Multifunctional conference centralized control equipment

By employing a heat dissipation design with semiconductor cooling chips and a vapor chamber, along with redundant power supply through dual power interfaces, the problems of low heat dissipation efficiency and unstable power supply in traditional equipment have been solved. This has resulted in stable temperature and reliable power supply, thereby improving the operational reliability of the equipment and the continuity of meetings.

CN224250065UActive Publication Date: 2026-05-15广州市雅音电子有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
广州市雅音电子有限公司
Filing Date
2025-06-04
Publication Date
2026-05-15

AI Technical Summary

Technical Problem

Traditional conference control equipment has poor heat dissipation efficiency in compact spaces, making it prone to overheating and crashing. It also lacks power supply redundancy protection, resulting in poor system stability.

Method used

It adopts an active heat dissipation design with semiconductor cooling chips and heat spreaders, combined with diagonally distributed forced convection air ducts and multi-layer composite filter cloth, and is equipped with dual power supply interfaces for redundant power supply to ensure temperature stability and power supply reliability under high load.

Benefits of technology

It achieves stable control of the internal temperature of the equipment, significantly reduces the rate of dust deposition, and seamlessly switches to backup power in case of power failure, avoiding meeting interruptions and improving the operational reliability and stability of the equipment.

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Abstract

The utility model relates to the technical field of conference control equipment, in particular to multifunctional conference centralized control equipment which comprises a protection box, a protection cover is installed at the bottom end of the protection box through bolts, a rubber strip is fixedly installed on one side of the protection cover, a cavity is formed after the protection box and the protection cover are fixed, a control mainboard is fixed through bolts, and the protection box and the protection cover are fixed through bolts. A heating point of the control main board is attached to the vapor chamber through heat conduction silicone grease, the heat dissipation end of the vapor chamber is connected with the refrigeration end of the semiconductor board through heat conduction silicone grease, the heating end of the semiconductor board faces the heat dissipation window, and an exhaust fan is installed on the heat dissipation window through bolts. According to the utility model, the semiconductor chilling plate and the vapor chamber are used for cooperative heat dissipation, the diagonal air duct and the multilayer filter screen are combined, the temperature stability under high load is maintained, the dust retention is reduced, the problems of low efficiency and frequent maintenance in the traditional scheme are solved, the standby power supply can be seamlessly switched during power failure due to the dual-power-supply redundancy design, conference interruption is avoided, and the service life of the conference is prolonged. And the anti-voltage fluctuation reliability of equipment is improved.
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Description

Technical Field

[0001] This utility model relates to the field of conference control equipment technology, specifically a multi-functional centralized conference control device. Background Technology

[0002] Centralized conference control equipment is an integrated management system that controls electronic devices (such as lights, sound systems, and projectors) in the conference room through a unified interface. This eliminates the cumbersome process of operating multiple devices independently, ensures efficient and coordinated operation of equipment, reduces human error, and thus improves conference efficiency and process stability.

[0003] However, traditional conference control equipment mostly uses single air cooling, and cannot balance heat dissipation efficiency and dust prevention requirements in a compact space. Overheating and crashes or dust blockage are likely to occur during long-term operation. At the same time, conventional equipment is only equipped with a single power interface and lacks a power supply redundancy protection mechanism. Power failure can easily lead to system downtime, which cannot meet the continuous control requirements of high-stability conference scenarios. Utility Model Content

[0004] The purpose of this invention is to provide a multifunctional centralized control device for conferences to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A multifunctional centralized control device for conferences includes a protective box. A protective cover is bolted to the bottom of the protective box, and an adhesive strip is fixedly installed on one side of the protective cover. The protective box and the protective cover are fixed together to form a cavity, and a control board is fixed to it with bolts. The heating point of the control board is attached to a heat spreader plate with thermal grease. The heat dissipation end of the heat spreader plate is connected to the cooling end of a semiconductor board with thermal grease. The heating end of the semiconductor board faces the heat dissipation window, and an exhaust fan is bolted to the heat dissipation window.

[0007] The heat dissipation window is located at the top of the protective box, and an air intake window is provided on the side of the protective box adjacent to the heat dissipation window. A filter mesh is installed inside the protective box on the side of the air intake window by bolts.

[0008] Preferably, a display screen is installed through the protective box on the side away from the air intake window, an indicator light is fixedly installed on the side of the protective box adjacent to the display screen, and a USB interface is installed through the protective box on the side adjacent to the indicator light.

[0009] Preferably, the protective box has an infrared learning window on the side adjacent to the USB interface, and the infrared learning window, display screen, indicator light and USB interface are fixedly connected to the control motherboard through flexible wires.

[0010] Preferably, a first power interface is installed through the protective box on the side away from the infrared learning window, a second power interface is installed through the protective box on the side adjacent to the first power interface, and a network interface is installed through the protective box on the side adjacent to the second power interface.

[0011] Preferably, the protective box has two sets of RS485 interfaces installed through it on the side adjacent to the network interface, an RS232 interface installed through it on the side adjacent to the RS485 interface, and an infrared transmitter port installed through it on the side adjacent to the RS232 interface.

[0012] Preferably, an I / O digital interface is installed through the protective box on the side adjacent to the infrared emission port, a high-definition input interface and a high-definition output interface are installed through the protective box on the side adjacent to the I / O digital interface, and a relay port is installed through the protective box on the side adjacent to the high-definition input interface.

[0013] Preferably, the relay port, the first power interface, the second power interface, the network interface, the RS485 interface, the RS232 interface, the infrared transmitter, the IO digital interface, the high-definition input interface, and the high-definition output interface are respectively soldered to the control motherboard via pins.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. This type of multifunctional centralized conference control equipment, through the active heat dissipation collaborative design of semiconductor cooling chip and heat dissipation plate, combined with diagonally distributed forced convection air duct and multi-layer composite filter cloth, can continuously maintain the internal temperature of the equipment under high load operation, while significantly reducing the dust deposition rate, effectively solving the problems of rapid efficiency decay and short maintenance cycle of traditional heat dissipation solutions.

[0016] 2. This multi-functional centralized conference control device, through a redundant power supply design with dual power interfaces, can seamlessly switch to the backup power supply when the main power supply is abnormal, avoiding interruption of the conference process and significantly improving the operational reliability of the device in the event of a sudden power outage or voltage fluctuation. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the rear view structure of this utility model;

[0019] Figure 3 This is a schematic diagram of the bottom structure of this utility model;

[0020] Figure 4 This is a schematic diagram of the planar structure of this utility model.

[0021] In the diagram: 101, Protective box; 102, Protective cover; 103, Adhesive strip; 104, Chamber; 105, Control main board; 107, Heat sink; 108, Semiconductor board; 109, Heat dissipation window; 110, Exhaust fan; 111, Air inlet; 112, Filter cloth; 113, Display screen; 114, Indicator light; 115, USB interface; 116, Infrared learning window; 118, First power interface; 119, Second power interface; 120, Network interface; 121, RS485 interface; 122, RS232 interface; 123, Infrared transmitter; 124, I / O digital interface; 125, High-definition input interface; 126, High-definition output interface; 127, Relay port. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figures 1-4 As shown, this utility model provides a technical solution:

[0024] A multifunctional centralized control device for conferences includes a protective box 101. A protective cover 102 is bolted to the bottom of the protective box 101. An adhesive strip 103 is fixedly installed on one side of the protective cover 102. After the protective box 101 and the protective cover 102 are fixed together, a chamber 104 is formed. A control motherboard 105 is fixed to the protective box 105 with bolts. The heat-generating point of the control motherboard 105 is attached to a heat spreader 107 with thermal grease. The heat dissipation end of the heat spreader 107 is connected to the cooling end of a semiconductor board 108 with thermal grease. The heating end of the semiconductor board 108 faces a heat dissipation window 109. An exhaust fan 110 is bolted to the heat dissipation window 109.

[0025] The heat dissipation window 109 is located at the top of the protective box 101. An air inlet window 111 is provided on the side of the protective box 101 adjacent to the heat dissipation window 109. A filter mesh 112 is installed inside the protective box 101 on the side of the air inlet window 111 by bolts.

[0026] The above solution forms a sealed chamber by bolting the protective box and cover, achieving physical protection and electromagnetic shielding for the internal components. By controlling the thermal grease between the motherboard's heat-generating area and the heat spreader, the core heat source can be quickly dissipated. The close connection between the heat spreader and the cooling end of the thermoelectric cooler generates uniform heat distribution and actively transfers heat. The design of the thermoelectric cooler's heating end facing the heat dissipation window allows for forced exhaust of accumulated heat using an exhaust fan. The combination of the air intake window and filter cloth ensures clean intake of external air while preventing dust accumulation within the chamber. Adhesive strips prevent movement during overall placement.

[0027] In this embodiment, preferably, a display screen 113 is installed through the protective box 101 on the side away from the air intake window 111, an indicator light 114 is fixedly installed on the protective box 101 adjacent to the display screen 113, and a USB interface 115 is installed through the protective box 101 adjacent to the indicator light 114.

[0028] With the above solution, the display screen installed across the side away from the air intake can display the equipment's operating parameters and operation interface in real time; the indicator lights set near the display screen can provide feedback on power status and fault warnings through color changes; and the USB interface on the side of the indicator lights can enable plug-and-play data transfer from external storage devices.

[0029] In this embodiment, preferably, the protective box 101 has an infrared learning window 116 on the side adjacent to the USB interface 115. The infrared learning window 116, the display screen 113, the indicator light 114 and the USB interface 115 are respectively fixedly connected to the control motherboard 105 through flexible wires.

[0030] The above solution, through the opening design of the infrared learning window, can receive and learn infrared remote control signals; by connecting the display screen, indicator lights, USB interface and infrared learning window with flexible wires, the stability of signal transmission can be ensured and the circuit damage caused by mechanical vibration can be reduced.

[0031] In this embodiment, preferably, a first power interface 118 is installed through the protective box 101 on the side away from the infrared learning window 116, a second power interface 119 is installed through the protective box 101 on the side adjacent to the first power interface 118, and a network interface 120 is installed through the protective box 101 on the side adjacent to the second power interface 119.

[0032] The above solution, through the dual-power supply design of the first and second power interfaces, enables seamless switching and redundancy protection of the main and backup power supplies; through the through-installation of the network interface, a high-speed wired data transmission channel can be established to ensure real-time response to conference control commands.

[0033] In this embodiment, preferably, two sets of RS485 interfaces 121 are installed through the protective box 101 on the side adjacent to the network interface 120, an RS232 interface 122 is installed through the protective box 101 on the side adjacent to the RS485 interface 121, and an infrared transmitter 123 is installed through the protective box 101 on the side adjacent to the RS232 interface 122.

[0034] The above solution, with its symmetrical layout of two sets of RS485 interfaces, allows for the simultaneous connection of multiple audio devices while avoiding signal crosstalk; the independent setting of the RS232 interface ensures compatibility with traditional control terminal devices; and the directional installation of the infrared transmitter port enables the precise transmission of learned control signals to the target device.

[0035] In this embodiment, preferably, an I / O digital interface 124 is installed through the protective box 101 on the side adjacent to the infrared emitting port 123, a high-definition input interface 125 and a high-definition output interface 126 are respectively installed through the protective box 101 on the side adjacent to the I / O digital interface 124, and a relay port 127 is installed through the protective box 101 on the side adjacent to the high-definition input interface 125.

[0036] The above solution integrates an I / O digital interface to receive external sensor signals and intelligently adjust environmental parameters; the independent channel design of high-definition input and output interfaces enables bidirectional transmission of lossless audio and video signals; and the high-power control function of the relay port can safely drive high-power external devices.

[0037] In this embodiment, preferably, the relay port 127, the first power interface 118, the second power interface 119, the network interface 120, the RS485 interface 121, the RS232 interface 122, the infrared transmitter port 123, the IO digital interface 124, the high-definition input interface 125, and the high-definition output interface 126 are respectively soldered to the control motherboard 105 via pins.

[0038] The above solution eliminates poor contact caused by loose connectors by directly soldering all interface pins to the control motherboard; the modular and centralized layout of the interfaces simplifies cable management and improves equipment maintenance efficiency.

[0039] In this embodiment, a multifunctional centralized conference control device is used such that, when the protective box 101 and the protective cover 102 are tightly fixed with bolts to form a sealed chamber 104, the internal control main board 105 is bolted to the center of the chamber 104. The heat generated in its heating area is quickly conducted to the surface of the heat spreader 107 through a tightly adhered thermal grease. The high thermal conductivity of the heat spreader 107 is used to evenly diffuse the heat to the entire heat dissipation end. The heat dissipation end of the heat spreader 107 is in seamless contact with the cooling end of the thermoelectric cooler through another layer of thermal grease. The thermoelectric cooler transfers heat from the cooling end to the heating end based on the Peltier effect. The heat generated at the heating end is accelerated by the heat dissipation fins that are tightly attached to the inside of the heat dissipation window 109. At this time, the exhaust fan 110 installed on the heat dissipation window 109 starts to operate. Forced airflow is exhausted outward from the heat dissipation window 109 at the top of the protective box 101. Simultaneously, the air intake window 111 at the lower side wall of the protective box 101 draws in external air under negative pressure. A multi-layer composite filter cloth 112 installed inside the air intake window 111 provides double interception of dust from the external air. The outer stainless steel mesh blocks large particles, while the inner electrostatic fiber layer adsorbs fine dust, ensuring the cleanliness of the air entering the chamber 104. The clean airflow forms a diagonal circulation path within the chamber 104, flowing in through the air intake window 111 and along the surface of the heating area, absorbing residual heat from the control motherboard 105 and surrounding components. Finally, carrying the heat, it is efficiently exhausted through the heat dissipation window 109, achieving dynamic temperature balance within the equipment. The control motherboard 105 (using a PVC circuit board, integrating an ARM Cortex) The A7@Max.1.3GHz chip, DDR3 4G RAM, and 2GFlash flash memory, under stable operating conditions, maintain signal connection via flexible wires to the display screen 113, indicator lights 114, USB interface, and infrared learning window 116, which are installed through the side wall of the protective box 101. The display screen 113 displays the device's operating status and conference control parameters in real time. The indicator lights 114 provide feedback on power, network, and fault information through color changes. The USB interface provides a plug-and-play data transmission channel for external storage devices. The infrared learning window 116 receives remote control signals and completes code learning. The control motherboard 10... 5. Simultaneously manage the power distribution of two sets of power interfaces. The first power interface 118 is connected to the main power supply line, and the second power interface 119 serves as a redundant backup. The network interface 120 establishes a wired data transmission channel. The two sets of RS485 interfaces 121 and RS232 interfaces 122 are respectively connected to the audio equipment and environmental control module in the conference system. The infrared transmitter 123 sends the learned control signals to the controlled equipment. The IO digital interface 124 receives external sensor signals. The high-definition input and output interfaces transmit lossless audio and video signals through the HDMI protocol. The relay port 127 controls the start and stop of external high-power devices.All electrical pins of the interfaces are integrated onto the corresponding pads of the control motherboard 105 by soldering, eliminating the risk of loose connectors and ensuring the stability and anti-interference capability of signal transmission. During equipment operation, the synergistic effect of the semiconductor cooling chip and the forced air cooling system keeps the temperature of the core components below the safe threshold. The composite filtration system significantly reduces the internal dust accumulation rate. The modular layout of multiple interfaces significantly improves cable management efficiency. The overall structure achieves high-density functional integration within a limited space, meeting the stringent requirements of the conference environment for equipment reliability, quiet operation, and ease of use.

[0040] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A multifunctional centralized control device for conferences, comprising a protective housing (101), characterized in that: The protective box (101) is fitted with a protective cover (102) by bolts at the bottom. A rubber strip (103) is fixedly installed on one side of the protective cover (102). After the protective box (101) and the protective cover (102) are fixed, a cavity (104) is formed. The control board (105) is fixed by bolts. The heating point of the control board (105) is attached to the heat spreader (107) by thermal grease. The heat dissipation end of the heat spreader (107) is connected to the cooling end of the semiconductor board (108) by thermal grease. The heating end of the semiconductor board (108) faces the heat dissipation window (109). An exhaust fan (110) is installed on the heat dissipation window (109) by bolts. The heat dissipation window (109) is located at the top of the protective box (101). An air inlet window (111) is provided on the side of the protective box (101) adjacent to the heat dissipation window (109). A filter mesh (112) is installed inside the protective box (101) on the side of the air inlet window (111) by bolts.

2. The multifunctional centralized control device for conferences according to claim 1, characterized in that: A display screen (113) is installed through the protective box (101) on the side away from the air intake window (111). An indicator light (114) is fixedly installed on the side of the protective box (101) adjacent to the display screen (113). A USB interface (115) is installed through the protective box (101) adjacent to the indicator light (114).

3. The multifunctional centralized control device for conferences according to claim 2, characterized in that: The protective box (101) has an infrared learning window (116) on the side adjacent to the USB interface (115). The infrared learning window (116), the display screen (113), the indicator light (114) and the USB interface (115) are fixedly connected to the control motherboard (105) through flexible wires.

4. A multifunctional centralized conference control device according to claim 3, characterized in that: The protective box (101) has a first power interface (118) installed through it on the side away from the infrared learning window (116), the protective box (101) has a second power interface (119) installed through it on the side adjacent to the first power interface (118), and the protective box (101) has a network interface (120) installed through it on the side adjacent to the second power interface (119).

5. A multifunctional centralized conference control device according to claim 4, characterized in that: Two sets of RS485 interfaces (121) are installed through the protective box (101) on the side adjacent to the network interface (120). An RS232 interface (122) is installed through the protective box (101) on the side adjacent to the RS485 interface (121). An infrared transmitter (123) is installed through the protective box (101) on the side adjacent to the RS232 interface (122).

6. A multifunctional centralized conference control device according to claim 5, characterized in that: An IO digital interface (124) is installed through the side of the protective box (101) adjacent to the infrared emission port (123). A high-definition input interface (125) and a high-definition output interface (126) are installed through the side of the protective box (101) adjacent to the IO digital interface (124). A relay port (127) is installed through the side of the protective box (101) adjacent to the high-definition input interface (125).

7. A multifunctional centralized conference control device according to claim 6, characterized in that: The relay port (127), the first power interface (118), the second power interface (119), the network interface (120), the RS485 interface (121), the RS232 interface (122), the infrared transmitter (123), the IO digital interface (124), the high-definition input interface (125), and the high-definition output interface (126) are respectively soldered to the control motherboard (105) via pins.