Low-resistance four-terminal resistor

Abstract

The utility model discloses a low-resistance four-terminal resistor, and relates to the technical field of low-resistance resistors. The top of the voltage end is welded with the resistor structure, the resistor structure comprises a substrate, the top of the substrate is provided with an adhesive layer, the top of the adhesive layer is bonded with an alloy layer, the top of the alloy layer is provided with a copper electrode, the inner side of the copper electrode is provided with a protective layer, the bottom of the protective layer is fixedly connected with the alloy layer, and the top of the copper electrode is provided with a copper plating layer; and the bottom of the copper-plated layer is attached and fixed to the copper electrode and the protective layer. Through the arrangement of the copper electrode, the copper electrode can be simultaneously connected with the four groups of terminals to conduct current leading work, the current can be dispersed into the four groups of terminals, the copper electrode can better conduct heat dissipation work due to the fact that the contact area of the terminals and the copper electrode is increased, heat is prevented from being concentrated in several points, and compared with a short-edge electrode, the heat dissipation efficiency is improved. And the heat dissipation effect is better than that of a resistor with the same size and the same resistance value.

Description

Technical Field

[0001] This utility model relates to the field of low resistance resistor technology, specifically a low resistance four-terminal resistor. Background Technology

[0002] Terminal resistance refers to the resistance exhibited by terminals in an electrical connection. Terminals are typically made of metallic materials such as copper and aluminum. These materials inherently possess a certain resistivity, resulting in resistance when current flows through them. Even copper, a highly conductive material, is not entirely without resistance; it is simply relatively low. A certain amount of electrical energy is dissipated through the two sets of terminals, and the remaining energy is then transferred, thus reducing the current intensity. However, existing terminal resistors have some shortcomings, such as:

[0003] Existing terminal resistors typically use a short-side electrode to connect two sets of terminals, allowing current to be transmitted directly through the two sets of terminals when current is drawn, which can be more efficient. However, in actual use, when current is drawn through the two sets of terminals, the current may be concentrated on the two sets of terminals, which may cause excessive heat generation on the short-side electrode when current is drawn.

[0004] Therefore, we propose a low-resistance four-terminal resistor to solve the problems mentioned above. Utility Model Content

[0005] The purpose of this invention is to provide a low-resistance four-terminal resistor to solve the problem mentioned in the background art of excessive heat generation caused by current concentration on the short-side terminal electrodes in the current market.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a low-resistance four-terminal resistor, including a voltage terminal and a welding contact surface connected to the top of the voltage terminal, a resistor structure is installed inside the welding contact surface, and the resistor structure is located at the top of the voltage terminal;

[0007] The voltage terminal is welded to the top of the resistor structure, and the resistor structure includes a substrate. An adhesive layer is installed on the top of the substrate, an alloy layer is bonded to the top of the adhesive layer, a copper electrode is installed on the top of the alloy layer, and a protective layer is installed inside the copper electrode. The bottom of the protective layer is fixedly connected to the alloy layer, and a copper plating layer is provided on the top of the copper electrode. The bottom of the copper plating layer is attached and fixed to the copper electrode and the protective layer. The copper electrode is a long-side electrode assembly that can be electrically connected to four sets of terminals simultaneously, and the thickness of the electrode assembly is less than 0.35mm.

[0008] By setting copper electrodes, which can simultaneously connect to four sets of terminals for current input, the current can be distributed to the four sets of terminals. Furthermore, due to the increased contact area between the terminals and the copper electrodes, the copper electrodes can better dissipate heat, thus avoiding heat concentration at a few points. Compared to short-side electrodes, it has a better heat dissipation effect than resistors of the same size and resistance.

[0009] As a preferred technical solution of this utility model, the bottom of the substrate is welded to the voltage terminal, and a rolling protective layer is provided on the outer side of the substrate, and the inner side of the rolling protective layer is fixedly attached to the alloy layer, the copper electrode and the protective layer.

[0010] The above technical solution enables the substrate to be more stable when connected to the voltage terminal, thereby increasing the robustness of the device during installation.

[0011] As a preferred technical solution of this utility model, the outer side of the rolling protective layer is fixedly connected to the welding contact surface, and a lettering layer is installed on the top of the rolling protective layer.

[0012] The above technical solution makes it easier to protect equipment such as low alloy layers and copper electrodes with the rolling protective layer, thereby increasing the protective performance of the equipment during use and providing insulation.

[0013] As a preferred technical solution of this utility model, the top of the rolling protective layer is provided with a heat-conducting sheet, and the heat-conducting sheet is provided with holes around its perimeter. The top of the heat-conducting sheet is provided with a glue-filling hole, which is located at the top of the holes in the heat-conducting sheet and is blocked. The bottom of the heat-conducting sheet is provided with a silicone layer.

[0014] The above technical solution enables the thermal conductive sheet to transfer silicone into the interior of the roll film protective layer through the holes at the potting hole after being connected to the top of the roll film protective layer, thereby forming a silicone layer. This allows the heat dissipated by the copper electrode to be transferred to the silicone sheet through the copper plating layer, and then transferred to the thermal conductive sheet for heat dissipation, thus increasing the heat dissipation efficiency of the resistor for the copper electrode during use.

[0015] As a preferred technical solution of this utility model, the silicone layer is located on top of the rolling protective layer, and the silicone layer is connected to the top of the copper plating layer, and the silicone material in the silicone layer is injected through the injection hole.

[0016] The above technical solution enables the silicone layer to block the holes on the top of the heat-conducting sheet after the silicone layer is poured in, thus preventing gaps from appearing on the top and damaging the resistor.

[0017] As a preferred technical solution of this utility model, a heat sink is provided at the bottom of the rolling protective layer, and the heat sink is fixedly connected to the voltage terminal. Furthermore, a heat-conducting base layer is provided at the bottom of the substrate, and a connecting copper sheet is connected to the bottom of the heat-conducting base layer.

[0018] The above technical solution enables the heat to be transferred to the thermally conductive base layer and connecting copper sheet when the substrate temperature is too high, and then to the heat sink. This allows the resistor to dissipate heat from its bottom when it is used in an environment where the bottom temperature is too high.

[0019] As a preferred technical solution of this utility model, the thermally conductive base layer is fixedly connected to the heat sink by connecting copper sheets, and when the substrate dissipates heat, the heat is transferred to the heat sink through the thermally conductive base layer for heat dissipation.

[0020] The above technical solution makes it easier for the heat sink to dissipate heat, thereby increasing the heat dissipation efficiency of the resistor during use.

[0021] Compared with the prior art, the beneficial effects of this utility model are: by setting copper electrodes, and the copper electrodes can connect to four sets of terminals at the same time to conduct current, the current can be distributed to the four sets of terminals. Furthermore, due to the increased contact area between the terminals and the copper electrodes, the copper electrodes can better dissipate heat, thereby avoiding heat concentration in a few points. Compared with short-side electrodes, it has a better heat dissipation effect than resistors of the same size and resistance value.

[0022] Furthermore, by setting a heat-conducting sheet and a silicone layer on top of the roll film protective layer, the heat-conducting sheet can transfer silicone into the roll film protective layer through the holes at the glue-filling hole after being connected to the top of the roll film protective layer, thereby forming a silicone layer. This allows the heat dissipated by the copper electrode to be transferred to the silicone sheet through the copper plating layer, and then transferred to the heat-conducting sheet through the silicone sheet for heat dissipation, thus increasing the heat dissipation efficiency of the resistor for the copper electrode during use.

[0023] Furthermore, by setting a thermally conductive base layer and connecting copper sheets at the bottom of the substrate, when the substrate temperature is too high, heat can be transferred to the thermally conductive base layer and connecting copper sheets, and then to the heat sink. This allows the resistor to dissipate heat from its bottom when used in an environment where the bottom temperature is too high. Attached Figure Description

[0024] Figure 1 This is a front view elevation diagram of the present utility model;

[0025] Figure 2 This is a three-dimensional structural schematic diagram of the front cross-section of this utility model;

[0026] Figure 3 This is a schematic diagram of the layered elevation structure of the resistor structure of this utility model;

[0027] Figure 4 This is a top view of the copper electrode and protective layer of this utility model.

[0028] Figure 5 This is a front view elevation diagram of Embodiment 2 of the present invention;

[0029] Figure 6 This is a three-dimensional structural diagram of the heat-conducting sheet of this utility model;

[0030] Figure 7 This is a three-dimensional structural schematic diagram of a front cross-section of Embodiment 3 of this utility model;

[0031] Figure 8 This is Embodiment 3 of the present invention. Figure 7 A magnified structural diagram at point A.

[0032] In the diagram: 1. Substrate; 2. Adhesive layer; 3. Alloy layer; 4. Copper electrode; 5. Protective layer; 6. Copper plating layer; 7. Roll film protective layer; 8. Engraving layer; 9. Welding contact surface; 10. Voltage terminal; 11. Thermal conductive sheet; 12. Potting hole; 13. Silicone layer; 14. Thermal conductive base layer; 15. Connecting copper sheet; 16. Heat sink. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0034] Example 1: To address the problem of excessive heat generation caused by concentrated current in the prior art, the following solution is disclosed. Please refer to [link / reference]. Figures 1-4 This utility model provides a technical solution: a low resistance four-terminal resistor, including a voltage terminal 10 and a welding contact surface 9 connected to the top of the voltage terminal 10. A resistor structure is installed inside the welding contact surface 9 and the resistor structure is located at the top of the voltage terminal 10.

[0035] The voltage terminal 10 is welded to the top of the resistor structure, and the resistor structure includes a substrate 1. An adhesive layer 2 is installed on the top of the substrate 1. An alloy layer 3 is bonded to the top of the adhesive layer 2. A copper electrode 4 is installed on the top of the alloy layer 3. A protective layer 5 is installed inside the copper electrode 4. The bottom of the protective layer 5 is fixedly connected to the alloy layer 3. A copper plating layer 6 is provided on the top of the copper electrode 4. The bottom of the copper plating layer 6 is attached and fixed to the copper electrode 4 and the protective layer 5. The copper electrode 4 is a long-side electrode assembly that can be electrically connected to four sets of terminals at the same time. The thickness of the electrode assembly is less than 0.35mm.

[0036] The bottom of the substrate 1 is welded to the voltage terminal 10, and a rolling protective layer 7 is provided on the outer side of the substrate 1. The inner side of the rolling protective layer 7 is fixedly attached to the alloy layer 3, the copper electrode 4 and the protective layer 5. The outer side of the rolling protective layer 7 is fixedly connected to the welding contact surface 9, and a lettering layer 8 is installed on the top of the rolling protective layer 7.

[0037] Example 2: This example discloses another heat dissipation method, which differs from Example 1, as follows: Figure 5-6 As shown, the difference between this embodiment and embodiment 1 is that: a heat-conducting sheet 11 is provided on the top of the rolling protective layer 7, and holes are provided around the heat-conducting sheet 11. A glue-filling hole 12 is provided on the top of the heat-conducting sheet 11, and the glue-filling hole 12 is located on the top of the holes of the heat-conducting sheet 11 and is blocked. A silicone layer 13 is provided at the bottom of the heat-conducting sheet 11, and the silicone layer 13 is located on the top of the rolling protective layer 7. The silicone layer 13 is connected to the top of the copper plating layer 6, and the silicone material in the silicone layer 13 is injected through the glue-filling hole 12.

[0038] When the copper electrode 4 generates heat, some of the heat is absorbed by the silicone layer 13, and then the silicone layer 13 transfers the heat to the heat-conducting sheet 11, so that the heat-conducting sheet 11 dissipates heat from the top of the resistor structure.

[0039] Example 3: This example discloses another heat dissipation method, which differs from Example 1, as follows: Figure 7-8 As shown, the difference between this embodiment and embodiment 1 is that: the bottom of the roll film protective layer 7 is provided with a heat sink 16, and the heat sink 16 is fixedly connected to the voltage terminal 10; the bottom of the substrate 1 is provided with a thermally conductive base layer 14, and a connecting copper sheet 15 is connected to the bottom of the thermally conductive base layer 14. The thermally conductive base layer 14 is fixedly connected to the heat sink 16 through the connecting copper sheet 15; and when the substrate 1 dissipates heat, the heat is transferred to the heat sink 16 through the thermally conductive base layer 14 for heat dissipation.

[0040] When the substrate 1 of the resistor structure is used in an environment with excessively high temperature, a heat-conducting base layer 14 can be provided at the bottom of the substrate 1. The heat-conducting base layer 14 can be connected to the heat sink 16 provided inside the heat dissipation voltage terminal 10 through the connecting copper sheet 15. This allows the heat-conducting base layer 14 to transfer the heat from the bottom of the substrate 1 to the heat sink 16 for heat dissipation. The heat sink 16 can then fix the substrate 1 at the bottom of the resistor structure, making the resistor structure more secure when connected to the voltage terminal 10.

[0041] Example 4: This example discloses another alloy layer 3, which is different from Example 1. The difference between this example and Example 1 is that the alloy layer 3 is composed of copper and nickel, wherein the nickel content is 40%, and the bottom of the alloy layer 3 is fixedly bonded to the adhesive layer 2, and the adhesive layer 2 is composed of graphite polymer and has electrical conductivity.

[0042] Working principle: When using this low-resistance four-terminal resistor, first connect both sides of the resistor structure to the welding contact surface 9, and then connect the welding contact surface 9 to the voltage terminal 10, so that the four sets of terminals on the top of the voltage terminal 10 are connected to the resistor structure. At this time, the copper electrode 4 will be connected to the four sets of terminals, thus conducting electricity. The current inside the voltage terminal 10 will be transmitted to the inside of the copper electrode 4 through the four sets of terminals, so that the copper electrode 4 disperses the current. Then it is transmitted through the four sets of terminals on the other side, so that the resistor structure can transmit current simultaneously through the four sets of terminals. Compared with the short side electrode of the two sets of terminals, the current can be more dispersed, thereby reducing the heat dissipation. And through the setting of the protective layer 5, the protective layer 5 can protect the outside of the copper electrode 4.

[0043] When the resistor structure is connected to the voltage terminal 10, it can be connected to the voltage terminal 10 through the substrate 1. When the copper electrode 4 on the top of the substrate 1 generates heat, it will dissipate heat normally through the welding contact surfaces 9 on both sides.

[0044] This completes a series of tasks. The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0045] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A low resistance four-terminal resistor, comprising a voltage terminal (10) and a welding contact surface (9) connected to the top of the voltage terminal (10), wherein a resistor structure is installed inside the welding contact surface (9) and the resistor structure is located on the top of the voltage terminal (10); Its features are: The voltage terminal (10) is welded to the top of the resistor structure, and the resistor structure includes a substrate (1). An adhesive layer (2) is installed on the top of the substrate (1). An alloy layer (3) is bonded to the top of the adhesive layer (2). A copper electrode (4) is installed on the top of the alloy layer (3). A protective layer (5) is installed inside the copper electrode (4). The bottom of the protective layer (5) is fixedly connected to the alloy layer (3). A copper plating layer (6) is provided on the top of the copper electrode (4). The bottom of the copper plating layer (6) is attached and fixed to the copper electrode (4) and the protective layer (5).

2. The low-resistance four-terminal resistor according to claim 1, characterized in that, The bottom of the substrate (1) is welded to the voltage terminal (10), and a rolling protective layer (7) is provided on the outer side of the substrate (1), and the inner side of the rolling protective layer (7) is fixedly attached to the alloy layer (3), the copper electrode (4) and the protective layer (5).

3. The low-resistance four-terminal resistor according to claim 2, characterized in that, The outer side of the roll film protective layer (7) is fixedly connected to the welding contact surface (9), and a lettering layer (8) is installed on the top of the roll film protective layer (7).

4. The low-resistance four-terminal resistor according to claim 2, characterized in that, The roll film protective layer (7) has a heat-conducting sheet (11) on top, and holes are provided around the heat-conducting sheet (11). The heat-conducting sheet (11) has a glue-filling hole (12) on top. The glue-filling hole (12) is located at the top of the holes of the heat-conducting sheet (11) and is blocked. The heat-conducting sheet (11) has a silicone layer (13) at the bottom.

5. The low-resistance four-terminal resistor according to claim 4, characterized in that, The silicone layer (13) is located on top of the roll film protective layer (7), and the silicone layer (13) is connected to the top of the copper plating layer (6). The silicone material in the silicone layer (13) is injected through the potting hole (12).

6. The low-resistance four-terminal resistor according to claim 3, characterized in that, The bottom of the roll film protective layer (7) is provided with a heat sink (16), and the heat sink (16) is fixedly connected to the voltage terminal (10). The bottom of the substrate (1) is provided with a thermally conductive base layer (14), and a connecting copper sheet (15) is connected to the bottom of the thermally conductive base layer (14).

7. The low-resistance four-terminal resistor according to claim 6, characterized in that, The thermally conductive base layer (14) is fixedly connected to the heat sink (16) via a connecting copper sheet (15), and when the substrate (1) dissipates heat, the heat is transferred to the heat sink (16) through the thermally conductive base layer (14) for heat dissipation.

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