Thermotank testing device adaptive to samples of multiple sizes

Abstract

The embodiment of the utility model discloses a thermotank testing device adaptive to samples of multiple sizes, which relates to the technical field of semiconductor testing and comprises a control module and a plurality of testing box bodies of different sizes, and each testing box body comprises a testing plate and a temperature adjusting module; the control module can be switched to be connected into different test box bodies, and when the control module is connected into the test box bodies, the control module is detachably and electrically connected with the test plates of the test box bodies and the temperature adjusting module. A user can flexibly meet the test requirements of small-sized to medium-sized PCBA samples by replacing the test box bodies with different sizes, so that the space redundancy occupation of a large-volume constant-temperature box on small samples is avoided, and the utilization rate of equipment is remarkably improved. And a single control module multiplexes a plurality of box bodies, so that the capital investment of purchasing a plurality of constant-temperature equipment by a user is reduced. The detachable electric connection design of the control module and the box body simplifies the equipment switching process, a user can quickly adapt to different test scenes without complex debugging, and the test efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing technology, and in particular to a constant temperature chamber testing device that is adaptable to samples of multiple sizes. Background Technology

[0002] In the field of industrial testing, temperature control chambers are a key piece of equipment widely used for environmental reliability verification of electronic products, playing a particularly important role in high and low temperature cycling tests. Traditional temperature control chambers are typically designed for mass production or standardized product testing needs, with fixed internal volumes and structural dimensions to meet the batch testing requirements of large quantities of products. However, with the shortening of electronic product development cycles and the increase in diversified demands, especially in testing scenarios for small PCBA (Printed Circuit Board Assembly) samples, the limitations of traditional temperature control chambers are becoming increasingly apparent.

[0003] First, traditional incubators suffer from significant space consumption issues due to their large size. Their fixed-size design cannot accommodate PCBA samples of varying sizes, resulting in extremely low internal space utilization during testing. For example, when testing small PCBA samples, most of the chamber space remains unused, increasing the equipment's footprint and causing unnecessary energy waste. Second, the heating and cooling systems of traditional incubators are typically designed for large volumes, resulting in high thermal inertia and difficulty in quickly responding to temperature regulation needs in small spaces. This design characteristic necessitates prolonged operation to maintain a stable temperature field when testing small samples, further exacerbating energy consumption and equipment aging.

[0004] In light of the above issues, there is an urgent need for a constant temperature testing device that can adapt to PCBA samples of various sizes, optimize space utilization, and improve energy efficiency. Utility Model Content

[0005] The technical problem to be solved by this utility model embodiment is how to provide a constant temperature chamber testing device that can be adapted to test PCBA samples of different specifications.

[0006] To address the aforementioned issues, this utility model proposes a constant temperature chamber testing device adaptable to samples of multiple sizes. The device includes a control module and multiple test chambers of different sizes. Each test chamber includes a test plate and a temperature adjustment module. The control module can be switched between different test chambers. When the control module is connected to a test chamber, the control module is detachably electrically connected to the test plate and temperature adjustment module of the test chamber.

[0007] A further technical solution is that the temperature adjustment module includes a heating element, which is disposed inside the test chamber, and the heating element is detachably electrically connected to the control module.

[0008] A further technical solution is that the temperature adjustment module includes a cooling chip, which is disposed inside the test chamber and is detachably electrically connected to the control module.

[0009] A further technical solution is that the temperature adjustment module includes a fan, which is located inside the test chamber, and the fan is detachably electrically connected to the control module.

[0010] A further technical solution is that the temperature adjustment module includes a temperature sensor, which is located inside the test chamber and is detachably electrically connected to the control module.

[0011] A further technical solution is that the test chamber also includes a display device, which is located on the outside of the test chamber and is detachably electrically connected to the control module.

[0012] A further technical solution is that the test chamber also includes a button, which is located on the outside of the test chamber and is detachably electrically connected to the control module.

[0013] A further technical solution is that the test chamber also includes an indicator device, which is located on the outside of the test chamber and is detachably electrically connected to the control module.

[0014] A further technical solution is that the control module includes a microcontroller, a heating element power supply module, and a cooling element power supply module. The microcontroller is electrically connected to the heating element power supply module and the cooling element power supply module, respectively. The heating element power supply module is detachably electrically connected to the heating element, and the cooling element power supply module is detachably electrically connected to the cooling element.

[0015] A further technical solution is that the control module also includes a serial port and an SD card, which are connected to the microcontroller.

[0016] Compared with the prior art, the technical effects achieved by the embodiments of this utility model include:

[0017] This invention provides a constant temperature chamber testing device adaptable to samples of multiple sizes, including a control module and multiple test chambers of different sizes. Each test chamber includes a test plate and a temperature adjustment module. The control module can be switched to different test chambers. When the control module is connected to a test chamber, the control module is detachably electrically connected to the test plate and temperature adjustment module of the test chamber. Users can flexibly match the testing needs of small to medium-sized PCBA samples by changing test chambers of different sizes, avoiding the redundant space occupation of large-volume constant temperature chambers for small samples and significantly improving equipment utilization. A single control module reuses multiple chambers, reducing the capital investment of users in purchasing multiple constant temperature devices. The detachable electrical connection design between the control module and the chambers simplifies the equipment switching process, allowing users to quickly adapt to different testing scenarios without complex debugging, thus improving testing efficiency.

[0018] This invention provides an innovative temperature control chamber testing device adaptable to samples of various sizes, effectively solving the problem of insufficient adaptability of traditional temperature control equipment in miniaturized and diversified testing scenarios. Its technical effects can be systematically derived as follows:

[0019] 1. Improved equipment utilization and adaptability

[0020] Traditional constant temperature chambers, due to their fixed-size design, exhibit significant space redundancy when testing small PCBA samples, resulting in low internal volume utilization. This solution introduces multi-size interchangeable test chambers, allowing users to flexibly select a matching chamber structure based on the actual size of the sample being tested, avoiding the unnecessary space occupation of small samples by large-volume equipment. Simultaneously, the detachable electrical connection design between the control module and the chamber allows for seamless switching between different chambers, preserving the reusability of core control functions while achieving dynamic adaptation to the testing environment. This design significantly improves equipment utilization, making it particularly suitable for the rapid verification needs of multi-specification samples during the R&D phase.

[0021] 2. Cost optimization and resource conservation

[0022] In traditional solutions, users need to purchase multiple temperature control devices for samples of different sizes, resulting in high capital investment and maintenance costs. This solution reuses multiple enclosures through a single control module, decoupling the core control functions from the enclosure structure. Users only need to configure enclosures of the appropriate size according to their testing requirements, eliminating the need to repeatedly purchase complete equipment.

[0023] 3. Enhanced operational efficiency and flexibility

[0024] Traditional constant temperature chambers require recalibrating equipment parameters when switching test scenarios, resulting in a cumbersome operation process. This solution simplifies the interface process between the control module and the chamber through a standardized, detachable electrical connection design. When changing chambers, users do not need to reconfigure control parameters or calibrate the system; only a physical connection is required before testing, significantly reducing equipment preparation time. This design is particularly suitable for multi-project parallel testing scenarios, supporting rapid switching between test environments and significantly improving R&D and mass production verification efficiency.

[0025] 4. Functionality expansion and compatibility assurance

[0026] The modular architecture provides a foundation for system function expansion. The universal interface design of the control module is compatible with temperature adjustment modules (such as heating, cooling, and airflow circulation) in different enclosures, ensuring dynamic matching of temperature control performance with enclosure size. In addition, this design supports the integration of future new functional modules (such as humidity control and vibration testing), avoiding equipment obsolescence due to technological iterations and enhancing the long-term applicability of the solution.

[0027] This solution optimizes the overall performance of the constant temperature testing device from four dimensions: space utilization, cost control, operational efficiency, and functional expansion through the collaborative design of multi-size enclosures, detachable control modules, and standardized interfaces. It provides an efficient, economical, and sustainable solution for environmental reliability testing of miniaturized and diversified electronic products. Attached Figure Description

[0028] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0029] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0031] Figure 1 A schematic diagram of a constant temperature chamber testing device adapted to samples of multiple sizes, as proposed in an embodiment of this utility model;

[0032] Figure 2 A circuit block diagram of a constant temperature chamber testing device adapted to samples of multiple sizes, as proposed in an embodiment of this utility model;

[0033] Figure 3 This is a schematic diagram of the circuit board of the control module of a constant temperature chamber testing device adapted to samples of multiple sizes, as proposed in an embodiment of this utility model.

[0034] Figure Labels

[0035] Control module 10, test board 20, heating element 30, cooling element 40, fan 50, temperature sensor 60, display device 70, button 80, indicating device 90, microcontroller 11, heating element power module 12, cooling element power module 13, serial port 14, SD card 15. Detailed Implementation

[0036] The technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Similar component reference numerals in the drawings represent similar components. Obviously, the embodiments described below are only some embodiments of this utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0037] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0038] It should also be understood that the terminology used in this specification of embodiments of the present invention is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of the present invention. As used in this specification of embodiments of the present invention and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0039] See Figures 1-3 This utility model provides a constant temperature chamber testing device adaptable to samples of multiple sizes, which can accommodate PCBA samples of different sizes, effectively avoiding resource waste. To achieve the above technical objectives, the constant temperature chamber testing device adaptable to samples of multiple sizes includes a control module 10 and multiple test chambers of different sizes, the specific structure of which is described below:

[0040] Multiple test chambers of different sizes are available to accommodate various PCBA samples of different specifications. The test chambers can be rectangular, with different dimensions referring to variations in length, width, and height. The test chambers can be constructed with a metal shell and high-temperature resistant materials, and include a door.

[0041] The test chamber includes a test board 20 and a temperature adjustment module. The test board 20 is used to connect to the PCBA sample for testing the PCBA sample. The test board 20 can be determined based on specific testing requirements, and this utility model does not specifically limit it. The temperature adjustment module is used to adjust the temperature inside the test chamber.

[0042] The control module 10 can be switched to different test chambers. When the control module 10 is connected to a test chamber, the control module 10 is detachably electrically connected to the test board 20 and the temperature adjustment module of the test chamber. Specifically, the detachable electrical connection can be achieved through an interface. The control module 10 is provided with an interface, and the test board 20 and the temperature adjustment module are detachably connected to the interface of the control module 10. The interface can be a USB interface, a UART interface, etc., and this utility model is not specifically limited to that.

[0043] This invention provides an innovative temperature control chamber testing device adaptable to samples of various sizes, effectively solving the problem of insufficient adaptability of traditional temperature control equipment in miniaturized and diversified testing scenarios. Its technical effects can be systematically derived as follows:

[0044] 1. Improved equipment utilization and adaptability

[0045] Traditional constant temperature chambers, due to their fixed-size design, exhibit significant space redundancy when testing small PCBA samples, resulting in low internal volume utilization. This solution introduces multi-size interchangeable test chambers, allowing users to flexibly select a matching chamber structure based on the actual size of the sample being tested, avoiding the unnecessary space occupation of small samples by large-volume equipment. Simultaneously, the detachable electrical connection between the control module 10 and the chamber allows for seamless switching between different chambers, preserving the reusability of core control functions while achieving dynamic adaptation to the testing environment. This design significantly improves equipment utilization, making it particularly suitable for the rapid verification needs of multi-specification samples during the R&D phase.

[0046] 2. Cost optimization and resource conservation

[0047] In traditional solutions, users need to purchase multiple temperature control devices for samples of different sizes, resulting in high capital investment and maintenance costs. This solution reuses multiple enclosures through a single control module 10, decoupling the core control functions from the enclosure structure. Users only need to configure enclosures of the appropriate size according to their testing requirements, eliminating the need to repeatedly purchase complete equipment.

[0048] 3. Enhanced operational efficiency and flexibility

[0049] Traditional constant temperature chambers require recalibrating equipment parameters when switching test scenarios, resulting in a cumbersome operation process. This solution simplifies the interface process between the control module 10 and the chamber through a standardized, detachable electrical connection design. When changing chambers, users do not need to reconfigure control parameters or calibrate the system; they only need to complete the physical connection before testing, significantly reducing equipment preparation time. This design is particularly suitable for multi-project parallel testing scenarios, supporting rapid switching of test environments and significantly improving R&D and mass production verification efficiency.

[0050] 4. Functionality expansion and compatibility assurance

[0051] The modular architecture provides a foundation for system function expansion. The universal interface design of control module 10 is compatible with temperature adjustment modules (such as heating, cooling, and airflow circulation) in different enclosures, ensuring dynamic matching of temperature control performance with enclosure size. In addition, this design supports the integration of future new functional modules (such as humidity control and vibration testing), avoiding equipment obsolescence due to technological iterations and enhancing the long-term applicability of the solution.

[0052] This solution optimizes the overall performance of the constant temperature testing device from four dimensions: space utilization, cost control, operational efficiency, and functional expansion through the collaborative design of multi-size enclosures, detachable control modules 10, and standardized interfaces. It provides an efficient, economical, and sustainable solution for environmental reliability testing of miniaturized and diversified electronic products.

[0053] This invention provides a constant temperature chamber testing device adaptable to samples of multiple sizes, including a control module 10 and multiple test chambers of different sizes. Each test chamber includes a test plate 20 and a temperature adjustment module. The control module 10 can be switched to different test chambers. When the control module 10 is connected to a test chamber, it is detachably electrically connected to the test plate 20 and the temperature adjustment module of the test chamber. Users can flexibly match the testing needs of small to medium-sized PCBA samples by changing test chambers of different sizes, avoiding the redundant space occupation of large-volume constant temperature chambers for small samples and significantly improving equipment utilization. A single control module 10 reuses multiple chambers, reducing the capital investment of users in purchasing multiple constant temperature devices. The detachable electrical connection design between the control module 10 and the chambers simplifies the equipment switching process, allowing users to quickly adapt to different testing scenarios without complex debugging, thus improving testing efficiency.

[0054] Furthermore, in some preferred embodiments, such as this embodiment, the temperature adjustment module includes a heating element 30, which is disposed inside the test chamber and is detachably electrically connected to the control module 10.

[0055] In practice, the heating element 30 is directly integrated into the enclosure. Power is adjusted via PWM control of the module 10 to achieve rapid heating and reduce the impact of thermal inertia on temperature stability. The detachable design allows for independent replacement or upgrades of the heating element 30, preventing complete equipment failure due to partial malfunctions and extending equipment lifespan. The power of the heating element 30 is dynamically matched to the enclosure size, avoiding energy waste from high-power heating elements in small enclosures and reducing testing energy consumption.

[0056] Furthermore, the temperature adjustment module includes a cooling chip 40, which is disposed inside the test chamber and is detachably electrically connected to the control module 10.

[0057] In practice, the cooling chip 40 is directly integrated into the enclosure. Power is adjusted via PWM control by the module 10 to achieve rapid cooling and reduce the impact of thermal inertia on temperature stability. The detachable design allows for independent replacement or upgrades of the cooling chip 40, preventing complete equipment failure due to partial malfunctions and extending equipment lifespan. The power of the cooling chip 40 is dynamically matched to the enclosure size, avoiding energy waste from a high-power cooling chip 40 in a small enclosure and reducing testing energy consumption.

[0058] Furthermore, the temperature adjustment module includes a fan 50, which is disposed inside the test chamber and is detachably electrically connected to the control module 10.

[0059] In practice, fan 50 forces airflow circulation, accelerating the diffusion of heat or cold within the chamber and reducing localized temperature differences (e.g., temperature difference between edge and center ≤ ±1℃). Fan 50's speed can be adjusted according to the chamber size to avoid temperature fluctuations in small chambers caused by excessive airflow, thus improving testing accuracy. The detachable design allows for independent repair or replacement of fan 50 components, reducing maintenance complexity.

[0060] Furthermore, the temperature adjustment module includes a temperature sensor 60, which is disposed inside the test chamber and is detachably electrically connected to the control module 10.

[0061] In practice, the temperature sensor 60 directly collects data from inside the enclosure and feeds it back to the control module 10 to achieve dynamic adjustment using the PID algorithm, ensuring temperature stability (fluctuation ≤ ±0.5℃).

[0062] Temperature sensor 60 can be placed in key areas of the chamber (such as near the sample) to avoid control deviations caused by a single temperature measurement point.

[0063] Temperature sensor 60 is matched and calibrated with different enclosures to ensure that measurement accuracy is not affected by enclosure size.

[0064] Furthermore, in some preferred embodiments, such as this embodiment, the test chamber further includes a display device 70, which is located on the outside of the test chamber and is detachably electrically connected to the control module 10.

[0065] In practice, by adding a display device 70, the temperature setpoint, actual value, alarm information, etc. are displayed in real time, reducing the user's dependence on external devices and improving the ease of operation.

[0066] Furthermore, the test chamber also includes a button 80, which is located on the outside of the test chamber and is detachably electrically connected to the control module 10.

[0067] In practice, users can set the temperature and start / stop the test via button 80 without relying on a PC, improving device independence. Button 80 supports manual interruption of the test or adjustment of parameters, enhancing system security.

[0068] Furthermore, the test chamber also includes an indicator device 90, which is located on the outside of the test chamber and is detachably electrically connected to the control module 10.

[0069] In practice, the indicating device 90 includes indicator lights and a buzzer. The combination of indicator lights (e.g., red / green / yellow) and the buzzer visually reflects the system status (normal, alarm, adjusting). The indicating device 90 supports custom logic (e.g., flashing frequency to distinguish different alarm types) to adapt to diverse testing needs.

[0070] Furthermore, the control module 10 includes a microcontroller 11, a heating element power module 12, and a cooling element power module 13. The microcontroller 11 is electrically connected to the heating element power module 12 and the cooling element power module 13, respectively. The heating element power module 12 is detachably electrically connected to the heating element 30, and the cooling element power module 13 is detachably electrically connected to the cooling element 40.

[0071] In a specific implementation, the microcontroller 11 can be an STM32 microcontroller. The control module 10 is connected to an external power supply. The heating element power supply module 12 is used to convert the power supply voltage to a voltage suitable for the heating element 30, and the cooling element power supply module 13 is used to convert the power supply voltage to a voltage suitable for the cooling element 40.

[0072] By setting independent power supply modules 12 for the heating element and 13 for the cooling element, power conflicts can be avoided, ensuring temperature control stability. The microcontroller 11 integrates a PID algorithm to dynamically adjust the PWM output of the power supply modules 12 and 13 for the heating element and the cooling element, reducing temperature overshoot (e.g., overshoot ≤1℃ during the heating phase).

[0073] Furthermore, the fan 50, the temperature sensor 60, the display device 70, the button 80, and the indicator device 90 are all detachably electrically connected to the microcontroller 11.

[0074] Furthermore, the control module 10 also includes a serial port 14 and an SD card 15, which are connected to the microcontroller 11.

[0075] In practice, serial port 14 is used to connect to the PC, and SD card 15 is used to store test data. Connecting to the PC via serial port 14 enables remote parameter configuration and real-time data monitoring, supporting automated test scripts. SD card 15 stores historical test data (such as temperature profiles and alarm records) for subsequent analysis and report generation. Simultaneously, serial port 14 is compatible with Wi-Fi, Bluetooth, and other communication modules, providing a foundation for system networking or multi-machine collaborative testing.

[0076] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0077] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0078] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0079] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0080] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0081] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0082] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Since these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

[0083] The above description describes specific embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the scope of protection of this utility model. Therefore, the scope of protection of this utility model should be determined by the scope of the claims.

Claims

1. A constant temperature chamber test device suitable for adapting to multiple sizes of samples, characterized by, The system includes a control module and multiple test chambers of different sizes. Each test chamber includes a test board and a temperature adjustment module. The control module can be switched to different test chambers. When the control module is connected to a test chamber, the control module is detachably electrically connected to the test board and temperature adjustment module of the test chamber.

2. The multi-size sample adapted incubator test device of claim 1, wherein, The temperature adjustment module includes a heating element, which is disposed inside the test chamber and is detachably electrically connected to the control module.

3. The multi-size sample adapted incubator test device of claim 2, wherein, The temperature adjustment module includes a cooling chip, which is disposed inside the test chamber and is detachably electrically connected to the control module.

4. The multi-size sample adapted incubator test device of claim 3, wherein, The temperature adjustment module includes a fan, which is located inside the test chamber and is detachably electrically connected to the control module.

5. The multi-size sample adapted incubator test device of claim 4, wherein, The temperature adjustment module includes a temperature sensor, which is located inside the test chamber and is detachably electrically connected to the control module.

6. The multi-size sample adapted incubator test device of claim 5, wherein, The test chamber also includes a display device, which is located on the outside of the test chamber and is detachably electrically connected to the control module.

7. The multi-size sample adapted incubator test device of claim 6, wherein, The test chamber also includes a button, which is located on the outside of the test chamber and is detachably electrically connected to the control module.

8. The multi-size sample adapted incubator test device of claim 7, wherein, The test chamber also includes an indicator device located on the outside of the test chamber, which is detachably electrically connected to the control module.

9. The multi-size sample adapted incubator test device of claim 8, wherein, The control module includes a microcontroller, a heating element power supply module, and a cooling element power supply module. The microcontroller is electrically connected to both the heating element power supply module and the cooling element power supply module. The heating element power supply module is detachably electrically connected to the heating element, and the cooling element power supply module is detachably electrically connected to the cooling element.

10. The multi-size sample adapted incubator test device of claim 9, wherein, The control module also includes a serial port and an SD card, which are connected to the microcontroller.

Images