5).

3. The ITO lithography-based liquid crystal display connection device based on multimodal modulation according to claim 1, characterized in that: The substrate assembly (203) includes an elastic conductive adhesive layer (2031), the top of which is fixedly connected to the middle of the bottom end of the flexible screen (206), and a phase change energy storage layer (2032) is fixedly connected to the bottom end of the elastic conductive adhesive layer (2031).

4. The ITO lithography-based liquid crystal display connection device based on multimodal modulation according to claim 1, characterized in that: The uniform heat conduction component (205) includes a flexible printed heating film (2051), the top end of which is fixedly connected to the bottom end of the flexible screen (206), and a honeycomb buffer plate (2052) is fixedly connected to the middle of the top end of the flexible printed heating film (2051).

5. The ITO lithography-based liquid crystal display connection device based on multimodal modulation according to claim 1, characterized in that: The top of the connecting plate (5) is fixedly connected with multiple reinforcing columns (6), and the front end of the connecting block (4) is provided with a heat dissipation port (7).

6. The ITO lithography-based liquid crystal display connection device based on multimodal modulation according to claim 1, characterized in that: The front bottom of the connecting plate (5) is fixedly connected to a connector (8), and the outer wall size of the connecting plate (5) is the same as the inner wall size of the connecting block (4).

7. The ITO lithography-based liquid crystal display connection device based on multimodal modulation according to claim 4, characterized in that: The outer wall of the honeycomb buffer plate (2052) is fixedly connected to the bottom of the inner wall of the annular resistance heater (204), and the top of the photoresist layer (201) is fixedly connected to the top of the inner wall of the screen frame (1).

8. The ITO lithography-based liquid crystal display connection device based on multimodal modulation according to claim 2, characterized in that: The outer wall of the roller (303) engages with the inner wall of the inclined groove (305), and the inner wall size of the connecting block (4) is the same as the outer wall size of the U-shaped block (302).

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