TMR sensor

Abstract

The utility model provides a TMR sensor, which relates to the technical field of sensors and comprises a shell, a monitoring mechanism and a power supply assembly. Wherein the shell comprises an upper shell assembly and a lower shell assembly, one end of the upper shell assembly is hinged to one end of the lower shell assembly, the other end of the upper shell assembly is connected with the other end of the lower shell assembly through a releasable locking assembly, and after the upper shell assembly and the lower shell assembly are closed, a cable hole allowing a cable to penetrate through is formed; the monitoring mechanism comprises a TMR chip packaging assembly arranged in the upper shell assembly, a TMR chip lower plate and a circuit mainboard, wherein the TMR chip lower plate and the circuit mainboard are arranged in the lower shell assembly and are electrically connected with each other. The power supply assembly is arranged in the shell, is electrically connected with the circuit mainboard and is used for supplying power to the monitoring mechanism; the TMR chip packaging assembly is electrically connected with the TMR chip lower plate through a connecting structure at the hinged end of the shell, and the TMR chip packaging assembly and the circuit mainboard form a monitoring closed loop together. Therefore, the device has the advantages of being convenient to install and use and stable in data transmission.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, and in particular to a TMR sensor. Background Technology

[0002] In existing technologies, such as the IoT smart current and temperature sensing element disclosed in Chinese Patent Publication No. CN113009205A, current and voltage are detected or monitored when a cable passes through a sensor using a Rogowski coil. However, Rogowski coils suffer from problems such as large size, low integration, and difficulty in integrating with other components, making it difficult to meet the current demand for miniaturization and modularization in monitoring equipment.

[0003] Therefore, some have considered using tunnel magnetoresistive (TMR) technology, which has advantages such as high sensitivity, low power consumption, good stability, and wide response frequency, to replace Rogowski coils for monitoring physical quantities such as current and voltage. However, existing TMR sensor structures are mostly enclosed or integrated designs, which are inconvenient in terms of cable routing, sensor maintenance and replacement, and the stability of the data transmission interface is easily affected by the opening and closing of the structure, limiting its flexible application in practical engineering.

[0004] Therefore, a TMR sensor that is easy to install and use and provides stable data transmission needs to be designed. Utility Model Content

[0005] The purpose of this invention is to address the deficiencies and shortcomings of the existing technology by providing a TMR sensor that solves at least one of the aforementioned technical problems. It has the advantages of being easy to install and use, and providing stable data transmission.

[0006] To achieve the above objectives, this utility model provides a TMR sensor, comprising:

[0007] The housing includes an upper housing assembly and a lower housing assembly. One end of the upper housing assembly and the lower housing assembly are hinged to each other, and the other end is connected by a releasable locking assembly. When the upper housing assembly and the lower housing assembly are closed, they form a wire hole for cables to pass through.

[0008] The monitoring mechanism includes a TMR chip packaging assembly located within the upper shell assembly, and a TMR chip lower board and a circuit main board located within the lower shell assembly and electrically connected thereto.

[0009] A power supply component is disposed inside the housing and electrically connected to the main circuit board for supplying power to the monitoring mechanism;

[0010] The TMR chip packaging assembly and the lower TMR chip board are electrically connected through the connection structure of the housing hinge end, and together with the circuit motherboard, they form a monitoring closed loop.

[0011] Optionally, the upper shell assembly has a first arcuate groove for mounting the TMR chip packaging assembly, and the lower shell assembly has an assembly cavity for mounting the lower TMR chip board and the circuit board.

[0012] The connection structure includes:

[0013] The first tunnel is located in the upper shell assembly and opens at the hinge end of the shell, and communicates with the first arc-shaped groove;

[0014] The second tunnel is located in the lower shell assembly, opens at the hinge end of the shell, and communicates with the assembly cavity;

[0015] A flexible electrical connector is inserted through the first tunnel and the second tunnel, with one end connected to the TMR chip packaging assembly and the other end connected to the TMR chip lower plate.

[0016] Optionally, the upper end face of the lower shell assembly is provided with a rotating groove, and the inner walls on both sides of the rotating groove are provided with shaft holes;

[0017] The upper shell assembly is provided with a rotating seat that mates with the rotating groove, and the rotating seat has first rotating shafts on both sides that extend outward and rotatably mate with the shaft hole;

[0018] The opening of the first tunnel is located on the lower end face of the rotating seat, and the opening of the second tunnel is located on the upper end face of the rotating groove; the two are arranged opposite to each other.

[0019] Optionally, the lower shell assembly includes a lower outer shell and a bottom shell that are disposed together, and a lower inner shell located between the lower outer shell and the bottom shell;

[0020] A voltage sensing FPC board is embedded between the lower outer shell and the lower inner shell. The voltage sensing FPC board integrates a temperature measuring chip and is electrically connected to the circuit motherboard.

[0021] The upper arc surface of the lower outer shell has a protrusion corresponding to the temperature measuring chip.

[0022] Optionally, the power supply component is an energy harvesting magnetic ring assembly, which includes an upper magnetic ring, a lower magnetic ring, and an energy harvesting coil;

[0023] The upper magnetic ring is installed inside the upper shell assembly, and at least a portion of both ends of the upper magnetic ring are exposed on the lower end face of the upper shell assembly.

[0024] The lower magnetic ring is installed inside the lower shell assembly, and at least a portion of both ends of the lower magnetic ring are exposed on the upper surface of the lower shell assembly.

[0025] After the upper shell assembly and the lower shell assembly are closed, the two ends of the upper magnetic ring and the lower magnetic ring are connected to form a closed ring magnetic circuit structure.

[0026] The energy harvesting coil is wound around the outside of the annular magnetic circuit structure and electrically connected to the main circuit board.

[0027] Optionally, the upper shell assembly is provided with a second arc-shaped groove for mounting the upper magnetic ring;

[0028] An arc-shaped spring is provided between the inner circumference of the upper magnetic ring and the wall of the second arc-shaped groove, and an elastic tube is provided between the outer circumference of the upper magnetic ring and the wall of the second arc-shaped groove.

[0029] Optionally, the upper shell assembly is provided with a copper foil and a spring probe connected to the copper foil, and at least a portion of one end of the spring probe is exposed on the lower end face of the upper shell assembly;

[0030] The lower housing assembly contains pins that are connected to the main circuit board, with at least a portion of one end exposed on the upper surface of the lower housing assembly.

[0031] After the upper shell assembly and the lower shell assembly are closed, the spring probe is connected to the pin and forms an anti-interference circuit with the copper foil and the circuit board.

[0032] Optionally, a first sealing ring is provided between the lower outer shell and the bottom shell;

[0033] A second sealing ring is provided on the outer periphery of the pin and between the lower inner shell and the lower outer shell;

[0034] A third sealing ring is provided on the outer periphery of the junction between the first tunnel and the second tunnel.

[0035] Optionally, the upper shell assembly is provided with a groove that extends radially and communicates with the wire hole;

[0036] It also includes an elastic clamping element that can be telescopically installed within the groove, for adapting to and clamping cables of different diameters.

[0037] Optionally, the releasable locking assembly includes a buckle disposed on one of the upper shell assembly or the lower shell assembly, and a latch disposed on the other for engaging with the buckle;

[0038] It also includes hooks located on both sides of the lower housing assembly and extending outward for securing the housing to the cable with cable ties.

[0039] Compared with the prior art, the advantages of this application are:

[0040] This TMR sensor employs a housing structure with a hinged end and a releasable locking end, allowing the upper and lower housing assemblies to open and close freely. This facilitates cable routing and the installation, maintenance, and replacement of the TMR sensor. The TMR chip packaging assembly is housed within the upper housing assembly, while the lower TMR chip board and circuit board are located within the lower housing assembly. Electrical connection is achieved through a connection structure at the hinged end of the housing, forming a stable monitoring closed loop. This connection structure is largely unaffected by tension or displacement during the opening and closing of the housing, effectively ensuring the stability of the electrical connection between the TMR chips and thus improving the reliability of data transmission. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0042] Figure 1 This is a structural schematic diagram of an embodiment of the present utility model, wherein the upper shell assembly and the lower shell assembly are in a closed state;

[0043] Figure 2 This is a structural schematic diagram of an embodiment of the present utility model, wherein the upper shell assembly and the lower shell assembly are in the open state;

[0044] Figure 3 This is an exploded view of a portion of the structure of an embodiment of the present utility model;

[0045] Figure 4 This is an exploded view of a portion of the structure of an embodiment of the present utility model from another perspective;

[0046] Figure 5 This is an exploded view of a portion of the structure of an embodiment of the present utility model;

[0047] Figure 6 This is an exploded view of the upper shell assembly according to an embodiment of the present utility model;

[0048] Figure 7 This is an exploded view of a portion of the structure of an embodiment of the present utility model from another perspective;

[0049] Figure 8 This is a top view of an embodiment of the present invention.

[0050] Figure 9 for Figure 8 Schematic diagram of the cross-sectional structure along line AA in the middle;

[0051] Figure 10 for Figure 8Schematic diagram of the cross-sectional structure along the BB line in the middle;

[0052] Figure 11 for Figure 8 Schematic diagram of the cross-sectional structure along the CC line.

[0053] Explanation of reference numerals in the attached figures

[0054] 100-TMR sensor;

[0055] 1-Shell; o1-Wire hole;

[0056] 11-Upper shell assembly; 111-Upper shell base; 112-Upper shell cover; 1111-Rotating seat; 113-First rotating shaft; c1-First arc-shaped groove; c2-Second arc-shaped groove; c3-Sliding groove;

[0057] 12-Lower shell assembly; d-Assembly cavity; 121-Lower outer shell; 1211-Protrusion; 122-Lower inner shell; c4-U-shaped groove; c5-Assembly groove; 123-Bottom shell; o2-Light transmission hole; 124-Pressure plate; 125-First screw; c6-Rotating groove; o3-Shaft hole; 126-Hanging lug; 127-Light guide post;

[0058] 2-Releasable locking component; 21-Snap-on; 22-Bayonet;

[0059] 31-TMR chip packaging assembly; 311-TMR chip PCBA board; 312-PCBA board packaging shell; 32-TMR chip lower board; 33-Circuit motherboard; 331-Surface mount LED light; 341-First tunnel; 342-Second tunnel; 343-Flexible electrical connector;

[0060] 4-Voltage sensing FPC board; 41-Temperature sensing chip;

[0061] 51-Upper magnetic ring; 52-Lower magnetic ring; 53-Energy harvesting coil;

[0062] 61-Arc-shaped spring sheet; 62-Elastic tube;

[0063] 71-Copper foil; 72-Spring probe; 73-Pin;

[0064] 81-First sealing ring; 82-Second sealing ring; 83-Third sealing ring;

[0065] 91-Elastic clamping element; 911-Spring; 912-Pressure block; 92-Grounding clamp. Detailed Implementation

[0066] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0067] It should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," "back," "side," and "circumferential" used in this utility model to indicate the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used to distinguish multiple parts or structures with the same or similar structures, and do not indicate any special limitation on the arrangement order or connection relationship.

[0068] Please refer to Figures 1 to 11 This utility model provides a TMR sensor 100, including: a housing 1, a monitoring mechanism and a power supply component.

[0069] The housing 1 includes an upper housing assembly 11 and a lower housing assembly 12. One end of the upper housing assembly 11 and the lower housing assembly 12 are hinged together, and the other end is connected by a releasable locking assembly 2. When the upper housing assembly 11 and the lower housing assembly 12 are closed, a wire hole o1 is formed for a cable (not shown in the figure) to pass through. Understandably, the housing 1 is generally annular in shape, but it is not limited to a circular ring; it can also be a square ring, as long as the upper housing assembly 11 and the lower housing assembly 12 form a wire hole o1 for the cable to pass through. The releasable locking assembly 2 securely locks the upper housing assembly 11 and the lower housing assembly 12 when needed, and releases the lock when maintenance or replacement of the TMR sensor 100 is required, allowing the end of the upper housing assembly 11 and the lower housing assembly 12 away from the hinge to open. The releasable locking assembly 2 can be a snap-fit, a lock, a threaded fastener, etc.

[0070] The monitoring mechanism includes a TMR chip packaging assembly 31, a TMR chip lower board 32, and a circuit main board 33. The TMR chip packaging assembly 31 is disposed within the upper shell assembly 11 and may include a TMR chip PCBA board 311 containing the TMR chip and a PCBA board packaging shell 312. The TMR chip lower board 32 and the circuit main board 33 are electrically connected and are disposed within the lower shell assembly 12. In this embodiment, the TMR chip packaging assembly 31 and the TMR chip lower board 32 are respectively disposed on the same side of the shell 1.

[0071] The power supply component is located inside the housing 1 and is electrically connected to the main circuit board 33 to supply power to the monitoring mechanism. Understandably, the power supply component can be a battery, and / or an energy harvesting magnetic ring component that is electrically connected to the main circuit board 33 and located inside the upper housing assembly 11 and the lower housing assembly 12, forming a magnetic ring structure around the cable after the housing 1 is closed.

[0072] The TMR chip packaging assembly 31 and the TMR chip lower plate 32 are electrically connected through the connection structure of the hinge end of the housing 1, and together with the circuit main board 33, they form a monitoring closed loop.

[0073] The TMR sensor 100 employs a housing 1 structure with one end hinged and the other end releasable and lockable, allowing the upper housing assembly 11 and lower housing assembly 12 to open and close freely. This facilitates cable routing and the installation, maintenance, and replacement of the TMR sensor 100. The TMR chip packaging assembly 31 is housed within the upper housing assembly 11, while the TMR chip lower board 32 and circuit board 33 are housed within the lower housing assembly 12. They are electrically connected via a connection structure at the hinged end of the housing 1, forming a stable monitoring closed loop. This connection structure is largely unaffected by tension or displacement during the opening and closing of the housing 1, effectively ensuring the stability of the electrical connection between the TMR chips and thus improving the reliability of data transmission.

[0074] Alternatively, please refer to Figures 3 to 7 and Figure 9 In this embodiment, the upper shell assembly 11 has a first arc-shaped groove c1 for mounting the TMR chip packaging assembly 31, and the lower shell assembly 12 has an assembly cavity d for mounting the TMR chip lower plate 32 and the circuit main board 33. Optionally, the upper shell assembly 11 includes an upper shell base 111 and an upper shell cover 112. After the upper shell base 111 and the upper shell cover 112 are assembled, the first arc-shaped groove c1 is formed inside. The lower shell assembly 12 includes a lower outer shell 121, a bottom shell 123, and a lower inner shell 122. The lower outer shell 121 and the bottom shell 123 are fitted together, specifically through a snap-fit ​​structure. The lower inner shell 122 is located between the lower outer shell 121 and the bottom shell 123. Specifically, the lower inner shell 122 can be fixed to the lower outer shell 121 by a first screw 125. Specifically, a U-shaped groove c4 is formed inside the lower inner shell 122, and the TMR chip lower plate 32 is inserted into the U-shaped groove c4. The TMR chip lower plate 32 is then pressed onto the lower inner shell 122 by the pressure plate 124.

[0075] The connection structure includes a first tunnel 341, a second tunnel 342, and a flexible electrical connector 343. The first tunnel 341 is located on the upper shell assembly 11, opens at the hinge end of the shell 1, and connects to the first arc-shaped groove c1. The second tunnel 342 is located on the lower shell assembly 12, opens at the hinge end of the shell 1, and connects to the assembly cavity d. The flexible electrical connector 343 passes through the first tunnel 341 and the second tunnel 342, with one end connected to the TMR chip packaging assembly 31 and the other end connected to the TMR chip lower plate 32. Since the openings of the first tunnel 341 and the second tunnel 342 are respectively located at the hinge end of the housing 1, the relative positional change of the openings of the first tunnel 341 and the second tunnel 342 is small during the opening and closing of the housing 1. Furthermore, the TMR chip packaging assembly 31 and the TMR chip lower plate 32 are connected by the flexible electrical connector 343, which can provide a certain deformation. Therefore, the TMR sensor 100 is basically unaffected by stretching or displacement during the opening and closing of the housing 1, effectively ensuring the stability of the electrical connection between the TMR chips and thus improving the reliability of data transmission. Understandably, the flexible electrical connector 343 can be selected as an FPC connection flexible board, with one end connected to the TMR chip packaging assembly 31 and the other end connected to the TMR chip lower plate 32.

[0076] Alternatively, please refer to Figures 3 to 5 and Figure 9 In this embodiment, the upper end face of the lower shell assembly 12 is provided with a rotating groove c6, and the inner walls on both sides of the rotating groove c6 are provided with shaft holes o3. The upper shell assembly 11 is provided with a rotating seat 1111 that mates with the rotating groove c6, and the rotating seat 1111 has first rotating shafts 113 extending outward on both sides and rotatably engaging with the shaft holes o3. Thus, the upper shell assembly 11 and the lower shell assembly 12 are hinged by the engagement of the first rotating shafts 113 on the rotating seat 1111 with the shaft holes o3 on the inner walls on both sides of the rotating groove c6.

[0077] The opening of the first tunnel 341 is located on the lower end face of the rotating seat 1111, and the opening of the second tunnel 342 is located on the upper end face of the rotating groove c6, with the two tunnels positioned opposite each other. The first tunnel 341 and the second tunnel 342 together form the path for the flexible electrical connector 343 to pass through. Preferably, the opening of the first tunnel 341 is located at the middle position of the lower end face of the rotating seat 1111, and the opening of the second tunnel 342 is located at the middle position of the upper end face of the rotating groove c6. This further prevents the flexible electrical connector 343 from stretching or twisting during rotation.

[0078] To achieve real-time monitoring of cable voltage and stability, optionally, please refer to... Figure 5 and Figure 10In this embodiment, a voltage sensing FPC board 4 is embedded between the lower outer shell 121 and the lower inner shell 122. A temperature sensing chip 41 is integrated on the voltage sensing FPC board 4 and is electrically connected to the main circuit board 33. A protrusion 1211 is provided on the upper arc surface of the lower outer shell 121 corresponding to the temperature sensing chip 41, thus enabling the TMR sensor 100 to form a non-contact temperature sensing and voltage measurement closed loop. Specifically, an assembly groove c5 is provided on the arc-shaped upper surface of the lower inner shell 122, and the voltage sensing FPC board 4 is embedded in the assembly groove c5 and sandwiched between the lower outer shell 121 and the lower inner shell 122.

[0079] To achieve self-powered operation of the TMR sensor 100, optionally, please refer to... Figure 5 and Figure 10 In this embodiment, the power supply component is an energy-harvesting magnetic ring assembly, which includes an upper magnetic ring 51, a lower magnetic ring 52, and an energy-harvesting coil 53. The upper magnetic ring 51 is installed inside the upper shell assembly 11, with at least a portion of both ends exposed on the lower end face of the upper shell assembly 11; the lower magnetic ring 52 is installed inside the lower shell assembly 12, with at least a portion of both ends exposed on the upper end face of the lower shell assembly 12; after the upper shell assembly 11 and the lower shell assembly 12 are closed, the upper magnetic ring 51 and the lower magnetic ring 52 are connected at both ends to form a closed annular magnetic circuit structure; the energy-harvesting coil 53 is wound around the outside of the annular magnetic circuit structure and is electrically connected to the circuit board 33. Specifically, in this embodiment, the energy-harvesting coil 53 is wound around the lower magnetic ring 52, which simplifies the structure. Due to the presence of the energy-harvesting magnetic ring assembly, energy can be induced from the cable using the principle of electromagnetic induction to achieve self-powering of the TMR sensor 100.

[0080] To facilitate the installation of the upper magnetic ring 51 and avoid problems such as easy damage from stress, optionally, please refer to... Figure 5 , Figure 6 and 10 In this embodiment, the upper shell assembly 11 is provided with a second arc-shaped groove c2 for mounting the upper magnetic ring 51. Specifically, the second arc-shaped groove c2 is also formed after the upper shell base 111 and the upper shell cover 112 are assembled. An arc-shaped spring piece 61 is provided between the inner circumference of the upper magnetic ring 51 and the groove wall of the second arc-shaped groove c2, and an elastic tube 62 is provided between the outer circumference of the upper magnetic ring 51 and the groove wall of the second arc-shaped groove c2. Thus, during installation, the arc surface of the upper magnetic ring 51 can rotate within the second arc-shaped groove c2. The arc-shaped spring piece 61 and the elastic tube 62 allow the upper magnetic ring 51 to flexibly adjust the smoothness of rotation and the position of the sliding axis point within the second arc-shaped groove c2; at the same time, it can elastically change the distance between the upper magnetic ring 51 and the lower magnetic ring 52 to avoid damage from force when encountering impact.

[0081] To improve the signal stability of the TMR sensor 100 and enhance the system's anti-interference capability, optionally, please refer to... Figure 3 , Figure 5and Figure 9 In this embodiment, the upper shell assembly 11 also includes a copper foil 71 and a spring probe 72, with the copper foil 71 connected to the spring probe 72. At least a portion of one end of the spring probe 72 is exposed on the lower end face of the upper shell assembly 11. The lower shell assembly 12 includes a pin 73. The pin 73 is connected to the main circuit board 33, and at least a portion of one end is exposed on the upper end face of the lower shell assembly 12. After the upper shell assembly 11 and the lower shell assembly 12 are closed, the spring probe 72 and the pin 73 are connected, forming an anti-interference circuit with the copper foil 71 and the main circuit board 33. Specifically, in this embodiment, the spring probe 72 and the pin 73 are correspondingly positioned at the end of the shell 1 furthest from the hinge end. Of course, in other embodiments, the spring probe 72 and the pin 73 are correspondingly positioned at the end of the shell 1 furthest from the hinge end. No specific limitations are imposed here.

[0082] To improve the waterproof performance of the TMR sensor 100, optionally, please refer to... Figure 5 and Figure 9 In this embodiment, a first sealing ring 81 is provided between the lower outer shell 121 and the bottom shell 123; a second sealing ring 82 is provided on the outer periphery of the pin 73, located between the lower inner shell 122 and the lower outer shell 121; and a third sealing ring 83 is provided at the junction of the first tunnel 341 and the second tunnel 342. Thus, the reliability of the TMR sensor 100 in harsh environments such as outdoors, humidity, and dust can be improved through this three-layer sealing structure. Furthermore, waterproof sealant can be applied to the gaps between the two ends of the lower magnetic ring 52 and the lower outer shell 121, and to the gaps between the two ends of the upper magnetic ring 51 and the upper shell seat 111, to further enhance waterproof performance.

[0083] To accommodate cables of different diameters, please refer to [reference needed]. Figures 4 to 6 In this embodiment, the upper shell assembly 11 is provided with a groove c3 extending radially and communicating with the wire hole o1; the TMR sensor 100 also includes an elastic clamping member 91 that can be telescopically disposed within the groove c3, for adapting to and clamping cables of different diameters. Specifically, the elastic clamping member 91 may include a spring 911 and a pressure block 912; one end of the spring 911 is connected to the upper shell cover 112, and the other end is connected to the pressure block 912; thus, the pressure block 912 can telescopically move within the groove c3 to adapt to and clamp cables of different diameters.

[0084] To facilitate the locking or separation of the upper housing assembly 11 and the lower housing assembly 12, and to improve the cable securing effect, optionally, please refer to... Figure 1 and Figure 2In this embodiment, the releasable locking component 2 includes a latch 21 and a latch 22. The latch 21 is located on the lower shell component 12, and the latch 22 that engages with the latch 21 is correspondingly located on the upper shell component 11. Specifically, the lower shell 121 of the lower shell component 12 has a groove on the outer wall of the side away from the hinge end, and two latches 21 are provided in the groove; the upper shell cover 112 of the upper shell component 11 has a connecting plate that extends downward and engages with the groove on the corresponding side, and the latch 22 that engages with the latches 21 is located on the connecting plate. Of course, in some other embodiments, the latch 21 may also be located on the upper shell component 11, and the corresponding latch 21 may be located on the lower shell component 12, which is not specifically limited here.

[0085] The TMR sensor 100 also includes hooks 126 located on both sides of the lower housing assembly 12 and extending outward for securing the housing 1 to the cable using cable ties (not shown). Thus, after the TMR sensor 100 secures the cable by closing the upper housing assembly 11 and the lower housing assembly 12 with the releasable locking assembly 2, the cable under test can be further secured by using the hooks 126 on both sides with cable ties.

[0086] Optionally, in this embodiment, the circuit board 33 has a built-in wireless communication module, such as Bluetooth, Wi-Fi, LoRa, etc., which enables the TMR sensor 100 to wirelessly transmit data with external supporting devices (not shown in the figure). Understandably, the circuit board 33 also includes a power management module, a sensing module, a diagnostic module, an application control module, and a microprocessor chip, enabling the TMR sensor 100 to monitor the data information of the measured object in real time and perform corresponding storage and transmission.

[0087] To facilitate observation of the operating status of the TMR sensor 100, optionally, please refer to... Figure 5 and Figure 8 In this embodiment, a surface-mount LED 331 is built into the circuit board 33, and a light-transmitting hole o2 is provided on the bottom shell 123 at the position corresponding to the surface-mount LED 331. A light guide post 127 is installed on the light-transmitting hole o2. In this way, the operator can directly understand the operating status of the TMR sensor 100 by observing the display of the surface-mount LED 331.

[0088] Alternatively, please refer to Figure 1 and Figure 5 In this embodiment, the TMR sensor 100 also includes a grounding clamp 92. The grounding clamp 92 is electrically connected to the circuit board 33, thus enabling the TMR sensor 100 to form a grounding loop and improving safety.

[0089] The working process and principle / assembly steps of this utility model embodiment are roughly as follows:

[0090] After the TMR sensor 100 secures the cable to the wire hole o1 via the releasable locking assembly 2 on the housing 1, a ring-shaped magnetic field is generated around the cable when current flows within it. The TMR chip encapsulation assembly 31 and the TMR chip lower plate 32, located inside the housing 1, sense changes in this magnetic field and output an electrical signal reflecting the current change. The main circuit board 33 then reads, amplifies, filters, and processes the signal output by the TMR chip, converting it into digital or analog signals representing physical quantities such as current and voltage. This enables the monitoring of the cable.

[0091] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the substance of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A TMR sensor, characterized in that, include: The housing includes an upper housing assembly and a lower housing assembly. One end of the upper housing assembly and the lower housing assembly are hinged to each other, and the other end is connected by a releasable locking assembly. When the upper housing assembly and the lower housing assembly are closed, they form a wire hole for cables to pass through. The monitoring mechanism includes a TMR chip packaging assembly located within the upper shell assembly, and a TMR chip lower board and a circuit main board located within the lower shell assembly and electrically connected thereto. A power supply component is disposed inside the housing and electrically connected to the main circuit board for supplying power to the monitoring mechanism; The TMR chip packaging assembly and the lower TMR chip board are electrically connected through the connection structure of the housing hinge end, and together with the circuit motherboard, they form a monitoring closed loop.

2. The TMR sensor as described in claim 1, characterized in that, The upper shell assembly has a first arc-shaped groove for mounting the TMR chip packaging assembly, and the lower shell assembly has an assembly cavity for mounting the lower TMR chip board and the circuit motherboard. The connection structure includes: The first tunnel is located in the upper shell assembly and opens at the hinge end of the shell, and communicates with the first arc-shaped groove; The second tunnel is located in the lower shell assembly, opens at the hinge end of the shell, and communicates with the assembly cavity; A flexible electrical connector is inserted through the first tunnel and the second tunnel, with one end connected to the TMR chip packaging assembly and the other end connected to the TMR chip lower plate.

3. The TMR sensor as described in claim 2, characterized in that, The upper end face of the lower shell assembly is provided with a rotating groove, and the inner walls on both sides of the rotating groove are provided with shaft holes; The upper shell assembly is provided with a rotating seat that mates with the rotating groove, and the rotating seat has first rotating shafts on both sides that extend outward and rotatably mate with the shaft hole; The opening of the first tunnel is located on the lower end face of the rotating seat, and the opening of the second tunnel is located on the upper end face of the rotating groove; the two are arranged opposite to each other.

4. The TMR sensor as described in claim 2, characterized in that, The lower shell assembly includes a lower outer shell and a bottom shell that are covered together, and a lower inner shell located between the lower outer shell and the bottom shell; A voltage sensing FPC board is embedded between the lower outer shell and the lower inner shell. The voltage sensing FPC board integrates a temperature measuring chip and is electrically connected to the circuit motherboard. The upper arc surface of the lower outer shell has a protrusion corresponding to the temperature measuring chip.

5. The TMR sensor as described in claim 2, characterized in that, The power supply component is an energy harvesting magnetic ring assembly, which includes an upper magnetic ring, a lower magnetic ring, and an energy harvesting coil. The upper magnetic ring is installed inside the upper shell assembly, and at least a portion of both ends of the upper magnetic ring are exposed on the lower end face of the upper shell assembly. The lower magnetic ring is installed inside the lower shell assembly, and at least a portion of both ends of the lower magnetic ring are exposed on the upper surface of the lower shell assembly. After the upper shell assembly and the lower shell assembly are closed, the two ends of the upper magnetic ring and the lower magnetic ring are connected to form a closed ring magnetic circuit structure. The energy harvesting coil is wound around the outside of the annular magnetic circuit structure and electrically connected to the main circuit board.

6. The TMR sensor as described in claim 5, characterized in that, The upper shell assembly is provided with a second arc-shaped groove for mounting the upper magnetic ring; An arc-shaped spring is provided between the inner circumference of the upper magnetic ring and the wall of the second arc-shaped groove, and an elastic tube is provided between the outer circumference of the upper magnetic ring and the wall of the second arc-shaped groove.

7. The TMR sensor as described in claim 4, characterized in that, The upper shell assembly contains a copper foil and a spring probe connected to the copper foil, with at least a portion of one end of the spring probe exposed on the lower end face of the upper shell assembly. The lower shell assembly contains pins that are connected to the circuit board, and at least a portion of one end of the pins is exposed on the upper surface of the lower shell assembly. After the upper shell assembly and the lower shell assembly are closed, the spring probe is connected to the pin and forms an anti-interference circuit with the copper foil and the circuit board.

8. The TMR sensor as described in claim 7, characterized in that, A first sealing ring is provided between the lower outer shell and the bottom shell; A second sealing ring is provided on the outer periphery of the pin and between the lower inner shell and the lower outer shell; A third sealing ring is provided on the outer periphery of the junction between the first tunnel and the second tunnel.

9. The TMR sensor as described in claim 1, characterized in that, The upper shell assembly is provided with a groove that extends radially and communicates with the wire hole; It also includes an elastic clamping element that can be telescopically installed within the groove, for adapting to and clamping cables of different diameters.

10. The TMR sensor as described in claim 1, characterized in that, The releasable locking assembly includes a buckle on one of the upper shell assembly or the lower shell assembly, and a latch on the other shell assembly that engages with the buckle. It also includes hooks located on both sides of the lower housing assembly and extending outward for securing the housing to the cable with cable ties.

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