Elastic pressure self-adaptive adjusting mechanism for SMT (Surface Mount Technology) processing element mounting head

Abstract

The utility model discloses an elastic pressure self-adaptive adjusting mechanism for a mounting head of an SMT (Surface Mount Technology) processing element, and belongs to the technical field of mounting head elastic adjustment. The device mainly comprises a main board, the bottom of the main board is provided with a bottom board and an adjusting unit, the adjusting unit is installed on the main board, the adjusting unit is composed of two groups of transmission wheels installed on the main board through bearings and a belt arranged on the two groups of transmission wheels, the mounting mechanism is installed on the bottom board, the mounting mechanism comprises an air pipe, the air pipe penetrates through the bottom board in a sliding mode, and the air pipe penetrates through the main board. A connecting block and a connecting pipe which are connected with the belt are fixed on the air pipe, the connecting pipe is arranged at the bottom of the air pipe, the bottom of the connecting pipe is slidably connected with a sleeve shaft, the sleeve shaft is connected with a vacuum suction nozzle and an elastic body, the elastic body is arranged between the sleeve shaft and the connecting pipe, and the elastic body is composed of a first spring and a second spring. According to the elastic pressure self-adaptive adjusting mechanism for the SMT processing element mounting head, the effect of pressure self-adaptive adjustment when elements with different thicknesses are mounted is achieved.

Description

Technical Field

[0001] This application relates to the field of placement head elasticity adjustment technology, specifically to an adaptive adjustment mechanism for the elastic pressure of an SMT component placement head. Background Technology

[0002] The placement head is the core execution component of an SMT pick-and-place machine, responsible for accurately picking up, positioning, and placing electronic components onto the PCB. The placement head is equipped with elastic components to solve problems such as PCB deformation, component tolerance, and high-speed impact through flexible buffering and dynamic pressure adjustment.

[0003] For example, the patent with publication number CN220044079U specifically discloses a placement head structure for an SMT pick and place machine. The placement head structure includes a base and a side plate installed on one side of the base. A mounting plate is fixed to the top of the side plate, and a mounting block is slidably connected below the mounting plate. A hydraulic rod is installed on the mounting block, and a connecting plate is fixed to the output end of the hydraulic rod. A mounting post is provided on the connecting plate, and a suction cup is provided on the mounting post. A spring connected to the suction cup is provided inside the mounting post.

[0004] In the above-disclosed patent structure, the mounting head structure mainly drives the mounting block to move through external driving force, and indirectly drives the suction cup to move. In conjunction with the hydraulic rod and the spring on the top of the suction cup, the components are mounted on the PCB board to complete the mounting of the PCB board.

[0005] However, in actual PCB mounting, due to factors such as component height and assembly level, the thickness and pressure resistance of components on the PCB are different. When mounting components of different thicknesses on the PCB, the springs in the suction cups and mounting posts are ordinary springs, which results in different pressures on the components when mounting each set of suction cups, which may damage the components. Therefore, it is necessary to provide an adaptive elastic pressure adjustment mechanism for SMT component mounting head to solve the above problems.

[0006] It should be noted that the information disclosed in this background section is only for understanding the background technology of this application concept, and therefore may include information that does not constitute prior art. Utility Model Content

[0007] Based on the aforementioned problems in the existing technology, the problem to be solved by this application is to provide an adaptive elastic pressure adjustment mechanism for the component placement head in SMT surface mount technology (SMT) to achieve adaptive pressure adjustment when placing components of different thicknesses.

[0008] To achieve the above objectives, this application provides the following technical solution: an adaptive elastic pressure adjustment mechanism for an SMT component mounting head, comprising a main board with a base plate at its bottom, an adjustment unit mounted on the main board, the adjustment unit consisting of two sets of transmission wheels with bearings mounted on the main board and belts mounted on the two sets of transmission wheels, a mounting mechanism mounted on the base plate, the mounting mechanism including an air tube that slides through the base plate, a connecting block fixed on the air tube and connected to the belt, a connecting pipe mounted at the bottom of the air tube, a sleeve shaft slidably connected to the bottom of the connecting pipe, a vacuum nozzle connected to the sleeve shaft, and an elastic body mounted between the sleeve shaft and the connecting pipe, the elastic body consisting of a first spring and a second spring.

[0009] Preferably, the first spring has a greater elastic force than the second spring, and the second spring is located near the vacuum nozzle.

[0010] Preferably, a limiting platform is provided on the inner side of the sleeve shaft, and an inner platform that mates with the limiting platform is provided at the bottom of the connecting pipe.

[0011] Preferably, an air pump is connected to the top of the trachea.

[0012] Preferably, a guide post is fixed on the base plate, the guide post passes through the connecting block, and the connecting block is adapted to slide up and down along the guide post.

[0013] Preferably, a motor is connected to the drive wheel at the top of the motherboard.

[0014] The beneficial effects of this application are as follows: The SMT component placement head elastic pressure adaptive adjustment mechanism provided by this application drives the rotation of the transmission wheel by the motor and drives the belt drive to move the air tube up and down, realizing the independent drive of each placement mechanism. At the same time, under the cooperation of the first spring and the second spring of the elastic body, the pressure adaptive adjustment effect is achieved when placing components of different thicknesses through a progressive pressure curve of first soft and then hard.

[0015] In addition to the purposes, features, and advantages described above, this application has other purposes, features, and advantages. A further detailed description of this application will be provided below with reference to the figures. Attached Figure Description

[0016] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings:

[0017] Figure 1This is an overall schematic diagram of an adaptive elastic pressure adjustment mechanism for an SMT component mounting head according to this application.

[0018] Figure 2 for Figure 1 Schematic diagram of the structure of the central adjustment unit;

[0019] Figure 3 for Figure 2 Enlarged structural diagram at point A;

[0020] The following are the labeling elements in the figure:

[0021] 1. Main board; 11. Base plate; 12. Adjustment unit; 121. Belt; 122. Drive wheel; 123. Motor; 2. Mounting mechanism; 21. Air pipe; 211. Connecting block; 22. Guide post; 23. Connecting pipe; 231. Inner platform; 24. Sleeve shaft; 241. Limiting platform; 25. Elastomer; 251. First spring; 252. Second spring; 26. Vacuum nozzle. Detailed Implementation

[0022] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0023] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0024] like Figures 1-2 As shown, this application provides an adaptive adjustment mechanism for the elastic pressure of the component mounting head in SMT surface mount technology (SMT) processing, including a main board 1 and a base plate 11 disposed at the bottom of the main board 1, and at least two sets of mounting mechanisms 2 are mounted on the base plate 11, and the mounting mechanisms 2 are arranged in an array along the base plate 11.

[0025] An adjustment unit 12 is provided on the side of the motherboard 1, and the position of the adjustment unit 12 corresponds to the position of the mounting mechanism 2. The adjustment unit 12 consists of two sets of transmission wheels 122 with bearings mounted on the side of the motherboard 1, and a belt 121 wrapped around the two sets of transmission wheels 122. A motor 123 is connected to the transmission wheel 122 at the top of the motherboard 1. The motor 123 is fixed to the back side of the motherboard 1. The motor 123 is adapted to drive the transmission wheel 122 at the top of the motherboard 1 to rotate and drive the belt 121 to drive. With the cooperation of the transmission wheel 122 at the bottom of the motherboard 1, the belt 121 moves continuously.

[0026] The mounting mechanism 2 includes an air tube 21 that slides through the base plate 11, and a connecting block 211 connected to a belt 121 is fixedly installed on the air tube 21. A guide post 22 is fixed on the base plate 11, and the guide post 22 passes through the connecting block 211, so that the connecting block 211 is suitable for sliding up and down along the guide post 22 to guide the movement of the air tube 21. When the height of the air tube 21 is adjusted, the motor 123 drives the transmission wheel 122 and drives the belt 121 to drive the connecting block 211 to move synchronously. The guide post 22 limits the movement of the connecting block 211, and the movement of the connecting block 211 drives the air tube 21 to move up and down.

[0027] Each mounting mechanism 2 is connected to an adjustment unit 12, which makes each mounting mechanism 2 suitable for independent driving under the action of the adjustment unit 12;

[0028] Combination Figure 3 As shown, a connecting pipe 23 is installed at the lower end of the base plate 11 of the air pipe 21, and a sleeve 24 is slidably connected at the bottom of the connecting pipe 23. A limiting platform 241 is provided on the inner side of the sleeve 24, and an inner platform 231 that cooperates with the limiting platform 241 is provided at the bottom of the connecting pipe 23. The position of the sleeve 24 is limited by the cooperation of the limiting platform 241 and the inner platform 231.

[0029] Furthermore, a vacuum nozzle 26 is connected to the bottom end of the sleeve shaft 24. The vacuum nozzle 26 is connected to the sleeve shaft 24, the connecting pipe 23, and the air pipe 21. An air pump (not shown in the figure) is connected to the top end of the air pipe 21, thereby driving the vacuum nozzle 26 to adsorb the component under the action of the air pump.

[0030] At the same time, an elastic body 25 is provided at the top of the sleeve shaft 24 and the bottom of the connecting tube 23. The elastic body 25 is an integral structure composed of a first spring 251 and a second spring 252. The elastic force of the first spring 251 is greater than that of the second spring 252, and the second spring 252 is located near the vacuum nozzle 26.

[0031] When mounting at different depths on the PCB board, the motor 123 first drives the transmission wheel 122 to rotate and drives the belt 121 to drive. With the cooperation of the connector 211, the mounting mechanism 2 moves towards the component. As the vacuum nozzle 26 approaches the component, the low-elasticity second spring 252 close to the nozzle is compressed first to provide a gentle buffer and avoid the high-elasticity direct impact that could cause the component to shift or break. Under the action of the air pump, the vacuum nozzle 26 picks up the component.

[0032] After the vacuum nozzle 26 is aligned with the PCB board mounting position, the adjustment unit 12 drives the vacuum nozzle 26 to move closer to the PCB board mounting position. At the same time, during the contact between the vacuum nozzle 26 and the PCB board, the component mounting stage is underway. Through the independent control of the adjustment unit 12, the micro-components adsorbed on the vacuum nozzle 26 are first mounted on the PCB board by the action of the second spring 252. After the micro-components are mounted, when a thick component that requires greater downward pressure is mounted, the high-elasticity first spring 251 starts to act to ensure that the thick component is compacted, thus achieving the purpose of adaptive adjustment of mounting pressure for components of different thicknesses.

[0033] In summary, by driving the transmission wheel 122 to rotate via the motor 123, and driving the belt 121 to move the air tube 21 up and down, the independent drive of each mounting mechanism 2 is achieved. At the same time, with the cooperation of the first spring 251 and the second spring 252 of the elastic body 25, the pressure is adaptively adjusted when mounting components of different thicknesses through a progressive pressure curve that is first soft and then hard.

[0034] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations are possible for those skilled in the art. Any improvements and modifications made within the spirit and principles of this application, without departing from its principles, should also be considered within the scope of protection of this application.

Claims

1. A self-adaptive elastic pressure adjustment mechanism for an SMT component placement head, characterized in that: The placement head includes: Mainboard (1), with a base plate (11) at the bottom; An adjustment unit (12) is installed on the main board (1). The adjustment unit (12) consists of two sets of transmission wheels (122) with bearings installed on the main board (1) and belts (121) set on the two sets of transmission wheels (122). A mounting mechanism (2) is mounted on the base plate (11), and the mounting mechanism (2) includes: An air tube (21) is slidably passed through the base plate (11), and a connecting block (211) connected to the belt (121) is fixed on the air tube (21); A connecting tube (23) is installed at the bottom of the air tube (21), and a sleeve shaft (24) is slidably connected to the bottom of the connecting tube (23). A vacuum nozzle (26) is connected to the sleeve shaft (24). An elastomer (25) is installed between the sleeve shaft (24) and the connecting pipe (23), and the elastomer (25) is composed of a first spring (251) and a second spring (252).

2. The SMT component placement head elastic pressure adaptive adjustment mechanism according to claim 1, characterized in that: The first spring (251) has a greater elastic force than the second spring (252), and the second spring (252) is located near the vacuum nozzle (26).

3. The SMT component placement head elastic pressure adaptive adjustment mechanism according to claim 2, characterized in that: A limiting platform (241) is provided on the inner side of the sleeve shaft (24), and an inner platform (231) that cooperates with the limiting platform (241) is provided at the bottom of the connecting pipe (23).

4. The SMT component placement head elastic pressure adaptive adjustment mechanism according to claim 3, characterized in that: An air pump is connected to the top of the air pipe (21).

5. The SMT component placement head elastic pressure adaptive adjustment mechanism according to claim 4, characterized in that: A guide post (22) is fixed on the base plate (11), the guide post (22) passes through the connecting block (211), and the connecting block (211) is adapted to slide up and down along the guide post (22).

6. The SMT component placement head elastic pressure adaptive adjustment mechanism according to claim 5, characterized in that: The drive wheel (122) at the top of the main board (1) is connected to a motor (123).

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