Compression resistance detection device for organic photoelectric material

Abstract

The utility model provides an organic photoelectric material compression resistance detection device, which relates to the field of organic photoelectric material compression resistance detection and comprises a detection unit. Comprising a base, an outer cover fixedly connected to the top of the base, a cover door movably connected to the front face of the outer cover through a hinge, an electric cylinder fixedly connected to the top of the outer cover, a stress plate fixedly connected to the output end of the electric cylinder, and a laser scanner arranged at the top of an inner cavity of the outer cover. The microcontroller is fixedly connected to one side of the outer cover; according to the utility model, a test material can be isolated from the external environment through the outer cover and the cover door during testing, so that a closed design is realized, the influence of external environment factors on a test result is effectively avoided, and the temperature control unit can be controlled by the cooperation of a centrifugal fan, an electric heating box, a semiconductor chilling plate and a temperature sensor in the temperature control unit. Accurate control over the temperature of the testing environment can be achieved, it is ensured that a testing material is tested under the set temperature condition, and the reliability of the testing result is improved.

Description

Technical Field

[0001] This utility model belongs to the field of compressive strength testing of organic optoelectronic materials, specifically a compressive strength testing device for organic optoelectronic materials. Background Technology

[0002] With the rapid development of science and technology, organic optoelectronic materials have shown great application potential in display technology, lighting technology, energy conversion and information storage due to their unique electrical and optical properties. In order to ensure the stability and reliability of these materials in practical applications, pressure testing devices are used to test their pressure resistance performance to ensure their quality.

[0003] In order to facilitate testing, existing organic optoelectronic material compressive strength testing devices often adopt an exposed design. By placing the material to be tested on the testing stage, the control processor enables the pressure application device to apply controllable and uniform pressure to the material. During the pressure application process, the laser scanner collects material state data and transmits the data to the control processor. The control processor then analyzes the material state data in conjunction with the pressure value to achieve compressive strength testing of organic optoelectronic materials.

[0004] However, existing organic optoelectronic material compressive strength testing devices employ an exposed design, which exposes the material directly to the external environment during the testing process. This makes the material highly susceptible to external environmental factors, especially in environments with large temperature variations. The material's properties may change significantly due to thermal expansion and contraction, leading to a substantial reduction in the accuracy of the test results.

[0005] In summary, this utility model provides a pressure resistance testing device for organic optoelectronic materials to solve the above-mentioned problems. Utility Model Content

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0007] An organic optoelectronic material compressive strength testing device, comprising:

[0008] The detection unit includes a base, an outer cover fixedly connected to the top of the base, a door hinged to the front of the outer cover, an electric cylinder fixedly connected to the top of the outer cover, a stress plate fixedly connected to the output end of the electric cylinder, a laser scanner disposed on the top of the inner cavity of the outer cover, and a microcontroller fixedly connected to one side of the outer cover.

[0009] The temperature control unit includes a connecting box, a centrifugal fan fixedly connected to the back of the inner cavity of the connecting box, an electric heating box connected to the air inlet of the centrifugal fan, an air inlet pipe connected to the bottom of the electric heating box and connected to the outer cover, a three-way pipe connected to the air inlet of the centrifugal fan, a semiconductor cooling chip fixedly connected to the back of the inner cavity of the outer cover and with the other side located in the inner cavity of the connecting box, and a temperature sensor disposed on one side of the inner cavity of the outer cover.

[0010] Furthermore, in this utility model, a limiting groove is provided on the top of the base and in the inner cavity of the outer cover, the front of the connecting box is fixedly connected to the outer cover, a placement box is fixedly connected to the front end of the bottom of the base, and universal wheels are provided around the bottom of the base.

[0011] Furthermore, in this utility model, a viewing window is provided on the front of the cover, and a sealing strip is fixedly connected to the back of the cover. The sealing strip is located in the inner cavity of the outer cover and contacts the inner wall of the outer cover.

[0012] Furthermore, in this utility model, the electric heating box is provided with an electric heating wire inside, the right end of the three-way pipe is connected to the outer cover, and the left end of the three-way pipe is connected to the inner cavity of the connecting box. Solenoid valves are provided on the surfaces of both the left and right ends of the three-way pipe.

[0013] Furthermore, in this utility model, heat dissipation grooves are provided on both sides of the connecting box, and an intercepting net is fixedly connected to the inner cavity of the heat dissipation groove. Heat dissipation fans are provided on both sides of the back of the inner cavity of the connecting box, and a filter screen is provided on the back of the heat dissipation fan.

[0014] Beneficial effects: This utility model has the following beneficial effects:

[0015] This invention isolates the test material from the external environment during testing through an outer cover and a door, achieving a closed design that effectively avoids the influence of external environmental factors on the test results. Furthermore, through the coordinated operation of the centrifugal fan, heating box, semiconductor cooling chip, and temperature sensor in the temperature control unit, precise control of the test environment temperature can be achieved, ensuring that the test material is tested under the set temperature conditions and improving the reliability of the test results. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the outer cover of this utility model in the open state;

[0018] Figure 3 This is a schematic diagram of the structure of the cover door in the rear view of this utility model;

[0019] Figure 4This is a cross-sectional structural diagram of the present invention;

[0020] Figure 5 This is a schematic diagram of the system principle of this utility model.

[0021] In the picture:

[0022] 100. Detection unit; 110. Base; 111. Placement box; 112. Casters; 120. Outer cover; 130. Door; 131. Viewing window; 132. Sealing strip; 140. Electric cylinder; 150. Stress plate; 160. Laser scanner; 170. Microcontroller; 200. Temperature control unit; 210. Connection box; 211. Heat sink; 220. Centrifugal fan; 230. Heating box; 240. Air inlet pipe; 250. T-pipe; 260. Semiconductor cooling chip; 261. Cooling fan; 270. Temperature sensor. Detailed Implementation

[0023] To better understand the technical content of this utility model, specific embodiments are described below in conjunction with the accompanying drawings. Various aspects of this utility model are described in this disclosure with reference to the accompanying drawings, which illustrate numerous illustrative embodiments. The embodiments of this disclosure are not necessarily defined to include all aspects of this utility model. It should be understood that the various concepts and embodiments described above, as well as those described in more detail below, can be implemented in any of many ways, because the concepts and embodiments disclosed in this utility model are not limited to any particular implementation. Furthermore, some aspects of this utility model can be used alone or in any suitable combination with other aspects disclosed in this utility model.

[0024] Example 1

[0025] like Figure 1-5 As shown, this is the first embodiment of the present invention, which provides a compressive strength testing device for organic optoelectronic materials, including...

[0026] The detection unit 100 includes a base 110, an outer cover 120 fixedly connected to the top of the base 110, a door 130 movably connected to the front of the outer cover 120 via a hinge, an electric cylinder 140 fixedly connected to the top of the outer cover 120, a stress plate 150 fixedly connected to the output end of the electric cylinder 140, a laser scanner 160 disposed on the top of the inner cavity of the outer cover 120, and a microcontroller 170 fixedly connected to one side of the outer cover 120.

[0027] The temperature control unit 200 includes a connecting box 210, a centrifugal fan 220 fixedly connected to the back of the inner cavity of the connecting box 210, an electric heating box 230 connected to the air inlet of the centrifugal fan 220, an air inlet pipe 240 connected to the bottom of the electric heating box 230 and connected to the outer cover 120, a three-way pipe 250 connected to the air inlet of the centrifugal fan 220, a semiconductor cooling chip 260 fixedly connected to the back of the inner cavity of the outer cover 120 and located on the other side of the inner cavity of the connecting box 210, and a temperature sensor 270 disposed on one side of the inner cavity of the outer cover 120.

[0028] like Figure 1-5 As shown, by placing the material to be tested inside the outer casing 120, the outer casing 120, in conjunction with the door 130, isolates the material from the external environment, achieving a closed design that effectively avoids the influence of external environmental factors on the test results. The temperature inside the outer casing 120 can be set by the microcontroller 170. By activating the electric heating box 230 or the semiconductor cooling chip 260, the test environment reaches the set temperature through the circulation of the centrifugal fan 220, the air inlet pipe 240, and the three-way pipe 250. The temperature is monitored in real time by the temperature sensor 270 to ensure that the temperature remains constant and reaches the required temperature. The stress plate 150 moves downward by activating the electric cylinder 140, applying controllable and uniform pressure to the test material. During the pressure application process, the laser scanner 160 collects material state data in real time and transmits the data to the microcontroller 170. The microcontroller 170 analyzes the material state data and the pressure value to obtain the test results, thus realizing the pressure resistance test of organic optoelectronic materials.

[0029] Example 2

[0030] Reference Figure 1-3 5, is the second embodiment of this utility model, which is based on the previous embodiment.

[0031] In this embodiment, a limiting groove is provided on the top of the base 110 and in the inner cavity of the outer cover 120. The front of the connecting box 210 is fixedly connected to the outer cover 120. A placement box 111 is fixedly connected to the front end of the bottom of the base 110. Universal wheels 112 are provided around the bottom of the base 110.

[0032] The front of the cover 130 has a viewing window 131, and the back of the cover 130 is fixedly connected to a sealing strip 132. The sealing strip 132 is located in the inner cavity of the outer cover 120 and contacts the inner wall of the outer cover 120. The output terminals of the electric cylinder 140 and the laser scanner 160 are both connected to the input terminal of the microcontroller 170.

[0033] like Figure 1-3As shown in Figure 5, the limiting groove is used to fix and limit the material to be tested, ensuring that the material will not shift or shake during the test, thereby ensuring the accuracy of the test results. The placement box 111 can be used to store auxiliary tools or materials required for the test, improving the convenience of the device. The casters 112 make the device easy to move, facilitating testing or transportation in different locations. The viewing window 131 allows the operator to observe the state of the material during the test without opening the cover 130, thus maintaining the closedness of the test environment. When the cover 130 is closed, the sealing strip 132 is in close contact with the inner wall of the outer cover 120, effectively ensuring the sealing performance.

[0034] Example 3

[0035] Reference Figure 1 , 4 5 and 6 are the third embodiment of this utility model, which is based on the first two embodiments.

[0036] In this embodiment, the heating box 230 is equipped with a heating wire inside. The right end of the three-way pipe 250 is connected to the outer cover 120, and the left end of the three-way pipe 250 is connected to the inner cavity of the connecting box 210. Solenoid valves are provided on the surfaces of the left and right ends of the three-way pipe 250. The input ends of the heating box 230, centrifugal fan 220, semiconductor refrigeration chip 260, temperature sensor 270 and solenoid valves are all connected to the output end of the microcontroller 170. The temperature sensor 270 is a DS18B20, the semiconductor refrigeration chip 260 is a TEC1-12706, and the microcontroller 170 is an ESP32 series microcontroller.

[0037] The connection box 210 has heat dissipation slots 211 on both sides, and the inner cavity of the heat dissipation slots 211 is fixedly connected with an interception net. The back of the inner cavity of the connection box 210 is provided with heat dissipation fans 261 on both sides, and the back of the heat dissipation fans 261 is provided with a filter. The input end of the heat dissipation fan 261 is connected to the output end of the microcontroller 170.

[0038] like Figure 1 , 4 As shown in Figure 5, the airflow channel is provided by the three-way pipe 250, which is connected to the outer cover 120 on the right and to the inner cavity of the connecting box 210 on the left, thereby realizing the airflow. Both ends are equipped with solenoid valves, which can be used to control the airflow. The heating box 230 is equipped with heating wires to generate heat, which is convenient for heating the airflow. The heat dissipation slots 211 on both sides of the connecting box 210 and the heat dissipation fan 261 on the back of the inner cavity can achieve rapid heat dissipation, which can improve the working efficiency and quality of the semiconductor cooling chip 260. The interception net and filter can effectively prevent foreign objects and impurities from entering the inner cavity of the connecting box 210.

[0039] In use, the material to be tested is first placed inside the outer cover 120 and positioned within the limiting groove of the base 110. By pushing the cover door 130, it closes the outer cover 120. The sealing strip 132 ensures a tight seal between the outer cover 120 and the cover door 130, thus isolating the test material from the external environment. This closed design effectively avoids the influence of external environmental factors on the test results. Afterwards, the temperature inside the outer cover 120 can be set via the microcontroller 170. The microcontroller 170 activates the heating box 230 or the thermoelectric cooler 260 based on the temperature monitored by the temperature sensor 270. When heating is required, the centrifugal fan 220, the heating box 230, and the solenoid valve at the left end of the three-way pipe 250 are activated. The centrifugal fan 220 draws air from inside the outer casing 120 into the heating box 230 for heating, and then transmits the heated air to the left end of the three-way pipe 250. The three-way pipe 250 then transmits the hot air into the outer casing 120, achieving air circulation. In hot operation, when cooling is required, the semiconductor cooling chip 260, centrifugal fan 220, and the solenoid valve at the right end of the three-way pipe 250 are activated. The semiconductor cooling chip 260 uses the Peltier effect to cool the inside of the outer casing 120. The centrifugal fan 220, in conjunction with the air inlet pipe 240 and the three-way pipe 250, can circulate the air inside the outer casing 120, achieving both heating and cooling effects. This allows the test environment to reach the set temperature, and the temperature is monitored in real time by the temperature sensor 270 to ensure that the temperature remains constant and reaches the required temperature. When performing compressive strength testing on organic optoelectronic materials, the electric cylinder 140 is activated to move the stress plate 150 downward and apply controllable and uniform pressure to the test material. During the pressure application process, the laser scanner 160 collects material state data in real time and transmits the data to the microcontroller 170. The microcontroller 170 analyzes the material state data and pressure values ​​to obtain the test results, thus realizing the compressive strength testing of organic optoelectronic materials.

[0040] All standard parts used in this application can be purchased from the market, and can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art. The control method is automatic control through a controller. The control circuit of the controller can be implemented by simple programming by those skilled in the art and is common knowledge in the field. Since this application is mainly used to protect mechanical devices, the control method and circuit connection will not be explained in detail in this application.

[0041] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Those skilled in the art to which this invention pertains can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of this invention shall be determined by the claims.

Claims

1. A device for detecting pressure on an organic optoelectronic material, characterized by: Comprising The detection unit (100) comprises a base (110), a cover (120) fixedly connected to the top of the base (110), a cover door (130) movably connected to the front of the cover (120) by a hinge, an electric cylinder (140) fixedly connected to the top of the cover (120), a stress plate (150) fixedly connected to the output end of the electric cylinder (140), a laser scanner (160) arranged at the top of the inner cavity of the cover (120), and a microcontroller (170) fixedly connected to one side of the cover (120); The temperature control unit (200) comprises a connecting box (210), a centrifugal fan (220) fixedly connected to the back of the inner cavity of the connecting box (210), an electric heating box (230) communicated with the air inlet end of the centrifugal fan (220), an air inlet pipe (240) communicated with the bottom of the electric heating box (230) and the cover (120), a three-way pipe (250) communicated with the air inlet end of the centrifugal fan (220), a semiconductor refrigeration sheet (260) fixedly connected to the back of the inner cavity of the cover (120) and located in the inner cavity of the connecting box (210) on the other side, and a temperature sensor (270) arranged on one side of the inner cavity of the cover (120).

2. The device for detecting pressure resistance of organic optoelectronic material according to claim 1, wherein: The top of the base (110) and the inner cavity of the cover (120) are provided with a limiting groove, the front surface of the connecting box (210) is fixedly connected with the cover (120), the front end of the bottom of the base (110) is fixedly connected with a placing box (111), and the periphery of the bottom of the base (110) is provided with universal wheels (112).

3. The device of claim 1, wherein the device is a pressure sensor. The front surface of the cover door (130) is provided with a viewing window (131), the back surface of the cover door (130) is fixedly connected with a sealing strip (132), the sealing strip (132) is located in the inner cavity of the cover (120) and in contact with the inner wall of the cover (120).

4. The apparatus for detecting pressure of the organic optoelectronic material according to claim 1, wherein: The electric heating box (230) is provided with an electric heating wire, the right end of the three-way pipe (250) is communicated with the cover (120), the left end of the three-way pipe (250) is communicated with the inner cavity of the connecting box (210), and the surfaces of the left and right ends of the three-way pipe (250) are provided with electromagnetic valves.

5. The apparatus for detecting pressure of the organic optoelectronic material according to claim 1, wherein: The connecting box (210) is provided with heat dissipation grooves (211) on both sides, and the inner cavities of the heat dissipation grooves (211) are fixedly connected with intercepting nets, and the back surfaces of the heat dissipation fans (261) are provided with filter screens.

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