Rapid heat conduction structure for fanless industrial computer

Abstract

The utility model discloses a quick heat conduction structure for a fanless industrial computer, which belongs to the technical field of industrial computers and comprises a computer main body, a heat conduction wrapping shell is arranged on the computer main body, a protective shell is mounted on the computer main body, a connecting plate is connected onto the computer main body, a rotating rod is rotatably connected onto the computer main body, and the rotating rod is connected with a fan. One end of the rotating rod is connected with a hand wheel. According to the rapid heat conduction structure for the fanless industrial computer, liquid in the water tank and liquid in the cooling pipe can flow mutually by starting the liquid pump, meanwhile, the semiconductor refrigerator can refrigerate and cool the liquid flowing back through the cooling pipe, and the heat conduction jacket can absorb and conduct heat generated by working of the computer body; and at the moment, the cooling pipe can absorb heat on the heat conduction cladding and further transmit the heat to the cooling fins, so that the cooling fins and the liquid subjected to refrigeration and cooling are utilized for heat dissipation work, a fan is not needed, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This utility model belongs to the field of industrial computer technology, specifically a rapid heat conduction structure for fanless industrial computers. Background Technology

[0002] Industrial computers are mainly used in industrial control, testing, and other fields. A typical application of an industrial computer is to obtain external data through a standard serial port, perform calculations through the computer's internal microprocessor, and finally output the data through a display screen or serial port to complete the calculation and processing work. They are widely used in power automation control, intelligent transportation, coal mines, and other fields.

[0003] Currently, the main way for ordinary industrial computers to dissipate heat is through fans. However, since industrial computers often work in harsh industrial environments, the fans are prone to accumulating dust and oil during use, which can affect their normal heat dissipation and thus the stability of the machine. Utility Model Content

[0004] To overcome the above-mentioned defects, this utility model provides a rapid heat conduction structure for fanless industrial computers, which solves the problem that industrial computers often operate in harsh industrial environments, and the use of fans for heat dissipation can easily lead to the accumulation of dust and oil, thus affecting the normal heat dissipation of the fans and the stability of the machine.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a rapid heat conduction structure for a fanless industrial computer, comprising a computer body, a heat-conducting shell on the computer body, a protective shell installed on the computer body, a connecting plate connected to the computer body, a rotating rod rotatably connected to the computer body, a handwheel connected to one end of the rotating rod, a main bevel gear connected to the other end of the rotating rod, secondary bevel gears meshing on both sides of the main bevel gear, and a threaded rod connected to the secondary bevel gear;

[0006] A movable block is installed on the threaded rod, and a plug rod is connected to the movable block. A cooling chamber is provided on the protective shell, and a water tank is fixedly installed inside the cooling chamber. A wiring port is opened on the wall of the cooling chamber, a liquid pump is fixedly installed inside the cooling chamber, a semiconductor cooler is fixedly installed inside the cooling chamber, a cooling pipe is connected inside the protective shell, and multiple heat sinks are connected to the protective shell.

[0007] As a further embodiment of this utility model: a connecting groove is provided on the main body of the computer, and a connecting strip is connected to the lower part of the protective shell, the connecting strip slidingly engaging with the connecting groove.

[0008] As a further embodiment of this utility model: the protective shell has insertion holes on both sides, the connecting plate has a sliding groove, and the moving block slides in the sliding groove and is in close contact with the groove wall.

[0009] As a further embodiment of this utility model: a threaded sleeve is connected to the movable block, the threaded sleeve is threadedly engaged with the threaded rod, and the insertion rod passes through the connecting plate and is inserted into the insertion hole.

[0010] As a further embodiment of this utility model: a rubber ring is fitted onto the rotating rod, and the rubber ring is positioned at the connection between the rotating rod and the computer body.

[0011] As a further embodiment of this utility model: the cooling pipe is designed in a serpentine shape, and both the heat-conducting shell and the protective shell are provided with mounting grooves. The cooling pipe is installed in the mounting groove, one end of the cooling pipe is connected to the liquid pump, and the other end of the cooling pipe passes through the semiconductor cooler and is connected to the water tank. The liquid pump is connected to the water tank through a pipe.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] 1. This rapid heat conduction structure for fanless industrial computers consists of a water tank, liquid pump, cooling pipes, a thermoelectric cooler, a thermally conductive shell, and heat sinks. During heat dissipation, the operator activates the liquid pump, allowing the liquid in the water tank and cooling pipes to flow between each other. Simultaneously, the thermoelectric cooler cools the liquid returning through the cooling pipes, while the thermally conductive shell absorbs and conducts heat generated by the computer's main unit. The cooling pipes absorb heat from the thermally conductive shell and further transfer it to the heat sinks through the shell. Thus, heat dissipation is achieved using the heat sinks and the cooled liquid, eliminating the need for a fan and improving heat dissipation efficiency.

[0014] 2. This rapid heat conduction structure for fanless industrial computers consists of a handwheel, a rotating rod, a main bevel gear, a secondary bevel gear, a threaded rod, a threaded sleeve, a moving block, an insertion rod, and an insertion hole. The operator drives the rotating rod and the main bevel gear to rotate by the handwheel, which in turn drives the threaded rod to rotate by the meshing of the main bevel gear and the secondary bevel gear. This causes the moving block to slide along the threaded rod in the groove through the threaded sleeve, allowing the insertion rod to pass through the connecting plate and be inserted into the insertion hole. This fixes the protective shell to the computer body, covering and enclosing the heat-conducting shell. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0016] Figure 2 This is a schematic diagram of the three-dimensional structure of the main body of the computer of this utility model;

[0017] Figure 3This is a schematic diagram of the three-dimensional structure of the protective shell of this utility model;

[0018] Figure 4 This is a schematic diagram of the cross-sectional structure of the connecting plate of this utility model;

[0019] In the diagram: 1. Computer body; 2. Thermal conductive shell; 3. Protective shell; 4. Connecting plate; 5. Rotating rod; 6. Handwheel; 7. Main bevel gear; 8. Secondary bevel gear; 9. Threaded rod; 10. Moving block; 11. Insert rod; 12. Cooling chamber; 13. Water tank; 14. Wiring port; 15. Liquid pump; 16. Semiconductor cooler; 17. Cooling pipe; 18. Heat sink; 19. Connecting groove; 20. Connecting strip; 21. Insertion hole; 22. Slide groove; 23. Threaded sleeve; 24. Rubber ring; 25. Mounting groove. Detailed Implementation

[0020] The technical solution of this patent will be further described in detail below with reference to specific embodiments.

[0021] like Figure 1-4 As shown, this utility model provides a technical solution: a rapid heat conduction structure for a fanless industrial computer, including a computer body 1, a heat-conducting shell 2 on the computer body 1, a connecting groove 19 on the computer body 1, a connecting strip 20 connected to the bottom of the shell 3, the connecting strip 20 slidingly engaging with the connecting groove 19, the sliding engagement of the connecting strip 20 with the connecting groove 19 allows the operator to directionally push the shell 3 to move, thereby completing the positioning and installation and preventing tilting.

[0022] The computer body 1 is equipped with a protective shell 3. The protective shell 3 has insertion holes 21 on both sides. The connecting plate 4 is provided with a sliding groove 22. The moving block 10 slides in the sliding groove 22 and is in contact with the groove wall of the sliding groove 22. Through the contact between the moving block 10 and the groove wall of the sliding groove 22, the sliding groove 22 can restrict the moving block 10, thereby preventing the moving block 10 from rotating or tilting.

[0023] A connecting plate 4 is connected to the computer body 1, and a rotating rod 5 is rotatably connected to the computer body 1. A rubber ring 24 is sleeved on the rotating rod 5. The rubber ring 24 is set at the connection between the rotating rod 5 and the computer body 1. The rubber ring 24 can increase friction and damping, thereby cooperating with the threaded rod 9 and the threaded sleeve 23 to lock the threads and prevent the rotating rod 5 and the threaded rod 9 from rotating accidentally.

[0024] One end of the rotating rod 5 is connected to a handwheel 6, and the other end of the rotating rod 5 is connected to a main bevel gear 7. The main bevel gear 7 is meshed with a secondary bevel gear 8 on both sides. A threaded rod 9 is connected to the secondary bevel gear 8. A moving block 10 is installed on the threaded rod 9. A threaded sleeve 23 is connected to the moving block 10. The threaded sleeve 23 is threadedly engaged with the threaded rod 9. The insertion rod 11 passes through the connecting plate 4 and is inserted into the insertion hole 21. Through the insertion of the insertion rod 11 into the insertion hole 21, the protective shell 3 can be fixedly installed on the computer body 1, causing the cooling pipe 17 to be embedded into the mounting groove 25 on the heat-conducting shell 2, thereby absorbing the heat on the heat-conducting shell 2 through the cooling pipe 17 to complete the heat dissipation.

[0025] A plug rod 11 is connected to the movable block 10. A cooling chamber 12 is provided on the protective shell 3. A water tank 13 is fixedly installed in the cooling chamber 12. A wiring port 14 is opened on the wall of the cooling chamber 12. A liquid pump 15 is fixedly installed in the cooling chamber 12. A semiconductor cooler 16 is fixedly installed in the cooling chamber 12. A cooling pipe 17 is connected inside the protective shell 3. Multiple heat sinks 18 are connected to the protective shell 3. The cooling pipe 17 has a serpentine design. Both the thermally conductive shell 2 and the protective shell 3 have mounting grooves 25. The cooling pipe 17 is placed in the mounting groove 25. One end of the cooling pipe 17 is connected to the liquid pump 15. The other end of the cooling pipe 17 passes through the semiconductor cooler 16 and is connected to the water tank 13. The liquid pump 15 is connected to the water tank 13 through a pipe. Through the flowing, cooled liquid and the multiple heat sinks 18 on the protective shell 3, the heat absorption and heat dissipation efficiency can be improved, thereby improving the heat dissipation effect and avoiding high temperature affecting normal operation.

[0026] The working principle of this utility model is as follows:

[0027] The operator pushes the connecting strip 20 into the connecting groove 19, causing the connecting plate 4 to enter the cooling chamber 12. Then, the handwheel 6 drives the rotating rod 5 and the main bevel gear 7 to rotate, and the meshing of the main bevel gear 7 and the secondary bevel gear 8 drives the threaded rod 9 to rotate, causing the moving block 10 to slide along the threaded rod 9 in the sliding groove 22 through the threaded sleeve 23, so that the insertion rod 11 can pass through the connecting plate 4 and be inserted into the insertion hole 21, thereby fixing the protective shell 3 to the computer body 1 and covering the heat-conducting shell 2. The heat-conducting shell 2 can absorb and conduct heat generated by the computer body 1 during operation. The liquid pump 15 is started, which allows the liquid in the water tank 13 and the cooling pipe 17 to flow to each other. At the same time, the semiconductor cooler 16 can cool and lower the liquid returning through the cooling pipe 17, thereby absorbing the heat on the heat-conducting shell 2 through the cooling pipe 17 and further transferring it to the heat sink 18 through the protective shell 3, so that the heat sink 18 and the cooled liquid can dissipate heat.

[0028] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0029] The preferred embodiments of this patent have been described in detail above. However, this patent is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this patent.

Claims

1. A rapid heat conduction structure for a fanless industrial computer, comprising a computer body (1), characterized in that: The computer body (1) is provided with a heat-conducting shell (2), the computer body (1) is equipped with a protective shell (3), the computer body (1) is connected with a connecting plate (4), the computer body (1) is rotatably connected with a rotating rod (5), one end of the rotating rod (5) is connected with a handwheel (6), the other end of the rotating rod (5) is connected with a main bevel gear (7), the main bevel gear (7) is meshed with a secondary bevel gear (8) on both sides, and a threaded rod (9) is connected to the secondary bevel gear (8). A movable block (10) is installed on the threaded rod (9), and a plug rod (11) is connected to the movable block (10). A cooling chamber (12) is provided on the protective shell (3). A water tank (13) is fixedly installed in the cooling chamber (12). A wiring port (14) is opened on the wall of the cooling chamber (12). A liquid pump (15) is fixedly installed in the cooling chamber (12). A semiconductor cooler (16) is fixedly installed in the cooling chamber (12). A cooling pipe (17) is connected in the protective shell (3). Multiple heat sinks (18) are connected on the protective shell (3).

2. The rapid heat conduction structure for a fanless industrial computer according to claim 1, characterized in that: The computer body (1) has a connecting groove (19), and the protective shell (3) has a connecting strip (20) connected to the bottom. The connecting strip (20) slides in conjunction with the connecting groove (19).

3. The rapid heat conduction structure for a fanless industrial computer according to claim 1, characterized in that: The protective shell (3) has insertion holes (21) on both sides, and the connecting plate (4) has a sliding groove (22). The moving block (10) slides in the sliding groove (22) and is in contact with the groove wall of the sliding groove (22).

4. The rapid heat conduction structure for a fanless industrial computer according to claim 3, characterized in that: The movable block (10) is connected to a threaded sleeve (23), which is threadedly engaged with the threaded rod (9). The insertion rod (11) passes through the connecting plate (4) and is inserted into the insertion hole (21).

5. The rapid heat conduction structure for a fanless industrial computer according to claim 1, characterized in that: A rubber ring (24) is fitted onto the rotating rod (5), and the rubber ring (24) is connected to the connection between the rotating rod (5) and the computer body (1).

6. The rapid heat conduction structure for a fanless industrial computer according to claim 1, characterized in that: The cooling pipe (17) has a serpentine design. The heat-conducting shell (2) and the protective shell (3) are both provided with mounting grooves (25). The cooling pipe (17) is installed in the mounting groove (25). One end of the cooling pipe (17) is connected to the liquid pump (15). The other end of the cooling pipe (17) passes through the semiconductor cooler (16) and is connected to the water tank (13). The liquid pump (15) is connected to the water tank (13) through a pipe.

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