Discharging and transferring device of degumming machine

Abstract

The utility model provides a discharging and transferring device of a degumming machine, and aims to solve the problems of low efficiency and high misoperation rate caused by adopting a manual transferring and reshaping degumming mode for silicon wafer stack treatment after discharging of the degumming machine in the prior art. The device mainly comprises a discharging platform, a transfer manipulator, a degumming machine discharging water tank, a feeding line and a processing workbench, according to the utility model, a silicon wafer stack is transferred through the six-shaft manipulator, and the silicon wafer shovel at the free end of the tail shaft integrates a swirl nozzle, a bucket and a clamping function; the processing workbench integrates the shaping and degumming functions of a silicon wafer stack, the six-axis mechanical arm, the processing workbench, the feeding line in the field and the discharging water tank cooperate with one another, silicon wafers can be automatically transferred, shaped and degummed, the production efficiency is improved, and manual intervention is reduced. And meanwhile, in the treatment process of the silicon wafer stack, the flexible cushion block and the correction sponge roller are adopted, so that the damage to the surface of the silicon wafer is avoided.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer production technology, and in particular to a degumming machine feeding and transfer device. Background Technology

[0002] After the silicon wafer de-adhesive machine finishes de-adhesive removal, the silicon wafers need to be removed in batches, sorted, and de-adhesive removed (residual adhesive on the surface of the silicon wafer stack), and then loaded into the insertion machine's loading box for the next process.

[0003] Currently, the unloading of silicon wafers from degumming machines is mainly done manually, which involves repeated handling and is time-consuming. Furthermore, operators at the unloading station must wear thick rubber gloves for extended periods, increasing the risk of errors and losses. Therefore, for the silicon wafer stacks after degumming, an automated device is needed to replace manual unloading, transfer, and pre-processing between the next process step. Utility Model Content

[0004] This application addresses the shortcomings of the prior art by providing a degumming machine material transfer device that can automatically complete the transfer, shaping, and degumming of silicon wafers, thereby improving production efficiency and reducing manual intervention.

[0005] The technical solution adopted by this utility model to solve the above-mentioned technical problems is as follows:

[0006] A degumming machine unloading and transfer device includes an unloading platform, which is equipped with a transfer robot, a degumming machine discharge water tank, a loading line, and a processing workbench. The transfer robot is configured to scoop out a silicon wafer stack from the degumming machine discharge water tank, transfer the silicon wafer stack to the processing workbench, and then transfer the processed silicon wafer stack to an empty box in the loading line for the next process.

[0007] Furthermore, the transfer robot is a six-axis robot.

[0008] Furthermore, the free end of the transfer robot is provided with a clamp for gripping the silicon wafer stack. The clamp includes a flange provided at the end of the joint of the transfer robot. A silicon wafer shovel is suspended on one side below the flange. The silicon wafer shovel has an L-shaped cross-section. A nozzle is also provided on the side of the flange adjacent to the silicon wafer shovel.

[0009] Furthermore, a clamping mechanism is also arranged on the silicon wafer shovel. The clamping mechanism includes two sets of clamping cylinders arranged opposite to each other. The strokes of the clamping cylinders are arranged opposite to each other. The driving end of the clamping cylinder is provided with a clamping plate. The two sets of clamping plates move away from or closer to each other during the relative stroke of the clamping cylinders. The clamping cylinders are arranged on the vertical shovel surface of the silicon wafer shovel.

[0010] Furthermore, the processing workbench includes three cavities, each of which is equipped with a shaping mechanism for silicon wafer stacking and a de-adhesive removal mechanism for silicon wafer stacking.

[0011] Furthermore, the shaping mechanism includes a push cylinder, and the drive end of the push cylinder is provided with a wheel assembly mounting frame, on which symmetrically arranged are correction sponge rollers that can roll freely.

[0012] Furthermore, the adhesive removal mechanism includes at least two sets of clamping assemblies disposed in the corresponding cavity on the front and back or left and right sides, and also includes an adhesive removal unit disposed above the corresponding cavity.

[0013] Furthermore, the clamping assembly includes a clamping cylinder fixed to the cavity wall, and the driving end of the clamping cylinder is provided with a support frame, on which a flexible pad is fixedly disposed.

[0014] Furthermore, the desizing unit includes a desizing cylinder disposed on one side above the cavity, the stroke range of the desizing cylinder covering the upper surface of the silicon wafer stack, the drive end of the desizing cylinder being provided with a desizing wheel frame, and a desizing brush roller being mounted on the main shaft of the desizing wheel frame.

[0015] The beneficial effects of this utility model are as follows:

[0016] Compared with existing technologies, this utility model uses a six-axis robot to transfer silicon wafer stacks. The silicon wafer shovel at the free end of the last axis integrates a swirling nozzle, a bucket, and a clamping function. The processing workbench integrates the shaping and de-adhesive removal of the silicon wafer stacks. Through the coordinated operation of the six-axis robot, the processing workbench, and the in-plant feeding line and discharge water tank, the transfer, shaping, and de-adhesive removal of silicon wafers can be completed automatically, improving production efficiency and reducing manual intervention.

[0017] Meanwhile, during the processing of silicon wafer stacks, flexible pads and calibrating sponge rollers are used to prevent rigid contact and avoid damage to the silicon wafer surface. The system can automatically complete the transfer, shaping, and desmearing of silicon wafers, improving production efficiency and reducing manual intervention. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the silicon wafer shovel in this utility model;

[0020] Figure 3 This is a schematic diagram showing the silicon wafer shovel in use when shoveling a stack of silicon wafers according to this utility model;

[0021] Figure 4 This is a schematic diagram of the shaping mechanism in this utility model;

[0022] Figure 5 This is a schematic diagram of the adhesive removal mechanism in this utility model.

[0023] The components include: 1. Transfer robot; 2. Degumming machine discharge trough; 3. Feeding line; 4. Processing workbench; 5. Flange; 6. Silicon wafer shovel; 7. Nozzle; 8. Clamping mechanism; 81. Clamping cylinder; 82. Clamping plate;

[0024] 41. Cavity; 42. Push cylinder; 43. Wheel assembly mounting frame; 44. Correcting sponge roller; 45. Clamping cylinder; 49. Support frame; 46. Flexible pad; 47. Glue removal cylinder; 48. Glue removal wheel frame; 50. Glue removal brush roller. Detailed Implementation

[0025] The technical solution of this utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0026] like Figures 1 to 5 As shown, this utility model provides a degumming machine unloading and transfer device, which includes an unloading platform. The unloading platform is equipped with a transfer robot 1, a degumming machine discharge water tank 2, a loading line 3, and a processing workbench 4. The transfer robot 1 is configured to scoop out a silicon wafer stack from the degumming machine discharge water tank 2 and transfer the silicon wafer stack to the processing workbench 4. Then, the processed silicon wafer stack is transferred to the empty box of the loading line 3 for the next process.

[0027] In one embodiment of this utility model, the transfer robot 1 is a six-axis robot.

[0028] In one embodiment of this utility model, the free end of the transfer robot 1 is provided with a clamp for gripping a stack of silicon wafers. The clamp includes a flange 5 provided at the joint end of the transfer robot 1. A silicon wafer shovel 6 is suspended on one side below the flange 5. The cross-section of the silicon wafer shovel 6 is L-shaped. A nozzle 7 is also provided on the side of the flange 5 adjacent to the silicon wafer shovel 6.

[0029] In one embodiment of this utility model, a clamping mechanism 8 is also arranged on the silicon wafer shovel 6. The clamping mechanism 8 includes two sets of clamping cylinders 81 arranged opposite to each other. The strokes of the clamping cylinders 81 are arranged opposite to each other. The driving end of the clamping cylinders 81 is provided with a clamping plate 82. The two sets of clamping plates 82 move away from or closer to each other during the relative strokes of the clamping cylinders 81. The clamping cylinders 81 are arranged on the vertical shovel surface of the silicon wafer shovel 6.

[0030] In one embodiment of this utility model, the processing workbench 4 includes three cavities 41, each of which is provided with a shaping mechanism for silicon wafer stacking and a de-adhesive removal mechanism for silicon wafer stacking.

[0031] In one embodiment of this utility model, the shaping mechanism includes a push cylinder 42, and the drive end of the push cylinder 42 is provided with a wheel assembly mounting frame 43. The wheel assembly mounting frame 43 is symmetrically provided with correction sponge rollers 44 that can roll freely.

[0032] In one embodiment of the present invention, the adhesive removal mechanism includes two sets of clamping components disposed in the corresponding cavity 41 at least on the front and rear or left and right sides, and also includes an adhesive removal unit disposed above the corresponding cavity 41.

[0033] In one embodiment of the present invention, the clamping assembly includes a clamping cylinder 45 fixedly disposed on the wall of the cavity 41, and a support frame 49 is provided at the driving end of the clamping cylinder 45, and a flexible pad 46 is fixedly disposed on the support frame 49.

[0034] In one embodiment of the present invention, the adhesive removal unit includes an adhesive removal cylinder 47 disposed on one side above the cavity 41. The stroke range of the adhesive removal cylinder 47 covers the upper surface of the silicon wafer stack. The drive end of the adhesive removal cylinder 47 is provided with an adhesive removal wheel frame 48, and an adhesive removal brush roller 50 is mounted on the main shaft of the adhesive removal wheel frame 48.

[0035] The specific workflow of this utility model is as follows:

[0036] Silicon wafer stack shovel:

[0037] The six-axis robotic arm moves above the degumming machine's discharge trough 2, and the silicon wafer shovel 6 is inserted into the bottom of the silicon wafer stack;

[0038] The robotic arm scoops the silicon wafer stack out of the discharge water tank, and the silicon wafer scoop 6 on the upper side of the silicon stack has nozzles 7 spraying water to separate the silicon wafers;

[0039] Silicon wafer stack transfer:

[0040] The six-axis robot transfers the silicon wafer stack into the cavity 41 of the processing workbench 4;

[0041] Silicon wafer stacking processing:

[0042] The shaping mechanism's push cylinder 42 drives the correction sponge roller 44 to squeeze the silicon wafer stack from at least three directions to shape its posture, ensuring it is neat and square.

[0043] The adhesive removal unit uses a de-adhesive brush roller 50 to remove adhesive from the surface of the silicon wafer.

[0044] Silicon wafer stacking and unloading:

[0045] The transfer robot 1 transfers the processed silicon wafer stack from the processing workbench 4 to the empty box of the loading line 3. At this time, the clamping module is activated, clamping the silicon wafer stack in the opposite direction and transferring it to the empty box of the loading line 3 to enter the next process.

[0046] In summary, this invention utilizes a six-axis robotic arm to transfer silicon wafer stacks. The wafer shovel 6 at the free end of its end axis integrates a swirling nozzle 7, a bucket, and clamping functions. The processing worktable 4 integrates shaping and de-adhesive removal of the silicon wafer stacks. Through the coordinated operation of the six-axis robotic arm, the processing worktable 4, and the on-site feeding line 3 and discharge water trough, the transfer, shaping, and de-adhesive removal of silicon wafers can be automatically completed, improving production efficiency and reducing manual intervention. Furthermore, during the processing of the silicon wafer stacks, flexible pads 46 and calibrating sponge rollers 44 are used to prevent damage to the silicon wafer surface.

[0047] The above description is an explanation of the present utility model and not a limitation thereof. The scope of the present utility model is defined by the claims. Within the protection scope of the present utility model, any form of modification may be made.

Claims

1. A material conveying device for a degumming machine, characterized in that: The system includes a material unloading platform, which is equipped with a transfer robot (1), a degumming machine discharge water tank (2), a feeding line (3), and a processing workbench (4). The transfer robot (1) is configured to scoop out the silicon wafer stack from the degumming machine discharge water tank (2), transfer the silicon wafer stack to the processing workbench (4), and then transfer the processed silicon wafer stack to the empty box of the feeding line (3) for the next process. The free end of the transfer robot (1) is provided with a clamp for gripping the silicon wafer stack. The clamp includes a flange (5) provided at the joint end of the transfer robot (1). A silicon wafer shovel (6) is suspended on one side below the flange (5). The cross-section of the silicon wafer shovel (6) is L-shaped. A nozzle (7) is also provided on the side of the flange (5) adjacent to the silicon wafer shovel (6). The silicon wafer shovel (6) is also provided with a clamping mechanism (8), which includes two sets of clamping cylinders (81) arranged opposite to each other. The strokes of the clamping cylinders (81) are arranged opposite to each other. The driving end of the clamping cylinder (81) is provided with a clamping plate (82). The two sets of clamping plates (82) move away from or closer to each other during the relative stroke of the clamping cylinders (81). The clamping cylinders (81) are arranged on the vertical shovel surface of the silicon wafer shovel (6).

2. The degumming and conveying device for a degumming machine as described in claim 1, characterized in that: The transfer robot (1) is a six-axis robot.

3. The degumming and conveying device for a degumming machine as described in claim 1, characterized in that: The processing workbench (4) includes two cavities (41), each cavity (41) being equipped with a shaping mechanism for silicon wafer stacking and a de-adhesive mechanism for silicon wafer stacking.

4. The degumming and conveying device for a degumming machine as described in claim 3, characterized in that: The shaping mechanism includes a push cylinder (42), and the drive end of the push cylinder (42) is provided with a wheel assembly mounting frame (43). The wheel assembly mounting frame (43) is symmetrically provided with correction sponge rollers (44) that can roll freely.

5. The degumming and conveying device for a degumming machine as described in claim 3, characterized in that: The adhesive removal mechanism includes at least two sets of clamping components disposed in the corresponding cavity (41) on the front and back or left and right sides, and also includes an adhesive removal unit disposed above the corresponding cavity (41).

6. The degumming machine feeding and conveying device as described in claim 5, characterized in that: The clamping assembly includes a clamping cylinder (45) fixed on the wall of the cavity (41), and a support frame (49) is provided on the drive end of the clamping cylinder (45), and a flexible pad (46) is fixedly provided on the support frame (49).

7. The degumming and conveying device for a degumming machine as described in claim 5, characterized in that: The desizing unit includes a desizing cylinder (47) disposed on one side above the cavity (41). The stroke range of the desizing cylinder (47) covers the upper surface of the silicon wafer stack. The driving end of the desizing cylinder (47) is provided with a desizing wheel frame (48). A desizing brush roller (50) is mounted on the main shaft of the desizing wheel frame (48).

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