Power supply equipment and switch

Abstract

The utility model relates to power supply equipment and a switch, and the power supply equipment comprises a bottom plate which is provided with an interface; the pinch plate assembly comprises a pinch plate, an electric connection unit and a PSE chip. The pinch plate is cuboid-shaped, and the two sides of the pinch plate in the length direction are parallel to the bottom plate; the electric connection unit is matched with the interface; the electric connection unit is provided with a plurality of PINs, each PIN comprises a parallel section and a vertical section, the parallel sections are fixedly arranged on the buckle plate and are parallel to the bottom plate, and the vertical sections are connected to the interface and are vertical to the bottom plate; the PSE chip is arranged on the buckle plate; and the micro-control unit is electrically connected to the PSE chip in a communication manner. In the power supply equipment, the parallel sections of the electric connection units are parallel to the bottom plate, and the vertical sections of the electric connection units are perpendicular to the bottom plate, so that the two sides of the pinch plate in the length direction can be parallel to the bottom plate, the situation that one side of the pinch plate in the thickness direction is parallel to the bottom plate and is close to the bottom plate is avoided, and the two sides of the pinch plate in the thickness direction can well dissipate heat; the PSE chip on the pinch plate can be prevented from being overheated, and normal work of the powered device can be guaranteed.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to power supply equipment and switches. Background Technology

[0002] PoE is a technology that transmits both data and power over an Ethernet cable (such as Cat5e / Cat6), allowing devices (such as IP cameras, wireless APs, IP phones, etc.) to operate without an additional power cable.

[0003] A PoE system includes PSE (Power Sourcing Equipment) and PD (Powered Device). The power supply equipment is responsible for providing power to the powered device, which is the device that receives power from PoE.

[0004] A switch is a network device used to connect and manage multiple network devices. It has various ports and supports data exchange and network traffic management. Switches can integrate PSE functionality to become PoE-enabled switches, directly powering devices via Ethernet cables.

[0005] Currently, PoE-enabled switches are typically built with an architecture where a microcontroller unit controls multiple PSE chips. To prevent the backplane from becoming too large, this architecture usually implements PoE functionality in the following physical form: the microcontroller unit and PSE chips are integrated on a backplane, which is plugged into and unplugged onto the backplane via electrical connection units (usually two electrical connectors) to enable signal communication and power supply.

[0006] The snap-on panel is a thin rectangular parallelepiped. Therefore, the area of ​​the two sides along the thickness direction of the panel is significantly larger than the area of ​​the other sides. Only the two sides along the thickness direction are suitable for installing electrical connection units. However, in traditional snap-on panels, the structure of the electrical connection unit is unreasonable. After being connected to the base plate via the electrical connection unit, one side of the snap-on panel along the thickness direction is parallel to and very close to the base plate. This results in poor ventilation on the side of the snap-on panel facing the base plate, negatively impacting heat dissipation. This may cause the PSE chip on the snap-on panel to overheat, triggering the protection mechanism at high temperatures, reducing output power or stopping power supply, thus causing the connected powered equipment to malfunction. Utility Model Content

[0007] Therefore, it is necessary to provide a power supply device and switch to address the above problems.

[0008] To address the above problems, this application provides the following technical solution:

[0009] A power supply device, the power supply device comprising:

[0010] Base plate with interfaces;

[0011] A snap-on assembly includes a snap-on plate, an electrical connection unit, and a PSE chip; the snap-on plate is cuboid in shape, with both sides along its length parallel to the base plate; the electrical connection unit is adapted to the interface; the electrical connection unit has multiple pins, each pin including a parallel segment and a vertical segment, the parallel segment being fixed to the snap-on plate and parallel to the base plate, and the vertical segment being connected to the interface and perpendicular to the base plate; the PSE chip is disposed on the snap-on plate; and

[0012] The microcontroller unit is electrically connected to the PSE chip.

[0013] This power supply equipment has at least the following beneficial effects:

[0014] In this power supply device, the parallel section of the electrical connection unit is parallel to the base plate, and the vertical section is perpendicular to the base plate. This allows both sides of the buckle plate in the length direction to be parallel to the base plate, avoiding the situation where one side of the buckle plate in the thickness direction is parallel to the base plate and very close to it. This allows both sides of the buckle plate in the thickness direction to dissipate heat well, which helps prevent the PSE chip on the buckle plate from overheating and helps ensure the normal operation of the powered equipment.

[0015] In one embodiment, the base plate is provided with a plurality of the interfaces.

[0016] This setup allows for the addition or removal of mounting plate components on the base plate according to the customer's customized needs, without requiring the redesign of the power supply equipment, which helps save manpower, material resources, and financial resources.

[0017] In one embodiment, the vertical segment is pluggable to the interface.

[0018] With this setup, simply inserting another snap-on panel into the interface on the base plate will increase the number of snap-on panels on the base plate, and removing the snap-on panels from the base plate will decrease the number of snap-on panels on the base plate. This allows for easy addition or removal of snap-on panels on the base plate according to the customer's customized needs.

[0019] In one embodiment, only one PSE chip is provided on the buckle.

[0020] With this configuration, each additional snap-on assembly added to the base plate adds exactly one PSE chip to the power supply unit; conversely, each removal of a snap-on assembly from the base plate removes exactly one PSE chip from the power supply unit. Users can easily change the number of PSE chips in the power supply unit by simply altering the corresponding number of snap-on assemblies on the base plate, thus conveniently meeting customers' customization needs.

[0021] In one embodiment, the microcontroller unit is located on the base plate.

[0022] This configuration, because the microcontroller unit is not located on any single panel, allows each panel assembly to be identical and all panels to be made equally small. This helps reduce the space occupied by all panel assemblies in the power supply equipment, and consequently, reduces the size of the switch.

[0023] In one embodiment, the power supply device includes a plurality of the buckle assemblies, and the microcontroller is disposed on a buckle in one of the buckle assemblies and electrically connected to a buckle in each of the buckle assemblies.

[0024] With this configuration, the microcontroller does not occupy space on the base plate, and the space saved can be used for other purposes.

[0025] In one embodiment, the vertical segment of the buckle assembly containing the microcontroller is welded to the interface, and the vertical segments of other buckle assemblies are plugged into the interface.

[0026] This setup ensures, on the one hand, that the microcontroller unit is reliably connected to the base plate; on the other hand, other mounting plate components can still be easily installed on or removed from the base plate, which also meets the customer's customization needs.

[0027] In one embodiment, the spacing between two adjacent PINs is greater than or equal to 2 mm.

[0028] This configuration ensures the electrical clearance between two adjacent pins, allowing them to be insulated from each other by air, which helps to ensure the stability and safety of the electrical performance of the power supply equipment.

[0029] This application also provides a switch that includes the power supply device described above.

[0030] This switch has at least the following beneficial effects:

[0031] In the power supply equipment of this switch, the parallel section of the electrical connection unit is parallel to the base plate, and the vertical section is perpendicular to the base plate. This allows the two sides of the buckle plate in the length direction to be parallel to the base plate, avoiding the situation where one side of the buckle plate in the thickness direction is parallel to the base plate and very close to it. This allows both sides of the buckle plate in the thickness direction to dissipate heat well, which helps to prevent the PSE chip on the buckle plate from overheating and helps to ensure the normal operation of the powered equipment.

[0032] In one embodiment, the switch is provided with a cooling fan with an air outlet, the cover plate is located directly in front of the air outlet, and the thickness direction of the cover plate is perpendicular to the orientation of the air outlet.

[0033] This design facilitates good heat dissipation for the backplate, helps prevent overheating of the PSE chip on the backplate, and ensures the normal operation of the powered equipment. Attached Figure Description

[0034] Figure 1 This is a top view of a power supply device according to an embodiment of this application;

[0035] Figure 2 This is a front view of a buckle assembly according to an embodiment of this application;

[0036] Figure 3 This is a left view of a buckle assembly according to an embodiment of this application.

[0037] Figure label:

[0038] 1. Base plate; 2. Buckle assembly; 21. Buckle; 22. Electrical connection unit; 221. Electrical connector; 2211. Pin; 22111. Parallel section; 22112. Vertical section; 23. PSE chip; 3. Microcontroller unit. Detailed Implementation

[0039] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0040] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0042] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0043] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0044] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0045] See Figures 1 to 3 This application provides a power supply device, which includes a base plate 1, a snap-on assembly 2, and a microcontroller unit 3.

[0046] See Figures 1 to 3 The base plate 1 has an interface, and the snap-on assembly 2 includes a snap-on plate 21, an electrical connection unit 22, and a PSE chip 23. The snap-on plate 21 is rectangular, and its two sides along its length are parallel to the base plate 1. The electrical connection unit 22 is adapted to the interface. The electrical connection unit 22 has multiple pins 2211, each pin 2211 including a parallel segment 22111 and a vertical segment 22112. The parallel segment 22111 is fixed to the snap-on plate 21 and parallel to the base plate 1, and the vertical segment 22112 is connected to the interface and perpendicular to the base plate 1. The PSE chip 23 is located on the snap-on plate 21, and the microcontroller unit 3 can be electrically connected to the PSE chip 23 for communication.

[0047] In this power supply device, the parallel section 22111 of the electrical connection unit 22 is parallel to the base plate 1, and the vertical section is perpendicular to the base plate 1. This allows the two sides of the buckle plate 21 in the length direction to be parallel to the base plate 1, avoiding the situation where one side of the buckle plate 21 in the thickness direction is parallel to the base plate 1 and very close to it. This allows both sides of the buckle plate 21 in the thickness direction to dissipate heat well, which helps to prevent the PSE chip 23 on the buckle plate 21 from overheating and helps to ensure the normal operation of the powered equipment.

[0048] Preferably, the base plate 1 is provided with multiple interfaces. In this way, the buckle assembly 2 on the base plate 1 can be added or removed according to the customer's customized needs without redesigning the power supply equipment, which helps to save manpower, material resources and financial resources.

[0049] Preferably, the vertical segment 22112 is plugged into the interface. In this way, simply inserting another buckle assembly 2 into the interface of the base plate 1 can increase the buckle assembly 2 on the base plate 1, and pulling out the buckle assembly 2 on the base plate 1 can reduce the buckle assembly 2 on the base plate 1. It is very convenient to add or remove buckle assemblies 2 on the base plate 1 according to the customer's customized needs.

[0050] See Figure 1 and Figure 3 Only one PSE chip 23 is installed on the snap-on plate 21. Thus, for every snap-on plate assembly 2 added to the base plate 1, one PSE chip 23 is added to the power supply device; conversely, for every snap-on plate assembly 2 removed from the base plate 1, one PSE chip 23 is removed from the power supply device. Users who wish to change the number of PSE chips 23 in the power supply device only need to change the corresponding number of snap-on plate assemblies 2 on the base plate 1, easily meeting customers' customization needs.

[0051] exist Figure 1 In the illustrated embodiment, the microcontroller unit 3 is located on the base plate 1. Thus, because the microcontroller unit 3 is not mounted on any specific latching plate 21, each latching plate assembly 2 can be identical, and all latching plate assemblies 2 can be made equally small. This helps reduce the space occupied by all latching plate assemblies 2 in the power supply equipment, and also helps reduce the size of the switch.

[0052] In some embodiments, the power supply device includes a plurality of snap-on plate assemblies 2, and a microcontroller 3 is disposed on a snap-on plate 21 in one of the snap-on plate assemblies 2 and electrically connected to the snap-on plate 21 in each snap-on plate assembly 2. In this way, the microcontroller 3 does not occupy space on the base plate 1, and the space on the base plate 1 thus saved can be used for other purposes.

[0053] Preferably, the vertical segment 22112 of the snap-on assembly 2 containing the microcontroller 3 is welded to the interface, while the vertical segments 22112 of other snap-on assemblies 2 are plugged into the interface. On the one hand, this ensures that the microcontroller 3 is reliably connected to the base plate 1; on the other hand, other snap-on assemblies 2 can still be easily installed on or removed from the base plate 1, which can also meet the customer's customization needs.

[0054] In some embodiments, the spacing between two adjacent pins 2211 is greater than or equal to 2 mm. This ensures the electrical clearance between two adjacent pins 2211, enabling them to be insulated from each other by air, which helps to ensure the stable and safe electrical performance of the power supply equipment.

[0055] See Figure 1 In some embodiments, the electrical connection unit 22 includes two electrical connectors 221, one of which is used to access the VMAIN (44-57V) power supply, AGND and low-speed communication signals of the PSE chip 23, and the other is used to output the VMAIN (44-57V) voltage to the LAN transformer for POE power supply.

[0056] In some embodiments, the electrical connection unit 22 may also be an electrical connector 221, in which a portion of the pins 2211 are used to access the VMAIN (44-57V) power supply, AGND and the low-speed communication signal of the PSE chip 23, and another portion of the pins 2211 are used to output the VMAIN (44-57V) voltage to the LAN transformer for POE power supply.

[0057] This application also provides a switch that includes the aforementioned power supply equipment. In the power supply equipment of this switch, the parallel segment 22111 of the electrical connection unit 22 is parallel to the base plate 1, and the vertical segment is perpendicular to the base plate 1. This allows both sides of the buckle plate 21 in the length direction to be parallel to the base plate 1, avoiding the situation where one side of the buckle plate 21 in the thickness direction is parallel to and very close to the base plate 1. This allows both sides of the buckle plate 21 in the thickness direction to dissipate heat well, which helps to prevent the PSE chip 23 on the buckle plate 21 from overheating and helps to ensure the normal operation of the powered equipment.

[0058] In some embodiments, the switch is equipped with a cooling fan with an air outlet. The mounting plate 21 is located directly in front of the air outlet, and the thickness direction of the mounting plate 21 is perpendicular to the orientation of the air outlet. This facilitates good heat dissipation for the mounting plate 21, helps prevent overheating of the PSE chip 23 on the mounting plate 21, and helps ensure the normal operation of the powered equipment.

[0059] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0060] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of protection of this application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the appended claims.

Claims

1. A power supply device, characterized in that, include: Base plate (1), with interfaces; A snap-on assembly (2) includes a snap-on plate (21), an electrical connection unit (22), and a PSE chip (23); the snap-on plate (21) is rectangular, and the two sides of the snap-on plate (21) along its length are parallel to the base plate (1); the electrical connection unit (22) is adapted to the interface; the electrical connection unit (22) has multiple pins (2211), each pin (2211) including a parallel segment (22111) and a vertical segment (22112), the parallel segment (22111) being fixed to the snap-on plate (21) and parallel to the base plate (1), and the vertical segment (22112) being connected to the interface and perpendicular to the base plate (1); the PSE chip (23) is disposed on the snap-on plate (21); and The microcontroller unit (3) is electrically connected to the PSE chip (23).

2. The power supply equipment according to claim 1, characterized in that, The base plate (1) is provided with multiple interfaces.

3. The power supply equipment according to claim 2, characterized in that, The vertical segment (22112) is plugged into the interface.

4. The power supply equipment according to claim 2, characterized in that, Only one PSE chip (23) is provided on the buckle plate (21).

5. The power supply equipment according to claim 4, characterized in that, The microcontroller unit (3) is located on the base plate (1).

6. The power supply equipment according to claim 2, characterized in that, The power supply device includes a plurality of the buckle plate assemblies (2), and the micro control unit (3) is disposed on the buckle plate (21) of one of the buckle plate assemblies (2) and electrically connected to the buckle plate (21) of each buckle plate assembly (2).

7. The power supply equipment according to claim 6, characterized in that, The vertical segment (22112) of the buckle assembly (2) where the microcontroller unit (3) is located is welded to the interface, and the vertical segments (22112) of the other buckle assemblies (2) are plugged into the interface.

8. The power supply equipment according to claim 1, characterized in that, The spacing between two adjacent PINs (2211) is greater than or equal to 2 mm.

9. A switch, characterized in that, The power supply equipment includes any one of claims 1 to 8.

10. The switch according to claim 9, characterized in that, The switch is equipped with a cooling fan with an air outlet. The mounting plate (21) is located directly in front of the air outlet, and the thickness direction of the mounting plate (21) is perpendicular to the orientation of the air outlet.

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