Air-cooled radiator

Abstract

The utility model discloses an air-cooled radiator, which relates to the technical field of air-cooled radiators, and comprises a high-power chip, a radiating mechanism is arranged above the high-power chip, the radiating mechanism comprises a phase change heat transfer unit, a fin convection unit and a fixed adjusting unit, the phase change heat transfer unit is arranged in the central area of the radiating mechanism and comprises a substrate, and the fin convection unit is arranged on the substrate. A cavity wall is integrally installed on the base plate, a central cavity is formed in the cavity wall, a plurality of central cavity bottom face microstructures are arranged in the bottom face of the central cavity, a liquid working medium is sealed and packaged in the central cavity, and the liquid working medium in the central cavity can be evaporated and condensed through the evaporation-condensation phase change process of the liquid working medium in the central cavity. In combination with the strengthening effect of the microstructure on boiling heat transfer, the heat transfer resistance of the central area is reduced to 30% or below of that of traditional single-path conduction, so that the heat dissipation power is improved by over 100% under the same volume.

Description

TECHNICAL FIELD

[0001] The utility model relates to a wind cooling radiator technical field, concretely is a kind of wind cooling radiator. BACKGROUND

[0002] Chip microstructure wind cooling radiator is a kind of device using metal heat conduction and air heat convection to chip cooling.

[0003] According to the patent name: a new type of wind cooling radiator (patent publication number: CN219349470U, patent publication date: 2023-07-14), including radiating fin, the bottom of radiating fin is equipped with base, the base is equipped with radiating fan, the radiating fan is located in the middle of the radiating fin, the included angle between the plane where the radiating fan is located and the plane where the base is located is 5-15 °. Change the wind direction by tilting the radiating fan, so as to speed up the heat dissipation, and the fixed wind direction carries out heat, achieves the effect of direct heat dissipation directional heat dissipation in the heat dissipation area, reduces the power of main fan of case, reduces noise, improves the heat dissipation speed, and is suitable for closed case and directional air duct.

[0004] And based on the above prior art, the existing wind cooling radiator still has the following problems, the existing wind cooling radiator has the problems of large size, heavy weight, low heat dissipation power and poor heat dissipation performance, therefore, the utility model provides a wind cooling radiator. UTILITY MODEL CONTENTS

[0005] In view of the deficiencies of the prior art, the utility model provides a wind cooling radiator, which solves the problems of the existing wind cooling radiator, such as large size, heavy weight, low heat dissipation power and poor heat dissipation performance.

[0006] To achieve the above purpose, the utility model is implemented by the following technical solutions: a wind cooling radiator, comprising a high-power chip, a heat dissipation mechanism is arranged above the high-power chip, and the heat dissipation mechanism comprises:

[0007] A phase change heat transfer unit is arranged in the central region of the heat dissipation mechanism and comprises a substrate, a cavity wall is integrally mounted on the substrate, a central cavity is arranged in the cavity wall, a plurality of central cavity bottom microstructures are formed in the bottom surface of the central cavity, a liquid working medium is sealed and packaged in the central cavity, and high-intensity evaporation and boiling heat transfer enhancement are realized by phase change of the liquid working medium in the central cavity under vacuum state.

[0008] A fin convection unit is arranged in the outer peripheral region of the substrate and is used for forced convection heat exchange of air.

[0009] A fixed adjustment unit is arranged above the substrate and is used for optimizing air distribution and improving the convection heat exchange coefficient.

[0010] Preferably, the phase change heat transfer unit further comprises a central cavity cover plate fixedly installed on the top of the cavity wall, and a central cavity boss provided outside the cavity wall for enhancing structural strength, wherein a circular hole is formed in the inside of the central cavity boss for preventing deformation of the central cavity boss structure.

[0011] Preferably, the rib convection unit comprises inner section ribs, middle section ribs and outer section ribs fixedly installed on the base plate, wherein the inner section ribs are connected with the side wall of the central cavity, and the inner section ribs, the middle section ribs and the outer section ribs are arranged in cross.

[0012] Preferably, the fixed adjustment unit comprises outer edge columns fixedly installed on the base plate, an encapsulation nozzle fixedly installed on the top of the central cavity cover plate, and a distance cap, wherein the top of the base plate is fixedly installed on four groups of outer edge columns, the base plate is fixedly connected with the outer edge columns through fan fixing screws, and the distance between the fan and the central cavity cover plate is determined by the height of the distance cap.

[0013] Preferably, gaps are arranged between the inner section ribs, the middle section ribs and the outer section ribs, the inner section ribs, the middle section ribs and the outer section ribs are separated through the gaps, and multi-stage air flow channels are formed, so that the air driven by the fan can uniformly flow through the surfaces of the ribs.

[0014] Preferably, the microstructure on the bottom surface of the central cavity is in the shape of a micro-cone or a micro-cylinder, and the liquid working medium is ethanol, water or freon.

[0015] The air-cooled radiator has the following beneficial effects compared with the prior art:

[0016] 1. The air-cooled radiator reduces the heat transfer thermal resistance of the central region to below 30% of the traditional single-path conduction through the evaporation-condensation phase change process of the liquid working medium in the central cavity and the strengthening effect of the microstructure on boiling heat transfer, so that the heat dissipation power is increased by more than 100% under the same volume.

[0017] 2. The air-cooled radiator reduces the weight of the radiator by more than 50% and reduces the volume to below 0.001 m³ through integrated processing of the integrated base plate, the inner section ribs, the middle section ribs and the outer section ribs, and the replacement of the central cavity for the traditional metal fins. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 The utility model of the appearance solid structure diagram is provided;

[0019] Figure 2 The utility model of the inside solid structure diagram is provided;

[0020] Figure 3 The utility model of the central cavity bottom surface solid structure diagram is provided;

[0021] Figure 4 The utility model discloses a central cavity bottom surface microstructure sectional view solid structure diagram.

[0022] In the drawing: 1 - fixed distance cap, 2 - central cavity cover plate, 3 - central cavity boss, 4 - round hole, 5 - inner section fin, 6 - middle section fin, 7 - outer section fin, 8 - base plate, 9 - outer edge stand, 10 - encapsulation mouth, 11 - fan, 12 - fan fixing screw, 13 - central cavity, 14 - central cavity bottom surface, 15 - chip, 16 - cavity wall, 17 - central cavity bottom surface microstructure, 18 - gap, 19 - liquid working medium. DETAILED DESCRIPTION

[0023] The utility model discloses an embodiment of the utility model will be clearly and completely described below with the drawings in the embodiment of the utility model to the technical scheme in the embodiment of the utility model, obviously, the described embodiment only is a part of embodiment of the utility model, but is not all the embodiment. Based on the embodiment in the utility model, all other embodiments that the ordinary skill in the art obtains without making the creative labor are within the scope of the utility model protection.

[0024] Please refer to Figures 1-4 The utility model provides a kind of technical scheme:

[0025] A forced air cooling radiator, comprising a high-power chip 15, a heat dissipation mechanism is arranged above the high-power chip 15, and the heat dissipation mechanism comprises:

[0026] A phase change heat transfer unit is arranged in the central region of the heat dissipation mechanism and comprises a base plate 8, and a cavity wall 16 is integrally installed on the base plate 8, and the cavity wall 16 is internally provided with a central cavity 13 and a central cavity bottom surface 14, the central cavity bottom surface 14 is internally provided with a plurality of central cavity bottom surface microstructures 17, a liquid working medium 19 is sealed and encapsulated in the central cavity 13, and the central cavity 13 realizes high-intensity evaporation and boiling heat transfer enhancement under vacuum state through the phase change of the liquid working medium 19.

[0027] A fin convection unit is arranged in the outer peripheral region of the base plate 8 and is used for forced air convection heat exchange.

[0028] A fixed adjustment unit is arranged above the base plate 8 and is used for optimizing air distribution and improving the convection heat exchange coefficient.

[0029] Through the integrated design of the base plate 8 and the cavity wall 16, combined with the phase change heat transfer of the vacuum sealed central cavity 13 and the liquid working medium 19, the heat transfer intensity of the central region is significantly improved, and the thermal resistance is reduced; at the same time, the microstructure 17 of the cavity wall 16 and the central cavity bottom surface 14 strengthens boiling heat transfer, and the heat dissipation power is increased by more than 100%.

[0030] In this embodiment, the phase change heat transfer unit further comprises a central cavity cover plate 2 fixedly installed on the top of the cavity wall 16, and a central cavity boss 3 arranged outside the cavity wall 16 for enhancing the structural strength, and a circular hole 4 is arranged in the central cavity boss 3 for preventing the structural deformation of the central cavity boss 3.

[0031] The central cavity cover plate 2 is welded and sealed with the cavity wall 16 to ensure the stability of the vacuum environment; the central cavity boss 3 disperses the thermal stress through the circular hole 4 to prevent the structural deformation under high temperature and prolong the service life.

[0032] In this embodiment, the rib convection unit comprises an inner section rib 5, a middle section rib 6 and an outer section rib 7 fixedly installed on the base plate 8, the inner section rib 5 is connected with the central cavity side wall, and the inner section rib 5, the middle section rib 6 and the outer section rib 7 are arranged in cross.

[0033] The cross arrangement of the inner section rib 5, the middle section rib 6 and the outer section rib 7 increases the heat dissipation surface area, forms a multi-stage air flow channel in cooperation with the fan 11, makes the air flow uniformly through the surface of each section of rib, reduces the local temperature rise, and ensures that the chip temperature is controlled within 50°C temperature rise.

[0034] In this embodiment, the fixed adjustment unit comprises an outer edge column 9 fixedly installed on the base plate 8, a packaging nozzle 10 fixedly installed on the top of the central cavity cover plate 2, and a fixed distance cap 1, the top of the base plate 8 is fixedly installed on four groups of outer edge columns 9, the fan 11 is fixedly connected with the outer edge column 9 through the fan fixing screw 12 fixedly installed on the top of the base plate 8, and the distance between the fan 11 and the central cavity cover plate 2 is determined by the height of the fixed distance cap 1.

[0035] The fixed distance cap 1 determines the distance H between the fan 11 and the radiator through the fixed height, optimizes the air flow distribution, and makes the forced convection heat transfer coefficient increase by more than 40%; the outer edge column 9 and the fan fixing screw 12 ensure the stable installation of the fan, and avoid the performance fluctuation caused by vibration.

[0036] In this embodiment, a gap 18 is arranged between the inner section rib 5, the middle section rib 6 and the outer section rib 6, the inner section rib 5, the middle section rib 6 and the outer section rib 8 are separated through the gap 18, a multi-stage air flow channel is formed, and the air driven by the fan 11 can flow uniformly through the surface of each section of rib.

[0037] The gap 18 separates the inner section rib 5, the middle section rib 6 and the outer section rib 18 to form a multi-stage air flow channel, prolongs the contact time of air and rib, and improves the heat exchange efficiency; at the same time, the stress generated by the thermal expansion of each section of rib is relieved, and the structural deformation is prevented.

[0038] In this embodiment, the central cavity bottom surface microstructure 17 is in the shape of micro-cone or micro-cylinder, and the liquid working medium 19 is ethanol, water or freon.

[0039] The micro-cone / cylinder-shaped central cavity bottom surface microstructure 17 increases the phase change contact area of the liquid working medium 19, and the boiling heat transfer efficiency is increased by more than 30%; the working medium such as ethanol and water can be flexibly selected according to the temperature requirement, and is suitable for different power chips.

[0040] Meanwhile, the contents not described in detail in the specification all belong to the prior art known to those skilled in the art.

[0041] During operation, the high-power chip 15 is tightly attached to the lower surface of the heat sink substrate 8 through a thermal interface material such as thermal conductive silicone grease, and the heat generated by the high-power chip 15 is conducted in two ways through the lower surface of the heat sink substrate 8 to the bottom of the inner section fin 5, the middle section fin 6, and the outer section fin 7 on the upper surface of the substrate 8 outside the central cavity region and the central cavity bottom surface 14.

[0042] The heat generated by the chip conducted to the central cavity bottom surface 14 is sealed and packaged in a vacuum state with a certain amount of liquid working medium 19 for phase change heat transfer, and the central cavity bottom surface 14 is distributed with microstructures 17 recessed on the central cavity bottom surface. The microstructures 17 are micro-cone-shaped or micro-cylinder-shaped, these microstructures 17 are immersed in the liquid, the heat generated by the chip conducted to the central cavity bottom surface 14 causes a high-intensity evaporation and boiling strengthening phase change heat transfer process of the liquid working medium 19 on the surface of the central cavity bottom surface microstructure, and the liquid changes into vapor after phase change, thereby carrying away heat from the central cavity bottom surface. The vapor isochorally diffuses to the inner side wall surface of the central cavity, and the vapor condenses into liquid on the inner side wall surface of the central cavity, and the liquid flows back to the central cavity bottom surface, while releasing the carried heat and transferring it to the inner side wall surface of the central cavity. Then, the heat is conducted to the surface of the inner section fin 5 through the inner section fin 5 connected to the side wall of the central cavity, and air forced convection heat exchange occurs between the fin surface and the ambient air by means of the fan 11, and finally the chip heat generated by this part is dissipated to the external environment.

[0043] The heat generated by the chip conducted to the central cavity bottom surface 14 is sealed and packaged in a vacuum state with a certain amount of liquid working medium 19 for phase change heat transfer, and the central cavity bottom surface 14 is distributed with microstructures 17 recessed on the central cavity bottom surface. The microstructures 17 are micro-cone-shaped or micro-cylinder-shaped, these microstructures 17 are immersed in the liquid, the heat generated by the chip conducted to the central cavity bottom surface 14 causes a high-intensity evaporation and boiling strengthening phase change heat transfer process of the liquid working medium 19 on the surface of the central cavity bottom surface microstructure, and the liquid changes

[0044] By the above two parallel and high-power heat transfer processes with equivalent heat transfer power, i.e. by coupling the high-intensity evaporation and boiling enhanced phase change heat transfer process of the bottom surface of the central cavity microstructure in the central cavity region and the heat conduction heat transfer process of the substrate to the outer surface of each section of the fin outside the central cavity region, the heat generated by the high-power chip is greatly shared by the heat transfer thermal resistance of the high-power heat sink through the traditional single heat conduction mode to the outer surface of the fin; at the same time, by further utilizing the segmentation of the fin and the cross arrangement of the fin between the inner section fin, the middle section fin and the outer section fin, the forced convection heat transfer coefficient between the fin surface and the air is further improved by the fan, thereby resulting in a significant reduction in the overall heat transfer thermal resistance of the high-power chip air-cooled heat sink, significantly improving the heat dissipation performance of the high-power chip air-cooled heat sink, greatly reducing the weight of the high-power chip air-cooled heat sink, and reducing the volume of the high-power chip air-cooled heat sink.

[0045] It should be noted that, in this document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0046] Although the embodiments of the present application have been shown and described, it is to be understood that for the purpose of the present application, the changes, modifications, replacements and variations of the embodiments can be made by those skilled in the art without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A wind-cooled heat sink, comprising a high-power chip (15), characterized in that: A heat dissipation mechanism is provided above the high-power chip (15), and the heat dissipation mechanism includes: A phase change heat transfer unit is located in the central area of ​​the heat dissipation mechanism. It includes a substrate (8) and a cavity wall (16) is integrally mounted on the substrate (8). A central cavity (13) is provided inside the cavity wall (16). Several microstructures (17) of the central cavity bottom surface (14) are opened inside the central cavity bottom surface. A liquid working medium (19) is sealed inside the central cavity (13). The central cavity (13) achieves high-intensity evaporation and boiling to enhance heat transfer through the phase change of the liquid working medium (19) under vacuum. The finned convection unit is disposed in the outer peripheral region of the substrate (8) and is used for forced air convection heat transfer; A fixed adjustment unit is set above the substrate (8) and is used to optimize airflow distribution and improve the convective heat transfer coefficient.

2. The air-cooled radiator according to claim 1, characterized in that: The phase change heat transfer unit also includes a central cavity cover plate (2) fixedly installed on the top of the cavity wall (16), and a central cavity boss (3) is provided on the outside of the cavity wall (16) to enhance the structural strength. A round hole (4) is provided inside the central cavity boss (3) to prevent the central cavity boss (3) from deforming.

3. The air-cooled radiator according to claim 1, characterized in that: The rib convection unit includes an inner rib (5), a middle rib (6) and an outer rib (7) fixedly mounted on a substrate (8). The inner rib (5) is connected to the side wall of the central cavity, and the inner rib (5), the middle rib (6) and the outer rib (7) are arranged in a cross pattern.

4. The air-cooled radiator according to claim 2, characterized in that: The fixed adjustment unit includes an outer edge column (9) fixedly mounted on the base plate (8), a sealing nozzle (10) and a spacer cap (1) fixedly mounted on the top of the central cavity cover plate (2). The base plate (8) is fixedly mounted on four sets of outer edge columns (9). The top of the base plate (8) is fixedly connected to the fan (11) and the outer edge column (9) by the fan fixing screw (12). The distance between the fan (11) and the central cavity cover plate (2) is determined by the height of the spacer cap (1).

5. A wind-cooled radiator according to claim 3, characterized in that: A gap (18) is provided between the inner rib (5), the middle rib (6) and the outer rib (7). The gap (18) separates the inner rib (5), the middle rib (6) and the outer rib (7) to form a multi-stage airflow channel, so that the air driven by the fan (11) can flow evenly across the surface of each rib.

6. The air-cooled radiator according to claim 1, characterized in that: The microstructure (17) on the bottom surface of the central cavity is in the shape of a microcone or microcylinder, and the liquid working medium (19) is ethanol, water or Freon.

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