Iron core TMR sensor

Abstract

The utility model provides an iron core TMR sensor, which relates to the technical field of sensors and comprises a shell, a monitoring assembly and a power supply assembly. Wherein the shell comprises an upper shell assembly and a lower shell assembly, one end of the upper shell assembly is hinged to one end of the lower shell assembly, the other end of the upper shell assembly is connected with the other end of the lower shell assembly through a releasable locking assembly, and a cable fixing hole for a cable to penetrate through is formed after closing; the monitoring assembly comprises a TMR current monitoring chip, an upper iron core magnetic ring arranged in the upper shell assembly, and a lower iron core magnetic ring and a circuit mainboard which are arranged in the lower shell assembly, and the TMR current monitoring chip is arranged on the top surface of the end part of the upper iron core magnetic ring or the lower iron core magnetic ring and is electrically connected with the circuit mainboard; the power supply assembly is arranged in the shell and is electrically connected with the circuit mainboard; and after the shell is closed, the upper iron core magnetic ring and the lower iron core magnetic ring form an annular structure with a gap, so that the annular structure, the TMR current monitoring chip and the circuit mainboard form a monitoring closed loop together. Therefore, the sensor has the advantages of being convenient to install and use and high in sensing precision.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, and in particular to an iron-core TMR sensor. Background Technology

[0002] In existing technologies, such as the IoT smart current and temperature sensing element disclosed in Chinese Patent Publication No. CN113009205A, current and voltage are detected or monitored when a cable passes through a sensor using a Rogowski coil. However, Rogowski coils suffer from problems such as large size, low integration, and difficulty in integrating with other components, making it difficult to meet the current demand for miniaturization and modularization in monitoring equipment.

[0003] Therefore, some have considered using tunnel magnetoresistive (TMR) technology, which has advantages such as high sensitivity, low power consumption, good stability, and wide response frequency, to replace Rogowski coils for monitoring physical quantities such as current and voltage. However, existing TMR sensors are mostly enclosed or integrated designs, which are inconvenient in terms of cable laying, sensor maintenance, and replacement, limiting their flexible application in practical engineering.

[0004] Therefore, a TMR sensor with an iron core that is easy to install and use and has high sensing accuracy needs to be designed. Utility Model Content

[0005] The purpose of this invention is to address the deficiencies and shortcomings of the existing technology by providing an iron-core TMR sensor, which solves at least one of the aforementioned technical problems. It has the advantages of being easy to install and use, and having high sensing accuracy.

[0006] To achieve the above objectives, this utility model provides an iron-core TMR sensor, comprising:

[0007] The housing includes an upper housing assembly and a lower housing assembly, wherein one end of the upper housing assembly and the lower housing assembly are hinged to each other and the other end is connected by a releasable locking assembly, forming a cable-fixing hole for cable to pass through when closed;

[0008] The monitoring component includes a TMR current monitoring chip, an upper iron core magnetic ring disposed in the upper shell assembly, a lower iron core magnetic ring disposed in the lower shell assembly, and a circuit board. The TMR current monitoring chip is disposed on the top surface of the end of the upper iron core magnetic ring or the lower iron core magnetic ring and is electrically connected to the circuit board.

[0009] The power supply component is located inside the housing and is electrically connected to the circuit board.

[0010] When the housing is closed, the upper iron core magnetic ring and the lower iron core magnetic ring form a ring structure with a gap, so as to form a monitoring closed loop together with the TMR current monitoring chip and the circuit motherboard.

[0011] Optionally, the TMR current monitoring chip is disposed on the top surface of the end of the lower iron core magnetic ring, and is electrically connected to the circuit main board through a TMR chip flexible board partially attached to one side of the lower iron core magnetic ring.

[0012] Optionally, the lower shell assembly includes a lower outer shell and a bottom shell that are disposed together, and a lower inner shell located between the lower outer shell and the bottom shell;

[0013] A voltage sensing FPC board is embedded between the lower outer shell and the lower inner shell. The voltage sensing FPC board integrates a temperature measuring chip and is electrically connected to the circuit motherboard.

[0014] The upper arc surface of the lower outer shell has a protrusion corresponding to the temperature measuring chip.

[0015] Optionally, the power supply component is an energy harvesting magnetic ring assembly, which includes an upper magnetic ring, a lower magnetic ring, and an energy harvesting coil;

[0016] The upper magnetic ring is installed inside the upper shell assembly, and at least a portion of both ends of the upper magnetic ring are exposed on the lower end face of the upper shell assembly.

[0017] The lower magnetic ring is installed inside the lower shell assembly, and at least a portion of both ends of the lower magnetic ring are exposed on the upper surface of the lower shell assembly.

[0018] After the upper shell assembly and the lower shell assembly are closed, the two ends of the upper magnetic ring and the lower magnetic ring are connected to form a closed ring magnetic circuit structure.

[0019] The energy harvesting coil is wound around the outside of the annular magnetic circuit structure and electrically connected to the main circuit board.

[0020] Optionally, the upper shell assembly is provided with a third arc-shaped groove for mounting the upper magnetic ring;

[0021] An arc-shaped spring is provided between the inner circumference of the upper magnetic ring and the wall of the third arc-shaped groove, and an elastic tube is provided between the outer circumference of the upper magnetic ring and the wall of the third arc-shaped groove.

[0022] Optionally, the upper shell assembly is provided with a copper foil and a spring probe connected to the copper foil, and at least a portion of one end of the spring probe is exposed on the lower end face of the upper shell assembly;

[0023] The lower housing assembly contains pins that are connected to the main circuit board, with at least a portion of one end exposed on the upper surface of the lower housing assembly.

[0024] After the upper shell assembly and the lower shell assembly are closed, the spring probe is connected to the pin and forms an anti-interference circuit with the copper foil and the circuit board.

[0025] Optionally, a first sealing ring is provided between the lower outer shell and the bottom shell;

[0026] A second sealing ring is provided on the outer periphery of the pin and between the lower inner shell and the lower outer shell;

[0027] The lower inner shell and the lower outer shell are fixed by a threaded connector, and a third sealing ring is provided at the threaded connection between the two.

[0028] Optionally, the upper shell assembly is provided with a groove that extends radially and communicates with the fixing hole;

[0029] It also includes an elastic clamping element that can be telescopically installed within the groove, for adapting to and clamping cables of different diameters.

[0030] Optionally, the releasable locking assembly includes a buckle disposed on one of the upper shell assembly or the lower shell assembly, and a latch disposed on the other for engaging with the buckle;

[0031] It also includes hooks located on both sides of the lower housing assembly and extending outward for securing the housing to the cable with cable ties.

[0032] Optionally, the circuit board has a built-in surface-mount LED, and the bottom shell has a light-transmitting hole corresponding to the position of the surface-mount LED, with a light guide installed on the light-transmitting hole.

[0033] Compared with the prior art, the advantages of this application are:

[0034] This iron-core TMR sensor employs a housing structure with one hinged end and a release lockable end, allowing the upper and lower housing assemblies to open and close freely, facilitating cable routing and the installation, maintenance, and replacement of the TMR sensor. Furthermore, this iron-core TMR sensor uses a closed-loop monitoring circuit consisting of an upper iron core magnetic ring, a lower iron core magnetic ring, a circuit board, and a TMR current monitoring chip instead of a traditional Rogowski coil, enabling high-precision sensing of current signals in the cable. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0036] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model, wherein the shell is in a closed state;

[0037] Figure 2 This is a structural schematic diagram of an embodiment of the present utility model, wherein the housing is in an open state;

[0038] Figure 3 This is an exploded view of a portion of the structure of an embodiment of the present utility model;

[0039] Figure 4 This is an exploded view of a portion of the structure of an embodiment of the present utility model from another perspective;

[0040] Figure 5 This is an exploded view of a portion of the structure of an embodiment of the present utility model;

[0041] Figure 6 This is an exploded view of the upper shell assembly according to an embodiment of the present utility model;

[0042] Figure 7 This is an exploded view of a portion of the structure of an embodiment of the present utility model from another perspective;

[0043] Figure 8 This is an exploded view of the structure of the iron core magnetic ring, TMR current monitoring chip, and TMR chip flexible circuit board in an embodiment of this utility model.

[0044] Figure 9 This is a top view of an embodiment of the present utility model.

[0045] Figure 10 for Figure 9 Schematic diagram of the cross-sectional structure along line AA in the middle;

[0046] Figure 11 for Figure 9 Schematic diagram of the cross-sectional structure along the BB line in the middle;

[0047] Figure 12 for Figure 9 Schematic diagram of the cross-sectional structure along the CC line;

[0048] Figure 13 for Figure 9 Schematic diagram of the cross-sectional structure along the DD line in the middle;

[0049] Explanation of reference numerals in the attached figures

[0050] 100-iron-core TMR sensor;

[0051] 1-Housing shell; o1-Fixing hole;

[0052] 11-Upper shell assembly; 111-Upper shell base; 1111-Rotating seat; 112-Upper shell cover; 1121-Connecting plate; c1-First arc-shaped groove; 113-First rotating shaft; c2-Third arc-shaped groove; c3-Sliding groove;

[0053] 12-Lower shell assembly; 121-Lower outer shell; 1211-Protrusion; 122-Lower inner shell; c4-Assembly groove; 123-Bottom shell; o2-Light transmission hole; 124-Pressure plate; d-Assembly cavity; c5-Second arc groove; c6-Rotating groove; o3-Shaft hole; c7-Fourth arc groove; c8-Groove; 126-Hanging ear; 127-Light guide post;

[0054] 2-Releasable locking component; 21-Snap-on; 22-Bayonet;

[0055] 31-Upper iron core magnetic ring; 32-Lower iron core magnetic ring; 33-Circuit main board; 331-Surface mount LED; 34-TMR current monitoring chip; 35-TMR chip flexible circuit board;

[0056] 4-Voltage sensing FPC board; 41-Temperature sensing chip; 42-Long strip branch;

[0057] 51-Upper magnetic ring; 52-Lower magnetic ring; 53-Energy harvesting coil;

[0058] 61-Arc-shaped spring sheet; 62-Elastic tube;

[0059] 71-Copper foil; 72-Spring probe; 73-Pin;

[0060] 81-First sealing ring; 82-Second sealing ring; 83-Third sealing ring; 84-Threaded connector;

[0061] 91-Elastic clamping element; 911-Spring; 912-Pressure block; 92-Grounding clamp. Detailed Implementation

[0062] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0063] It should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," "back," "side," and "circumferential" used in this utility model to indicate the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used to distinguish multiple parts or structures with the same or similar structures, and do not indicate any special limitation on the arrangement order or connection relationship.

[0064] Please refer to Figures 1 to 13 This utility model provides a core TMR sensor 100, including: a housing 1, a monitoring component and a power supply component.

[0065] The housing 1 includes an upper housing assembly 11 and a lower housing assembly 12. One end of the upper housing assembly 11 and the lower housing assembly 12 are hinged together, and the other end is connected by a releasable locking assembly 2. When the housing 1 is closed, i.e., when the upper housing assembly 11 and the lower housing assembly 12 are closed, a cable-holding hole o1 is formed for a cable (not shown in the figure) to pass through. It can be understood that the housing 1 is generally ring-shaped, but it is not limited to a circular ring; it can also be a square ring, as long as it forms a cable-holding hole o1 when closed. The releasable locking assembly 2 can be a snap-fit, a lock, a threaded fastener, etc., to quickly lock or open the housing 1 when needed.

[0066] The monitoring components include: a TMR current monitoring chip 34, an upper iron core magnetic ring 31, a lower iron core magnetic ring 32, and a circuit board 33. The upper iron core magnetic ring 31 is located within the upper housing assembly 11. The lower iron core magnetic ring 32, the TMR current monitoring chip 34, and the circuit board 33 are all located within the lower housing assembly 12. The TMR current monitoring chip 34 is located on the top end of the lower iron core magnetic ring 32 and is electrically connected to the circuit board 33. Alternatively, in some embodiments, the TMR current monitoring chip 34 may also be located within the upper housing assembly 11, on the top end of the upper iron core magnetic ring 31, and electrically connected to the circuit board 33 via a tunnel structure on the upper housing assembly 11 and the lower housing assembly 12 and a flexible connection structure; no specific limitations are imposed here.

[0067] The power supply component is located inside the housing 1 and electrically connected to the circuit board 33 to power the monitoring component. Understandably, the power supply component can be a battery, and / or an energy harvesting magnetic ring component that is electrically connected to the circuit board 33 and located inside the upper housing assembly 11 and the lower housing assembly 12, forming a magnetic ring structure around the cable after the housing 1 is closed, so that energy can be harvested and powered by sensing the current in the cable.

[0068] After the housing 1 is closed, the upper iron core magnetic ring 31 and the lower iron core magnetic ring 32 form a ring structure with a gap, which together with the TMR current monitoring chip 34 and the circuit board 33 forms a closed monitoring loop. Understandably, the upper iron core magnetic ring 31 and the lower iron core magnetic ring 32 are positioned correspondingly on one side of the housing 1. After the housing 1 is closed, the cable can be fixed in the cable fixing hole o1. At this time, the upper iron core magnetic ring 31 and the lower iron core magnetic ring 32 form a ring structure with a gap, and the TMR current monitoring chip 34 is located precisely at the gap position of the ring structure. When current flows through the cable, according to Ampere's circuital law, a magnetic field is generated around the cable. The magnetic lines of force are concentrated and distributed within the ring structure to form magnetic flux, and a magnetic induction intensity is generated at the gap of the ring structure. Because the TMR (tunneling magnetoresistive) current monitoring chip 34 has a tunneling magnetoresistive effect that is highly sensitive to changes in the magnetic field, its output resistance changes with the change of the external magnetic field, thus enabling accurate sensing of the magnetic field strength.

[0069] The TMR current monitoring chip 34 senses changes in the magnetic field strength at the gap, converts it into an electrical signal proportional to the cable current, and transmits it to the main circuit board 33. The main circuit board 33 receives and processes this signal, and combined with internal algorithms, enables real-time monitoring and analysis of electrical parameters such as voltage, current, fault waveforms, and harmonics in the cable, thereby achieving dynamic perception of the cable's operating status and intelligent operation and maintenance support. Understandably, the method by which the TMR current monitoring chip 34 senses the current, the transmission of the electrical signal to the main circuit board 33, and the algorithm by which the main circuit board 33 processes the signal are all existing technologies, and therefore will not be elaborated upon here.

[0070] Thus, the iron-core TMR sensor 100, by employing a housing 1 structure with one end hinged and the other end releasable and lockable, allows the upper housing assembly 11 and the lower housing assembly 12 to open and close freely, facilitating cable routing and the installation, maintenance, and replacement of the TMR sensor. Furthermore, the iron-core TMR sensor 100 uses a monitoring closed loop composed of an upper iron-core magnetic ring 31, a lower iron-core magnetic ring 32, a circuit board 33, and a TMR current monitoring chip 34 instead of a traditional Rogowski coil, enabling high-precision sensing of current signals in the cable.

[0071] To further improve the structural compactness and electrical connection reliability of the iron-core TMR sensor 100, please refer to... Figure 5 , Figure 8 , Figure 13In this embodiment, the TMR current monitoring chip 34 is disposed on the top surface of the end of the lower iron core magnetic ring 32, and is electrically connected to the circuit main board 33 through a flexible connection structure, namely the TMR chip flexible board 35. A portion of the TMR chip flexible board 35 is attached to the side of the lower iron core magnetic ring 32 to form a stable lead-out path. Because the mounting method of the TMR chip flexible board 35 has good flexibility and shock resistance, it can effectively adapt to the internal spatial layout of the housing 1, avoiding connection breakage or poor contact caused by external forces, vibration, or thermal expansion and contraction.

[0072] Alternatively, please refer to Figures 5 to 7 In this embodiment, the upper shell assembly 11 has a first arc-shaped groove c1 for mounting the upper iron core magnetic ring 31, and the lower shell assembly 12 has an assembly cavity d for mounting the lower iron core magnetic ring 32 and the circuit board 33. Optionally, the upper shell assembly 11 includes an upper shell base 111 and an upper shell cover 112. After the upper shell base 111 and the upper shell cover 112 are assembled, the first arc-shaped groove c1 is formed inside. The lower shell assembly 12 includes a lower outer shell 121, a bottom shell 123, and a lower inner shell 122. The lower outer shell 121 and the bottom shell 123 are fitted together, specifically through a snap-fit ​​structure. The lower inner shell 122 is located between the lower outer shell 121 and the bottom shell 123. Specifically, the lower inner shell 122 can be fixed to the lower outer shell 121 by screws. Specifically, a second arc-shaped groove c5 is formed inside the lower inner shell 122, and the lower iron core magnetic ring 32 is assembled in the second arc-shaped groove c5. The lower iron core magnetic ring 32 is then pressed onto the lower inner shell 122 by the pressure plate 124.

[0073] Alternatively, please refer to Figure 3 Figure 4 In this embodiment, the upper end face of the lower shell assembly 12 is provided with a rotating groove c6, and the inner walls on both sides of the rotating groove c6 are provided with shaft holes o3. The upper shell assembly 11 is provided with a rotating seat 1111 that mates with the rotating groove c6, and the rotating seat 1111 has first rotating shafts 113 extending outward on both sides and rotatably engaging with the shaft holes o3. Thus, the upper shell assembly 11 and the lower shell assembly 12 are hinged by the engagement of the first rotating shafts 113 on the rotating seat 1111 with the shaft holes o3 on the inner walls on both sides of the rotating groove c6.

[0074] To achieve real-time monitoring of cable voltage and stability, optionally, please refer to... Figure 3 , Figure 5 and Figure 10In this embodiment, a voltage sensing FPC board 4 is embedded between the lower outer shell 121 and the lower inner shell 122. The voltage sensing FPC board 4 integrates a temperature sensing chip 41 and is electrically connected to the circuit board 33. Specifically, a long strip branch 42 is located on one side of the lower voltage sensing FPC board 4, which passes through the lower inner shell 122 and is electrically connected to the circuit board 33. A protrusion 1211 is provided on the upper arc surface of the lower outer shell 121 corresponding to the temperature sensing chip 41, thus enabling the TMR sensor to form a non-contact temperature sensing and voltage measurement closed loop. Specifically, an assembly groove c4 is provided on the arc-shaped upper surface of the lower inner shell 122. The voltage sensing FPC board 4 is embedded in the assembly groove c4 and sandwiched between the lower outer shell 121 and the lower inner shell 122. This effectively prevents measurement deviations or structural loosening of the voltage sensing FPC board 4 due to vibration or displacement. Understandably, the voltage-sensing FPC board 4 achieves non-contact sensing of the cable conductor voltage through a capacitive coupling structure formed with the cable passing through the housing 1 of the iron-core TMR sensor 100. When the cable is energized, its conductor generates an alternating electric field in the surrounding space. After the voltage-sensing FPC board 4 is deployed close to the cable, a small capacitive coupling is formed between it and the cable, thereby sensing the voltage signal corresponding to this alternating electric field. Specifically, the sensing of cable voltage by the voltage-sensing FPC board 4 is existing technology, and therefore will not be elaborated upon here.

[0075] To achieve self-powered operation of this TMR sensor, optionally, please refer to... Figure 5 and Figure 11 In this embodiment, the power supply component is an energy-harvesting magnetic ring assembly, which includes an upper magnetic ring 51, a lower magnetic ring 52, and an energy-harvesting coil 53. The upper magnetic ring 51 is installed inside the upper shell assembly 11, with at least a portion of both ends exposed on the lower end face of the upper shell assembly 11; the lower magnetic ring 52 is installed inside the lower shell assembly 12, with at least a portion of both ends exposed on the upper end face of the lower shell assembly 12; after the upper shell assembly 11 and the lower shell assembly 12 are closed, the upper magnetic ring 51 and the lower magnetic ring 52 are connected at both ends to form a closed annular magnetic circuit structure; the energy-harvesting coil 53 is wound around the outside of the annular magnetic circuit structure and is electrically connected to the circuit board 33. Specifically, in this embodiment, the energy-harvesting coil 53 is wound around the lower magnetic ring 52, which simplifies the structure. Because of the energy-harvesting magnetic ring assembly, energy can be induced from the cable using the principle of electromagnetic induction to achieve self-powering of the TMR sensor.

[0076] To facilitate the installation of the upper magnetic ring 51 and avoid problems such as easy damage from stress, optionally, please refer to... Figures 5 to 7 and Figure 11In this embodiment, the upper shell assembly 11 is provided with a third arc-shaped groove c2 for mounting the upper magnetic ring 51. Specifically, the third arc-shaped groove c2 is also formed by assembling the upper shell base 111 and the upper shell cover 112. Further, an arc-shaped spring piece 61 is provided between the inner circumference of the upper magnetic ring 51 and the groove wall of the third arc-shaped groove c2, and an elastic tube 62 is provided between the outer circumference of the upper magnetic ring 51 and the groove wall of the third arc-shaped groove c2. Thus, during installation, the arc surface of the upper magnetic ring 51 can rotate within the third arc-shaped groove c2. The arc-shaped spring piece 61 and the elastic tube 62 allow the upper magnetic ring 51 to flexibly adjust the smoothness of rotation and the position of the sliding axis point within the third arc-shaped groove c2; at the same time, it can elastically change the distance between the upper magnetic ring 51 and the lower magnetic ring 52 to avoid damage from force when encountering impact.

[0077] To facilitate the installation of the lower magnetic ring 52 and avoid its susceptibility to damage from stress, optionally, please refer to... Figure 7 In this embodiment, the lower component is provided with a fourth arc-shaped groove c7 for mounting the lower magnetic ring 52. Specifically, the fourth arc-shaped groove c7 is also formed after the upper housing seat 111 and the upper housing cover 112 are assembled. Specifically, the lower inner housing 122 has a fourth arc-shaped groove c7 formed inside it, the lower magnetic ring 52 is assembled in the fourth arc-shaped groove c7, and then the lower magnetic ring 52 is pressed onto the lower inner housing 122 by the pressure plate 124.

[0078] To improve the signal stability of the iron-core TMR sensor 100 and enhance the system's anti-interference capability, optionally, please refer to... Figure 5 and Figure 10 In this embodiment, the upper shell assembly 11 also includes a copper foil 71 and a spring probe 72, with the copper foil 71 connected to the spring probe 72. At least a portion of one end of the spring probe 72 is exposed on the lower end face of the upper shell assembly 11. The lower shell assembly 12 includes a pin 73. The pin 73 is connected to the main circuit board 33, and at least a portion of one end is exposed on the upper end face of the lower shell assembly 12. After the upper shell assembly 11 and the lower shell assembly 12 are closed, the spring probe 72 and the pin 73 are connected, forming an anti-interference circuit with the copper foil 71 and the main circuit board 33. Specifically, in this embodiment, the spring probe 72 and the pin 73 are correspondingly positioned at the end of the shell 1 furthest from the hinge end. Of course, in other embodiments, the spring probe 72 and the pin 73 are correspondingly positioned at the end of the shell 1 furthest from the hinge end. No specific limitations are imposed here.

[0079] To improve the waterproof performance of the TMR sensor 100 with its iron core, optionally, please refer to... Figure 5 and Figure 10In this embodiment, a first sealing ring 81 is provided between the lower outer shell 121 and the bottom shell 123. A second sealing ring 82 is provided around the outer periphery of the pin 73, located between the lower inner shell 122 and the lower outer shell 121. The lower inner shell 122 and the lower outer shell 121 are fixed by a threaded connector 84, and a third sealing ring 83 is provided at the threaded connection between them. Thus, the reliability of the iron-core TMR sensor 100 can be improved in harsh environments such as outdoors, humidity, and dust through the three-layer sealing structure. Furthermore, waterproof sealant can be applied to the gaps between the two ends of the lower magnetic ring 52 and the lower outer shell 121, and to the gaps between the two ends of the upper magnetic ring 51 and the upper shell seat 111 to further improve the waterproof performance.

[0080] To accommodate cables of different diameters, please refer to [reference needed]. Figure 4 and Figure 5 In this embodiment, the upper shell assembly 11 is provided with a radially extending groove c3 that connects to the wire hole; the iron core TMR sensor 100 also includes an elastic clamping member 91 that can be telescopically disposed within the groove c3, for adapting to and clamping cables of different diameters. Specifically, the elastic clamping member 91 may include a spring 911 and a pressure block 912; one end of the spring 911 is connected to the upper shell cover 112, and the other end is connected to the pressure block 912; thus, the pressure block 912 can telescopically move within the groove c3 to adapt to and clamp cables of different diameters.

[0081] To facilitate the locking or separation of the upper housing assembly 11 and the lower housing assembly 12, and to improve the cable securing effect, optionally, please refer to... Figure 1 and Figure 2 In this embodiment, the releasable locking component 2 includes a latch 21 and a latch 22. The latch 21 is located on the lower shell component 12, and the latch 22 that engages with the latch 21 is correspondingly located on the upper shell component 11. Specifically, the lower shell 121 of the lower shell component 12 has a groove c8 on its outer wall away from the hinge end, and two latches 21 are provided on the groove c8; the upper shell cover 112 of the upper shell component 11 has a connecting plate 1121 that extends downward and engages with the groove c8 on its corresponding side, and the latch 22 that engages with the latches 21 is located on the connecting plate 1121. Of course, in some other embodiments, the latch 21 may also be located on the upper shell component 11, and the corresponding latch 21 may be located on the lower shell component 12, which is not specifically limited here.

[0082] The iron-core TMR sensor 100 also includes hooks 126 located on both sides of the lower housing assembly 12 and extending outward for securing the housing 1 to the cable using cable ties (not shown). Thus, after the iron-core TMR sensor 100 secures the cable by closing the upper housing assembly 11 and lower housing assembly 12 with the releasable locking assembly 2, the cable under test can be further secured by clamping it with cable ties using the hooks 126 on both sides.

[0083] Optionally, in this embodiment, the circuit board 33 has a built-in wireless communication module, such as Bluetooth, Wi-Fi, LoRa, etc., enabling the TMR sensor to wirelessly transmit data with external supporting devices (not shown in the figure). Understandably, the circuit board 33 also includes a power management module, a sensing module, a diagnostic module, an application control module, and a microprocessor chip, enabling the TMR sensor to monitor the data information of the measured object in real time and perform corresponding storage and transmission. Specifically, the inclusion of the aforementioned modules on the circuit board 33 is a conventional technical means in the art, and therefore will not be elaborated upon here.

[0084] To facilitate observation of the TMR sensor's operating status, optionally, please refer to... Figure 5 and Figure 7 In this embodiment, a surface-mount LED 331 is built into the circuit board 33, and a light-transmitting hole o2 is provided on the bottom shell 123 at the position corresponding to the surface-mount LED 331. A light guide post 127 is installed on the light-transmitting hole o2. In this way, the operator can directly understand the operating status of the iron core TMR sensor 100 by observing the display of the surface-mount LED 331.

[0085] Alternatively, please refer to Figure 1 and Figure 5 In this embodiment, the TMR sensor also includes a grounding clamp 92. The grounding clamp 92 is electrically connected to the circuit board 33, thus enabling the iron-core TMR sensor 100 to form a grounding loop and improving safety.

[0086] The working process and principle / assembly steps of this utility model embodiment are roughly as follows:

[0087] After the iron-core TMR sensor 100 fixes the cable to the wire hole via the releasable locking assembly 2 on the housing 1, a ring-shaped magnetic field is generated around the cable when current flows within it. The TMR current monitoring chip 34, located inside the housing 1 and within the gap between the upper iron-core magnetic ring 31 and the lower iron-core magnetic ring 32, senses the change in the magnetic field and outputs an electrical signal reflecting the change in current. The circuit board 33 then reads, amplifies, filters, and processes the signal output by the TMR current monitoring chip 34, converting it into digital or analog signals representing physical quantities such as current and voltage. This enables the monitoring of the cable.

[0088] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the substance of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A core-driven TMR sensor, characterized in that, include: The housing includes an upper housing assembly and a lower housing assembly, wherein one end of the upper housing assembly and the lower housing assembly are hinged to each other and the other end is connected by a releasable locking assembly, forming a cable-fixing hole for cable to pass through when closed; The monitoring component includes a TMR current monitoring chip, an upper iron core magnetic ring disposed in the upper shell assembly, a lower iron core magnetic ring disposed in the lower shell assembly, and a circuit board. The TMR current monitoring chip is disposed on the top surface of the end of the upper iron core magnetic ring or the lower iron core magnetic ring and is electrically connected to the circuit board. The power supply component is located inside the housing and is electrically connected to the circuit board. When the housing is closed, the upper iron core magnetic ring and the lower iron core magnetic ring form a ring structure with a gap, so as to form a monitoring closed loop together with the TMR current monitoring chip and the circuit motherboard.

2. The iron-core TMR sensor as described in claim 1, characterized in that, The TMR current monitoring chip is disposed on the top surface of the end of the lower iron core magnetic ring, and is electrically connected to the circuit main board through a TMR chip flexible board partially attached to one side of the lower iron core magnetic ring.

3. The iron-core TMR sensor as described in claim 2, characterized in that, The lower shell assembly includes a lower outer shell and a bottom shell that are covered together, and a lower inner shell located between the lower outer shell and the bottom shell; A voltage sensing FPC board is embedded between the lower outer shell and the lower inner shell. The voltage sensing FPC board integrates a temperature measuring chip and is electrically connected to the circuit motherboard. The upper arc surface of the lower outer shell has a protrusion corresponding to the temperature measuring chip.

4. The iron-core TMR sensor as described in claim 1, characterized in that, The power supply component is an energy harvesting magnetic ring assembly, which includes an upper magnetic ring, a lower magnetic ring, and an energy harvesting coil. The upper magnetic ring is installed inside the upper shell assembly, and at least a portion of both ends of the upper magnetic ring are exposed on the lower end face of the upper shell assembly. The lower magnetic ring is installed inside the lower shell assembly, and at least a portion of both ends of the lower magnetic ring are exposed on the upper surface of the lower shell assembly. After the upper shell assembly and the lower shell assembly are closed, the two ends of the upper magnetic ring and the lower magnetic ring are connected to form a closed ring magnetic circuit structure. The energy harvesting coil is wound around the outside of the annular magnetic circuit structure and electrically connected to the main circuit board.

5. The iron-core TMR sensor as described in claim 4, characterized in that, The upper shell assembly is provided with a third arc-shaped groove for mounting the upper magnetic ring; An arc-shaped spring is provided between the inner circumference of the upper magnetic ring and the wall of the third arc-shaped groove, and an elastic tube is provided between the outer circumference of the upper magnetic ring and the wall of the third arc-shaped groove.

6. The iron-core TMR sensor as described in claim 3, characterized in that, The upper shell assembly contains a copper foil and a spring probe connected to the copper foil, with at least a portion of one end of the spring probe exposed on the lower end face of the upper shell assembly. The lower housing assembly contains pins that are connected to the main circuit board, with at least a portion of one end exposed on the upper surface of the lower housing assembly. After the upper shell assembly and the lower shell assembly are closed, the spring probe is connected to the pin and forms an anti-interference circuit with the copper foil and the circuit board.

7. The iron-core TMR sensor as described in claim 6, characterized in that, A first sealing ring is provided between the lower outer shell and the bottom shell; A second sealing ring is provided on the outer periphery of the pin and between the lower inner shell and the lower outer shell; The lower inner shell and the lower outer shell are fixed by a threaded connector, and a third sealing ring is provided at the threaded connection between the two.

8. The iron-core TMR sensor as described in claim 1, characterized in that, The upper shell assembly is provided with a groove that extends radially and communicates with the fixing hole; It also includes an elastic clamping element that can be telescopically installed within the groove, for adapting to and clamping cables of different diameters.

9. The iron-core TMR sensor as described in claim 1, characterized in that, The releasable locking assembly includes a buckle on one of the upper shell assembly or the lower shell assembly, and a latch on the other shell assembly that engages with the buckle. It also includes hooks located on both sides of the lower housing assembly and extending outward for securing the housing to the cable with cable ties.

10. The iron-core TMR sensor as described in claim 3, characterized in that, The circuit board has a built-in surface-mount LED, and the bottom shell has a light-transmitting hole corresponding to the position of the surface-mount LED, with a light guide installed on the light-transmitting hole.

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