Chip packaging structure convenient for pin welding

Abstract

The utility model discloses a chip packaging structure convenient for pin welding. The chip packaging structure comprises a packaging substrate, a clamping piece and a chip, the packaging substrate is provided with a plurality of bonding pad grooves, and the packaging substrate is also provided with positioning through holes which are through up and down; the clamping piece comprises a base and two clamping strips integrally arranged on the base, the base is located at the bottom of the packaging substrate, and the two clamping strips are arranged in the positioning through holes in a penetrating mode from bottom to top and extend to the upper portion of the packaging substrate; the two sides of the chip are provided with a plurality of pins, the chip is further provided with a limiting groove, the chip is clamped between the two clamping strips from top to bottom, the pins correspondingly extend into the bonding pad grooves, and the upper ends of the clamping strips and the limiting groove are mutually limited. According to the utility model, the clamping piece is designed to be matched with the unique packaging substrate and the chip, so that the chip and the packaging substrate can be accurately and reliably clamped and aligned in the welding and assembling process, and the operation difficulty of pin welding is greatly reduced; the utility model has the advantages of strong practicability and strong popularization significance.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and in particular to a chip packaging structure that facilitates pin soldering. Background Technology

[0002] In the manufacturing process of integrated circuits, chips are typically bonded and packaged onto a substrate using soldering to form integrated circuit boards with complex and diverse functions. However, due to the continuous development of chip technology, chips are becoming increasingly smaller. When soldering and packaging chips onto the substrate, tools such as tweezers are often needed to hold and fix the chips. This clamping operation heavily tests the stability of the soldering operator's hands, and is prone to instability, causing misalignment between the pins and the pads, leading to poor chip soldering and packaging. Utility Model Content

[0003] Therefore, it is necessary to provide a chip packaging structure that facilitates pin soldering to address the shortcomings of existing technologies.

[0004] A chip packaging structure facilitating lead soldering includes a packaging substrate, a clamping member, and a chip. The packaging substrate has several pad grooves and a through-hole extending vertically. The clamping member includes a base and two clamping strips integrally formed on the base. The base is located at the bottom of the packaging substrate, and the two clamping strips extend upwards through the through-hole and above the packaging substrate. The chip has several leads on both sides and a limiting groove. The chip is engaged between the two clamping strips from top to bottom, with the leads correspondingly extending into the pad grooves. The upper ends of the clamping strips and the limiting grooves mutually limit each other.

[0005] Furthermore, the packaging substrate is also provided with a plurality of auxiliary positioning blocks, which respectively limit the positions of the four corners of the chip.

[0006] Furthermore, the outer end of the pin is provided with a through-hole for welding, and the bottom of the solder pad groove is provided with a corresponding welding bump, which is inserted into the through-hole from bottom to top.

[0007] Furthermore, each pin has two sets of welding through holes, and each pad groove has two sets of welding bumps. A connecting groove is provided between the two sets of welding through holes, and the connecting groove is connected to the welding through holes at both ends.

[0008] Furthermore, the side cross-section of the welding bump is designed in a "T" shape, and the length and width dimensions of the welding bump are smaller than the length and width dimensions of the welding through hole.

[0009] Furthermore, the width of the outer end of the pin is greater than the width of the inner end, and the width of the outer end of the pin is less than the width of the pad groove.

[0010] Furthermore, the chip packaging structure that facilitates pin soldering also includes a positioning plate located below the packaging substrate, and the base of the clamping member can be snapped onto the positioning plate.

[0011] In summary, the beneficial effects of this utility model's chip packaging structure for easy pin soldering are as follows: by designing clamping components in conjunction with a unique packaging substrate and chip, the chip and packaging substrate can be accurately and reliably clamped and aligned during the soldering assembly process, greatly reducing the operational difficulty of pin soldering; moreover, the chip pins and solder pad grooves are also additionally designed with reinforcing structures, which can effectively improve the firmness of pin soldering; this utility model is highly practical and has strong promotional significance. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of a chip packaging structure that facilitates pin soldering according to the present invention;

[0013] Figure 2 for Figure 1 A schematic diagram of the decomposed structure;

[0014] Figure 3 for Figure 2 Schematic diagram of the structure of the intermediate packaging substrate;

[0015] Figure 4 for Figure 3 A magnified structural diagram of part A in the middle;

[0016] Figure 5 for Figure 2 Schematic diagram of the middle clamping component;

[0017] Figure 6 for Figure 2 A schematic diagram of the structure of the chip;

[0018] Figure 7 for Figure 6 A magnified structural diagram of part B. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of the utility model.

[0020] like Figures 1 to 7As shown, this utility model provides a chip packaging structure 100 that facilitates pin soldering, which includes a packaging substrate 10, a clamping member 20, and a chip 30.

[0021] The packaging substrate 10 has a plurality of pad grooves 11 and a vertically penetrating positioning through hole 12. The clamping member 20 includes a base 21 and two clamping strips 22 integrally formed on the base 21. The base 21 is located at the bottom of the packaging substrate 10, and the two clamping strips 22 are respectively inserted into the positioning through hole 12 from bottom to top and extend above the packaging substrate 10. The chip 30 has a plurality of pins 31 on both sides and a limiting groove 32. The chip 30 is engaged between the two clamping strips 22 from top to bottom, and the pins 31 extend into the pad grooves 11 respectively. The upper end of the clamping strip 22 and the limiting groove 32 mutually limit each other.

[0022] When it is necessary to solder the chip 30 onto the packaging substrate 10, firstly, the clamping member 20, corresponding to the length of the chip 30, is fastened onto the packaging substrate 10 from bottom to top, ensuring that the two elastically deformable clamping strips 22 extend to the upper side of the packaging substrate 10. Next, the chip 30 is fastened between the two clamping strips 22 from top to bottom, fixing it firmly to the packaging substrate 10. At this time, the pins 31 on the chip 30 also extend one-to-one into the solder pad grooves 11 of the packaging substrate 10. Then, molten solder is dripped into each solder pad groove 11 sequentially using a soldering gun to complete the soldering of the chip 30 to the packaging substrate 10. Finally, after all soldering is completed, the clamping member 20 can be removed from the bottom of the packaging substrate 10 to obtain the final product.

[0023] By designing a movable clamping component 20 to clamp and fix the chip 30 during the welding process, the welding operator does not need to use traditional tools such as tweezers to clamp and fix the chip 30, which greatly reduces the difficulty of welding the pins 31.

[0024] The packaging substrate 10 is further provided with a plurality of auxiliary positioning blocks 13, which respectively limit the position of the four corners of the chip 30. The auxiliary positioning blocks 13 can work with the clamping member 20 to further limit and fix the chip 30, so as to avoid problems such as welding misalignment caused by accidental shaking of the chip 30 during the welding process.

[0025] The outer end of the pin 31 is provided with a through-hole 311 extending vertically. A corresponding welding bump 111 is provided at the bottom of the pad groove 11, and the welding bump 111 extends upwards through the through-hole 311. Specifically, in this embodiment, each pin 31 has two sets of through-holes 311, and each pad groove 11 has two sets of welding bumps 111. A connecting groove 312 is provided between the two sets of through-holes 311, and the connecting groove 312 communicates with the through-holes 311 at both ends. The structural design of the through-holes 311, welding bumps 111, and connecting groove 312 strengthens the adhesion between the solder liquid and the pin 31 and the pad groove 11 after solidification, significantly improving the strength and reliability of the pin 31 soldering.

[0026] The welding bump 111 has a "T"-shaped side cross-section, and its length and width are smaller than those of the welding through-hole 311. The width of the outer end of the pin 31 is greater than that of the inner end, and the width of the outer end of the pin 31 is smaller than that of the pad groove 11. The gaps between the welding through-hole 311 and the welding bump 111, and between the outer end of the pin 31 and the pad groove 11, allow the molten solder to fill the solder more smoothly, further improving the solder joint strength.

[0027] The chip packaging structure 100, which facilitates pin soldering, also includes a positioning plate 40 located below the packaging substrate 10. The base 21 of the clamping member 20 can be snapped onto the positioning plate 40. The positioning plate 40 can snap onto multiple clamping members 20 at once, thereby assisting in clamping and fixing multiple chips 30 on the packaging substrate 10. This allows soldering operators to continuously perform pin soldering operations on multiple chips 30 on the packaging substrate 10, optimizing work efficiency.

[0028] In summary, the beneficial effects of the chip packaging structure 100 of this utility model that facilitates pin soldering are as follows: by designing the clamping member 20 in conjunction with the unique packaging substrate 10 and chip 30, the chip 30 and the packaging substrate 10 can be accurately and reliably clamped and aligned during the soldering process, greatly reducing the operational difficulty of pin soldering; and the chip 30 pins 31 and the pad groove 11 are also additionally designed with a reinforcing structure, which can effectively improve the firmness of pin soldering; this utility model is highly practical and has strong promotional significance.

[0029] The embodiments described above illustrate only one implementation of the utility model, and while the description is relatively specific and detailed, it should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the inventive concept, and these all fall within the protection scope of the utility model. Therefore, the protection scope of the utility model patent should be determined by the appended claims.

Claims

1. A chip packaging structure that facilitates pin soldering, characterized in that: The device includes a packaging substrate, a clamping component, and a chip. The packaging substrate has several pad grooves and a vertically penetrating positioning through-hole. The clamping component includes a base and two clamping strips integrally mounted on the base. The base is located at the bottom of the packaging substrate, and the two clamping strips are respectively inserted into the positioning through-hole from bottom to top and extend above the packaging substrate. The chip has several pins on both sides and a limiting groove. The chip is engaged between the two clamping strips from top to bottom, and the pins extend into the several pad grooves. The upper ends of the clamping strips and the limiting grooves mutually limit each other.

2. The chip packaging structure for easy pin soldering as described in claim 1, characterized in that: The packaging substrate is also provided with a plurality of auxiliary positioning blocks, which respectively limit the position of the four corners of the chip.

3. The chip packaging structure for easy pin soldering as described in claim 1, characterized in that: The outer end of the pin is also provided with a through-hole for welding, and the bottom of the solder pad groove is provided with a corresponding welding bump, which is inserted into the through-hole from bottom to top.

4. The chip packaging structure for easy pin soldering as described in claim 3, characterized in that: Each pin has two sets of welding through holes, and each pad groove has two sets of welding bumps. A connecting groove is provided between the two sets of welding through holes, and the connecting groove is connected to the welding through holes at both ends.

5. The chip packaging structure for easy pin soldering as described in claim 3, characterized in that: The side cross-section of the welding bump is designed in a "T" shape, and the length and width dimensions of the welding bump are smaller than the length and width dimensions of the welding through hole.

6. The chip packaging structure for easy pin soldering as described in claim 1, characterized in that: The width of the outer end of the pin is greater than the width of the inner end, and the width of the outer end of the pin is less than the width of the pad groove.

7. The chip packaging structure for easy pin soldering as described in claim 1, characterized in that: It also includes a positioning plate located below the packaging substrate, and the base of the clamping member can be snapped onto the positioning plate.

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