Electromagnetic wire insulating layer processing device

Abstract

The utility model relates to the technical field of electromagnetic wire processing, in particular to an electromagnetic wire insulating layer processing device. Comprising a bottom plate, a positioning assembly, a stripping assembly and a feeding assembly are sequentially arranged on the bottom plate in the Y direction, the positioning assembly comprises a base and a movable pressing block, and an electromagnetic wire is contained in a through groove of the base to limit radial displacement; a cutting ring sleeve of the stripping assembly is mounted on the base, and a cutting ring directly faces the notch of the penetrating groove, so that an insulating layer on the surface of the electromagnetic wire can be scraped without damaging a wire core; the feeding assembly enables the electromagnetic wires to move in the Y direction, and an elastic floating roller of the feeding assembly is matched with the electromagnetic wires with different diameters and guarantees uniform-speed movement. Through the structural design of the mounting base, the scrap collecting box, the guide pipe and the like, the device guarantees scraping precision, collects paint scraps, avoids pollution, achieves continuous machining of an electromagnetic wire insulating layer, and improves machining efficiency and quality.

Description

Technical Field

[0001] This utility model relates to the field of electromagnetic wire processing technology, and in particular to an electromagnetic wire insulation layer processing device. Background Technology

[0002] Electromagnetic wire is a basic electrical material consisting of a conductive metal core and a surface insulating layer. It is widely used in the manufacture of electromagnetic equipment such as motors and transformers. In scenarios such as coil repair and conductor recycling, it is necessary to remove the insulating paint layer on the surface of the electromagnetic wire to expose the conductive core.

[0003] Currently, common methods for removing the insulating varnish layer from electromagnetic wires include chemical solvent dissolution and mechanical scraping. Chemical solvent dissolution utilizes specific chemical reagents to react with the insulating varnish, causing it to dissolve and peel off. While this method can remove the insulation layer relatively evenly, the use of chemical reagents poses environmental pollution risks, and the treated electromagnetic wire requires a complex cleaning process, resulting in a long processing cycle and high costs. Mechanical scraping involves treating the surface of the electromagnetic wire with blades or other grinding tools. For example, Chinese utility model patent CN222791664U discloses a varnish removal device for electromagnetic wire production. This device limits both ends of the electromagnetic wire with fixing components before grinding and removing the varnish. While this device can conveniently remove the insulating varnish layer from the surface of the electromagnetic wire, when the length of the electromagnetic wire exceeds the device's maximum working length, the wire needs to be ground in sections, leading to difficulties in continuous processing and low processing efficiency. Therefore, there is an urgent need for an electromagnetic wire insulation layer processing device to solve the above problems. Utility Model Content

[0004] To overcome the shortcomings of the prior art, this utility model provides an electromagnetic wire insulation layer processing device, which solves the technical problem that the electromagnetic wire coating removal process is difficult to process continuously and has low work efficiency.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution:

[0006] An apparatus for processing the insulation layer of an electromagnetic wire, used to remove the insulating paint layer from the surface of an electromagnetic wire, includes: a base plate, wherein the base plate is provided with the following sequentially arranged in the Y direction:

[0007] A positioning component, comprising: a base and a pressure block, the pressure block being movably pressed onto the upper surface of the base, the base having a through groove extending in the Y direction for accommodating an electromagnetic wire;

[0008] A stripping assembly, comprising: a ring blade sleeve mounted on a base, a ring blade provided inside the ring blade sleeve, the through groove including a notch extending laterally out of the base, the ring blade being positioned opposite the notch, the ring blade being used to scrape off the insulating paint layer on the surface of the electromagnetic wire after it passes through the notch;

[0009] A feed assembly for moving the electromagnetic wire along the Y direction.

[0010] Based on the above structure, the principle of the electromagnetic wire insulation layer processing device is as follows: First, the end of the electromagnetic wire whose insulating paint layer to be removed is inserted through a notch on the side away from the stripping component and exits through a notch on the other end. At this time, the pressure block is pressed down onto the upper surface of the base, and the electromagnetic wire is located in the groove to restrict the displacement of the electromagnetic wire in its radial direction, while retaining the degree of freedom of movement in the Y direction. Next, the end of the electromagnetic wire is inserted into the ring cutter sleeve and passes through the ring cutter. The ring cutter sleeve is on the outside of the electromagnetic wire, and the inner diameter of the ring cutter is adapted to the electromagnetic wire. The electromagnetic wire moves freely in the Y direction. During axial movement, the cutting edge of the ring cutter exerts a compressive force on the insulating varnish layer. As the electromagnetic wire continues to move, the cutting edge of the ring cutter cuts into the insulating varnish layer, using shearing force to scrape the insulating varnish layer along the axial direction of the electromagnetic wire. Because the ring cutter has a ring structure, the cutting edge of the ring cutter acts on the entire circumferential surface of the insulating varnish layer simultaneously, achieving circumferential scraping in one pass without damaging the electromagnetic wire core, resulting in high processing efficiency. The feed assembly is used to drive the electromagnetic wire to move at a uniform speed along the Y direction, ensuring the uniformity of the insulating varnish layer scraping. Combined with the ring cutter, it enables continuous processing, further improving processing efficiency.

[0011] Furthermore, in this application, an electromagnetic wire insulation layer processing apparatus includes a feeding component comprising a drive device and a pair of rollers. The pair of rollers are elastically floating in the vertical direction, and the electromagnetic wire is located between the pair of rollers. The drive device is mounted on a base plate and is used to drive the rollers to rotate. As a preferred embodiment of this application, in this electromagnetic wire insulation layer processing apparatus, after the drive device operates, it transmits power to the pair of rollers, causing the rollers to rotate. When the electromagnetic wire is located between the pair of rollers, the elastically floating rollers automatically adhere to the outer surface of the electromagnetic wire under the action of elastic force. When the rollers rotate, the friction between the rollers and the surface of the electromagnetic wire drives the electromagnetic wire to move axially in the Y direction. Furthermore, the elastically floating roller design can adapt to electromagnetic wires of different diameters, improving the versatility of the apparatus.

[0012] Furthermore, in this application, an electromagnetic wire insulation layer processing apparatus includes a pair of rollers comprising a main roller and a driven roller. The main roller is mounted on the drive end of a drive device, and the driven roller is disposed on the upper end of the main roller. The feeding assembly further includes a mounting column, a crossbeam, and an elastic element. The mounting column is mounted on a base plate and is spaced apart from the drive device in the X direction. The crossbeam is slidably mounted on the mounting column. The elastic element is disposed between the mounting column and the crossbeam, and its two ends are respectively connected to the mounting column and the crossbeam. The driven roller is rotatably mounted on the end of the crossbeam away from the mounting column. As a preferred embodiment of this application, an electromagnetic wire insulation layer processing device is provided. A horizontal beam floats vertically, causing a driven roller to float. An elastic element connects the mounting column and the horizontal beam, providing a downward elastic force that causes the driven roller to press against the main roller. When the electromagnetic wire passes between the main roller and the driven roller, the compression of the elastic element automatically adjusts according to the diameter of the electromagnetic wire, ensuring stable clamping force. When the diameter of the electromagnetic wire increases, the driven roller is lifted upwards, increasing the distance between the main roller and the driven roller, increasing the compression of the elastic element, and increasing the clamping force to prevent slippage. When the diameter of the electromagnetic wire decreases, the elastic element rebounds, and the driven roller descends, maintaining stable friction.

[0013] Furthermore, in the electromagnetic wire insulation layer processing apparatus of this application, the positioning component further includes: a mounting bracket, which is disposed above the base, and a screw is threaded through the mounting bracket. The screw is threadedly connected to the mounting bracket, and one end of the screw near the base is connected to a pressure block. As a preferred embodiment of this application, when the electromagnetic wire needs to be positioned on the base, the electromagnetic wire insulation layer processing apparatus of this application, by rotating the screw, utilizes the threaded engagement between the screw and the mounting bracket to convert the rotational motion of the screw into linear motion, thereby driving the pressure block to move downward in the vertical direction until it presses against the upper end surface of the base, thus effectively limiting the radial displacement of the electromagnetic wire and preventing the electromagnetic wire from shifting or shaking during movement, ensuring the scraping quality; when it is necessary to release the pressure block from the base, the feed component is rotated in the opposite direction to separate the pressure block from the base.

[0014] Furthermore, the electromagnetic wire insulation layer processing apparatus of this application further includes: a mounting base, which is disposed on a base plate, the base being mounted on the mounting base, the mounting base having a receiving groove for accommodating a ring cutter sleeve, and the ring cutter sleeve having a cover plate, the cover plate being detachably mounted on the mounting base. As a preferred embodiment of this application, in the electromagnetic wire insulation layer processing apparatus of this application, the mounting base positions the base and the ring cutter sleeve on the same reference plane, ensuring that the notch for the groove is aligned with the central axis of the ring cutter, avoiding scraping errors caused by electromagnetic wire misalignment; the cover plate presses and positions the ring cutter sleeve tightly within the receiving groove, preventing the ring cutter from shifting due to vibration during processing; the cover plate is detachably mounted on the mounting base, and when the ring cutter is worn or damaged, the cover plate can be removed to remove the ring cutter sleeve for replacement and repair, reducing downtime for maintenance; simultaneously, the receiving groove can also collect insulating varnish flakes that peel off during scraping, preventing varnish flakes from splashing and contaminating the equipment or affecting the processing environment.

[0015] Furthermore, the electromagnetic wire insulation layer processing apparatus of this application further includes: a chip collection box, which is installed on the side of the base plate away from the mounting seat; the ring cutter sleeve includes a cavity, the ring cutter is disposed in the cavity; the mounting seat is provided with a chip collection through hole, the chip collection through hole extends axially into the cavity, and the end of the chip collection through hole away from the ring cutter sleeve is connected to the chip collection box through a pipe. As a preferred embodiment of this application, the electromagnetic wire insulation layer processing apparatus of this application uses a chip collection box to collect insulating varnish chips generated during the scraping process. When scraping the electromagnetic wire, the insulating varnish chips fall off under the shearing force of the ring cutter, collect in the cavity, enter the pipe through the chip collection through hole, and finally fall into the chip collection box. This design prevents the insulating varnish chips from spreading in the processing area, keeping the equipment clean and the operating environment safe.

[0016] Furthermore, in the electromagnetic wire insulation layer processing apparatus of this application, a guide tube is provided at the end of the ring cutter sleeve away from the base. The guide tube is connected to the cavity and is positioned directly opposite the ring cutter. The guide tube extends axially out of the mounting base. As a preferred embodiment of this application, in the electromagnetic wire insulation layer processing apparatus, after the cut electromagnetic wire passes through the ring cutter, it enters the guide tube. The inner wall of the guide tube provides support for the electromagnetic wire, preventing it from bending or deviating due to its own weight or feed thrust, ensuring that the electromagnetic wire is output in a straight direction, reducing fluctuations during the movement of the electromagnetic wire, and ensuring the consistency of the scraping quality of the insulating paint layer.

[0017] Furthermore, in one of the electromagnetic wire insulation layer processing apparatuses of this application, an opening is provided on the side wall of the chip collection box, and a sealing cover is rotatably installed at the opening. As a preferred embodiment of this application, in one of the electromagnetic wire insulation layer processing apparatuses of this application, the sealing cover is rotatably installed at the opening of the chip collection box, and the operator can open the sealing cover to clean the insulating varnish chips inside the chip collection box.

[0018] As can be seen from the above technical solution, this utility model has the following beneficial effects:

[0019] The purpose of this invention is to provide an electromagnetic wire insulation layer processing device. This device restricts the radial displacement of the electromagnetic wire through a positioning component while preserving its Y-direction freedom of movement. A ring cutter in the stripping component, adapted to the diameter of the electromagnetic wire, removes the insulating paint layer in a single circumferential scraping motion without damaging the wire core. Combined with an elastically floating roller in the feeding component, it adapts to electromagnetic wires of different diameters and ensures uniform speed movement, enabling continuous processing. Simultaneously, the design of the mounting base, chip collection box, and guide tube ensures scraping accuracy, collects paint chips, avoids paint chip contamination, and ensures the quality of the output electromagnetic wire, thereby improving processing efficiency and quality. Attached Figure Description

[0020] Figure 1 This is a cross-sectional view of an electromagnetic wire corresponding to an electromagnetic wire insulation layer processing device in an embodiment of this application.

[0021] Figure 2 This is a three-dimensional structural schematic diagram of an electromagnetic wire insulation layer processing device according to an embodiment of this application;

[0022] Figure 3 This is an exploded view of a stripping component in an electromagnetic wire insulation layer processing apparatus according to an embodiment of this application;

[0023] Figure 4 This is a cross-sectional view of a ring cutter sleeve in an electromagnetic wire insulation layer processing device according to an embodiment of this application;

[0024] Figure 5 This is a three-dimensional structural schematic diagram of the feed component in an electromagnetic wire insulation layer processing device according to an embodiment of this application.

[0025] In the diagram: 1-Insulating paint layer; 100-Base plate; 2-Positioning component; 20-Slot; 21-Base; 210-Notch; 22-Pressure block; 23-Mounting bracket; 24-Screw; 3-Peeling component; 31-Ring cutter sleeve; 310-Cavity; 32-Ring cutter; 4-Feeding component; 41-Drive device; 42-Roller; 421-Main roller; 422-Die roller; 43-Mounting column; 430-Notch; 431-Railway; 44-Crossbeam; 45-Elastic element; 5-Mounting seat; 50-Slot; 500-Chip collection through hole; 51-Cover plate; 6-Chip collection box; 61-Sealed cover plate; 7-Conduit. Detailed Implementation

[0026] like Figure 1 , 2 As shown in Figure 4, an electromagnetic wire insulation layer processing apparatus for removing the insulating paint layer 1 from the surface of the electromagnetic wire includes: a base plate 100, wherein the base plate 100 is provided with the following sequentially arranged in the Y direction:

[0027] Positioning component 2, the positioning component 2 includes: base 21, pressure block 22, the pressure block 22 is movably pressed onto the upper end surface of base 21, the base 21 is provided with a through groove 20 extending in the Y direction, the through groove 20 is used to accommodate electromagnetic wire;

[0028] The stripping assembly 3 includes: a ring blade sleeve 31, which is mounted on the base 21. A ring blade 32 is provided inside the ring blade sleeve 31. The through groove 20 includes a notch 210 extending laterally out of the base 21. The ring blade 32 is positioned opposite the notch 210. The ring blade 32 is used to scrape the insulating paint layer 1 on the surface of the electromagnetic wire after it passes through the notch 210.

[0029] Feeding component 4, which is used to move the electromagnetic wire along the Y direction.

[0030] Based on the above structure, the principle of the electromagnetic wire insulation layer processing device is as follows: First, the end of the electromagnetic wire whose insulating paint layer 1 to be removed is inserted through the notch 210 on the side away from the stripping component 3 and exits through the notch 210 on the other end. At this time, the pressure block 22 is pressed down onto the upper surface of the base 21, and the electromagnetic wire is located in the through groove 20 to restrict the displacement of the electromagnetic wire in its radial direction, while retaining the degree of freedom of movement in the Y direction. Next, the end of the electromagnetic wire is inserted into the ring cutter sleeve 31 and passes through the ring cutter 32. The ring cutter 32 is sleeved on the outside of the electromagnetic wire, and the inner diameter of the ring cutter 32 is adapted to the electromagnetic wire. The electromagnetic wire moves in the Y direction. When the ring cutter 32 moves axially, the cutting edge of the ring cutter 32 exerts a compressive force on the insulating varnish layer 1. As the electromagnetic wire continues to move, the cutting edge of the ring cutter 32 cuts into the insulating varnish layer 1, using shearing force to scrape the insulating varnish layer 1 along the axial direction of the electromagnetic wire. Since the ring cutter 32 has a ring structure, the cutting edge of the ring cutter 32 acts on the entire circumferential surface of the insulating varnish layer 1 simultaneously, achieving circumferential one-time scraping without damaging the electromagnetic wire core, resulting in high processing efficiency. The feed assembly 4 is used to drive the electromagnetic wire to move at a uniform speed along the Y direction, ensuring the uniformity of scraping the insulating varnish layer 1, and working with the ring cutter 32 to achieve continuous processing, further improving processing efficiency.

[0031] In this embodiment, as Figure 5As shown, the feeding assembly 4 includes: a drive device 41 and a pair of rollers 42. The pair of rollers 42 are elastically floating in the vertical direction. The electromagnetic wire is located between the pair of rollers 42. The drive device 41 is mounted on the base plate 100 and is used to drive the rollers 42 to rotate. After the drive device 41 operates, it transmits power to the pair of rollers 42, causing the rollers 42 to rotate. When the electromagnetic wire is located between the pair of rollers 42, the elastically floating rollers 42 automatically adhere to the outer surface of the electromagnetic wire under the action of elastic force. When the rollers 42 rotate, the friction between the rollers 42 and the surface of the electromagnetic wire drives the electromagnetic wire to move axially in the Y direction. Furthermore, the elastically floating rollers 42 can adapt to electromagnetic wires of different diameters, improving the versatility of the device. The drive device 41 is a motor.

[0032] In this embodiment, the pair of rollers 42 includes a main roller 421 and a driven roller 422. The main roller 421 is mounted on the driving end of the driving device 41, and the driven roller 422 is disposed on the upper end of the main roller 421. The feeding assembly 4 further includes a mounting column 43, a crossbeam 44, and an elastic element 45. The mounting column 43 is mounted on the base plate 100 and is spaced apart from the driving device 41 in the X direction. The crossbeam 44 is slidably mounted on the mounting column 43. The elastic element 45 is disposed between the mounting column 43 and the crossbeam 44, and both ends of the elastic element 45 are respectively connected to the mounting column 43 and the crossbeam 44. The driven roller 422 is rotatably mounted on the end of the crossbeam 44 away from the mounting column 43. The crossbeam 44 floats vertically, causing the driven roller 422 to float. The elastic element 45 connects the mounting column 43 and the crossbeam 44, providing a downward elastic force so that the driven roller 422 presses against the main roller 421. When the electromagnetic wire passes between the main roller 421 and the driven roller 422, the compression of the elastic element 45 is automatically adjusted according to the diameter of the electromagnetic wire to ensure stable clamping force. When the diameter of the electromagnetic wire increases, the driven roller 422 is pushed upward, the distance between the main roller 421 and the driven roller 422 increases, the compression of the elastic element 45 increases, the clamping force increases, and slippage is avoided. When the diameter of the electromagnetic wire decreases, the elastic element 45 rebounds, the driven roller 422 descends, and stable friction is maintained. The mounting column 43 is provided with a notch 430, which extends along the axial direction of the mounting column 43. A track 431 is provided inside the notch 430, and the crossbeam 44 is slidably mounted on the track 431. An elastic element 45 is provided inside the notch 430; the elastic element 45 is a spring.

[0033] In this embodiment, the positioning component 2 further includes a mounting bracket 23, which is disposed above the base 21. A screw 24 is threaded through the mounting bracket 23 and connected to it. One end of the screw 24 near the base 21 is connected to the pressure block 22. When it is necessary to position the electromagnetic wire on the base 21, the screw 24 is rotated, and the threaded engagement between the screw 24 and the mounting bracket 23 converts the rotational motion of the screw 24 into linear motion. This drives the pressure block 22 to move downwards in the vertical direction until it presses against the upper surface of the base 21, thereby effectively limiting the radial displacement of the electromagnetic wire and preventing it from shifting or wobbling during movement, ensuring the scraping quality. When it is necessary to release the pressure block 22 from the base 21, the feed component 4 is rotated in the opposite direction to separate the pressure block 22 from the base 21.

[0034] In this embodiment, as Figure 3 As shown, it also includes: a mounting base 5, which is disposed on the base plate 100, the base 21 is mounted on the mounting base 5, the mounting base 5 is provided with a receiving groove 50 for accommodating the ring cutter sleeve 31, and the ring cutter sleeve 31 is provided with a cover plate 51, which is detachably mounted on the mounting base 5. The mounting base 5 positions the base 21 and the ring cutter sleeve 31 on the same reference plane, ensuring that the notch 210 of the through groove 20 is aligned with the central axis of the ring cutter 32, avoiding scraping errors caused by electromagnetic wire misalignment; the cover plate 51 presses and positions the ring cutter sleeve 31 tightly within the receiving groove 50, preventing the ring cutter 32 from shifting due to vibration during processing; the cover plate 51 is detachably mounted on the mounting base 5, and when the ring cutter 32 is worn or damaged, the cover plate 51 can be removed to take out the ring cutter sleeve 31 for replacement and repair, reducing downtime for maintenance; at the same time, the receiving groove 50 can also collect insulating varnish flakes that peel off during scraping, preventing varnish flakes from splashing and contaminating the equipment or affecting the processing environment. The cover plate 51 is detachably mounted on the mounting base 5 by a pair of screws (not shown).

[0035] This embodiment also includes a chip collection box 6, which is installed on the side of the base plate 100 away from the mounting base 5. The ring cutter sleeve 31 includes a cavity 310, and the ring cutter 32 is disposed in the cavity 310. The mounting base 5 is provided with a chip collection through hole 500, which extends axially into the cavity 310. The end of the chip collection through hole 500 away from the ring cutter sleeve 31 is connected to the chip collection box 6 through a pipe. The chip collection box 6 is used to collect insulating varnish chips generated during the scraping process. When scraping the electromagnetic wire, the insulating varnish chips fall off under the shearing force of the ring cutter 32, collect in the cavity 310, enter the pipe through the chip collection through hole 500, and finally fall into the chip collection box 6. This design prevents the insulating varnish chips from spreading in the processing area, keeping the equipment clean and the operating environment safe. The chip collection through hole 500 is an elongated hole that extends axially along the ring cutter sleeve 31.

[0036] In this embodiment, a guide tube 7 is provided on the end of the ring cutter sleeve 31 away from the base 21. The guide tube 7 is connected to the cavity 310 and is positioned directly opposite the ring cutter 32. The guide tube 7 extends axially out of the mounting base 5. After the cut electromagnetic wire passes through the ring cutter 32, it enters the guide tube 7. The inner wall of the guide tube 7 provides support for the electromagnetic wire, preventing it from bending or deviating due to its own weight or feed thrust. This ensures that the electromagnetic wire is output in a straight line, reduces fluctuations when the electromagnetic wire moves, and guarantees the consistency of the scraping quality of the insulating paint layer 1.

[0037] In this embodiment, the chip collection box 6 has an opening on its side wall, and a sealing cover 61 is rotatably installed at the opening. The sealing cover 61 is rotatably installed at the opening of the chip collection box 6. The operator can open the sealing cover 61 to clean the insulating varnish debris inside the chip collection box 6. The sealing cover 61 is installed at the opening of the chip collection box 6 by a hinge (not shown). A rubber sealing ring (not shown) is provided between the sealing cover 61 and the chip collection box 6. Closing the sealing cover 61 can prevent the insulating varnish debris from overflowing.

[0038] The technical principles of this utility model have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on the explanation herein, those skilled in the art can conceive of other specific embodiments of this utility model without creative effort, and these embodiments will all fall within the scope of protection of this utility model.

Claims

1. An apparatus for processing the insulation layer of an electromagnetic wire, used to remove the insulating paint layer (1) from the surface of the electromagnetic wire, characterized in that: include: The base plate (100) is provided with the following in sequence in the Y direction: Positioning component (2), the positioning component (2) includes: base (21) and pressure block (22), the pressure block (22) is movably pressed on the upper surface of the base (21), the base (21) is provided with a through groove (20) extending in the Y direction, the through groove (20) is used to accommodate electromagnetic wire; The stripping assembly (3) includes: a ring blade sleeve (31) mounted on a base (21), a ring blade (32) provided inside the ring blade sleeve (31), the through groove (20) including a notch (210) extending laterally out of the base (21), the ring blade (32) being positioned opposite the notch (210), and the ring blade (32) being used to scrape the insulating paint layer (1) on the surface of the electromagnetic wire after it passes through the notch (210); Feeding assembly (4) is used to move the electromagnetic wire along the Y direction.

2. The electromagnetic wire insulation layer processing apparatus according to claim 1, characterized in that: The feeding assembly (4) includes: a driving device (41) and a pair of rollers (42). The pair of rollers (42) are elastically floating in the vertical direction. The electromagnetic wire is located between the pair of rollers (42). The driving device (41) is mounted on the base plate (100) and is used to drive the rollers (42) to rotate.

3. The electromagnetic wire insulation layer processing apparatus according to claim 2, characterized in that: The pair of rollers (42) includes a main roller (421) and a driven roller (422). The main roller (421) is mounted on the drive end of the drive device (41), and the driven roller (422) is located on the upper end of the main roller (421). The feed assembly (4) further includes a mounting column (43), a crossbeam (44), and an elastic element (45). The mounting column (43) is mounted on the base plate (100). The mounting column (43) is spaced apart from the drive device (41) in the X direction. The crossbeam (44) is slidably mounted on the mounting column (43). The elastic element (45) is located between the mounting column (43) and the crossbeam (44). The two ends of the elastic element (45) are respectively connected to the mounting column (43) and the crossbeam (44). The driven roller (422) is rotatably mounted on the end of the crossbeam (44) away from the mounting column (43).

4. The electromagnetic wire insulation layer processing apparatus according to claim 1, characterized in that: The positioning component (2) further includes: a mounting bracket (23), which is located above the base (21). A screw (24) is threaded through the mounting bracket (23), and the screw (24) is threadedly connected to the mounting bracket (23). One end of the screw (24) near the base (21) is connected to the pressure block (22).

5. The electromagnetic wire insulation layer processing apparatus according to claim 1, characterized in that: Also includes: Mounting base (5), the mounting base (5) is located on the base plate (100), the base (21) is mounted on the mounting base (5), the mounting base (5) is provided with a receiving groove (50), the receiving groove (50) is used to accommodate the ring cutter sleeve (31), the ring cutter sleeve (31) is provided with a cover plate (51), the cover plate (51) is detachably mounted on the mounting base (5).

6. The electromagnetic wire insulation layer processing apparatus according to claim 5, characterized in that: Also includes: The chip collection box (6) is installed on the side of the base plate (100) away from the mounting seat (5). The ring cutter sleeve (31) includes a cavity (310). The ring cutter (32) is located in the cavity (310). The mounting seat (5) is provided with a chip collection through hole (500). The chip collection through hole (500) extends axially to the cavity (310). The end of the chip collection through hole (500) away from the ring cutter sleeve (31) is connected to the chip collection box (6) through a pipe.

7. The electromagnetic wire insulation layer processing apparatus according to claim 6, characterized in that: The ring cutter sleeve (31) is provided with a guide tube (7) at one end away from the base (21). The guide tube (7) is connected to the cavity (310). The guide tube (7) is positioned opposite the ring cutter (32). The guide tube (7) extends axially out of the mounting seat (5).

8. The electromagnetic wire insulation layer processing apparatus according to claim 6, characterized in that: The chip collection box (6) has an opening on its side wall, and a sealing cover (61) is rotatably installed at the opening.

Images