COC chip conveying device and test equipment

Abstract

The utility model relates to a COC chip conveying device and test equipment. The COC chip conveying device comprises a COC chip conveying unit, wherein the COC chip conveying unit comprises a first conveying assembly and a second conveying assembly; the COC chip containing unit is used for containing a COC chip; the fishbone bearing unit is used for bearing a fishbone clamp capable of bearing the COC chip; the transfer unit is used for placing and adjusting the COC chip to a target position; the first conveying assembly is controlled to reciprocate between the COC chip containing unit and the transfer unit and conveys chips on the COC chip containing unit to the transfer unit. The second conveying assembly is controlled to reciprocate between the transfer unit and the fishbone bearing unit and conveys the chips on the transfer unit to the transfer unit. The COC chip conveying device has the composite functions of code scanning and circulation of the COC chips.

Description

Technical Field

[0001] This application relates to the field of chip manufacturing and assembly equipment, specifically to a COC chip transfer device and testing equipment. Background Technology

[0002] In modern manufacturing, especially in high-precision manufacturing fields such as semiconductors, electronic components, and solar panels, it is necessary to photograph and scan the COC chip to identify various information during the movement of the COC chip between the blue film and the fishbone clamp. Patent application number 202411476208.0, entitled "Prior Technology of a High-Precision Automated Clamping and Testing Equipment for Radio Frequency Chips," includes a worktable, a hopper mechanism disposed on one side of the worktable, a tray clamping mechanism disposed on the worktable and located on the side of the hopper mechanism, a chip clamping mechanism disposed on and connected to the tray clamping mechanism, a test fixture disposed on the worktable, a test mechanism disposed on the worktable and located on the side of the test fixture, and a first photographic recognition mechanism disposed on the worktable and located on the side of the test fixture.

[0003] Existing technologies only disclose the first photo recognition mechanism for scanning and recognizing the chip, but they overlook the small size of the chip and the relatively small area of ​​the part used for information recognition (such as the area of ​​patterns containing device information such as QR codes and barcodes). Once the position of the part used for information recognition is slightly off, the scanning device will need to be repositioned so that the scanning range of the scanning device falls on the part used for information recognition and refocuses, which greatly reduces the efficiency of scanning, recognizing and circulating the COC chip. Utility Model Content

[0004] To solve the above-mentioned technical problems, this application provides the following technical solution:

[0005] This application provides a COC chip transmission device, including:

[0006] The COC chip delivery unit includes a first delivery component and a second delivery component;

[0007] COC chip holding unit, used to hold COC chips;

[0008] A fishbone support unit is used to support a fishbone clamp, which is capable of supporting the COC chip.

[0009] The transfer unit is used to place and adjust the COC chip to the target position;

[0010] The first conveying component is capable of reciprocating between the COC chip holding unit and the transfer unit, and conveying the COC chip on the COC chip holding unit to the transfer unit;

[0011] The second conveying component moves back and forth between the transfer unit and the fishbone support unit in a controlled manner, and conveys the COC chip, which has been adjusted to the target position on the transfer unit, to the fishbone support unit.

[0012] Furthermore, the transfer unit includes a position correction component and a transfer adjustment platform;

[0013] The position correction component is positioned above the transfer adjustment platform;

[0014] Either the position correction component or the transfer adjustment platform is fixed, while the other can be moved in a controlled manner relative to it.

[0015] Furthermore, the position correction component is fixedly disposed above the transfer adjustment platform;

[0016] The transfer adjustment platform can be moved in a controlled manner relative to the position correction component.

[0017] Furthermore, the transfer and adjustment platform is provided with a receiving part for carrying the COC chip;

[0018] The position correction component has a replaceable position correction part;

[0019] The position correction part is located above the receiving part.

[0020] Furthermore, the position correction part has a first correction edge and a second correction edge connected to each other;

[0021] The first correction edge and the second correction edge are set at a preset angle;

[0022] During the process of the transfer adjustment platform moving the COC chip relative to the position correction part, the first correction edge and the second correction edge are respectively able to abut against the corresponding sidewalls of the COC chip, and the COC chip is adjusted to the target position.

[0023] Furthermore, the end face of the transfer and adjustment platform is provided with an adsorption port, which is used to adsorb the COC chip onto the end face of the transfer and adjustment platform.

[0024] Furthermore, the COC holding unit includes a blue film supporting mechanism and a blue film detachment component. The blue film supporting mechanism is movable in the XY plane of a given coordinate system, and the blue film detachment component is movable along the Z-axis of the given coordinate system. The blue film detachment component is disposed below the blue film supporting mechanism.

[0025] Furthermore, the fishbone carrying unit includes a fishbone clamping platform and a fishbone conveying assembly, wherein the fishbone clamping platform is fixedly mounted on the fishbone conveying assembly.

[0026] The fishbone conveying assembly is used to move the fishbone clamp platform.

[0027] Furthermore, the fishbone support unit also includes a disassembly device, which is disposed above the fishbone clamp platform;

[0028] The disassembly device is used to disassemble the fishbone clamp on the fishbone clamp platform.

[0029] This application embodiment also provides a testing device, characterized in that it includes the COC chip transmission device, and the testing device further includes an ID identification unit for identifying the COC chip, wherein the ID identification unit and the relay unit are correspondingly arranged.

[0030] The transfer unit of this solution has a combined function of scanning and transferring COC chips. The transfer unit can adjust the COC chip placed on the transfer unit to the target position, so that the scanning device can accurately scan the COC chip with one focus and continue to transfer it on the transport path after scanning. Attached Figure Description

[0031] Figure 1 This is a first-view perspective three-dimensional structural diagram of a COC chip transmission device provided in an embodiment of this application.

[0032] Figure 2 This is an enlarged schematic diagram of part A of a COC chip transmission device provided in an embodiment of this application.

[0033] Figure 3 This is a schematic diagram of the structure of the relay unit of the COC chip transmission device provided in an embodiment of this application.

[0034] Figure 4 This is a schematic diagram of the position correction component of a COC chip transmission device provided in an embodiment of this application.

[0035] Figure 5 This is a second-view perspective three-dimensional structural diagram of a COC chip transmission device provided in an embodiment of this application.

[0036] Figure 6 This is a schematic diagram of the blue film detachment component of a COC chip transmission device provided in an embodiment of this application.

[0037] Figure 7 This is a schematic diagram of the fishbone support unit of a COC chip transmission device provided in an embodiment of this application.

[0038] Figure label:

[0039] 1. COC holding unit; 2. Fishbone support unit; 3. Transfer unit; 4. Position correction component; 5. Transfer adjustment platform; 6. Position correction section; 8. Target position; 9. ID recognition unit; 10. Accommodation space; 11. Ramp; 12. Retraction groove; 13. Blue film; 14. Blue film detachment component; 15. Adsorption column; 16. Ejector pin; 17. First conveying component; 18. Second conveying component; 19. Fishbone clamp platform; 20. Fishbone conveying component; 21. Adsorption hole; 22. First correction edge; 23. Second correction edge. Detailed Implementation

[0040] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0041] In the description of this application, it should be understood that if terms such as "length", "width", "thickness", "upper", "lower", "vertical", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0042] The embodiments of this application are described in detail below with reference to the accompanying drawings.

[0043] Example 1

[0044] This embodiment provides a COC chip transfer device, including a COC conveying unit for driving the COC chip to move. The COC conveying unit includes a first conveying component 17 and a second conveying component 18, which move independently of each other. It also includes a COC holding unit 1 for holding the COC chip, a fishbone support unit 2 for receiving the COC chip, and a transfer unit 3 for transferring the COC chip. The transfer unit 3 is located on the COC chip conveying path, wherein the conveying path is the transport path from when the COC chip is taken out of the COC holding unit 1 to when it is placed in the fishbone support unit 2. The transfer unit 3 is provided with a receiving part for receiving the COC chip, and the transfer unit 3 can fine-tune the position of the COC chip placed on the receiving part in a given coordinate system XY plane, and finally adjust the COC chip to the target position 8, so that the scanning device can accurately collect the code information on the COC chip. It should be noted that the target position 8 is not unique, and the target position 8 can be defined at any position on the receiving part as needed. The first conveying component 17 reciprocates between the COC holding unit 1 and the transfer unit 3, while the second conveying component 18 reciprocates between the transfer unit 3 and the fishbone support unit 2. The first and second conveying components 17 move relatively independently and do not interfere with each other. Specifically, the first conveying component 17 is located on the COC holding unit 1 and picks up the COC chip from it, then moves along the positive Y-axis above the transfer unit 3. The transfer unit 3 can adjust the COC chip to the target position 8. Simultaneously, the second conveying component 18 is located above the transfer unit 3 and picks up the COC chip placed at the target position 8 by the first conveying component 17 in the previous round. Then, the second and first conveying components 18 move along the positive Y-axis without interference to the fishbone support unit 2, placing the COC chip on it; or, the second conveying component 18... Component 18 is located on the fishbone support unit 2 and picks up the COC chip on the fishbone support unit 2. Then it moves in the opposite direction along the Y-axis to above the transfer unit 3 and places the COC chip on the transfer unit 3. At the same time, the first conveying component 17 is located above the transfer unit 3 and picks up the COC chip that the second conveying component 18 placed on the target position 8 in the previous round. Then the first conveying component 17 and the second conveying component 18 move in the opposite direction along the Y-axis without interference to above the COC holding unit 1 and place the COC chip on the COC holding unit 1. The first conveying component 17 and the second conveying component 18 include, but are not limited to, the suction nozzle component.

[0045] The COC chip transfer device comprises multiple units, each playing a different role in solving the problem of efficient and accurate movement and positioning of COC chips. The COC transport unit achieves the transfer of COC chips through the independent movement of the first and second transport components 18. The COC holding unit 1 holds the COC chips, ensuring their storage before transfer. The fishbone support unit 2 receives the COC chips during the transfer process. The transfer unit 3 is located on the transport path and has a combined function of scanning and transferring the COC chips. The transfer unit 3 is equipped with a receiving part for carrying the COC chips. Placing the COC chips at the target position 8 on the receiving part allows the scanning device to accurately scan several COC chips placed sequentially at the target position 8 in a single focus, and allows the chips to continue their transfer on the transport path after scanning.

[0046] It should be noted that the COC chip transfer device in this embodiment operates in both forward and reverse directions. In the forward direction, the first conveying component 17 moves the COC chip from the COC holding unit 1 to the receiving part of the transfer unit 3, and after the COC chip moves to form a target position 8 in the given coordinate system XY plane, the COC chip at the target position 8 is scanned, and the second conveying component 18 accurately picks up the COC chip at the target position 8 and moves the COC chip to the fishbone support unit 2. In the reverse direction, the COC chip on the fishbone support unit 2 is moved to the receiving part of the transfer unit 3 by the second conveying component 18, and after the COC chip moves to form a target position 8 in the given coordinate system XY plane, the first conveying component 17 accurately picks up the COC chip at the target position 8 and moves the COC chip to the COC holding unit 1.

[0047] During the transfer process, COC chips, due to their small size, are prone to positional shifts, affecting the accuracy and efficiency of barcode scanning. Introducing a COC chip transfer device effectively solves this problem. First, the COC transfer unit moves independently between the first transfer component 17 and the second transfer component 18, ensuring the stability and consistency of the COC chip transfer process. Second, the COC holding unit 1 and the fishbone support unit 2 are used for storing and receiving COC chips, respectively, ensuring the safety and stability of the COC chips at different stages. Finally, the transfer unit 3 is located on the transfer path. On one hand, by adjusting the COC chips to the target position 8, precise positioning of the COC chips is achieved, allowing the scanning device to accurately scan multiple COC chips in a single focus, thereby improving the efficiency and accuracy of barcode scanning. On the other hand, the target position 8 also ensures that the independently moving first transfer component 17 and the second transfer component 18 can accurately transfer COC chips, preventing the second transfer component 18 from failing to accurately hold the COC chips placed on the transfer unit 3.

[0048] Specifically, the COC holding unit 1 includes a blue membrane 13 and a blue membrane detachment component 14. The blue membrane 13 can move within the XOY plane of a given coordinate system, and the blue membrane detachment component 14 can move along the Z-axis of the given coordinate system, ensuring that the COC chip can smoothly detach from the blue membrane 13 and be adsorbed and transferred by the first conveying component 17. The fishbone carrying unit 2 includes a fishbone clamping platform 19 and a fishbone conveying component 20. The fishbone clamping platform 19 is fixedly mounted on the fishbone rotation drive component and is used to receive the COC chip during the transfer process. The transfer unit 3 includes a fixedly mounted position correction component 4 and a transfer adjustment platform 5 that moves relative to the position correction component 4. The transfer adjustment platform 5 moves relative to the position correction component 4 within the XOY plane of the given coordinate system to adjust the COC chip to the target position 8, ensuring accurate positioning of the COC chip.

[0049] Compared with existing technologies, the COC chip transfer device of this application solves the problem of COC chip position shift during the transfer process through the coordinated action of each unit. In existing technologies, the first image recognition mechanism scans and identifies the chip, but it neglects the small size of the chip and the tiny area of ​​the recognition part, causing the scanning device to frequently shift and refocus, affecting efficiency and accuracy. This application, however, uses the movement of the transfer unit 3 to adjust the COC chip to the target position 8, achieving precise positioning of the COC chip. This allows the scanning device to accurately scan multiple COC chips in a single focus, thereby improving the efficiency and accuracy of barcode recognition.

[0050] Therefore, this application effectively solves the problem of reduced scanning and recognition efficiency and accuracy caused by COC chip position offset in the prior art.

[0051] Furthermore, this application also proposes that the transfer unit 3 includes a fixedly installed position correction component 4 and a transfer adjustment platform 5 that moves relative to the position correction component 4. The transfer adjustment platform 5 moves relative to the position correction component 4 in a given coordinate system XOY plane to adjust the COC chip to the target position 8.

[0052] The transfer unit 3 includes a fixed position correction component 4 and a movable transfer adjustment platform 5. Either the position correction component 4 or the transfer adjustment platform 5 is fixed, while the other can be moved relative to it in a controlled manner.

[0053] One implementation involves the transfer adjustment platform 5 moving and adjusting the COC chip to the target position 8 within the XOY plane. The combination of the position correction component 4 and the transfer adjustment platform 5 ensures accurate positioning of the COC chip during the transfer process. The position correction component 4 provides a fixed reference point, and the transfer adjustment platform 5, by moving within the XOY plane, can precisely adjust the COC chip to the target position 8. This technical solution, through the cooperation of fixed and moving components, and the movement of the transfer adjustment platform 5 relative to the position correction component 4, greatly simplifies the design of the position correction component 4. It eliminates the need for extensive structural design regarding the position correction component 4 and how to drive its movement in the XOY plane, and accurately adjusts the COC chip to the target position 8, solving the problem of accurate COC chip positioning during transfer and ensuring the accuracy of subsequent scanning operations and the efficiency of the transfer process.

[0054] The position correction component 4 can be fixed to the base of the transfer unit 3 using various methods, such as screws or adhesive. The movement of the transfer adjustment platform 5 can be achieved in various ways, such as using a stepper motor, servo motor, or linear drive. The movement path of the transfer adjustment platform 5 can be preset and precisely controlled by a control system. The surface of the transfer adjustment platform 5 can be designed to be smooth to reduce friction and damage to the COC chip. As a preferred embodiment, the transfer adjustment platform 5 can be equipped with sensors to detect its current position to ensure accurate movement.

[0055] This application ensures accurate positioning of the COC chip during the transfer process by setting a fixed position correction component 4 and a movable transfer adjustment platform 5 in the transfer unit 3. Compared with the prior art, the technical solution of this application simplifies the design of the position correction component 4 through the cooperation of fixed and movable components, and can accurately adjust the COC chip to the target position 8. This solves the chip position offset problem existing in the prior art, and ensures accurate handover of the COC chip between the first transport component 17 and the second transport component 18, improving the accuracy of barcode scanning and the efficiency of the transfer operation.

[0056] Another embodiment involves the controlled movement of the position adjustment member 4 relative to the transfer adjustment platform 5, i.e., the transfer adjustment platform 5 is fixed, and the position adjustment member 4 moves in the XOY plane to adjust the COC chip to the target position 8.

[0057] Furthermore, this application proposes that the position correction component 4 has a position correction part 6, which has a first correction edge 22 and a second correction edge 23 connected to each other. The position correction part 6 fine-tunes the COC chip placed on the transfer adjustment platform 5, moving it to an accurate position, i.e., the target position 8, within the given coordinate system XOY plane. These fine-tunings ensure that the COC chip maintains a precise position during the transfer process, improving transfer efficiency and scanning accuracy. Through the above technical means, the design of the position correction part 6 enables the COC chip to perform position fine-tuning during the transfer process, ultimately allowing the COC chip to be fine-tuned to the given target position 8 on the transfer adjustment platform 5. This solves the problem of potential positional shifts during chip transfer that require the scanning device to refocus, ensuring accurate chip positioning on the transfer path and thus improving transfer efficiency and scanning accuracy.

[0058] The shape and size of the position correction unit 6 can be customized according to the specific size and shape of the COC chip to ensure optimal fine-tuning effect. Furthermore, the position correction unit 6 can be mounted on an adjustable frame for adjustment and replacement as needed. Specifically, the position correction unit 6 can be fixed to the position correction component 4 by screws, clamps, or other fixing devices for replacement or adjustment when required.

[0059] By designing the position correction unit 6, this application effectively solves the problem of positional shift of COC chips during the transfer process. Compared with the prior art, this application provides a more accurate and efficient solution, avoiding the problem of refocusing the scanning device due to positional shift, and improving transfer efficiency and scanning accuracy.

[0060] Furthermore, in this embodiment, the first correction edge 22 and the second correction edge 23 in the position correction part 6 are connected in sequence along their length directions and form a ring. That is, the first correction edge 22 and the second correction edge 23 are set at a preset angle and form a ring. An accommodating space 10 for placing the COC chip is formed inside the ring. The position correction part 6 is attached to the end face of the transfer adjustment platform 5.

[0061] The position correction units 6 are sequentially connected and arranged in a ring to form a receiving space 10 for placing the COC chip. This ring-shaped structure's receiving space 10 is used to place the COC chip. After the COC chip is placed in the receiving space 10, the transfer adjustment platform 5 moves the COC chip by making slight movements in the XOY plane. During this movement, the COC chip comes into contact with the first correction edge 22 and the second correction edge 23, and is then moved by the first and second correction edges 22 and 23 within the given XY plane to readjust its position, ultimately positioning it to the target position 8. Furthermore, the position correction units 6 are attached to the end face of the transfer adjustment platform 5, ensuring the chip remains stable and does not shift when the transfer adjustment platform 5 moves relative to the position correction units 6. This structural design, by providing a stable and accurate positioning space for placing the COC chip, solves the problem of inaccurate positioning that may occur during COC chip transfer, thereby improving the accuracy and efficiency of chip transfer.

[0062] Compared with existing technologies, the relative movement design between the position correction unit 6 and the receiving part of the transfer unit 3 in this embodiment provides a more stable and accurate positioning environment, thereby improving the accuracy and efficiency of chip transfer. By having the position correction unit 6 adhere to the receiving part of the transfer adjustment platform 5, the stability of the chip during movement is further ensured, avoiding chip misalignment. Therefore, this application provides higher reliability and accuracy during chip transfer, significantly improving production efficiency.

[0063] Furthermore, this application also proposes that the sides of the first corrective edge 22 and the second corrective edge 23 near the accommodating space 10 are provided with ramps 11, which are used to reduce the contact area between the first corrective edge 22 and the second corrective edge 23 and the COC chip; and that a relief groove 12 is formed at the junction of adjacent first corrective edges 22 and second corrective edges 23; and that the receiving part of the transfer adjustment platform 5 is provided with an adsorption port, which is used to adsorb the COC chip onto the receiving part of the transfer adjustment platform 5.

[0064] First, since the position correction unit 6 and the sides of the COC chip are not specially treated to ensure that the first correction edge 22 or the second correction edge 23 is completely parallel to the sides of the COC chip, the fine-tuning distance may deviate from the required adjustment distance when the position correction unit 6 pushes the chip, resulting in insufficient fine-tuning accuracy and ultimately affecting the scanning accuracy. Therefore, the ramp 11 reduces the contact area between the first correction edge 22 or the second correction edge 23 and the sides of the COC chip, thereby largely avoiding the problem of fine-tuning accuracy errors caused by insufficient parallelism and roughness between the sides of the first correction edge 22 or the second correction edge 23 and the sides of the COC chip. Second, the ramp 11 formed by the side of the first correction edge 22 or the second correction edge 23 near the accommodating space 10 reduces friction by reducing the contact area between the first correction edge 22 or the second correction edge 23 and the COC chip, thus improving flow efficiency by reducing friction. The angle at the junction of the first correction edge 22 and the second correction edge 23, and the right angle of the COC chip, are not specially treated, thus failing to guarantee that the angle at the junction of the first correction edge 22 and the second correction edge 23 completely coincides with the right angle of the COC chip. The relief groove 12 formed at the junction of the first correction edge 22 and the second correction edge 23 avoids direct contact between the junction of the first correction edge 22 and the second correction edge 23 and the right angle of the COC chip, which would cause fine-tuning errors. This further ensures that the COC chip can be accurately fine-tuned to the target position 8. At the same time, avoiding direct contact between the junction of the first correction edge 22 and the second correction edge 23 and the right angle of the COC chip also avoids damage to the COC chip during fine-tuning. The suction port of the receiving part of the transfer adjustment platform 5 fixes the COC chip through suction, ensuring its stability during the transfer process. These technical features work together to effectively solve the problem of how to reduce the contact area between the position correction part 6 and the COC chip to improve transfer efficiency and scanning efficiency.

[0065] In other words, the ramp 11 can be formed by tilting the side of the position correction part 6, so that it forms a certain angle on the side near the accommodating space 10, thereby reducing the contact area. The relief groove 12 can be formed by cutting or pressing at the junction of the first correction edge 22 and the second correction edge 23, so that it forms a groove at the junction to avoid direct contact. The adsorption port can be formed by opening one or more small holes in the receiving part of the transfer adjustment platform 5 and connecting it to a negative pressure system, so that the COC chip can be adsorbed by negative pressure, ensuring its stability during the transfer process.

[0066] Furthermore, this application also proposes that the COC holding unit 1 includes a blue film carrying mechanism 13 and a blue film detachment component 14. A blue film is placed on the upper surface of the blue film carrying mechanism 13, and there is a certain degree of adhesion between the blue film and the upper surface of the blue film carrying mechanism 13. The COC chip is attached to the blue film. The blue film carrying mechanism 13 can move in the XOY plane of a given coordinate system. The blue film detachment component 14 can move along the Z-axis of the given coordinate system. The blue film detachment component 14 is disposed below the blue film carrying mechanism 13.

[0067] The technical features involved in this application include a blue film carrier mechanism 13 and a blue film detachment component 14. The blue film 13 is movable in the XOY plane, and the blue film detachment component 14 is movable along the Z-axis. The blue film detachment component 14 is located below the blue film carrier mechanism 13. These technical features work together to achieve the following: the blue film on the blue film carrier mechanism 13 is lifted upward by the movement of the blue film detachment component 14 along the Z-axis, causing the upper surface of the blue film and the blue film carrier mechanism 13 to separate, and the COC chip and the blue film carrier mechanism 13 are initially separated, facilitating the first conveying component 17 to smoothly remove the COC chip from the blue film and transfer it. In other words, the movement of the blue film carrier mechanism 13 in the XOY plane ensures the horizontal alignment of the COC chip and the blue film detachment component 14; the movement of the blue film detachment component 14 along the Z-axis enables the initial vertical detachment of the COC chip, thereby ensuring that the first conveying component 17 can smoothly remove the COC chip from the blue film.

[0068] In other words, this application solves the problem of excessive adhesion between the COC chip and the blue film 13, making them difficult to pick up, by setting up the blue film detachment component 14. This achieves initial detachment between the COC chip and the blue film 13, ensuring that the first suction nozzle can smoothly pick up the COC chip from the blue film. Compared with the prior art, this application improves the efficiency and reliability of COC chip transfer by combining the movement of the blue film carrying mechanism 13 in the XOY plane with the movement of the blue film detachment component 14 along the Z-axis, avoiding the transfer difficulties caused by excessive adhesion between the blue film and the COC chip.

[0069] Furthermore, this application also proposes that the blue film detachment component 14 includes an adsorption column 15 and a push pin 16, the push pin 16 is coaxially disposed inside the adsorption column 15, the end of the adsorption column 15 is provided with an adsorption hole 21, and the adsorption column 15 can move along the Z-axis direction of a given coordinate system.

[0070] The adsorption column 15 provides adsorption force to stably adsorb the COC chip. The ejector pins 16 are located inside the adsorption column 15 and arranged coaxially to ensure precise positioning of the COC chip during adsorption and detachment. The adsorption hole 21 is located at the end of the adsorption column 15 and generates adsorption force to hold the blue film support mechanism 13 and drive it to move slightly along the Z-axis of a given coordinate system. The movement of the adsorption column 15 along the Z-axis causes the blue film with the COC chip adhered to it and the blue film support mechanism 13 to move relative to the ejector pins 16. The ejector pins 16 lift the blue film, overcoming the adhesive effect between the blue film and the upper surface of the blue film support mechanism 13, and ensuring stable adsorption of the blue film support mechanism 13 during detachment. Through the synergy of these technical features, the adsorption orifice 21 provides the necessary adsorption force, while the Z-axis downward movement of the adsorption column 15 drives the blue film support mechanism 13 and the blue film with the COC chip attached to it to move downward along the Z-axis. The ejector pin 16 extends out of the end face of the adsorption column 15 and abuts against the lower end face of the blue film with the COC chip attached. Furthermore, due to the small contact area between the ejector pin 16 and the COC chip, the adhesion between the ejector pin 16 and the blue film is minimized. After the ejector pin 16 pushes the blue film out of the blue film support mechanism 13 and achieves initial separation of the blue film from the blue film support mechanism 13, it allows for easy detachment between the ejector pin 16 and the blue film. These features work together to solve the technical problems of stable adsorption of the blue film support mechanism 13 and adhesion between the blue film and the blue film detachment component 14 during the process of the blue film detaching from the blue film support mechanism 13.

[0071] Preferably, the adsorption column 15 has an adsorption hole 21 at its end. The adsorption hole 21 can generate adsorption force through a vacuum pump. The adsorption column 15 and the ejector pin 16 can be made of high-strength materials with low coefficient of friction, such as stainless steel or engineering plastics, to ensure their durability and operational stability.

[0072] Furthermore, this application also proposes that the fishbone support unit 2 includes a fishbone clamp platform 19 and a fishbone conveying assembly 20, wherein the fishbone clamp platform 19 is fixedly mounted on the fishbone conveying assembly 20, and the fishbone conveying assembly is used to drive the fishbone clamp platform to move.

[0073] The fishbone support unit 2 is equipped with a fishbone clamp, on which two rows of COC chips are arranged parallel to each other. Preferably, the fishbone support unit 2 can rotate 180° to better position the two rows of COC chips receiving the chips from the second suction nozzle. The fishbone clamp can be designed with a symmetrical structure on both sides, with multiple slots on each side for placing the COC chips, ensuring that the COC chips are stably placed in the slots during rotation. This embodiment, by setting a fishbone clamp on the fishbone support unit 2 and realizing the 180° rotation of the fishbone clamp, allows the two rows of COC chips to be better positioned to receive the chips from the second suction nozzle. Compared with the prior art, this application can hold more COC chips in a limited space, improve the efficiency of chip flow, and reduce the complexity and cost of the equipment.

[0074] Specifically, the fishbone conveying assembly 20 can be a motor-driven moving mechanism, which moves the fishbone clamp platform 19 by controlling the rotation of the motor.

[0075] The fishbone support unit 2 also includes a disassembly device, which is located above the fishbone clamp platform 19. The disassembly device is used to disassemble the fishbone clamp on the fishbone clamp platform 19. The disassembly device includes, but is not limited to, a screwdriver.

[0076] Example 2

[0077] This embodiment provides a testing device, including the COC chip transmission device of Embodiment 1. Compared with Embodiment 1, this embodiment also includes an ID identification unit 9 for identifying COC chips, and the ID identification unit 9 corresponds to the target position 8.

[0078] By integrating a COC chip transfer device and an ID recognition unit 9 into the testing equipment, the problem of efficiently identifying chips during chip transfer is solved. The ID recognition unit 9 corresponds to the target position 8, enabling accurate identification of chip information when the chip moves to the target position 8. This avoids the problem of low identification efficiency caused by slight chip position shifts, thereby improving the efficiency of the entire transfer process.

[0079] The ID recognition unit 9 can be implemented using various technologies, such as image recognition using a high-resolution camera or barcode scanning using a laser scanner. Specifically, the ID recognition unit 9 can be positioned above or to the side of the target location 8 to ensure accurate capture of the chip's ID information when the chip reaches the target location 8. In a preferred embodiment, the ID recognition unit 9 can be linked to a sensor at the target location 8; when the sensor detects the chip's arrival at the target location 8, it triggers the ID recognition unit 9 to perform the recognition operation.

[0080] This application utilizes a transfer adjustment platform 5 carrying the COC chip to move relative to the position correction component 4, forming a target position 8. This design simplifies the structure by allowing the position correction component 4 to move relative to the transfer adjustment platform 5. Furthermore, the target position 8 corresponds not only to the scanning position of the ID recognition unit 9 but also to the transport path of the COC transport unit, ensuring accurate scanning by the ID recognition unit 9 and smooth transport by the COC transport unit. Compared to existing technologies, this application can accurately identify chip information during chip transfer, avoiding the problem of low recognition efficiency caused by slight chip position shifts, thereby improving the efficiency of the entire transfer process.

[0081] The above embodiments are used to further illustrate this application, but do not limit this application to these specific implementations. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be understood as falling within the protection scope of this application.

Claims

1. A COC chip transmission device, characterized in that, include: The COC chip delivery unit includes a first delivery component and a second delivery component; COC chip holding unit, used to hold COC chips; A fishbone support unit is used to support a fishbone clamp, which is capable of supporting the COC chip. The transfer unit is used to place and adjust the COC chip to the target position; The first conveying component is capable of reciprocating between the COC chip holding unit and the transfer unit, and conveying the COC chip on the COC chip holding unit to the transfer unit; The second conveying component moves back and forth between the transfer unit and the fishbone support unit in a controlled manner, and conveys the COC chip, which has been adjusted to the target position on the transfer unit, to the fishbone support unit.

2. The COC chip transmission device according to claim 1, characterized in that, The transfer unit includes a position correction component and a transfer adjustment platform; The position correction component is positioned above the transfer adjustment platform; Either the position correction component or the transfer adjustment platform is fixed, while the other can be moved in a controlled manner relative to it.

3. The COC chip transmission device according to claim 2, characterized in that, The position correction component is fixedly installed above the transfer adjustment platform; The transfer adjustment platform can be moved in a controlled manner relative to the position correction component.

4. The COC chip transmission device according to claim 2, characterized in that, The transfer and adjustment platform is equipped with a receiving part for carrying the COC chip; The position correction component has a replaceable position correction part; The position correction part is located above the receiving part.

5. The COC chip transmission device according to claim 4, characterized in that, The position correction unit has a first correction edge and a second correction edge connected to each other; The first correction edge and the second correction edge are set at a preset angle; During the process of the transfer adjustment platform moving the COC chip relative to the position correction part, the first correction edge and the second correction edge are respectively able to abut against the corresponding sidewalls of the COC chip, and the COC chip is adjusted to the target position.

6. The COC chip transmission device according to claim 2, characterized in that, The transfer and adjustment platform has an adsorption port on its end face, which is used to adsorb the COC chip onto the end face of the transfer and adjustment platform.

7. The COC chip transmission device according to any one of claims 1-6, characterized in that, The COC chip holding unit includes a blue film support mechanism and a blue film detachment component. The blue film support mechanism is movable in the XY plane of a given coordinate system, and the blue film detachment component is movable along the Z-axis of the given coordinate system. The blue film detachment component is disposed below the blue film support mechanism.

8. The COC chip transmission device according to claim 7, characterized in that, The fishbone carrying unit includes a fishbone clamping platform and a fishbone conveying assembly, wherein the fishbone clamping platform is fixedly mounted on the fishbone conveying assembly. The fishbone conveying assembly is used to move the fishbone clamp platform.

9. The COC chip transmission device according to claim 8, characterized in that, The fishbone support unit also includes a disassembly device, which is disposed above the fishbone clamp platform; The disassembly device is used to disassemble the fishbone clamp on the fishbone clamp platform.

10. A testing device, characterized in that, The test equipment includes the COC chip transmission device as described in any one of claims 1-9, and further includes an ID identification unit for identifying the COC chip, wherein the ID identification unit and the relay unit are respectively configured.

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