Novel four-step top structure

Abstract

The utility model relates to the technical field of chip packaging, and discloses a novel four-step jacking structure which comprises a base, a jacking mechanism is arranged at the upper end of the base and comprises auxiliary ejector pins, a main ejector pin is arranged in the middle of the upper end face of the base, and a plurality of auxiliary ejector pins are arranged on the upper end face of the base and located on the periphery of the main ejector pin. Springs are arranged at the upper ends of the auxiliary ejector pins, fixing blocks are connected to the upper ends of the springs, and gaskets are arranged at the upper ends of the fixing blocks. According to the utility model, through the arrangement of the spring piezoelectric composite drive, the edge pressure can be gradually released in the jacking process of the chip, cracking is prevented, and meanwhile, the flatness of the chip can be ensured and the warping amount can be reduced through the piezoelectric plate.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and in particular to a novel four-step top structure. Background Technology

[0002] In semiconductor chip packaging, traditional chip fixtures typically employ single-point lifting or synchronous multi-pin structures, but these still present numerous problems. Large chips are prone to warping or cracking due to uneven local stress during the lifting process. Furthermore, the original bottom lifting mechanism design involves a single-piece machining process, which is difficult to manufacture and inconvenient for assembly.

[0003] Therefore, those skilled in the art have provided a novel four-step top structure to solve the problems mentioned in the background art. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a novel four-step top structure. By setting a spring-piezoelectric composite drive, the edge pressure of the chip can be gradually released during the lifting process to prevent cracking. At the same time, the piezoelectric sheet can ensure the flatness of the chip and reduce warpage.

[0005] To achieve the above objectives, the present invention provides the following technical solution:

[0006] A novel four-step top structure includes a base, and a lifting mechanism is provided at the upper end of the base;

[0007] The lifting mechanism includes auxiliary ejector pins, a main ejector pin is provided at the middle of the upper end face of the base, and multiple auxiliary ejector pins are provided on the upper end face of the base and around the main ejector pin. Each of the multiple auxiliary ejector pins is provided with a spring at its upper end, and a fixing block is connected to the upper end of the spring. A washer is provided at the upper end of the fixing block.

[0008] By using the above technical solution and setting a spring-piezoelectric composite drive, the edge pressure can be gradually released during the chip lifting process to prevent cracking. At the same time, the piezoelectric sheet can ensure the flatness of the chip and reduce the amount of warpage.

[0009] Furthermore, an outer cylinder is provided at the upper end of the base;

[0010] The chip is protected using the above technical solutions.

[0011] Furthermore, piezoelectric elements are provided at the upper ends of the plurality of the gaskets;

[0012] The height of the auxiliary ejector pin can be controlled through the above technical solution.

[0013] Furthermore, the gasket material is configured as flexible conductive silicone;

[0014] The above technical solution avoids scratching the chip surface, and the conductivity can prevent electrostatic damage.

[0015] Furthermore, the piezoelectric material is configured as piezoelectric ceramic;

[0016] The height of the auxiliary ejector pin can be finely adjusted using the above technical solution via a ceramic piezoelectric sheet.

[0017] Furthermore, a chip is disposed on the upper end of the piezoelectric sheet;

[0018] The chip is placed using the above technical solution.

[0019] Furthermore, a damper is connected between the fixing block, the auxiliary ejector pin, and the main ejector pin, and the spring is sleeved on the outer wall of the damper;

[0020] The above technical solution prevents vibration during the upward lifting process.

[0021] Furthermore, the base and the outer cylinder are connected by welding;

[0022] The above technical solutions can reduce production difficulty and processing costs.

[0023] This utility model has the following beneficial effects:

[0024] 1. This utility model proposes a novel four-step lifting structure. During the four-step lifting process, the main ejector pin first contacts the center of the chip, and the auxiliary ejector pins follow step by step, thereby gradually releasing edge stress. At the same time, the piezoelectric ceramic provides real-time feedback on the lifting pressure data and dynamically adjusts the height of each ejector pin to ensure the flatness of the chip and reduce its warpage. By setting a spring-piezoelectric composite drive, the edge pressure of the chip can be gradually released during the lifting process to prevent cracking. At the same time, the piezoelectric sheet can ensure the flatness of the chip and reduce warpage. In addition, the flexible conductive silicone on the ejector pin head can avoid scratching the chip and prevent damage from static electricity.

[0025] 2. The novel four-step top structure proposed in this utility model separates and processes the outer cylinder and the base into shape, and then connects them together by welding. By processing them separately, the complexity of integrated processing is reduced, the processing difficulty is reduced, and the processing cost is also reduced. Attached Figure Description

[0026] Figure 1 This is an axonometric drawing of a novel four-step top structure proposed in this utility model;

[0027] Figure 2 This is an internal axonometric view of a novel four-step top structure proposed in this utility model;

[0028] Figure 3 This is a cross-sectional view of a novel four-step top structure proposed in this utility model;

[0029] Figure 4 This is a schematic diagram of the lifting mechanism of a novel four-step lifting structure proposed in this utility model;

[0030] Figure 5 for Figure 3 Enlarged view of point A in the middle.

[0031] Legend:

[0032] 1. Lifting mechanism; 101. Auxiliary ejector pin; 102. Main ejector pin; 103. Gasket; 104. Fixing block; 105. Piezoelectric element; 106. Damper; 107. Spring; 2. Base; 3. Outer cylinder; 4. Chip. Detailed Implementation

[0033] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of specific embodiments. Obviously, the described specific embodiments are only a part of the specific embodiments of the present invention, and not all of them. Based on the specific embodiments of the present invention, all other specific embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Reference Figures 1-5 The present invention provides a specific embodiment: a novel four-step top structure, including a base 2, and a lifting mechanism 1 is provided on the upper end of the base 2;

[0035] The lifting mechanism 1 includes auxiliary ejector pins 101. A main ejector pin 102 is located at the center of the upper surface of the base 2. Multiple auxiliary ejector pins 101 are arranged around the main ejector pin 102 on the upper surface of the base 2. Each of the auxiliary ejector pins 101 has a spring 107 at its upper end. A fixing block 104 is connected to the upper end of the spring 107. A gasket 103 is provided on the upper end of the fixing block 104. By setting a spring-piezoelectric composite drive, the edge pressure of the chip 4 can be gradually released during the lifting process to prevent cracking. At the same time, the piezoelectric sheet 105 can ensure the flatness of the chip 4 and reduce the amount of warping. An outer cylinder 3 is provided on the upper end of the base 2 to protect the chip 4. The upper ends of the multiple gaskets 103 are provided with... The piezoelectric sheet 105 controls the height of the auxiliary ejector pin 101. The pad 103 is made of flexible conductive silicone to avoid scratching the surface of the chip 4, and its conductive properties can prevent electrostatic damage. The piezoelectric sheet 105 is made of piezoelectric ceramic, and the height of the auxiliary ejector pin 101 can be finely adjusted by the ceramic piezoelectric sheet. The chip 4 is set on the upper end of the piezoelectric sheet 105. The chip 4 is placed on the fixing block 104, the auxiliary ejector pin 101 and the main ejector pin 102 are all connected to the damper 106. The spring 107 is sleeved on the outer wall of the damper 106 to prevent vibration during the upward lifting process. The base 2 and the outer cylinder 3 are connected by welding, which can reduce the production difficulty and processing cost.

[0036] Working principle: When the chip 4 is lifted upwards in four steps, the main ejector pin 102 first contacts the bottom of the chip 4 and provides rigid support for the chip 4. Then, the auxiliary ejector pin 101 lifts the chip upwards. Since the bottom of the chip 4 is equipped with piezoelectric ceramic, the pressure data during lifting can be fed back in real time, thereby dynamically adjusting the height of each ejector pin to ensure the flatness of the chip 4. When processing the device, the base 2 and the outer cylinder 3 are processed separately and then fixed together by welding, which reduces the processing difficulty and also reduces the processing cost.

[0037] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing specific embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A novel four-step top structure, comprising a base (2), characterized in that: The upper end of the base (2) is provided with a lifting mechanism (1); The lifting mechanism (1) includes auxiliary ejector pins (101), a main ejector pin (102) is provided at the middle of the upper surface of the base (2), and a plurality of auxiliary ejector pins (101) are provided on the upper surface of the base (2) and around the main ejector pin (102). A spring (107) is provided at the upper end of each of the plurality of auxiliary ejector pins (101), and a fixing block (104) is connected to the upper end of the spring (107). A washer (103) is provided at the upper end of the fixing block (104).

2. The novel four-step top structure according to claim 1, characterized in that: The base (2) is provided with an outer cylinder (3) at its upper end.

3. The novel four-step top structure according to claim 1, characterized in that: A piezoelectric sheet (105) is provided on the upper end of each of the gaskets (103).

4. The novel four-step top structure according to claim 1, characterized in that: The gasket (103) is made of flexible conductive silicone.

5. A novel four-step top structure according to claim 3, characterized in that: The piezoelectric sheet (105) is made of piezoelectric ceramic.

6. A novel four-step top structure according to claim 3, characterized in that: A chip (4) is provided on the upper end of the piezoelectric sheet (105).

7. A novel four-step top structure according to claim 1, characterized in that: A damper (106) is connected between the fixed block (104), the auxiliary ejector pin (101), and the main ejector pin (102), and the spring (107) is sleeved on the outer wall of the damper (106).

8. A novel four-step top structure according to claim 1, characterized in that: The base (2) and the outer cylinder (3) are connected by welding.

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