LED support and LED packaging body

Abstract

The utility model relates to the technical field of LED lighting elements, in particular to an LED support and an LED packaging body, the LED support comprises a conductive piece, the conductive piece comprises a positive electrode part and a negative electrode part which are insulated and separated, an insulating box dam is arranged on the conductive piece, a groove is defined by the insulating box dam and the conductive piece, the conductive piece is located at the groove bottom of the groove, and the positive electrode part and the negative electrode part are arranged on the conductive piece. A part of the bottom of the groove is a chip installation area used for installing the chip, a protruding strip structure is arranged between at least one side of the chip installation area and the insulating box dam, the protruding strip structure protrudes out of the bottom of the groove, and a gluing area is defined by the protruding strip structure and the insulating box dam. The gluing area is used for coating a reinforcing glue layer for reinforcing the structural strength of the LED bracket; and the surface of the raised line structure is a concave-convex surface with concave parts and convex parts, so that the path of water vapor permeating to the chip mounting area along the surface of the raised line structure is prolonged, and the luminous flux maintenance rate of the LED packaging body is improved.

Description

Technical Field

[0001] This utility model relates to the field of LED lighting element technology, specifically to an LED bracket and an LED package. Background Technology

[0002] The LED package includes an LED bracket and a chip. Specifically, the LED bracket includes a conductive lead frame and an insulating dam disposed at the edge of the conductive lead frame. The insulating dam protrudes upward relative to the conductive lead frame to cooperate with the conductive lead frame to form a groove. The chip is disposed at the bottom of the groove and is conductively connected to the conductive lead frame.

[0003] To enhance the structural strength of the LED package, a reinforcing adhesive layer is placed between the chip and the enclosure, and the chip is then encapsulated within the LED bracket using encapsulating adhesive. In actual use, moisture can penetrate through the interface between the reinforcing adhesive layer and the encapsulating adhesive to the chip location, affecting the silver plating at the bottom of the bracket and the chip itself, thus impacting the luminous flux of the LED package. Utility Model Content

[0004] This invention provides an LED bracket and an LED package to solve the technical problem that the luminous flux maintenance rate of LED packages is easily affected by moisture in the prior art.

[0005] In a first aspect, the LED bracket provided by this utility model includes:

[0006] A conductive component includes an insulatingly separated positive electrode portion and a negative electrode portion, wherein the positive electrode portion and the negative electrode portion are respectively used for conductive connection with the positive electrode and the negative electrode of a chip;

[0007] An insulating dam is provided on the conductive element and forms a groove with the conductive element, wherein the conductive element is located at the bottom of the groove;

[0008] A portion of the bottom of the groove is a chip mounting area for mounting the chip. At least one side of the chip mounting area has a raised strip structure between it and the insulating dam. The raised strip structure protrudes from the bottom of the groove and forms an adhesive coating area with the insulating dam. The adhesive coating area is used to apply a reinforcing adhesive layer to strengthen the structural strength of the LED bracket.

[0009] The surface of the raised strip structure is a concave-convex surface with concave and convex portions, so as to extend the path of water vapor as it penetrates into the chip mounting area along the surface of the raised strip structure.

[0010] In one technical solution, the protrusion is a rib extending along the length direction of the rib structure, and the recess is a groove extending along the length direction of the rib structure. The rib and the groove are alternately arranged from the side of the rib structure closer to the chip mounting area to the side farther away from the chip mounting area.

[0011] In one technical solution, the convex structure includes a first convex strip and a second convex strip arranged at intervals, the two ends of the first convex strip and the two ends of the second convex strip are respectively connected to the insulating dam, and the chip mounting area is located between the first convex strip and the second convex strip.

[0012] In one technical solution, the groove is an elongated groove with two oppositely arranged long sides, and the two ends of the first protrusion and the two ends of the second protrusion are respectively connected to the insulating dam at the two long sides.

[0013] In one technical solution, the bottom of the groove has a mounting groove, and a rib is provided through the mounting groove. The rib includes an embedded portion embedded in the mounting groove and an exposed portion protruding from the mounting groove. The exposed portion constitutes the first protrusion, and the surface area of ​​the embedded portion is greater than the surface area of ​​the exposed portion.

[0014] In one technical solution, in the cross section intersecting with the rib, at least a portion of the cross section of the embedded part has a lateral dimension greater than the maximum lateral dimension of the first protrusion.

[0015] In one technical solution, the positive electrode portion and the negative electrode portion are separated by an insulating spacer, the insulating spacer having a protruding portion that protrudes from the bottom of the groove, the protruding portion constituting the second protrusion.

[0016] In one technical solution, the side of the second protrusion closest to the chip mounting area is defined as the inner side, and the side closest to the adhesive coating area is defined as the outer side, and the insulating spacer is bent toward the inner side and / or the outer side.

[0017] Secondly, this utility model provides an LED package, including an LED bracket, a chip, a reinforcing adhesive layer, and an encapsulating adhesive. The LED bracket is the LED bracket in the above-mentioned schemes. The chip is disposed in the chip mounting area. The reinforcing adhesive layer is formed by adhesive liquid coated in the adhesive coating area. The encapsulating adhesive encapsulates the chip in the LED bracket.

[0018] In one technical solution, the bottom of the adhesive coating area has a silver plating layer, and the LED package further includes an organic coating disposed between the silver plating layer and the reinforcing adhesive layer, the organic coating being used to isolate and protect the silver plating layer.

[0019] The beneficial effects of this utility model are as follows:

[0020] In this invention, the raised strip structure and the insulating dam form the adhesive coating area, and the reinforcing adhesive layer is located between the raised strip structure and the insulating dam. When such an LED package is in use, if moisture penetrates into the LED package through the interface between the reinforcing adhesive layer and the encapsulating adhesive, it will inevitably pass through the location of the raised strip structure. Since the surface of the raised strip structure has a concave-convex structure, the path of moisture penetration through the surface of the raised strip structure is extended, thus mitigating the impact of moisture on the chip. For structures with a silver plating layer at the bottom of the LED bracket, the impact of moisture on the silver plating layer can also be mitigated. At the same time, the concave-convex design of the raised strip structure surface can increase the interface area and bonding force between the encapsulating adhesive and the LED bracket, reducing the risk of moisture penetration. In this way, the luminous flux maintenance rate of the LED package can be improved, solving the technical problem that LED packages are easily affected by moisture in the prior art. Attached Figure Description

[0021] Figure 1 This is a top view of an LED package in one embodiment of the present invention;

[0022] Figure 2 for Figure 1 Sectional view along direction A;

[0023] Figure 3 for Figure 2 A magnified view of section B;

[0024] Figure 4 This is a schematic diagram of the LED package structure in another embodiment of the present invention.

[0025] List of feature names corresponding to the labels in the figure:

[0026] 1. LED bracket;

[0027] 11. Conductive component; 12. Insulating dam; 13. Mounting groove; 14. Rib; 141. Embedded part; 15. Insulating spacer;

[0028] 2. Chip;

[0029] 3. convex strip structure; 31. convex part; 32. concave part; 33. first convex strip; 34. second convex strip;

[0030] 4. Reinforcing adhesive layer; 5. Encapsulating adhesive; 6. Organic coating; 7. Conductive leads. Detailed Implementation

[0031] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0032] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments, and the operational steps involved in each embodiment can also be rearranged or adjusted in a manner that is obvious to those skilled in the art. Therefore, the specification and drawings are only for clearly describing a particular embodiment and do not imply that they represent the necessary components and / or order.

[0033] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0034] In an embodiment of this utility model, the LED package includes an LED bracket and a chip packaged within the LED bracket. The bottom of the LED bracket is provided with a raised strip structure and an insulating dam to form a coating area. By applying adhesive to the coating area, a reinforcing adhesive layer can be formed. The chip is installed in the chip mounting area. Thus, the reinforcing adhesive layer and the chip are separated by the raised strip structure. When moisture penetrates into the LED package through the interface between the encapsulating adhesive and the reinforcing adhesive layer, it will inevitably pass through the surface of the raised strip structure. Since the surface of the raised strip structure is a concave-convex surface with a concave-convex structure, it can extend the penetration path of moisture and reduce the impact of moisture on the chip. For the structure with a silver plating layer at the bottom of the LED bracket, it can also reduce the impact of moisture on the silver plating layer and improve the maintenance rate of the luminous flux of the LED package.

[0035] An embodiment of the LED package in this utility model:

[0036] In one embodiment, please refer to Figure 1 The LED package includes an LED bracket 1 and a chip 2 encapsulated within the LED bracket 1. The chip 2 emits light when powered on. The structure of the chip 2 and its light-emitting principle are existing technologies and will not be described in detail here.

[0037] Please refer to Figure 1 and Figure 2 The LED bracket 1 includes a conductive component 11, which is also called a conductive lead frame, conductive substrate, conductive frame, plate, etc. The conductive component 11 is made of conductive material, generally a metal material, such as copper. Therefore, in the prior art, the conductive component 11 is also referred to as a metal substrate or metal frame. In some embodiments, the conductive component 11 can also be made of other non-metallic conductive materials, such as carbon materials, niobium phosphide, etc. Of course, it can also be a conductive metal oxide material, such as zinc oxide, tin oxide, etc.

[0038] The conductive component 11 is divided into a positive electrode part and a negative electrode part by an insulating structure. The positive electrode part and the negative electrode part can be electrically connected to the positive electrode and the negative electrode of the chip 2 respectively through conductive leads 7.

[0039] An insulating dam 12 is provided on the conductive component 11. The insulating dam 12 is made of insulating material. As those skilled in the art will know, the insulating dam 12 is formed by molding insulating material onto the conductive component 11. The insulating dam 12 and the conductive component 11 cooperate to form a groove. In the prior art, this structure is also referred to as a bowl or cup. The conductive component 11 is located at the bottom of the groove, and the insulating dam 12 forms the groove wall. How the insulating dam 12 is formed on the conductive component 11 is prior art and will not be described in detail here.

[0040] The bottom of the groove has a chip mounting area, where chip 2 is mounted. A raised strip structure 3 is located between the chip mounting area and the insulating dam 12. The raised strip structure 3 protrudes into the groove relative to its bottom and is elongated. The raised strip structure 3 and the insulating dam 12 form a coating area. A reinforcing adhesive layer 4 is formed by applying adhesive to this area, strengthening the structure of the LED bracket 1. The reinforcing adhesive layer 4 can contain substances such as silicone and titanium dioxide, which can effectively isolate the influence of moisture on the silver plating layer at the bottom of the groove. The raised strip structure 3 blocks the influence of titanium dioxide or silicone on the brightness of chip 2. White adhesive can be used for the reinforcing adhesive layer 4, giving it good reflectivity and increasing the light output of the LED package. The raised strip structure 3 acts as a barrier, blocking and isolating the reinforcing adhesive layer 4 from the chip 2 during the molding stage. In other embodiments, titanium dioxide can also be added to the reinforcing adhesive layer 4, and the adhesive used for the reinforcing adhesive layer 4 can also be silicone resin.

[0041] Please refer to Figure 3The surface of the raised strip structure 3 is a concave-convex surface with recesses 32 and protrusions 31. Since moisture must pass through the surface of the raised strip structure 3 when it penetrates from the interface between the reinforcing adhesive layer 4 and the encapsulating adhesive 5 into the chip mounting area, the penetration path of moisture can be extended by designing the surface of the raised strip structure 3 as a concave-convex surface, thus delaying the impact of moisture on the LED package and improving the luminous flux maintenance rate of the LED package. At the same time, the concave-convex surface design of the raised strip structure 3 can increase the bonding area and bonding force between the encapsulating adhesive 5 and the LED bracket 1, reducing the risk of moisture penetration, thereby also improving the luminous flux maintenance rate of the LED package.

[0042] In one embodiment, please refer to Figure 3 The convex portion 31 of the concave-convex surface is a rib extending along the length of the convex strip structure 3, and the concave portion 32 is a groove extending along the length of the convex strip structure 3. The ribs and grooves are alternately arranged from the side of the convex strip structure 3 closest to the chip mounting area to the side furthest from the chip mounting area. In other embodiments, the extending directions of the ribs and grooves may also have a certain angle with the length extending direction of the convex strip structure 3. Of course, for the specific structural form of the convex portion 31 and the concave portion 32, in other embodiments, the convex portion 31 may also be dot-like protrusions dispersed on the surface of the convex strip structure 3, and the concave portion 32 may also be pits dispersed on the surface of the convex strip structure 3. In one embodiment, the convex strip structure 3 is designed with an arc-shaped cross-section, which can further extend the water vapor penetration path.

[0043] For the specific form of the convex strip structure 3, please refer to one embodiment. Figure 1 , Figure 2 The raised strip structure 3 includes two raised strips, namely a first raised strip 33 and a second raised strip 34. The two ends of the first raised strip 33 and the two ends of the second raised strip 34 are respectively connected to the insulating dam 12. Naturally, the adhesive coating area includes the portion of the adhesive coating area enclosed by the first raised strip 33 and the insulating dam 12, and also includes the portion of the adhesive coating area enclosed by the second raised strip 34 and the insulating dam 12. The chip mounting area is located between the first raised strip 33 and the second raised strip 34. In other embodiments, the raised strip structure 3 may include only the first raised strip 33 or only the second raised strip 34. In this case, the raised strip structure 3 and the reinforcing adhesive layer 4 are only provided on one side of the chip mounting area. Of course, the raised strip structure 3 can also be a ring structure arranged around the chip mounting area, specifically a circular ring, a rectangular ring, etc.

[0044] In one embodiment, please refer to Figure 4The groove formed by the conductive component 11 and the insulating dam 12 has a mounting groove 13 at its bottom. A rib 14 is mounted through the mounting groove 13. The rib 14 includes an embedded portion 141 within the mounting groove 13 and an exposed portion protruding from the mounting groove 13. The exposed portion forms a first protrusion 33. In this embodiment, the surface area of ​​the embedded portion 141 is larger than the surface area of ​​the exposed portion. This allows for a larger contact area between the embedded portion 141 and the conductive component 11, ensuring stable and reliable mounting of the rib 14 on the bottom of the groove. The surface area of ​​the first protrusion 33 can be minimized, reducing the exposed area of ​​the plastic surface of the first protrusion 33, reducing its impact on the light emission effect of the LED package, and improving the brightness of the LED package. Simultaneously, reducing the height and width of the first protrusion 33 facilitates the wire bonding process and reduces welding difficulty. The height of the first protrusion 33 can be greater than 0.01 mm and less than 1 mm, and the width can also be greater than 0.01 mm and less than 1 mm. The dimensional parameters of the second protrusion 34 are similar. The height of the groove wall formed by the insulating dam 12 is greater than the height of the first protrusion 33 and the second protrusion 34.

[0045] The width of the raised strip structure 3 is between 0.01mm and 1mm, which can maximize the die bonding range. Therefore, larger chips 2 can be set to improve the brightness and reliability of the LED package.

[0046] In one embodiment, please refer to Figure 1 The groove is a long, narrow channel with two oppositely arranged long sides. The two ends of the first protrusion 33 and the two ends of the second protrusion 34 are respectively connected to the insulating dam 12 at the two long sides. This arrangement results in relatively short lengths for the first and second protrusions 33 and 34, leading to higher structural strength. Regarding the specific shape of the groove, it can be... Figure 1 The rectangle shown can also be a racetrack shape, or an ellipse, etc.

[0047] Regarding the structure of the reinforcing bar 14, in one embodiment, please refer to... Figure 3 In the cross section intersecting with the rib 14, at least a portion of the cross section of the embedded part 141 has a lateral dimension greater than the maximum lateral dimension of the first protrusion 33. This increases the bonding area between the embedded part 141 and the conductive element 11 by increasing the lateral dimension, which in turn increases the bonding area between the embedded part 141 and the internal surface area of ​​the mounting groove 13. The vertical dimension of the mounting groove 13 can be controlled within a reasonable range, thereby increasing the bonding area without affecting the strength of the LED bracket 1 and enabling reliable installation of the rib 14 on the conductive element 11.

[0048] In other embodiments, the cross-sectional shape of the rib 14 can also be elliptical, rectangular, trapezoidal, triangular, etc., wherein the trapezoidal or triangular shape can also make the cross-sectional lateral dimension of the embedded part 141 larger than the cross-sectional lateral dimension of the exposed part.

[0049] In one embodiment, the positive and negative portions of the conductive element 11 are separated by an insulating spacer 15, which has a protruding portion extending into the bottom of the groove, forming the second protrusion 34. In other embodiments, the second protrusion 34 can be formed in the same way as the first protrusion 33, in which case a separate insulating structure is provided to divide the conductive element 11 into positive and negative portions. Alternatively, both the first and second protrusions 33 can be disposed on the bottom surface of the groove, without any portion embedded within the groove bottom.

[0050] In one embodiment, please refer to Figure 1 and Figure 4 The side of the second protrusion 34 closest to the chip mounting area is defined as the inner side, and the side closest to the adhesive coating area is defined as the outer side. The insulating spacer 15 is bent towards both the inner and outer sides. In other embodiments, it may be bent only towards the inner side or only towards the outer side.

[0051] The first protrusion 33 and the second protrusion 34 have the same concave and convex surfaces. As those skilled in the art will understand, in other embodiments, since the first protrusion 33 and the second protrusion 34 are structurally relatively independent, their surface structures can be different. For example, the concave portion 32 and the protrusion 31 on one surface are dot-shaped protrusions and pits, while the concave portion 32 and the protrusion 31 on the other surface are grooves and ribs, respectively.

[0052] Regarding the dimensions of the LED package structure, in one embodiment, the height of the groove wall formed by the insulating dam 12 is not less than 0.4 mm. Meanwhile, because the insulating spacer 15 has a protruding portion extending into the groove, it increases the adhesive area, thereby improving the resistance to breakage of the LED bracket 1. The mounting groove 13 does not penetrate the conductive component 11 and will not substantially affect the strength of the LED bracket 1.

[0053] Please refer to Figure 2 The side of the reinforcing adhesive layer 4 facing the groove opening can be a sloping structure, specifically, the convex strip structure 3 is inclined towards the end of the insulating dam 12 away from the bottom of the groove, and its angle value α is between 0° and 70°.

[0054] The silver plating layer at the bottom of the groove reflects the light incident on the bottom of the groove, thereby increasing the light output of the LED package. In other embodiments, when the light output requirement is not high, the silver plating layer may not be provided at the bottom of the groove.

[0055] The height of the reinforcing adhesive layer 4 is lower than the height of the groove wall formed by the insulating dam 12.

[0056] In one embodiment, please refer to Figure 2 The bottom of the adhesive coating area has a silver plating layer. The LED package also includes an organic coating 6 disposed between the silver plating layer and the reinforcing adhesive layer 4. The organic coating 6 is used to isolate and protect the silver plating layer. It can be made by adding materials such as siloxane (with ultra-low oxygen permeability) to ethyl acetate (solvent) to prevent moisture, sulfur, halogens, etc. from affecting the silver plating layer. In other embodiments, please refer to Figure 4 If there are no requirements for relevant technical indicators, the LED package may not have an organic coating, which can reduce the manufacturing cost of the LED package.

[0057] The form of the LED bracket 1 can be a cut bracket, that is, the whole board is produced and then cut one by one to form an individual LED bracket 1. Of course, the form of the LED bracket 1 is not limited to a cut bracket. The material of the insulating dam 12 can be white plastic, including but not limited to PPA (semi-aromatic polyamide), PCT (thermoplastic plastic), EMC (epoxy molding compound), SMC (sheet molding compound). During the compression molding of the LED bracket 1, the white plastic can flow into the mounting groove 13 and connect to the insulating dam 12 at both ends to form the ribs 14. Insulating strips 15 can also be formed at the same time.

[0058] This utility model also provides an LED bracket, the structure of which is the same as that of the LED bracket 1 in the above-described embodiments of the LED package, and will not be described again here.

[0059] The above-described specific examples are for illustrative purposes only and are not intended to limit the scope of this invention. Those skilled in the art to which this invention pertains can make various simple deductions, modifications, or substitutions based on the concept of this invention.

Claims

1. An LED bracket, characterized in that, include: A conductive component includes an insulatingly separated positive electrode portion and a negative electrode portion, wherein the positive electrode portion and the negative electrode portion are respectively used for conductive connection with the positive electrode and the negative electrode of a chip; An insulating dam is provided on the conductive element and forms a groove with the conductive element, wherein the conductive element is located at the bottom of the groove; A portion of the bottom of the groove is a chip mounting area for mounting the chip. At least one side of the chip mounting area has a raised strip structure between it and the insulating dam. The raised strip structure protrudes from the bottom of the groove and forms an adhesive coating area with the insulating dam. The adhesive coating area is used to apply a reinforcing adhesive layer to strengthen the structural strength of the LED bracket. The surface of the raised strip structure is a concave-convex surface with concave and convex portions, so as to extend the path of water vapor as it penetrates into the chip mounting area along the surface of the raised strip structure.

2. The LED bracket as described in claim 1, characterized in that, The protrusion is a rib extending along the length of the rib structure, and the recess is a groove extending along the length of the rib structure. The rib and the groove are alternately arranged from the side of the rib structure closer to the chip mounting area to the side farther away from the chip mounting area.

3. The LED bracket as described in claim 1, characterized in that, The convex structure includes a first convex strip and a second convex strip arranged at intervals. The two ends of the first convex strip and the two ends of the second convex strip are respectively connected to the insulating dam. The chip mounting area is located between the first convex strip and the second convex strip.

4. The LED bracket as described in claim 3, characterized in that, The groove is a long strip with two long sides arranged opposite each other. The two ends of the first protrusion and the two ends of the second protrusion are respectively connected to the insulating dam at the two long sides.

5. The LED bracket as described in claim 3, characterized in that, The groove has a mounting groove at its bottom, through which a rib is provided. The rib includes an embedded portion that is embedded in the mounting groove and an exposed portion that protrudes from the mounting groove. The exposed portion forms the first protrusion. The surface area of ​​the embedded portion is greater than the surface area of ​​the exposed portion.

6. The LED bracket as described in claim 5, characterized in that, In the cross section intersecting with the rib, at least a portion of the cross section of the inlay portion has a lateral dimension greater than the maximum lateral dimension of the first protrusion.

7. The LED bracket as described in any one of claims 3-6, characterized in that, The positive electrode portion and the negative electrode portion are separated by an insulating spacer, the insulating spacer having a protruding portion that protrudes from the bottom of the groove, the protruding portion forming the second protrusion.

8. The LED bracket as described in claim 7, characterized in that, The side of the second protrusion closest to the chip mounting area is defined as the inner side, and the side closest to the adhesive coating area is defined as the outer side. The insulating spacer is bent toward the inner side and / or the outer side.

9. An LED package, characterized in that, The LED bracket includes an LED bracket, a chip, a reinforcing adhesive layer, and an encapsulating adhesive. The LED bracket is the LED bracket according to any one of claims 1-8. The chip is disposed in the chip mounting area. The reinforcing adhesive layer is formed by adhesive liquid coated in the adhesive area. The encapsulating adhesive encapsulates the chip in the LED bracket.

10. The LED package as described in claim 9, characterized in that, The bottom of the adhesive coating area has a silver plating layer, and the LED package also includes an organic coating disposed between the silver plating layer and the reinforcing adhesive layer, the organic coating being used to isolate and protect the silver plating layer.

Images