Low-power-consumption multicolor LED with moisture-proof structure and photoelectric mechanical keyboard

Abstract

The utility model discloses a low-power-consumption multicolor LED with a moisture-proof structure and a photoelectric mechanical keyboard, and relates to the technical field of LEDs. The four bonding pads are arranged in the bracket; the light-emitting wafer is arranged on the bonding pad; the low-power-consumption IC chip is arranged on the bonding pad; the four pins are all arranged on the side face of the support, and the four pins are connected with the four bonding pads in a one-to-one correspondence mode; the four pins are subjected to stretching treatment and are far away from the support, the pins are stretched, contact is carried out through the area where the pins are pulled out, water vapor is restrained from entering the lamp bead from the pins, the inner space of the bowl cup is reduced, and entering of the water vapor can also be reduced (after the inner space of the bowl cup is reduced, the volume of residual air is reduced, and the service life of the lamp bead is prolonged. Water vapor usually enters the interior through material permeation or tiny gaps, and a smaller space means less air amount, so that the potential capacity of water vapor diffusion is reduced.

Description

Technical Field

[0001] This utility model relates to the technical field of LEDs, and more specifically, to a moisture-proof low-power iridescent LED and an optomechanical keyboard. Background Technology

[0002] Traditional LED chips lack stretched leads, resulting in insufficient moisture penetration paths. Under humid-thermal coupling, water molecules, due to the difference in thermal expansion coefficients between the metal leads and the encapsulating epoxy resin, form capillary channels along the lead surface and penetrate the chip. When the relative humidity exceeds 60% RH, the infiltrated moisture condenses on the surface of the LED chip, causing electrochemical corrosion at the quantum well interface. This results in a luminous flux attenuation of over 30% within 500 hours and induces a 5-8nm wavelength shift in the RGB colors, causing color mixing distortion.

[0003] To address the aforementioned issues, we provide a moisture-proof, low-power RGB LED and optomechanical keyboard. Utility Model Content

[0004] To address the problems mentioned in the background art, this utility model provides a low-power RGB LED and optomechanical keyboard with a moisture-proof structure. By stretching the pins and making contact with the area pulled out by the pins, the space inside the bracket (cup) can be reduced, inhibiting moisture from entering the LED from the pins. The reduced space inside the cup can also reduce the entry of moisture.

[0005] The moisture-proof, low-power, RGB LED provided by this utility model adopts the following technical solution:

[0006] A moisture-proof, low-power, multi-colored LED includes a bracket; four pads, all disposed within the bracket; a light-emitting chip disposed on the pads; a low-power IC chip disposed on the pads; four pins, all disposed on the side of the bracket, and each of the four pins is connected to one of the four pads; all four pins are stretched and are located away from the bracket.

[0007] By adopting the above technical solution, the pins are stretched to suppress moisture from entering the lamp bead from the pins. The reduced internal space of the cup can also reduce the entry of moisture (after the internal space of the cup is reduced, the residual air volume is reduced. Moisture usually enters the interior through material penetration or tiny gaps, and a smaller space means less air volume, thereby reducing the potential capacity for moisture diffusion). Furthermore, by using a low-power IC chip, the temperature of the lamp bead can be reduced during long-term use or in high-brightness mode, avoiding light decay and shortened lifespan due to overheating.

[0008] Preferably, the light-emitting wafer is connected to the low-power IC chip via conductive leads.

[0009] Preferably, the pins include VDD pin, DIN pin, DOUT pin, and GND pin.

[0010] Preferably, the light-emitting wafer includes an R wafer, a G wafer, and a B wafer.

[0011] Preferably, the static operating current of the low-power IC chip is <1μA.

[0012] Preferably, the low-power IC chip is of model SN6800 to SN6808.

[0013] An optomechanical keyboard, wherein the key LEDs of the optomechanical keyboard adopt a low-power RGB LED with a moisture-proof structure as described above.

[0014] In summary, this utility model has the following beneficial technical effects:

[0015] 1. By stretching the pins, the contact area created by the stretched area of ​​the pins is used to suppress moisture from entering the LED chip. The reduced internal space of the cup also reduces the amount of moisture entering (after the internal space of the cup is reduced, the volume of residual air is reduced. Moisture usually enters the interior through material penetration or tiny gaps, and a smaller space means less air, thereby reducing the potential capacity for moisture diffusion).

[0016] 2. Using low-power IC chips can reduce the temperature of the LED beads during long-term use or in high-brightness mode, avoiding light decay and shortened lifespan due to overheating.

[0017] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a low-power iridescent LED with a moisture-proof structure according to an embodiment of this utility model;

[0019] Figure 2 This is a side view structural schematic diagram of a moisture-proof structure for a low-power iridescent LED according to an embodiment of this utility model;

[0020] Figure 3 This is a circuit diagram of a low-power iridescent LED with a moisture-proof structure according to an embodiment of this utility model;

[0021] Figure 4 This is a schematic diagram of the bent structure of the iridescent LED beads in this embodiment of the present invention;

[0022] Figure 5 This is a schematic diagram of the bent side of the iridescent LED beads in an embodiment of this utility model.

[0023] Explanation of reference numerals in the attached diagram: 1. Bracket; 2. Pad; 3. Light-emitting chip; 4. Low-power IC chip; 5. Pin; 500. VDD pin; 501. DIN pin; 502. DOUT pin; 503. GND pin. Detailed Implementation

[0024] The following is in conjunction with the appendix Figures 1 to 5 The present invention will be described in further detail below.

[0025] It should be noted that the accompanying drawings are schematic and not to scale. For clarity and convenience, the relative dimensions and proportions of the parts shown are exaggerated or reduced in size; all dimensions are merely illustrative and not limiting. Furthermore, the same reference numerals are used for the same structures, elements, or fittings appearing in more than two drawings to indicate similar features.

[0026] This utility model discloses a low-power iridescent LED with a moisture-proof structure. (Refer to...) Figures 1 to 5 A moisture-proof, low-power iridescent LED includes a bracket 1, four pads 2, a light-emitting chip 3, a low-power IC chip 4, and four pins 5. The four pads 2 are all disposed inside the bracket 1. The light-emitting chip 3 is disposed on the pads 2. The low-power IC chip 4 is disposed on the pads 2. The four pins 5 are all disposed on the side of the bracket 1, and the four pins 5 are connected to the four pads 2 in a one-to-one correspondence. The four pins 5 are all stretched and are all away from the bracket 1.

[0027] Specifically, by stretching pin 5, the area pulled out by pin 5 makes contact, thereby reducing the space inside the bracket 1 (cup), inhibiting moisture from entering the lamp bead from pin 5. The reduced space inside the cup also reduces the entry of moisture (after the space inside the cup is reduced, the volume of residual air is reduced, and moisture usually enters the interior through material penetration or tiny gaps, while a smaller space means less air, thereby reducing the potential capacity for moisture diffusion). Furthermore, by using a low-power IC chip 4, the temperature of the lamp bead can be reduced during long-term use or in high-brightness mode, avoiding light decay and shortened lifespan due to overheating.

[0028] Furthermore, the extension of pin 5 lengthens the path for moisture to penetrate along the metal surface of the pin (similar to the "maze effect"), while the reduction of the bowl space blocks the diffusion of moisture from the internal structure. The combination of the two forms a double guarantee of physical moisture protection.

[0029] like Figure 1As shown, specifically, the light-emitting chip 3 and the low-power IC chip 4 are connected by conductive leads.

[0030] Specifically, pin 5 includes VDD pin 500 (chip power supply, function is power supply), DIN pin 501 (data input, function is display data input), DOUT pin 502 (data output, function is display data cascade output) and GND pin 503 (ground, function is ground).

[0031] Specifically, the light-emitting chip 3 includes an R chip, a G chip, and a B chip.

[0032] Specifically, the quiescent operating current of the low-power IC chip 4 is <1μA.

[0033] Specifically, the low-power IC chip 4 has models ranging from SN6800 to SN6808.

[0034] The LED beads of this application are applied to mechanical keyboards to provide backlighting and decoration, so that the characters and symbols on the keyboard can be clearly seen in low-light environments. The control chip can control the combination of different colored LED beads and different lighting sequences to achieve a variety of cool lighting effects.

[0035] like Figure 4 and Figure 5 As shown, this is a pin 5-bend arrangement.

[0036] An opto-mechanical keyboard, wherein the key LEDs of the opto-mechanical keyboard adopt a low-power RGB LED with a moisture-proof structure as described above.

[0037] All standard parts used in this utility model can be purchased from the market. Irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. In addition, the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.

[0038] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. "A plurality of" means two or more, unless otherwise explicitly specified.

[0039] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0040] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0041] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0042] The accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other.

[0043] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A low-power, multi-colored LED with a moisture-proof structure, characterized in that, include: Frame (1); Four pads (2) are all set inside the bracket (1); A light-emitting chip (3) is disposed on a pad (2); A low-power IC chip (4) is mounted on a pad (2); Four pins (5) are all located on the side of the bracket (1), and the four pins (5) are connected to the four pads (2) one by one. All four pins (5) are stretched and are all located away from the support (1).

2. The low-power RGB LED with a moisture-proof structure according to claim 1, characterized in that: The light-emitting chip (3) is connected to the low-power IC chip (4) via conductive leads.

3. The low-power RGB LED with a moisture-proof structure according to claim 1, characterized in that: The pin (5) includes the VDD pin (500), the DIN pin (501), the DOUT pin (502), and the GND pin (503).

4. A low-power RGB LED with a moisture-proof structure according to claim 1, characterized in that: The light-emitting chip (3) includes an R chip, a G chip, and a B chip.

5. A low-power RGB LED with a moisture-proof structure according to claim 1, characterized in that: The static operating current of the low-power IC chip (4) is <1μA.

6. A low-power RGB LED with a moisture-proof structure according to claim 5, characterized in that: The low-power IC chip (4) is model number SN6800~SN6808.

7. A photoelectric mechanical keyboard, characterized in that: The key LEDs of the optomechanical keyboard adopt a low-power RGB LED with a moisture-proof structure as described in any one of claims 1-6.

Images