Cooker

Abstract

The utility model provides a cooker. The cooker comprises a cooker base body and a heat conduction layer, and the heat conduction layer is made of hexagonal boron nitride and is at least formed on the bottom wall of the cooker base body. The cooker with the heat conduction layer made of the hexagonal boron nitride is light in weight and good in heat conduction efficiency, so that the weight of the cooker can be reduced to a certain extent, the cooker which is light in weight and good in heat conduction efficiency can be obtained, and the cooker can be used by a cook conveniently.

Description

Technical Field

[0001] This utility model relates to the field of cookware technology, specifically to a cookware. Background Technology

[0002] Currently, some cookware is typically made of iron or titanium, which have relatively poor thermal conductivity, low thermal efficiency, and poor heat uniformity. During heating, they are prone to localized high temperatures, which can easily lead to localized burning.

[0003] In the traditional cookware industry, to improve the heat conduction efficiency of cookware, a layer of lightweight metallic heat-conducting materials such as aluminum or copper sheets is usually sprayed onto the existing material, or sheets of such materials are added through heat lamination to form a sandwich-like composite structure. While these methods can effectively improve the heat conduction efficiency of the product, the materials used are all metals, which have the disadvantages of being thick and heavy. It is difficult to combine high heat conduction efficiency with lightweight properties, making it unsuitable for cooks. Utility Model Content

[0004] Therefore, the purpose of this utility model is to provide a cookware that solves the technical problem that existing cookware cannot simultaneously possess excellent properties such as high heat conduction efficiency and lightweight, which is not conducive to the use of cooks.

[0005] According to a first aspect of the present invention, a cooker is provided, the cooker comprising a cooker base and a heat-conducting layer, the heat-conducting layer being made of hexagonal boron nitride and being formed at least on the bottom wall of the cooker base.

[0006] According to the embodiments of this utility model, the heat-conducting layer made of hexagonal boron nitride is lightweight and has good thermal conductivity. In this way, the weight of the cookware can be reduced to a certain extent, thereby obtaining a lightweight cookware with good thermal conductivity, which is beneficial to the cook.

[0007] In some embodiments, the heat-conducting layer is formed on the inner and / or outer surface of the bottom wall of the cookware substrate. The heat-conducting layer is formed in multiple locations, thus enabling the manufacture of various types of cookware.

[0008] In some embodiments, the heat-conducting layer extends from the bottom wall of the cookware base to the side wall of the cookware base, so that the side wall of the cookware also has higher thermal conductivity, so that the temperature of the cooking cavity of the cookware can be kept within a stable temperature range, thereby improving the smoke-free effect of the cookware while ensuring the cooking performance of the cookware.

[0009] In some embodiments, the thickness of the heat-conducting layer is 0.55 mm to 0.6 mm; and / or, the thickness of the cookware substrate is 3 mm to 5 mm. The heat-conducting layer and the cookware substrate have suitable thickness distributions. The cookware substrate enhances the basic mechanical properties of the cookware, while the heat-conducting layer, made of hexagonal boron nitride, enables efficient heat conduction and reduces the overall weight of the cookware. This results in a cookware that is lightweight, has high thermal conductivity, and meets the required mechanical properties for use.

[0010] In some embodiments, the cookware substrate includes an aluminum substrate, a titanium substrate, an iron substrate, a magnesium substrate, or an inorganic non-metallic substrate. The variety of cookware substrate types allows for the manufacture of a variety of cookware types based on actual needs.

[0011] In some embodiments, the cooker further includes a protective layer covering the outside of the heat-conducting layer. By providing a protective layer on the outside of the heat-conducting layer, the service life of the heat-conducting layer can be greatly improved, so as to avoid the heat-conducting layer being exposed and easily damaged (e.g., hexagonal boron nitride material falling out, scratching, etc.).

[0012] In some embodiments, the protective layer is an inorganic protective layer. Inorganic protective layers are heat-resistant and readily available, and can protect the heat-conducting layer, preventing it from being exposed and affecting its service life.

[0013] In some embodiments, the protective layer is made of aluminum, aluminum alloy, titanium, titanium alloy, iron, iron alloy, magnesium, magnesium alloy, nickel, nickel alloy, molybdenum, molybdenum alloy, vanadium, vanadium alloy, copper, or copper alloy.

[0014] In these embodiments, the protective layer formed by the metal material, covering the outside of the heat-conducting layer, can play a protective role and can further enhance the appearance of the obtained cookware by taking advantage of the metallic luster of the metal material.

[0015] In some embodiments, the thickness of the protective layer is 0.03 mm to 0.05 mm. The protective layer has a suitable thickness to provide protection without excessively affecting the heat conduction efficiency and lightweight effect of the cookware due to excessive thickness.

[0016] In some embodiments, the roughness Ra of the outer surface of the protective layer is 0.4 micrometers to 1.0 micrometers. Such roughness of the outer surface of the protective layer can ensure the appearance of the protective layer and prevent its surface from being too rough to scratch the user or affect the contact with the induction cooker. Attached Figure Description

[0017] The above and other objects and features of this utility model will become clearer from the following description of embodiments in conjunction with the accompanying drawings, in which:

[0018] Figure 1This is a structural schematic diagram of a cooker according to the first embodiment of the present utility model;

[0019] Figure 2 yes Figure 1 Enlarged structural diagram at point I;

[0020] Figure 3 This is a structural schematic diagram of another cooking utensil according to the first embodiment of the present utility model;

[0021] Figure 4 This is a structural schematic diagram of a cooker according to the second embodiment of the present utility model;

[0022] Figure 5 yes Figure 4 A magnified structural diagram of point J in the middle.

[0023] Tag Name

[0024] 100. Cookware; 101. Cookware base; 102. Heat-conducting layer; 103. Protective layer. Detailed Implementation

[0025] The following detailed descriptions are provided to aid the reader in gaining a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will become apparent upon understanding this disclosure. For example, the order of operations described herein is merely illustrative and is not limited to those orders set forth herein, but may be altered as will become clear upon understanding this disclosure, except for operations that must occur in a specific order. Furthermore, for clarity and conciseness, descriptions of features known in the art may be omitted.

[0026] The features described herein may be implemented in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein are provided only to illustrate some of the many possible ways of implementing the methods, apparatus and / or systems described herein, many of which will become clear upon understanding the disclosure of this utility model.

[0027] As used herein, the term “and / or” includes any one of the associated listed items and any combination of any two or more.

[0028] Although terms such as “first,” “second,” and “third” may be used herein to describe various components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts should not be limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Thus, without departing from the teaching of the examples described herein, the first component, first assembly, first region, first layer, or first part referred to as the first component, first assembly, first region, first layer, or first part may also be referred to as the second component, second assembly, second region, second layer, or second part.

[0029] In the specification, when an element such as a layer, region, or substrate is described as being "on" another element, "connected to," or "mounted to" another element, the element may be directly "on" another element, directly "connected to," or "mounted to" the other element, or one or more other elements may be present in between. Conversely, when an element is described as being "directly on" another element, "directly connected to," or "directly mounted to" another element, no other elements may be present in between.

[0030] The terminology used herein is for describing various examples only and is not intended to limit the invention. Unless the context clearly indicates otherwise, the singular form is intended to include the plural form as well. The terms “comprising,” “including,” and “having” indicate the presence of the described features, quantities, operations, components, elements, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof. The term “a plurality” represents any quantity of two or more.

[0031] The directional terms "upper," "lower," "inner," and "outer" used in this invention are all based on the orientation of the cookware when it is in normal use. This definition method will help ensure that readers or users can clearly understand the relative positional relationships of the various components and functions, and should not be construed as a limitation of this invention.

[0032] Unless otherwise defined, all terms used herein, including technical and scientific terms, shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains after understanding the invention. Unless expressly defined herein, terms such as those defined in a general dictionary shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and in this invention, and shall not be interpreted in an idealized or overly formalistic manner.

[0033] Furthermore, in the description of the examples, detailed descriptions of well-known related components or functions will be omitted when it is believed that such detailed descriptions would lead to a vague interpretation of the present invention.

[0034] The following will refer to Figures 1 to 5 The following describes in detail the cooking utensils provided according to the embodiments of the present utility model.

[0035] According to this utility model, a cooking utensil is provided, wherein, as shown in the figure below, the utensil is provided. Figures 1 to 5 As shown, the cookware includes a cookware base 101, a heat-conducting layer 102, and a protective layer 103. The heat-conducting layer 102 is made of hexagonal boron nitride and is formed at least on the bottom wall of the cookware base 101.

[0036] According to the cookware provided in this embodiment of the present invention, the heat-conducting layer 102 made of hexagonal boron nitride is lightweight and has good thermal conductivity. In this way, the weight of the cookware can be reduced to a certain extent, thereby obtaining a lightweight cookware with good thermal conductivity, which is beneficial to the cook.

[0037] The cookware according to the present invention will be described below with reference to specific embodiments.

[0038] According to this invention, the cookware substrate 101 can be made of commonly used materials. For example, the material can be aluminum, titanium, iron, magnesium, or composite materials formed from the above materials. It should be noted that when the material is a composite material, this invention does not specifically limit the weight ratio of each part of the composite material, because the composite material forming the cookware substrate 101 is a material already in the prior art. Correspondingly, the cookware substrate 101 includes at least one of an aluminum matrix, a titanium matrix, an iron matrix, and a magnesium matrix; that is, the cookware substrate can be a composite structure formed from multiple substrates, or a single-layer structure formed from a single type of substrate. Thus, the types of cookware substrates 101 are diversified, thereby enabling the manufacture of diverse types of cookware based on actual needs.

[0039] In some embodiments, the cookware base 101 includes a pot base, which may specifically be a wok base, a frying pan base, a steamer base, or a saucepan base. The cookware base 101 has a shape corresponding to its function. For example, when the cookware is a wok, the cookware base 101 has a shape corresponding to a conventional wok; when the cookware is a baking pan, the cookware base 101 has a shape corresponding to a conventional baking pan.

[0040] According to some embodiments of this utility model, the cookware substrate 101 has an inner surface and an outer surface facing away from each other. A heat-conducting layer 102 is formed on the inner surface and / or outer surface of the bottom wall of the cookware substrate 101. Since the heat-conducting layer is formed in multiple locations, various types of cookware can be manufactured. The inner surface and / or outer surface are rough surfaces, thus allowing for a relatively large contact area between the inner surface and / or outer surface of the cookware substrate 101 and the heat-conducting layer 102, thereby further enhancing the bonding force between the heat-conducting layer 102 and the cookware substrate 101.

[0041] In this invention, the rough surface can be obtained by sanding the inner and / or outer surfaces of the cookware substrate 101. For example, the roughness of the surface is Ra with a value in the range of 3-6 micrometers. Alternatively, it can be obtained by providing a rough transition layer on the cookware substrate 101. For example, the rough transition layer can be formed by thermally spraying a metallic material onto the inner and / or outer surfaces of the cookware substrate 101. It should be noted that this invention does not limit the type of metallic material used to form the rough transition layer.

[0042] According to this invention, the heat-conducting layer 102 is made of hexagonal boron nitride and is formed at least on the bottom wall of the cookware substrate 101. According to one embodiment of this invention, the heat-conducting layer 102 may be formed only on the bottom wall of the cookware substrate 101, thus ensuring moderate heat conduction efficiency of the cookware. According to another embodiment of this invention, the heat-conducting layer 102 may also extend from the bottom wall of the cookware substrate 101 to the side wall of the cookware substrate 101, thus giving the side wall of the cookware higher thermal conductivity, allowing the temperature of the cooking cavity of the cookware to remain within a stable temperature range, thereby improving the smoke-free effect of the cookware while ensuring its cooking performance.

[0043] As an example, the cookware is a pot with a height of H. The heat-conducting layer 102 extends from the bottom wall of the cookware base 101 to the side wall of the cookware base 101 at a height of 1 / 3H from the bottom wall of the pot. In this way, the temperature of the cookware side wall corresponding to the cooking function area of ​​the cookware can be within a stable temperature range, thereby improving the smoke-free effect of the cookware while ensuring the cooking performance of the cookware.

[0044] In some embodiments, a heat-conducting layer 102 is formed on the inner and / or outer surfaces of the cookware base 101. This allows the heat-conducting layer 102 to be disposed on the inner and / or outer surfaces of the cookware base 101 as needed, enabling the manufacture of various types of cookware. Here, the inner and / or outer surfaces of the cookware base 101 are relative to the cooking cavity of the cookware base 101; the inner surface of the cookware base 101 is the surface in contact with the cavity, and the outer surface of the cookware base 101 is the surface that does not contact the cavity.

[0045] In some embodiments, the heat-conducting layer is formed by hot bonding a hexagonal boron nitride plate onto the cookware substrate 101. This hot bonding process firmly bonds the hexagonal boron nitride plate to the cookware substrate 101. The hot bonding process utilizes a conventional manufacturing process that combines high temperature and mechanical force to composite the hexagonal boron nitride plate and the cookware substrate 101. As an example, using an iron substrate, the iron substrate and the hexagonal boron nitride plate are heated to above their recrystallization temperature (approximately 900-1200°C for steel), causing the materials to enter a plastic deformation state. High pressure is applied using a press of 2500 tons or more, forcing atomic diffusion between the iron substrate and the hexagonal boron nitride plate at the interface, forming a metallurgical bond. During this process, the high temperature allows the iron substrate and the hexagonal boron nitride plate to directly contact and composite at the atomic level, while the high pressure creates a mechanical bond between them.

[0046] In some embodiments, a heat-conducting layer 102 is formed at least on the bottom wall of the cookware substrate 101. The weight of the heat-conducting layer 102 is less than the weight of the cookware substrate 101, and the thermal conductivity of the heat-conducting layer 102 is greater than that of the cookware substrate 101. For example, the thermal conductivity of the heat-conducting layer 102 is 300 W / mK-400 W / mK, and the thermal conductivity of the cookware substrate 101 is 15 W / mK-200 W / mK. For example, taking a cookware with a diameter in the range of 24 cm-30 cm, the weight of the heat-conducting layer 102 is 35 g-60 g, and the weight of the cookware substrate 101 is 500 g-1650 g. Using a high thermal conductivity material to construct the heat-conducting layer 102 can significantly improve the heat transfer efficiency of the cookware. These materials, with their excellent thermal conductivity, accelerate the diffusion of heat within the cookware and achieve uniform heat distribution, effectively eliminating the problems of localized overheating or cold spots caused by uneven heat conduction in traditional cookware. Based on this advantage, the required thickness of the base material can be significantly reduced while ensuring stable thermal performance of the cookware. Optimizing the base material thickness not only directly reduces the overall weight of the cookware but also lowers manufacturing costs by reducing material usage, while simultaneously improving the cookware's portability and ease of use.

[0047] In some embodiments, the cookware substrate 101 is much thicker than the heat-conducting layer 102. Thus, while maintaining a certain overall strength and thermal conductivity, the weight of the resulting cookware can be significantly reduced by utilizing the heat-conducting layer 102. For example, the cookware substrate 101 has a thickness of 3mm-5mm, and the heat-conducting layer 102 has a thickness of 0.55mm-0.6mm. The heat-conducting layer 102 and the cookware substrate 101 have suitable thickness distributions. The cookware substrate enhances the basic mechanical properties of the cookware, while the heat-conducting layer 102, made of hexagonal boron nitride, achieves efficient heat conduction, reducing the overall weight of the cookware. This results in a cookware that is lightweight, has high thermal conductivity, and meets the required mechanical properties for use.

[0048] In some embodiments, the cookware substrate 101 includes at least one of an aluminum substrate, a titanium substrate, an iron substrate, and a magnesium substrate, and the cookware substrate 101 is of various types, thereby enabling the manufacture of a variety of cookware based on actual needs.

[0049] In other embodiments, the heat-conducting layer 102 and the cookware substrate 101 are made of the same material. As an example, the material of the cookware substrate 101 is similar to that of the heat-conducting layer 102, which is an inorganic non-metallic material, such as ceramic or glass. This ensures the bonding strength between the cookware substrate 101 and the heat-conducting layer 102, and further improves the service life of the cookware.

[0050] According to this invention, the cookware can be applied to an electromagnetic heat source (induction cooker) or an open flame heat source (gas stove). To further improve the service life of the heat-conducting layer 102, the cookware may also include a protective layer 103, which covers the outer side of the heat-conducting layer 102. Here, it can be understood that the protective layer 103 completely covers the heat-conducting layer 102 and extends to the cookware base connected to the outer edge of the heat-conducting layer 102, thereby effectively covering the sidewalls of the heat-conducting layer 102. By providing a protective layer 103 on the outer side of the heat-conducting layer 102, the service life of the heat-conducting layer 102 can be greatly improved, preventing the heat-conducting layer 102 from being exposed and easily damaged (e.g., the hexagonal boron nitride material coming off, scratching, etc.). Furthermore, it should be noted that when the heat-conducting layer 102 is formed on the inner bottom wall of the cookware base 101, covering the heat-conducting layer 102 with a protective layer 103 ensures the safety and hygiene of the user when using the cookware. When the heat-conducting layer 102 is formed on the outer bottom wall of the cookware substrate 101, damage caused by direct contact between the heat-conducting layer 102 and the heat source can be avoided by covering the heat-conducting layer 102 with a protective layer 103.

[0051] In some embodiments, the protective layer 103 is an inorganic protective layer. Inorganic protective layers are heat-resistant and readily available, and can protect the heat-conducting layer 102, preventing the heat-conducting layer 102 from being exposed and affecting its service life. Here, the protective layer 103 can be a simple covering layer, or it can have a certain magnetic permeability so that it can also serve as a magnetic permeable layer, thereby expanding the cookware's applicability to different heat sources.

[0052] In some embodiments, the protective layer 103 is a layer formed by spraying inorganic materials. Compared with thermal resurfacing, this method of formation is simpler and can significantly reduce the manufacturing cost of cookware. Here, the inorganic material is a solid material, and the protective layer 103 can be formed by spraying solid materials. Specifically, the spraying method for solid materials can include thermal spraying or cold spraying. Unlike atomized spraying methods (air spraying, airless spraying, electrostatic spraying, rotary cup spraying) where liquid coatings rely on solvent evaporation to solidify into layers, the solid particles of the solid material are heated and melted (thermal spraying) or deformed by high-speed impact (cold spraying) and then deposited to form a protective layer. Therefore, it can avoid the hazards to operators and the environment caused by atomized spraying. As examples, thermal spraying includes arc spraying, plasma spraying, flame spraying, etc.

[0053] As a specific example, the material forming the protective layer 103 can be either filament or granules. For filaments, thermal spraying methods such as arc spraying, supersonic flame spraying, or explosive spraying are required to obtain the protective layer. Taking arc spraying as an example, specific parameters include a current of 360-380 amps, a voltage of 38-40 volts, and a protective layer thickness of 0.03-0.05 mm. For granules, thermal spraying methods such as plasma spraying, supersonic flame spraying, or high-pressure cold spraying are required to obtain the protective layer. Taking plasma spraying as an example, specific parameters include a current of 250-300 amps, a voltage of 30-35 volts, and a total power of 10-15 kW.

[0054] As a specific example, the inorganic protective layer can be a metallic layer. For example, protective layer 103 is made of aluminum, aluminum alloy, titanium, titanium alloy, iron, iron alloy, magnesium, magnesium alloy, nickel, nickel alloy, molybdenum, molybdenum alloy, vanadium, vanadium alloy, copper, or copper alloy. It is understood that protective layer 103 can be made of one of aluminum, aluminum alloy, titanium, titanium alloy, iron, iron alloy, magnesium, magnesium alloy, nickel, nickel alloy, molybdenum, molybdenum alloy, vanadium, vanadium alloy, copper, and copper alloy. More specifically, the particle size of the particles forming protective layer 103 is 30 micrometers to 75 micrometers.

[0055] In these embodiments, the protective layer 103 formed of metal material, covering the outside of the heat-conducting layer 102, can play a protective role and can further enhance the appearance of the obtained cookware by means of the metallic luster of the metal material.

[0056] In some embodiments, the thickness of the protective layer 103 is 0.03 mm to 0.05 mm. The protective layer 103 has a suitable thickness to provide protection without excessively affecting the heat conduction efficiency and lightweight effect of the cookware due to excessive thickness.

[0057] In some embodiments, directly spraying metal particles may not produce a smooth surface on the cookware substrate 101, which has a rough surface (Ra 3-6 micrometers), requiring an additional polishing step. The outer surface of the protective layer 103 is a sanded surface, which can be obtained by sanding the surface of the sprayed layer. Specifically, the roughness Ra of the outer surface of the protective layer 103 is 0.4-1.0 micrometers. Here, the outer surface specifically refers to the surface of the protective layer 103 facing away from the cookware substrate 101. This roughness of the surface of the protective layer 103 facing away from the cookware substrate 101 ensures the appearance of the protective layer 103 and prevents its surface from being too rough to scratch the user or affect the contact with the induction cooker.

[0058] According to this utility model, the cookware has a multi-layer composite structure, specifically including a cookware base 101, a heat-conducting layer 102, and a protective layer 103.

[0059] like Figure 1 and Figure 2 As shown, the non-stick cookware 100 includes a multi-layer structure stacked on top of each other, specifically including a cookware base 101, a heat-conducting layer 102 and a protective layer 103 stacked on top of each other in sequence. The heat-conducting layer 102 is stacked on the inner bottom wall of the cookware base 101, and the protective layer 103 covers the outer side of the heat-conducting layer 102.

[0060] like Figure 3 As shown, the inner surface of the cookware substrate 101 is a rough surface. A heat-conducting layer 102 is formed by spraying on the cookware substrate with a rough surface. This allows the surface of the heat-conducting layer 102 to also have a concave-convex structure corresponding to the rough surface. In this way, the obtained cookware can store oil in the concave-convex structure during use, thereby improving its non-stick properties.

[0061] like Figure 4 and Figure 5 As shown, the non-stick cookware 100 includes a multi-layer structure stacked on top of each other, specifically including a cookware base 101, a heat-conducting layer 102 and a protective layer 103 stacked on top of each other in sequence. The heat-conducting layer 102 is stacked on the outer bottom wall of the cookware base 101, and the protective layer 103 covers the outside of the heat-conducting layer 102.

[0062] While the embodiments of the present invention have been described in detail above, those skilled in the art can make various modifications and variations to the embodiments of the present invention without departing from the spirit and scope thereof. However, it should be understood that these modifications and variations will still fall within the spirit and scope of the embodiments of the present invention as defined in the claims.

Claims

1. A cooking utensil, characterized in that, The cooking utensils include: Cookware base (101); A heat-conducting layer (102), made of hexagonal boron nitride, is formed at least on the bottom wall of the cookware substrate (101).

2. The cookware according to claim 1, characterized in that, The heat-conducting layer (102) is formed on the inner and / or outer surface of the bottom wall of the cookware substrate (101).

3. The cookware according to claim 1, characterized in that, The heat-conducting layer (102) also extends from the bottom wall of the cookware base (101) to the side wall of the cookware base (101).

4. The cookware according to claim 1, characterized in that, The thickness of the heat-conducting layer (102) is 0.55 mm to 0.6 mm; and / or the thickness of the cookware substrate (101) is 3 mm to 5 mm.

5. The cookware according to claim 1, characterized in that, The cookware substrate (101) includes an aluminum substrate, a titanium substrate, an iron substrate, a magnesium substrate, or an inorganic non-metallic substrate.

6. The cookware according to any one of claims 1 to 5, characterized in that, The cooking utensils also include: A protective layer (103) covers the outside of the thermally conductive layer (102).

7. The cookware according to claim 6, characterized in that, The protective layer (103) is an inorganic protective layer.

8. The cookware according to claim 6, characterized in that, The protective layer (103) is made of aluminum, aluminum alloy, titanium, titanium alloy, iron, iron alloy, magnesium, magnesium alloy, nickel, nickel alloy, molybdenum, molybdenum alloy, vanadium, vanadium alloy, copper or copper alloy.

9. The cookware according to claim 6, characterized in that, The thickness of the protective layer (103) is 0.03 mm to 0.05 mm.

10. The cookware according to claim 6, characterized in that, The roughness Ra of the outer surface of the protective layer (103) is 0.4 micrometers to 1.0 micrometers.

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