Heating constant temperature device and gluing head

Abstract

The utility model discloses a heating constant-temperature device and discloses a gluing head with the heating constant-temperature device, the heating constant-temperature device comprises a heating assembly and a heating assembly, the heating assembly comprises a heater, and the heater is connected with a gluing cylinder so as to heat glue in the gluing cylinder; the heat dissipation assembly comprises a cooler and a heat dissipation device, the cooler is connected with the heater so as to reduce the temperature of the heater, and the heat dissipation device is connected with the cooler so as to conduct heat of the cooler; the temperature control assembly comprises a cover body, an input pipe and a discharge pipe, the input pipe and the discharge pipe are connected with the cover body, the radiator is contained in the cover body so as to collect heat released by the radiator, the input pipe is used for introducing fluid into the cover body, and the discharge pipe is used for discharging the fluid in the cover body. According to the glue coating device, the temperature of glue in the glue coating barrel can be kept constant, the concentration of the glue is uniform, and good glue coating quality is ensured.

Description

Technical Field

[0001] This utility model relates to the technical field of adhesive coating equipment, and in particular to a heating and temperature control device and an adhesive coating head. Background Technology

[0002] Typically, adhesive is stored in a storage tank. When applying the adhesive, the adhesive in the storage tank is pumped to the applicator head, which then performs the application. When the ambient temperature is low, the adhesive is prone to solidification. Furthermore, if the adhesive is left to stand in the storage tank for a long time, sedimentation can occur, resulting in differences in adhesive concentration at different locations in the storage tank. This affects the application quality and ultimately the product quality. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a heating and temperature control device that can maintain a constant temperature and uniform concentration of the adhesive inside the coating tube, thereby ensuring good coating quality.

[0004] This utility model also proposes a glue applicator having the above-mentioned heating and temperature control device.

[0005] A heating and temperature control device according to a first aspect of the present invention includes: a heating assembly including a heater connected to a glue-applying cylinder for heating glue inside the glue-applying cylinder; a heat dissipation assembly including a cooler and a radiator connected to the heater for reducing the temperature of the heater, and the radiator connected to the cooler for conducting heat from the cooler; and a temperature control assembly including a cover, an input pipe connected to the cover, and an outlet pipe, wherein the radiator is housed inside the cover to collect heat released by the radiator, the input pipe is used to introduce fluid into the cover, and the outlet pipe is used to discharge fluid from the cover.

[0006] A heating and temperature control device according to an embodiment of the present invention has at least the following beneficial effects:

[0007] 1. This utility model incorporates a heater that heats the coating cylinder, raising the temperature of the adhesive inside and preventing it from solidifying. Furthermore, the heater improves the adhesive's fluidity, accelerating its flow across the entire coating cylinder and preventing sedimentation. This ensures consistent adhesive concentration throughout the cylinder, resulting in uniform adhesive composition that meets the temperature requirements for application and the overall coating process.

[0008] 2. By incorporating a cooler and a radiator, this utility model allows the cooler to cool and lower the temperature of the heater when the glue inside the coating tube is heated beyond the specified range, thus reducing the temperature of the glue inside the coating tube to the required range. Simultaneously, the radiator conducts heat from the cooler, which helps to accelerate the temperature drop of the heater. This achieves the function of temperature control for the glue inside the coating tube, preventing the glue from overheating and affecting its performance.

[0009] 3. This utility model, by setting up a cover, an inlet pipe and an outlet pipe, arranges the radiator inside the cover, so that the heat of the radiator is released inside the cover. Fluid, which can be air, is introduced into the cover through the inlet pipe to carry away the heat of the radiator. At the same time, the flow rate of the fluid delivered by the inlet pipe can be controlled to precisely control the temperature drop of the heater to the specified temperature and to quickly maintain the temperature of the heater within the specified range, thereby stabilizing the temperature of the glue inside the glue applicator.

[0010] According to a first aspect of the present invention, a heating and temperature control device is provided, wherein the cover is connected to the heater, and a receiving cavity is formed between the interior of the cover and the heater, the receiving cavity accommodating the cooler and the radiator.

[0011] The advantages are: by setting up a receiving cavity, the cooler and radiator are arranged inside the receiving cavity, which makes the cooler and radiator less susceptible to the influence of the external environment, facilitates precise control of heat dissipation inside the receiving cavity, and helps maintain the glue inside the glue applicator within the specified range.

[0012] According to a first aspect of the present invention, a heating and temperature control device is provided, wherein the cooler is a semiconductor refrigeration chip, and a limiting groove is provided on the side of the heater near the receiving cavity, the limiting groove accommodating the semiconductor refrigeration chip.

[0013] The advantage is that this invention uses a semiconductor refrigeration chip as a cooler. The semiconductor refrigeration chip can realize the cooling function by utilizing the thermoelectric effect of semiconductor materials. When the heater heats up to a temperature higher than the set temperature, the semiconductor refrigeration chip is activated and conducts heat to the heat sink, which facilitates precise control of the heater temperature.

[0014] In addition, by setting a limiting groove, the position of the thermoelectric cooler is restricted within the limiting groove, making the installation of the thermoelectric cooler more convenient. Furthermore, it ensures that the thermoelectric cooler is in close contact with the heater, which is beneficial for the thermoelectric cooler to quickly cool and lower the temperature of the heater.

[0015] According to a first aspect of the present invention, a heating and temperature control device is provided, wherein the heat sink has an abutting surface that abuts against the side of the semiconductor cooling chip away from the heater.

[0016] The advantage of this invention is that, through the contact surface, the heat sink abuts against the side of the thermoelectric cooler, increasing the contact area between the heat sink and the thermoelectric cooler. This facilitates the heat sink to quickly conduct heat from the thermoelectric cooler, enabling the thermoelectric cooler to rapidly reduce the temperature of the heater.

[0017] According to a first aspect of the present invention, a heating and temperature control device is provided in which the output port of the input tube and the discharge port of the discharge tube are arranged in a straight line opposite each other.

[0018] The advantages of this invention are: by arranging the output port of the input pipe and the inlet of the discharge pipe opposite each other, air is introduced into the input pipe. After the air enters the inside of the cover, it can be directly directed towards the inlet of the discharge pipe, forming a fast-flowing airflow inside the cover. The airflow carries away the heat inside the cover, thereby improving the efficiency of heat exhaust.

[0019] According to a first aspect of the present invention, a heating and temperature control device is provided, wherein the radiator has a plurality of heat dissipation fins arranged side by side and forming a straight channel between the plurality of heat dissipation fins, and the output port of the input pipe and the discharge port of the discharge pipe are respectively located at the two ends of the straight channel.

[0020] The advantages are: by setting multiple heat sinks, the thickness of the heat sinks is very small, and the heat sinks are used to remove the heat from the cooler.

[0021] Furthermore, the output port of the input pipe and the inlet / outlet of the discharge pipe are respectively arranged at both ends of the straight channel, so that air can quickly pass through the straight channel, thereby rapidly carrying away the heat from the heat sink and improving the heat dissipation efficiency of the heat sink.

[0022] According to a first aspect of the present invention, a heating and temperature control device is provided, wherein the heater has a main body and a heating wire connected to the main body, the main body is made of aluminum, and the main body has a through hole for accommodating the glue coating cylinder.

[0023] The advantages of this invention are: the main body and the heating wire. The main body can be a structural component made of aluminum. Aluminum has a good thermal conductivity. When the heating wire heats up, the main body can quickly conduct heat to the glue coating cylinder, which can quickly raise the temperature of the glue inside the glue coating cylinder.

[0024] According to a first aspect of the present invention, a heating and temperature control device is provided in which the main body is provided with a fixing member, the fixing member is provided with a mounting hole, and a bushing is sleeved on the outer surface of the glue coating cylinder, the bushing being installed in the mounting hole.

[0025] The advantages of this invention are: by using a fastener and a bushing, the bushing is fitted onto the outer surface of the glue applicator, and then the bushing is installed in the mounting hole of the fastener, thereby fixing the glue applicator to the main body. The bushing can reduce wear between the glue applicator and the fastener, which helps to extend the service life of the glue applicator.

[0026] According to a first aspect of the present invention, a heating and temperature control device is provided in which a glue-applying cylinder is provided with a needle for dispensing glue from inside the glue-applying cylinder, and a fixed sleeve is threadedly connected to the through hole, the fixed sleeve accommodating the needle.

[0027] The advantages of this invention are: by setting a needle, the needle can output the glue inside the glue applicator. By setting a fixing sleeve, when the glue applicator is installed, the needle passes through the through hole and the inside of the fixing sleeve. The fixing sleeve and the through hole are connected by threads, so that the needle is fixed in the fixing sleeve, thus avoiding the needle from being misaligned when applying glue.

[0028] A glue applicator according to a second aspect of the present invention includes the heating and temperature control device described in any one of the above-mentioned embodiments.

[0029] A glue applicator according to an embodiment of the present invention has at least the following beneficial effects:

[0030] This invention incorporates a heating and temperature control device that heats the adhesive in the coating tube and maintains it within a specific temperature range. This prevents sedimentation, ensures uniform adhesive concentration, and guarantees good coating quality.

[0031] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0032] To more clearly illustrate the technical solutions of the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of the structure of a heating and temperature control device and a glue applicator according to an embodiment of the present invention;

[0034] Figure 2 for Figure 1 An exploded view of a heating and temperature control device and a glue applicator head is shown.

[0035] Figure 3 for Figure 1 A cross-sectional view of a heating and temperature control device and a glue applicator head is shown.

[0036] Reference numerals: 100-Glue applicator, 110-Heater, 120-Cooler, 130-Radiator, 140-Cover, 150-Inlet pipe, 160-Outlet pipe, 170-Receiving cavity, 180-Limiting groove, 190-Heat fin, 200-Through hole, 210-Main body, 220-Fixing component, 230-Bushing, 240-Needle, 260-Fixing sleeve, 270-Straight channel. Detailed Implementation

[0037] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0038] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0039] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" and "second" are mentioned, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the order of the indicated technical features.

[0040] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation, connection, and linkage" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0041] The following description, in conjunction with the accompanying drawings, describes a heating and temperature control device and a glue applicator according to an embodiment of the present invention.

[0042] Reference Figure 1 The present invention aims to provide an embodiment of a heating and temperature control device and a glue applicator.

[0043] A heating and temperature control device according to an embodiment of the present invention includes a heating component, which includes a heater 110. The heater 110 is connected to a glue coating cylinder 100 to heat the glue inside the glue coating cylinder 100.

[0044] It is understood that by setting up a heater 110, this utility model can heat the glue coating cylinder 100, thereby raising the temperature of the glue inside the glue coating cylinder 100, preventing the glue inside the glue coating cylinder 100 from solidifying, and improving the fluidity of the glue, allowing the glue at the top and bottom of the glue coating cylinder 100 to flow faster, preventing the glue from settling, ensuring that the glue concentration at the top and bottom of the glue coating cylinder 100 is consistent, thus making the glue composition uniform, meeting the glue's temperature characteristics requirements, and satisfying the glue coating requirements.

[0045] A heating and temperature control device according to an embodiment of the present invention further includes a heat dissipation component, which includes a cooler 120 and a radiator 130. The cooler 120 is connected to the heater 110 to reduce the temperature of the heater 110, and the radiator 130 is connected to the cooler 120 to conduct heat from the cooler 120.

[0046] It is understood that by setting up a cooler 120 and a radiator 130, when the glue inside the glue applicator 100 is heated beyond the specified range, the cooler 120 can cool and lower the temperature of the heater 110, so that the temperature of the glue inside the glue applicator 100 drops to the required range. At the same time, the radiator 130 conducts heat from the cooler 120, which helps to accelerate the temperature drop of the heater 110. Thus, the function of temperature control of the glue inside the glue applicator 100 is achieved, avoiding the glue temperature from being too high and affecting the performance of the glue.

[0047] A heating and temperature control device according to an embodiment of the present invention further includes a temperature control component, which includes a cover 140, an input pipe 150 connected to the cover 140, and an output pipe 160. The cover 140 houses a radiator 130 to collect the heat released by the radiator 130. The input pipe 150 is used to introduce fluid into the cover 140, and the output pipe 160 is used to discharge the fluid inside the cover 140.

[0048] It is understood that this utility model, by setting up a cover 140, an inlet pipe 150, and an outlet pipe 160, with the radiator 130 arranged inside the cover, allows the heat from the radiator 130 to be released inside the cover 140. Fluid, which can be air, is introduced into the cover 140 through the inlet pipe 150 to carry away the heat from the radiator 130. At the same time, the flow rate of the fluid delivered by the inlet pipe 150 can be controlled to precisely control the temperature drop of the heater 110 to the specified temperature and to quickly maintain the temperature of the heater 110 within the specified range, thereby stabilizing the temperature of the glue inside the glue applicator 100.

[0049] In some embodiments of this utility model, a temperature sensor is also included. The temperature sensor is electrically connected to a thermostat. The temperature sensor and the thermostat are not shown in the drawings. The temperature sensor can check the temperature of the glue applicator 100. The temperature sensor inputs a signal to the thermostat, which displays the current device temperature. When the device temperature is lower than the set temperature, the thermostat controls the heater 110 to heat up to near the set temperature and then cuts off the power. When the device temperature is higher than the set temperature, the thermostat controls the cooler 120 to cool down the device and then cuts off the power.

[0050] In some embodiments of this utility model, reference is made to Figure 3 The cover 140 is connected to the heater 110, and a receiving cavity 170 is formed between the interior of the cover 140 and the heater 110, the receiving cavity 170 accommodating the cooler 120 and the radiator 130.

[0051] It is understood that by setting up a receiving cavity 170, the cooler 120 and the radiator 130 are both arranged inside the receiving cavity 170, making the cooler 120 and the radiator 130 less susceptible to the influence of the external environment, facilitating precise control of heat dissipation inside the receiving cavity 170, and helping to maintain the glue inside the glue applicator 100 within the specified range.

[0052] In some specific embodiments of this utility model, the cooler 120 is a semiconductor refrigeration chip. It can be understood that by using a semiconductor refrigeration chip as the cooler 120, the semiconductor refrigeration chip can realize the cooling function by utilizing the thermoelectric effect of semiconductor materials. When the heater 110 heats up to a temperature higher than the set temperature, the semiconductor refrigeration chip is activated and conducts heat to the heat sink 130, which facilitates precise control of the temperature of the heater 110.

[0053] Furthermore, referring to Figure 2A limiting groove 180 is provided on the side of the heater 110 near the receiving cavity 170. The limiting groove 180 accommodates the thermoelectric cooler. Therefore, the position of the thermoelectric cooler is restricted within the limiting groove 180, making the installation of the thermoelectric cooler more convenient. In addition, it makes the thermoelectric cooler in close contact with the heater 110, which is conducive to the thermoelectric cooler quickly cooling and lowering the temperature of the heater 110.

[0054] In some embodiments of the present invention, the heat sink 130 has an abutting surface that abuts against the side of the semiconductor cooling chip away from the heater 110.

[0055] Understandably, the heat sink 130 uses its contact surface to abut against the side of the thermoelectric cooler, which increases the contact area between the heat sink 130 and the thermoelectric cooler. This facilitates the heat sink 130 to quickly conduct heat from the thermoelectric cooler, enabling the thermoelectric cooler to rapidly reduce the temperature of the heater 110.

[0056] In some embodiments of this utility model, reference is made to Figure 1 and Figure 2 The output port of the input pipe 150 and the discharge port of the discharge pipe 160 are arranged in a straight line relative to each other.

[0057] Specifically, by arranging the output port of the input pipe 150 and the inlet of the discharge pipe 160 opposite to each other, or more specifically, by arranging the output port of the input pipe 150 and the inlet of the discharge pipe 160 horizontally, air is introduced into the input pipe 150. After the air enters the inside of the cover 140, it can be directly directed towards the inlet of the discharge pipe 160, forming a fast-flowing airflow inside the cover 140. The airflow carries away the heat inside the cover 140, thereby improving the efficiency of heat exhaust.

[0058] In some specific embodiments of this utility model, the radiator 130 has a plurality of heat sinks 190, which are arranged side by side and form a straight channel 270 between them. The output port of the input pipe 150 and the discharge port of the discharge pipe 160 are located at the two ends of the straight channel 270, respectively.

[0059] Understandably, by setting multiple heat sinks 190, the thickness of the heat sinks 190 is very small, and the heat of the cooler is carried away by the multiple heat sinks 190.

[0060] Furthermore, the output port of the input pipe 150 and the discharge port of the discharge pipe 160 are respectively arranged at both ends of the straight channel 270. The straight channel 270 can extend in the horizontal direction, so that air can pass through the straight channel 270 quickly, thereby rapidly carrying away the heat of the heat sink 190 and improving the heat dissipation efficiency of the heat sink 130.

[0061] In some embodiments of this utility model, the heater 110 has a main body 210 and a heating wire connected to the main body 210. The main body 210 is made of aluminum and has a through hole 200 for accommodating the glue coating cylinder 100.

[0062] It is understood that this utility model uses a main body 210 and a heating wire. The main body 210 can be a structural component made of aluminum. The aluminum main body 210 has a good thermal conductivity. When the heating wire heats up, the main body 210 can quickly conduct heat to the glue coating cylinder 100, which can quickly raise the temperature of the glue inside the glue coating cylinder 100.

[0063] In some embodiments of this utility model, the main body 210 is provided with a fixing member 220, the fixing member 220 is provided with a mounting hole, and a bushing 230 is sleeved on the outer surface of the glue applicator 100, the bushing 230 being installed in the mounting hole.

[0064] It is understood that, in this utility model, the bushing 230 is fitted onto the outer surface of the glue applicator 100 through the fastener 220 and the bushing 230, and then the bushing 230 is installed in the mounting hole of the fastener 220, thereby fixing the glue applicator 100 to the main body 210. The bushing 230 can reduce the wear between the glue applicator 100 and the fastener 220, which is beneficial to extending the service life of the glue applicator 100.

[0065] It should be noted that the bushing 230 has an opening, and the fastener 220 is threaded with a locking bolt. The end of the locking bolt abuts against the bushing 230, causing the bushing 230 to undergo elastic deformation. The bushing 230 can clamp the glue applicator 100, preventing the glue applicator 100 from shifting when external glue is introduced into the glue applicator 100.

[0066] In some embodiments of this utility model, the glue applicator 100 is provided with a needle 240, which is used to output glue inside the glue applicator 100. A through hole 200 is threadedly connected to a fixing sleeve 260, which houses the needle 240.

[0067] Understandably, by setting the needle 240, the needle 240 can output the glue inside the glue applicator 100. By setting the fixing sleeve 260, when the glue applicator 100 is installed, the needle 240 passes through the through hole 200 and the inside of the fixing sleeve 260. The fixing sleeve 260 and the through hole 200 are connected by threads, so that the needle 240 is fixed in the fixing sleeve 260, thus preventing the needle 240 from being misaligned when applying glue.

[0068] This utility model also proposes a glue applicator, including the aforementioned heating and temperature control device.

[0069] It is understood that this utility model, by setting a heating and temperature control device, can heat the glue in the glue applicator 100 and ensure that the glue is maintained within a certain temperature range, thereby avoiding glue sedimentation, ensuring uniform glue concentration, and ensuring good glue application quality.

[0070] In the description of this specification, references to terms such as "an embodiment," "some embodiments," "illustrative embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0071] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A heating and temperature control device for heating and maintaining the temperature of adhesive in a coating cylinder (100), characterized in that, include: A heating assembly includes a heater (110) connected to the glue applicator (100) to heat the glue inside the glue applicator (100); The heat dissipation assembly includes a cooler (120) and a radiator (130), the cooler (120) being connected to the heater (110) to reduce the temperature of the heater (110), and the radiator (130) being connected to the cooler (120) to conduct heat from the cooler (120). The temperature control assembly includes a housing (140), an input pipe (150) connected to the housing (140), and an outlet pipe (160). The housing (140) houses the radiator (130) to collect the heat released by the radiator (130). The input pipe (150) is used to introduce fluid into the housing (140), and the outlet pipe (160) is used to discharge the fluid inside the housing (140).

2. The heating and temperature control device according to claim 1, characterized in that, The cover (140) is connected to the heater (110), and a receiving cavity (170) is formed between the interior of the cover (140) and the heater (110), the receiving cavity (170) accommodating the cooler (120) and the radiator (130).

3. The heating and temperature control device according to claim 2, characterized in that, The cooler (120) is a semiconductor refrigeration chip, and the heater (110) is provided with a limiting groove (180) on the side near the receiving cavity (170), the limiting groove (180) accommodating the semiconductor refrigeration chip.

4. The heating and temperature control device according to claim 3, characterized in that, The heat sink (130) has an abutting surface that abuts against the side of the semiconductor cooling chip away from the heater (110).

5. The heating and temperature control device according to claim 1, characterized in that, The output port of the input pipe (150) and the discharge port of the discharge pipe (160) are arranged in a straight line opposite each other.

6. The heating and temperature control device according to claim 1, characterized in that, The radiator (130) has a plurality of heat sinks (190), which are arranged side by side and form a straight channel (270) between them. The output port of the input pipe (150) and the discharge port of the discharge pipe (160) are located at the two ends of the straight channel (270).

7. The heating and temperature control device according to claim 1, characterized in that, The heater (110) has a body (210) and a heating wire connected to the body (210). The body (210) is made of aluminum and has a through hole (200) for accommodating the glue-coating cylinder (100).

8. The heating and temperature control device according to claim 7, characterized in that, The main body (210) is provided with a fastener (220), the fastener (220) is provided with a mounting hole, and a bushing (230) is sleeved on the outer surface of the glue applicator (100), the bushing (230) is installed in the mounting hole.

9. The heating and temperature control device according to claim 7, characterized in that, The glue-applying tube (100) is equipped with a needle (240) for dispensing glue from inside the glue-applying tube (100). The through hole (200) is threadedly connected to a fixing sleeve (260), which houses the needle (240).

10. A glue applicator, characterized in that, It includes the heating and temperature control device as described in any one of claims 1 to 9.

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