Workpiece structure suitable for optimizing WireBonding working face

Abstract

The utility model provides a workpiece structure suitable for optimizing a WireBonding working face, and relates to the technical field of LED packaging, the workpiece structure comprises a bonding wire bottom plate, the bonding wire bottom plate is provided with a bottom plate groove used for packaging LED particles, the bottom of an inner cavity of the bottom plate groove is provided with a plurality of pits, and the pits are used for containing pins of the LED particles. According to the LED lamp, the pits are formed and used for containing the pins of the LED particles, the LED particles sink after the pins are contained in the pits, and the LED particles make contact with the bottom of the inner cavity of the bottom plate groove after sinking, so that the plastic material parts of the LED particles are supported, and the overall flatness is ensured.

Description

Technical Field

[0001] This utility model relates to the field of LED packaging technology, and more specifically, to a workpiece structure suitable for optimizing the wire bonding working surface. Background Technology

[0002] In the LED packaging industry, the base plate structure for wire bonding directly affects packaging efficiency and product quality. Current technologies commonly use flat base plates or base plates with transverse grooves, but uneven particle surfaces are prone to occur during the base / cover plate lamination process. With the miniaturization of LED particles, the lamination precision requirements have significantly increased, making the insufficient flatness of traditional structures increasingly prominent. This forces a shortened maintenance cycle for corner-cutting dies, resulting in a substantial increase in maintenance costs (including labor and material costs). Furthermore, traditional processes rely on the solder corners contacting the base plate, making it difficult to guarantee consistent support strength, further restricting production efficiency and product yield. Therefore, we propose an improvement, creating a workpiece structure suitable for optimizing the wire bonding working surface. Utility Model Content

[0003] The purpose of this invention is to address the problem of insufficient flatness in LED chip packaging.

[0004] To achieve the above-mentioned objectives, this utility model provides a workpiece structure suitable for optimizing the Wire Bonding working surface, thereby improving the aforementioned problems.

[0005] The application is as follows:

[0006] A workpiece structure suitable for optimizing the wire bonding working surface includes a wire bonding base plate. The base plate has a base plate groove for encapsulating LED chips, and the bottom of the inner cavity of the base plate groove has several recesses for accommodating the leads of the LED chips. This application utilizes these recesses to accommodate the LED chip leads. After the leads are accommodated in the recesses, the LED chips sink down and contact the bottom of the inner cavity of the base plate groove, thus supporting the plastic portion of the LED chips and ensuring overall flatness.

[0007] As a preferred technical solution of this application, the LED particle sinks after the pin is accommodated by the pit, and the LED particle contacts the bottom of the inner cavity of the base plate groove after sinking.

[0008] As a preferred technical solution of this application, the pit is formed by electrical discharge machining.

[0009] As a preferred technical solution of this application, the number of the pits is four, the four pits are arranged in a matrix, and there is an LED particle support surface between the four pits to support the LED particles.

[0010] As a preferred technical solution of this application, the LED particle support surface is provided with anti-slip micro-texture, which is an interlaced distribution of V-shaped grooves or honeycomb-shaped concave dots.

[0011] As a preferred technical solution of this application, the opening edge of the recess is provided with a chamfer, which is used to guide the LED chip pin into the recess.

[0012] As a preferred technical solution of this application, the edge of the bonding wire base plate is provided with an anti-oxidation layer, and the material of the anti-oxidation layer is a nickel-phosphorus alloy.

[0013] As a preferred technical solution of this application, the surface of the anti-oxidation layer is covered with a wear-resistant coating, and the material of the wear-resistant coating is titanium nitride or tungsten carbide.

[0014] As a preferred technical solution of this application, the inner wall of the pit is coated with a conductive coating, and the material of the conductive coating is silver.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] In the scheme of this application:

[0017] To address the issue of insufficient flatness in LED chip packaging in existing technologies, this application incorporates recesses designed to accommodate the leads of the LED chips. After the leads are contained within the recesses, the LED chips sink down and contact the bottom of the base plate groove, thus supporting the plastic portion of the LED chips and ensuring overall flatness. Attached Figure Description

[0018] Figure 1 A schematic diagram of the workpiece structure applicable to optimizing the Wire_Bonding working surface provided in this application;

[0019] Figure 2 A top view of the workpiece structure provided in this application for optimizing the Wire_Bonding working surface;

[0020] Figure 3 A side view of the workpiece structure provided in this application for optimizing the Wire_Bonding working surface;

[0021] Figure 4 A schematic diagram of the anti-slip microtexture provided in this application for optimizing the workpiece structure of the Wire_Bonding working surface.

[0022] The image shows:

[0023] 1. Wire bonding base plate; 2. Base plate groove; 3. Recess; 4. LED chip support surface. Detailed Implementation

[0024] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0025] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0026] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0027] Example 1, please refer to Figures 1-3 A workpiece structure suitable for optimizing the wire bonding working surface includes a wire bonding base plate 1, on which a base plate groove 2 for encapsulating LED particles is provided, and a plurality of pits 3 are provided at the bottom of the inner cavity of the base plate groove 2, the pits 3 being used to accommodate the leads of the LED particles; after the leads are accommodated by the pits 3, the LED particles sink down, and after sinking down, the LED particles contact the bottom of the inner cavity of the base plate groove 2, so that the plastic part of the LED particles is supported, ensuring the overall flatness;

[0028] When the LED chip's leads are accommodated by the recess 3 and sink down to contact the base plate groove 2, the plastic material is supported, reducing the possibility of the LED chip tilting or shaking. This stable support allows the LED chip to maintain the correct position and orientation during the packaging process, providing a good foundation for subsequent soldering operations.

[0029] Furthermore, the recess 3 is fabricated using an electrical discharge machining (EDM) process. EDM is a high-precision machining method based on the principle of electro-erosion. It can precisely remove material according to pre-set parameters, achieving micron or even nanometer-level machining accuracy. By precisely controlling parameters such as the energy, time, and frequency of the discharge, a recess 3 with dimensions and shape that closely match the design requirements can be obtained. This ensures that the recess 3 can accurately accommodate the LED chip pins and improves the reliability of the package.

[0030] Furthermore, such as Figure 2 As shown, there are four recesses 3 arranged in a matrix, and there is an LED particle support surface 4 between the four recesses 3 to support the LED particles. The four recesses 3 arranged in a matrix provide a more stable pin fixing method, effectively reducing the displacement and rotation of the LED particles during the packaging process. At the same time, the LED particle support surface 4 provides uniform support for the plastic part of the LED particles.

[0031] When in use, place the LED particle in the groove 2 of the base plate, and insert the lead of the LED particle into the recess 3. At this time, the plastic part of the LED particle corresponds to the support surface 4 of the LED particle, so that the LED particle is supported and the whole is more flat.

[0032] Example 2 further optimizes the workpiece structure provided in Example 1 for optimizing the Wire Bonding working surface. Specifically, as follows: Figure 4 As shown, the LED particle support surface 4 is provided with anti-slip micro-texture. The micro-texture consists of staggered V-shaped grooves or honeycomb-shaped concave dots, which greatly increases the friction between the LED particle and the LED particle support surface 4, effectively reducing the sliding of the LED particle during the packaging process. This improves the accuracy and consistency of the packaging and reduces packaging position deviation and poor soldering problems caused by LED particle sliding.

[0033] Furthermore, the opening edge of the recess 3 is chamfered. The chamfer is used to guide the LED chip pins into the recess 3, reducing wear and deformation of the pins during the insertion process.

[0034] Example 3 further optimizes the workpiece structure provided in Example 1 or 2 for optimizing the Wire Bonding working surface. Specifically, an anti-oxidation layer is provided on the edge of the wire bonding base plate 1. The material of the anti-oxidation layer is a nickel-phosphorus alloy. Nickel-phosphorus alloy has good anti-oxidation properties. It can form a protective film on the edge of the wire bonding base plate 1 to prevent the penetration of oxygen and other corrosive substances. Nickel-phosphorus alloy has stable chemical properties and can resist the erosion of various chemical substances, thereby effectively protecting the edge of the wire bonding base plate 1.

[0035] Furthermore, the surface of the anti-oxidation layer is covered with a wear-resistant coating. The material of the wear-resistant coating is titanium nitride or tungsten carbide. Both titanium nitride and tungsten carbide are materials with high hardness and good wear resistance. They have excellent mechanical properties and chemical stability. After the wear-resistant coating is covered on the surface of the anti-oxidation layer, the wear-resistant coating can withstand the main force, reducing the direct damage to the anti-oxidation layer.

[0036] Furthermore, the inner wall of the recess 3 is coated with a conductive coating made of silver to enhance the conductivity between the LED chip leads and the recess 3, which greatly improves the conductivity of the LED chip, significantly improves the luminous efficiency and stability. Good conductivity can reduce resistance and reduce the loss of electrical energy during transmission, allowing more electrical energy to be converted into light energy.

[0037] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0038] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A workpiece structure suitable for optimizing the Wire Bonding working surface, characterized in that, The device includes a wire bonding base plate (1), on which a base plate groove (2) for encapsulating LED particles is provided, and a number of pits (3) are provided at the bottom of the inner cavity of the base plate groove (2), the pits (3) being used to accommodate the pins of the LED particles.

2. A workpiece structure suitable for optimizing the Wire Bonding working surface according to claim 1, characterized in that, After the LED particles are accommodated by the pit (3) on the pin, they sink down and contact the bottom of the cavity of the bottom plate groove (2) after sinking.

3. A workpiece structure suitable for optimizing the Wire Bonding working surface according to claim 2, characterized in that, The pit (3) is formed by electrical discharge machining.

4. A workpiece structure suitable for optimizing the Wire Bonding working surface according to claim 3, characterized in that, The number of the pits (3) is four, and the four pits (3) are arranged in a matrix.

5. A workpiece structure suitable for optimizing the Wire Bonding working surface according to claim 4, characterized in that, An LED particle support surface (4) is left between the four recesses (3) to support the LED particles.

6. A workpiece structure suitable for optimizing the Wire Bonding working surface according to claim 5, characterized in that, The LED particle support surface (4) is provided with anti-slip micro-texture, which is an interlaced V-shaped groove or honeycomb-shaped concave dot.

7. A workpiece structure suitable for optimizing the Wire Bonding working surface according to claim 6, characterized in that, The opening edge of the recess (3) is chamfered, and the chamfer is used to guide the LED chip pin into the recess (3).

8. A workpiece structure suitable for optimizing the Wire Bonding working surface according to claim 1 or 7, characterized in that, The edge of the welding wire base plate (1) is provided with an anti-oxidation layer, and the material of the anti-oxidation layer is a nickel-phosphorus alloy.

9. A workpiece structure suitable for optimizing the Wire Bonding working surface according to claim 8, characterized in that, The surface of the anti-oxidation layer is covered with a wear-resistant coating, the material of which is titanium nitride or tungsten carbide.

10. A workpiece structure suitable for optimizing the Wire Bonding working surface according to claim 9, characterized in that, The inner wall of the pit (3) is coated with a conductive coating, and the material of the conductive coating is silver.

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