Wafer ejection structure

Abstract

The utility model relates to the field of wafer processing, in particular to a wafer ejection structure, and adopts the technical scheme that the wafer ejection structure comprises a mounting seat, a driving part arranged on the mounting seat, a moving seat arranged on the driving part, a tensioning device arranged on the moving seat and an ejection device, the tensioning device is used for tensioning a blue film, and the ejection device is used for ejecting the blue film. And the ejection device is used for ejecting the wafer on the blue film and comprises a pushing assembly arranged on the moving seat, a pushing rod arranged at the driving end of the pushing assembly and an ejector pin arranged at the end, away from the driving assembly, of the pushing rod. The method has the advantages that the tension degree of the blue film is improved, and the wafer on the blue film is convenient to take.

Description

Technical Field

[0001] This application relates to the field of wafer fabrication, and more particularly to a wafer ejection structure. Background Technology

[0002] During the wafer dicing process, to prevent the wafer from breaking or scattering during dicing, it is attached to a blue film before the dicing operation. For easy handling, the blue film is usually attached to a steel ring. Once dicing is complete, the suction nozzle picks up the wafer and removes it from the blue film.

[0003] Because the wafer is attached to the blue film, the existing nozzle pulls the blue film back when it picks up the wafer, causing the blue film to deform. This results in the nozzle picking up a specific wafer and causing surrounding wafers to shift in position or become loosely attached. Utility Model Content

[0004] To facilitate the removal of wafers from the blue film, this application provides a wafer ejection structure.

[0005] This application provides a wafer ejection structure, which adopts the following technical solution:

[0006] A wafer ejection structure includes a mounting base, a driving component disposed on the mounting base, a movable base disposed on the driving component, a tensioning device disposed on the movable base, and an ejection device. The tensioning device is used to tension a blue film, and the ejection device is used to eject the wafer from the blue film. The ejection device includes a pushing component disposed on the movable base, a pushing rod disposed at the driving end of the pushing component, and a ejector pin disposed at the end of the pushing rod away from the pushing component.

[0007] By adopting the above technical solution, the mounting base is used to install the driving component, the driving component is used to drive the moving base to move along the length direction of the mounting base, the moving base is used to install the tensioning device and the ejection device, the tensioning device is used to tension the blue film, the ejection device is used to eject the wafer on the blue film, the pushing component is used to drive the pushing rod to move along the length direction of the pushing rod, the movement of the pushing rod drives the ejector pin to move, the ejector pin is used to contact the wafer on the blue film, and to eject the adsorbed wafer, thereby facilitating the pick-up of the wafer on the blue film by the suction nozzle and other structures. At the same time, the ejector pin can target the ejected wafer, reducing its impact on the surrounding wafers.

[0008] Preferably, the movable seat is provided with a positioning sleeve that is fitted onto the push rod.

[0009] By adopting the above technical solution, the positioning sleeve improves the stability of the push rod movement.

[0010] Preferably, the end of the positioning sleeve away from the pushing component is provided with a guide sleeve fitted onto the end of the pushing rod, and the end of the pushing rod away from the pushing component is provided with a pushing block for pushing the ejector pin to move. The guide sleeve has a moving groove for the pushing block to move along the length direction of the pushing rod.

[0011] By adopting the above technical solution, the guide sleeve further improves the stability of the push rod movement, the push block is used to drive the ejector pin to move, and the moving groove improves the stability of the push block movement.

[0012] Preferably, the guide sleeve has several through holes at the end away from the pushing component for the ejector pin to pass through, and the end of the ejector pin facing the pushing block is connected to the pushing block.

[0013] By adopting the above technical solution, a through hole is used for the ejector pin to pass through, thereby improving the stability of the ejector pin movement.

[0014] Preferably, the pushing assembly includes a motor mounted on a movable base and an eccentric wheel mounted at the output end of the motor, with the end of the pushing rod facing the eccentric wheel contacting the side wall of the eccentric wheel.

[0015] By adopting the above technical solution, the motor drives the eccentric wheel to rotate, and the rotation of the eccentric wheel drives the push rod to move linearly.

[0016] Preferably, the tensioning device includes a hot air blower mounted on a movable seat and a positioning seat mounted on the movable seat for positioning the blowing end of the hot air blower.

[0017] By adopting the above technical solution, the positioning seat is used to position the hot air blower, thereby improving the stability of the hot air blower on the moving seat. The hot air blower blows hot air toward the blue film, and the hot air drives the blue film to be tensioned, thereby improving the stability of the blue film when picking up materials.

[0018] In summary, this application uses an ejector device to eject the wafer to be picked up, a suction nozzle to pick up the wafer, and a tensioning device to tension the blue film, thereby improving the stability of the wafer on the blue film and reducing the impact on surrounding wafers during wafer handling. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of a wafer ejection structure according to this application;

[0020] Figure 2 This is a cross-sectional view of a wafer ejection structure according to this application.

[0021] Explanation of reference numerals in the attached drawings: 1. Mounting base; 2. Driving component; 3. Moving base; 4. Tensioning device; 41. Hot air blower; 42. Positioning base; 5. Ejection device; 51. Pushing assembly; 511. Motor; 512. Eccentric wheel; 52. Push rod; 53. Ejector pin; 6. Positioning sleeve; 7. Guide sleeve; 8. Push block; 9. Moving groove; 10. Through hole. Detailed Implementation

[0022] The following is in conjunction with the appendix Figures 1-2 The present invention will be further described below. The following embodiments are only used to more clearly illustrate the technical solution of this application, and should not be used to limit the protection scope of the present invention.

[0023] In the description of this application, it should be noted that the orientations or positional relationships indicated by terms such as "center", "up", "down", "left", "right", "vertical", "horizontal", "inner", and "outer" are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0024] This application discloses a wafer ejection structure. (Refer to...) Figure 1 and Figure 2 The system includes a mounting base 1, a drive unit 2 mounted on the mounting base 1, a movable base 3 mounted on the drive unit 2, a tensioning device 4 mounted on the movable base 3, and an ejection device 5. In this embodiment, the drive unit 2 is a linear motor 511, which drives the movable base 3 to reciprocate along the length of the mounting base 1. The movable base 3 is used to mount the tensioning device 4 and the ejection device 5. The tensioning device 4 tensions the blue film, and the ejection device 5 ejects the wafer from the blue film. In specific implementations, the drive unit 2 can be a cylinder, a motor 511, a lead screw, or other linear drive structures. In this embodiment, one set of linear motors 511 is provided. In specific implementations, two, three, or more sets of linear motors 511 can be provided according to the wafer handling requirements. Two sets of linear motors 511 can drive the mounting base 1 to move along the length and height of the mounting base 1, and three sets of linear motors 511 can move along the length, width, and height of the mounting base 1, facilitating the adjustment of the positions of the ejection device 5 and the tensioning device 4 according to the wafer position.

[0025] Reference Figure 1 and Figure 2The tensioning device 4 includes a positioning seat 42 fixedly mounted on the movable seat 3 and a hot air blower 41 mounted on the positioning seat 42. The blowing end of the hot air blower 41 is set towards the blue film and is used to blow hot air towards the blue film, thereby tensioning the blue film. When the blue film is tensioned, the nozzle picks up the wafer, the deformation of the blue film is reduced, and the impact on the surrounding wafers when the nozzle picks up the material is reduced.

[0026] Reference Figure 1 and Figure 2 The ejection device 5 includes a push assembly 51 mounted on a movable base 3, a push rod 52 mounted on the drive end of the push assembly 51, and an ejector pin 53 mounted on the end of the push rod 52 away from the push assembly 51. The push assembly 51 is used to drive the push rod 52 to move toward the wafer. The push assembly 51 includes a motor 511 fixedly mounted on the movable base 3 and an eccentric wheel 512 fixedly mounted on the output end of the motor 511. The end of the push rod 52 near the eccentric wheel 512 contacts the side wall of the eccentric wheel 512. When the motor 511 drives the eccentric wheel 512 to rotate, the rotation of the eccentric wheel 512 drives the push rod 52 to move horizontally, thereby driving the ejector pin 53 at the other end of the push rod 52 to contact and eject the wafer on the blue film.

[0027] Reference Figure 1 and Figure 2 To improve the stability of the movement of the push rod 52 and the ejector pin 53, a positioning sleeve 6 is fixedly installed on the moving base 3 and fitted onto the push rod 52. Both ends of the positioning sleeve 6 are open, allowing the push rod 52 to pass through the positioning sleeve 6. The positioning sleeve 6 determines the movement path of the push rod 52, thereby improving the stability of the push rod 52's movement. A guide sleeve 7 is fixedly installed on the end of the positioning sleeve 6 away from the push assembly 51, fitted onto the end of the push rod 52. The open end of the guide sleeve 7 is connected to the end of the positioning sleeve 6, and the other end of the guide sleeve 7 is sealed. To facilitate the removal of the ejector pin 53, several through holes 10 are formed on the sealed end of the guide sleeve 7 facing the wafer side. The ejector pin 53 moves out from the through holes 10, improving the stability of the ejector pin 53 on the push rod 52. To further improve the connection stability between the push rod 52 and the ejector pin 53, a push block 8 is fixedly installed between the push rod 52 and the ejector pin 53. A moving groove 9 is formed inside the guide sleeve 7, and the push block 8 is located in the moving groove 9, improving the stability of the push block 8's movement. This application uses the driving component 2 to move the ejector pin 53 closer to or away from the wafer. In the specific implementation process, a spring can also be installed in the positioning sleeve 6. The spring is sleeved on the push rod 52. One end of the spring is connected to the positioning sleeve 6, and the other end of the spring is connected to the push rod 52, so that the push rod 52 can be reset.

[0028] The implementation principle of the wafer ejection structure in this application embodiment is as follows: The wafer ejection structure of this application embodiment is installed on the side of the blue film where the wafer is not attached. When the nozzle needs to pick up material, the driving component 2 is activated to move the hot air blower 41 toward the blue film, and then the hot air blower 41 toward the blue film to tension the blue film. The movement of the driving component 2 causes the end face of the guide sleeve 7 with the through hole 10 to contact the blue film. At this time, the motor 511 is activated to drive the eccentric wheel 512 to rotate. The rotation of the eccentric wheel 512 causes the push rod 52 to move toward the wafer, thereby causing the ejector pin 53 to move out of the through hole 10 and eject the wafer on the blue film. The nozzle then picks up the wafer. In this application embodiment, the ejector pin 53 performs the ejection operation on the material picked up by the nozzle, effectively reducing the impact of wafer picking on surrounding wafers, improving the stability of the wafer on the blue film, and improving the suction stability and suction efficiency of the nozzle.

[0029] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A wafer ejection structure, characterized in that: The device includes a mounting base (1), a drive unit (2) mounted on the mounting base (1), a movable base (3) mounted on the drive unit (2), a tensioning device (4) mounted on the movable base (3), and an ejection device (5). The tensioning device (4) is used to tension the blue film, and the ejection device (5) is used to eject the wafer on the blue film. The ejection device (5) includes a push assembly (51) mounted on the movable base (3), a push rod (52) mounted on the drive end of the push assembly (51), and a ejector pin (53) mounted on the end of the push rod (52) away from the push assembly (51).

2. The wafer ejection structure according to claim 1, characterized in that: The movable seat (3) is provided with a positioning sleeve (6) that is sleeved on the push rod (52).

3. The wafer ejection structure according to claim 2, characterized in that: The positioning sleeve (6) has a guide sleeve (7) at the end away from the push assembly (51) and is sleeved on the end of the push rod (52). The push rod (52) has a push block (8) at the end away from the push assembly (51) for pushing the ejector pin (53) to move. The guide sleeve (7) has a moving groove (9) for the push block (8) to move along the length direction of the push rod (52).

4. The wafer ejection structure according to claim 3, characterized in that: The guide sleeve (7) has several through holes (10) at the end away from the push assembly (51) for the ejector pin (53) to pass through. The end of the ejector pin (53) facing the push block (8) is connected to the push block (8).

5. The wafer ejection structure according to claim 1, characterized in that: The pushing assembly (51) includes a motor (511) mounted on the movable seat (3) and an eccentric wheel (512) mounted at the output end of the motor (511). The end of the pushing rod (52) facing the eccentric wheel (512) contacts the side wall of the eccentric wheel (512).

6. The wafer ejection structure according to claim 1, characterized in that: The tensioning device (4) includes a hot air blower (41) mounted on a movable seat (3) and a positioning seat (42) mounted on the movable seat (3) for positioning the blowing end of the hot air blower (41).

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