Anti-seismic buffer rubber shell for power supply equipment

By using a composite structure of support and buffer layers and a shock-absorbing airbag design, the seismic resistance of the power supply equipment was solved, achieving a synergistic effect of elastic buffering and rigid support, thereby improving the seismic performance and structural stability of the power supply equipment.

CN224249964UActive Publication Date: 2026-05-15DONGGUAN JINYUAN ELECTRONIC CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
DONGGUAN JINYUAN ELECTRONIC CO LTD
Filing Date
2025-05-12
Publication Date
2026-05-15

AI Technical Summary

Technical Problem

Traditional power supply equipment uses housing materials with limited performance, making it difficult to balance elastic cushioning and structural support. The way the PCB board is fixed results in the direct transmission of vibration energy, causing problems such as component solder joint fatigue and circuit breakage.

Method used

It adopts a composite structure of support layer and buffer layer, combined with shock-absorbing airbag and bracket design. The support layer is rigid support, the buffer layer is elastic absorption, the shock-absorbing airbag buffers vibration through elastic deformation, and the bracket is flexibly connected to the PCB board to avoid rigid contact.

Benefits of technology

Significantly improves the shock resistance of power equipment, reduces the risk of component damage, simplifies the assembly process, reduces weight and cost, and enhances structural compactness.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to an anti-seismic buffer rubber shell for power supply equipment, which comprises a shell body, the shell body comprises a supporting layer and a buffer layer, the supporting layer and the buffer layer are compounded and molded into a whole, a support is fixedly arranged in the supporting layer, a damping air bag is arranged on the support, and a support is arranged on the damping air bag. The shell adopts the composite structure design of the supporting layer and the buffer layer, the anti-seismic performance of the power supply equipment is remarkably improved, the buffer layer can effectively absorb vibration energy and provide waterproof protection, the supporting layer provides rigid support for the shell, structural deformation is avoided, meanwhile, the support is flexibly connected with the shell through the damping air bag, and the service life of the power supply equipment is prolonged. The damping air bag can effectively absorb vibration transmitted from the housing, reduce the transmission of vibration energy to the PCB, and reduce the risk of element damage.
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Description

Technical Field

[0001] The utility model relates to the technical field of power equipment protection, and specifically relates to an anti-seismic buffer rubber shell for power equipment. Background Art

[0002] In the practical application of power equipment, vibration and shock environments are common, such as the continuous operation of industrial equipment, the bumps during transportation, or mechanical vibrations in special scenarios. The outer shells of traditional power equipment expose the following deficiencies when dealing with such environments: Firstly, the performance of the rubber shell material is single, and it is difficult to balance the dual requirements of elastic buffering and structural support. Existing rubber shells mostly adopt single materials, such as ordinary plastics or silica gels. Plastic materials have certain rigidity but insufficient elasticity and cannot effectively absorb vibration energy; although silica gel materials can provide a certain buffering effect, their structural strength is low, and they are prone to deformation during long-term use, and stress concentration problems are likely to occur at the fixing interface with internal components. Secondly, the fixing method of the PCB board is unreasonable. Currently, the PCB board is usually directly fixed to the inner wall of the rubber shell by screws. This rigid connection method causes vibration energy to be directly transmitted to the circuit board. In a vibration environment, the rigid contact between the PCB board and the rubber shell will cause problems such as component solder joint fatigue and circuit breakage. Especially in high-frequency vibration scenarios, the defects of this fixing method are more significant. Content of the Utility Model

[0003] Aiming at the deficiencies of the existing technology, the purpose of the utility model is to provide an anti-seismic buffer rubber shell for power equipment.

[0004] The purpose of the utility model can be realized by the following technical solutions: An anti-seismic buffer rubber shell for power equipment, including a shell, the shell includes a support layer and a buffer layer, the support layer and the buffer layer are integrally formed by composite molding, a support is fixedly arranged inside the support layer, a shock-absorbing airbag is installed on the support, and a bracket is arranged on the shock-absorbing airbag.

[0005] Preferably, the support includes a bottom plate, a connecting plate is vertically arranged on the bottom plate, a support plate is arranged on one side of the upper part of the connecting plate, and an installation hole is formed on the support plate.

[0006] Preferably, the cross-section of the shock-absorbing airbag is in a "king" - shaped structure, including a closed main cavity, auxiliary cavities are arranged at intervals in the length direction of the main cavity, the auxiliary cavities are connected to the main cavity, an independent channel is arranged in the middle of the main cavity, and both ends of the channel are connected to the outside.

[0007] Preferably, the support layer and the buffer layer are integrally formed by secondary injection molding.

[0008] Preferably, a buffer rubber pad is arranged on the bracket.

[0009] Preferably, reinforcing ribs are arranged on the inner wall of the support layer.

[0010] Preferably, the outer surface of the buffer layer is provided with anti-slip texture.

[0011] The beneficial effects of this utility model are: by adopting a composite structure design of support layer and buffer layer, the shock resistance performance of the power supply equipment is significantly improved. The buffer layer can effectively absorb vibration energy and provide waterproof protection, while the support layer provides rigid support for the shell to avoid structural deformation. At the same time, the bracket is flexibly connected to the shell through shock-absorbing airbags to reduce the transmission of vibration energy to the PCB board and reduce the risk of component damage. Attached Figure Description

[0012] The present invention will be further described with reference to the accompanying drawings, but the embodiments in the drawings do not constitute any limitation on the present invention. For those skilled in the art, other drawings can be obtained based on the following drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the structure of an anti-vibration buffer shell for power supply equipment according to the present invention.

[0014] Figure 2 This is a schematic diagram of the support structure for an anti-vibration buffer shell used in power supply equipment according to the present invention.

[0015] Figure 3 This is a cross-sectional view of a shock-absorbing rubber shell for power supply equipment according to the present invention.

[0016] Figure 4 This is a schematic diagram of a support structure for an anti-vibration buffer shell used in power supply equipment according to the present invention.

[0017] Figure 5 This is a schematic diagram of a shock-absorbing airbag structure for a shock-absorbing and buffering shell used in power supply equipment according to the present invention.

[0018] Figure 6 This is a schematic diagram of the anti-slip textured structure of a shock-absorbing rubber shell for power supply equipment according to the present invention.

[0019] Figure 7 for Figure 3 A partial schematic diagram of point A in the middle.

[0020] The labels in the diagram represent: 1. Shell; 101. Support layer; 102. Buffer layer; 2. Support; 201. Base plate; 202. Connecting plate; 203. Support plate; 204. Mounting hole; 3. Shock-absorbing airbag; 301. Main cavity; 302. Channel; 303. Secondary cavity; 304. Groove; 4. Bracket; 5. Buffer pad; 6. Reinforcing rib; 7. Anti-slip texture. Detailed Implementation

[0021] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0022] Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0023] The technical solution of this utility model will be clearly and completely described below with reference to specific embodiments. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0024] See Figures 1 to 7 As shown, the structure of this utility model is as follows: a shock-absorbing and buffering shell for power supply equipment, including a shell 1, the shell 1 including a support layer 101 and a buffer layer 102, the buffer layer 102 being an elastic material for absorbing part of the impact force, and the support layer 101 being a rigid material for supporting the entire shell 1 structure and preventing the shell 1 from deforming when impacted. The support layer 101 and the buffer layer 102 are integrally molded, forming a synergistic force-bearing structure, which avoids the problem of easy delamination and detachment in traditional multi-layer structures, enhances the overall impact resistance through the dispersion of interfacial stress between materials, and simplifies the process. The assembly process improves the structural compactness, while reducing redundant structures, weight, and manufacturing costs. Supports 2 are fixedly installed inside the support layer 101. Multiple supports 2 are fixed inside the support layer 101 by ultrasonic welding or screws. Shock-absorbing airbags 3 are installed on the supports 2, and brackets 4 are installed on the shock-absorbing airbags 3. The PCB board is installed on the brackets 4 by screws. When the power supply equipment is subjected to external vibration or impact, the shock-absorbing airbags 3 buffer the vibration through their own elastic deformation or the elastic medium filled inside, so that the vibration transmitted to the brackets 4 is greatly attenuated, thereby reducing the impact of vibration on the electronic components on the PCB board.

[0025] like Figure 4As shown in the figure, the support 2 includes a bottom plate 201. A connecting plate 202 is vertically provided on the bottom plate 201. On one side of the upper part of the connecting plate 202, there is a support plate 203. An installation hole 204 is provided on the support plate 203. Specifically, the shock-absorbing airbag 3 is snap-fitted in the installation hole 204. The bottom plate 201 is fixed to the support layer 101 by ultrasonic welding or screws, firmly anchoring the shock-absorbing airbag 3 inside the support layer 101. At the same time, a certain floating space is left between the shock-absorbing airbag 3 and the support layer 101 through the connecting plate 202.

[0026] As Figure 5 shown in the figure, the cross-section of the shock-absorbing airbag 3 is in the shape of a "king" character structure, including a closed main cavity 301. The sub-cavities 303 are arranged at intervals in the length direction of the main cavity 301. The sub-cavity 303 is connected to the main cavity 302. An independent channel 302 is provided in the middle of the main cavity 301. Both ends of the channel 302 are connected to the outside. Specifically, two adjacent sub-cavities 303 form grooves 304 on the outer surface of the shock-absorbing airbag 3. One of the grooves 304 is snap-fitted with the support 2, and the other groove 304 is snap-fitted with the bracket 4. At the same time, a bolt is inserted through the channel 302, which not only ensures the stable connection between the shock-absorbing airbag 3, the bracket 4 and the support 2, but also can buffer impacts in multiple directions through the floating spaces of the main cavity 301 and the sub-cavities 303. The support 2, the bracket 4 and the bolt are separated by the sub-cavities 303 to avoid rigid connection.

[0027] Furthermore, the support layer 101 and the buffer layer 102 are integrally formed by secondary injection molding. The support layer 101 and the buffer layer 102 are tightly combined by secondary injection molding to form a composite structure without interface delamination, significantly enhancing the adhesion between the support layer 101 and the buffer layer 102 and the overall anti-peeling performance.

[0028] As Figure 1 、 Figure 2 shown in the figure, a buffer rubber pad 5 is provided on the bracket 4. When the housing 1 is subjected to external vibration, the buffer rubber pad 5 relieves the rigid contact between the bracket 4 and the PCB board through its own elastic deformation, reducing the direct transmission of vibration energy, thereby reducing the risk of solder joint fatigue and component damage. At the same time, when the PCB board is installed on the bracket 4, an elastic rubber ring is provided between the fixing screw and the PCB board to avoid stress concentration.

[0029] As Figure 1 、 Figure 3 shown in the figure, reinforcing ribs 6 are provided on the inner wall of the support layer 101 to further improve the strength of the housing 1.

[0030] As Figure 6As shown, the outer surface of the buffer layer 102 is provided with anti-slip texture 7. The anti-slip texture 7 adopts a geometric structure design with alternating convex and concave surfaces. By increasing the surface roughness, it significantly improves the friction with the external contact surface, thereby enhancing the stability of the shell 1 during use. At the same time, the anti-slip texture 7 can also guide the stress to be evenly distributed, further improving the buffering effect of the buffer layer 102.

[0031] In practical use, when the housing 1 is subjected to external vibration or impact, the buffer layer 102 absorbs part of the impact force through the deformation of its elastic material. At the same time, the support layer 101 prevents the housing 1 from deforming due to its rigid structure. Subsequently, the remaining vibration is transmitted to the shock-absorbing airbag 3 through the support 2. The shock-absorbing airbag 3 further buffers the vibration through its own elastic deformation or the elastic medium filled inside, thereby reducing the impact of vibration on the electronic components on the PCB board. The design of the support layer 101 and the buffer layer 102 being integrally molded together forms a synergistic force-bearing structure. This not only avoids the problem of easy delamination and detachment in traditional multi-layer structures, but also enhances the overall impact resistance through the dispersion of interfacial stress between materials. At the same time, it simplifies the assembly process and improves the structural compactness, reduces redundant structures, and lowers the weight and manufacturing cost of the housing 1.

[0032] The present invention has been further described above with reference to specific embodiments. However, it should be understood that the specific description herein should not be construed as limiting the substance and scope of the present invention. Various modifications made by those skilled in the art to the above embodiments after reading this specification are all within the scope of protection of the present invention.

Claims

1. A shock-absorbing housing for power supply equipment, comprising a housing (1), characterized in that: The housing (1) includes a support layer (101) and a buffer layer (102). The support layer (101) and the buffer layer (102) are integrally formed by composite molding. A support (2) is fixedly arranged in the support layer (101). A shock-absorbing airbag (3) is installed on the support (2), and a bracket (4) is arranged on the shock-absorbing airbag (3).

2. The shock-absorbing housing for power supply equipment according to claim 1, characterized in that: The support (2) includes a bottom plate (201). A connecting plate (202) is vertically arranged on the bottom plate (201). A support plate (203) is arranged on one side of the upper part of the connecting plate (202), and a mounting hole (204) is formed in the support plate (203).

3. The shock-absorbing housing for power supply equipment according to claim 1, characterized in that: The cross-section of the shock-absorbing airbag (3) is in a "king" character structure, including a closed main cavity (301). Auxiliary cavities (303) are arranged at intervals in the length direction of the main cavity (301). The auxiliary cavities (303) are communicated with the main cavity (302). An independent channel (302) is arranged in the middle of the main cavity (301), and both ends of the channel (302) are communicated with the outside.

4. The shock-absorbing housing for power supply equipment according to claim 1, characterized in that: The support layer (101) and the buffer layer (102) are integrally formed by secondary injection molding.

5. The shock-absorbing housing for power supply equipment according to claim 1, characterized in that: A buffer rubber pad (5) is arranged on the bracket (4).

6. The shock-absorbing housing for power supply equipment according to claim 1, characterized in that: Reinforcing ribs (6) are arranged on the inner wall of the support layer (101).

7. The shock-absorbing housing for power supply equipment according to claim 1, characterized in that: Anti-slip patterns (7) are arranged on the outer surface of the buffer layer (102).