Mobile phone loudspeaker conduction structure and mobile phone

Abstract

The utility model provides a mobile phone loudspeaker conduction structure, which comprises a bottom shell assembly and a middle frame, the middle frame is fixedly connected with a loudspeaker assembly and a main board, a conductive pattern is formed on one surface, facing the middle frame, of the bottom shell assembly through chemical plating of a laser technology, and the conductive pattern is provided with a first conductive end and a second conductive end. The loudspeaker assembly is provided with a loudspeaker elastic piece used for being elastically and electrically connected with the first conductive end, and the main board is provided with a main board elastic piece used for being elastically and electrically connected with the second conductive end. The conductive pattern is arranged on the bottom shell assembly, and the two conductive ends of the conductive pattern are respectively conducted with the horn elastic sheet and the mainboard elastic sheet, so that the connection between the horn assembly and the mainboard is realized, and the beneficial effects of sealing, low cost and convenient assembly can be realized.

Description

Technical Field

[0001] This utility model relates to the field of mobile phone technology, specifically to a mobile phone speaker conduction structure and a mobile phone. Background Technology

[0002] The mobile phone speaker is an electronic component inside a mobile phone used for sound output. In the manufacturing of low- and mid-range smartphones, to effectively control product costs, manufacturers generally adopt a single-speaker acoustic configuration. Currently, the electrical connection between this type of single speaker and the motherboard is mainly achieved in two ways: first, by using a wire-bonded speaker, which is directly soldered to the motherboard through wires to achieve conductivity; second, by using a spring-loaded speaker, which establishes a connection with the motherboard using a flexible printed circuit board (FPC).

[0003] However, both of these connection methods rely on external connectors such as wires or FPCs to establish communication between the speaker and the motherboard. This makes it difficult to create a completely sealed structure during speaker assembly. Because of the inability to achieve an effective seal, the speaker is prone to air leakage during operation, leading to noise issues and negatively impacting the smartphone's acoustic performance and user experience. Utility Model Content

[0004] The main purpose of this utility model is to provide a mobile phone speaker conduction structure and mobile phone, which aims to solve the problem that the existing mobile phone speaker part cannot be effectively sealed.

[0005] To achieve the above objectives, the first aspect of this utility model proposes a mobile phone speaker conduction structure, comprising: a bottom shell assembly and a middle frame, wherein a speaker assembly and a motherboard are fixedly connected to the middle frame, and a conductive pattern is formed on the side of the bottom shell assembly facing the middle frame by laser engraving technology, wherein the conductive pattern is provided with a first conductive end and a second conductive end, a speaker spring for elastically connecting with the first conductive end is provided on the speaker assembly, and a motherboard spring for elastically connecting with the second conductive end is provided on the motherboard.

[0006] In one alternative embodiment, the bottom shell assembly is provided with a bottom shell acoustic cavity surround, and the middle frame is provided with a middle frame acoustic cavity surround. The contact surfaces of the bottom shell acoustic cavity surround and the middle frame acoustic cavity surround are both planar. The first conductive end is disposed in the inner region of the bottom shell acoustic cavity surround, and the second conductive end is disposed in the outer region of the bottom shell acoustic cavity surround.

[0007] In one alternative embodiment, the speaker spring includes a first elastic protrusion that protrudes from the plane of the middle frame acoustic cavity surrounding bone and corresponds to the position of the first conductive end.

[0008] In one alternative embodiment, a seal is provided between the bottom shell acoustic cavity surround and the middle frame acoustic cavity surround.

[0009] In one alternative, the seal is foam.

[0010] In one alternative embodiment, the speaker assembly is provided with a grounding conductive cloth, and a grounding metal plate is also provided on the middle frame. The speaker assembly is grounded through the grounding conductive cloth and the grounding metal plate.

[0011] In one alternative embodiment, the middle frame is provided with a first receiving groove corresponding to the position of the speaker assembly, and a limiting plate for fixing the speaker assembly is provided on the periphery of the first receiving groove, the height of the limiting plate being less than the height of the middle frame acoustic cavity surrounding bone.

[0012] In one alternative embodiment, the middle frame is provided with a second receiving groove corresponding to the position of the motherboard, and the second receiving groove is located on the outer side of the acoustic cavity surrounding bone of the middle frame.

[0013] As a second aspect of this utility model, protection is claimed for a mobile phone including a mobile phone speaker conduction structure as described in any of the first aspects above.

[0014] In this invention, a conductive pattern is set on the bottom shell assembly, and the two conductive ends of the conductive pattern are respectively connected to the speaker spring and the motherboard spring, thereby realizing the connection between the speaker assembly and the motherboard. The speaker assembly and the motherboard are connected by a conductive pattern formed by laser. The speaker cavity does not need to leave a wire groove or space for the FPC, which can achieve complete sealing. Furthermore, there is no need to solder between the speaker assembly and the motherboard. The spring method can be used for easy assembly. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0016] Figure 1 This is an exploded view of the conductive structure of the mobile phone speaker of this utility model;

[0017] Figure 2 This is a schematic diagram of the bottom shell assembly of this utility model;

[0018] Figure 3 This is a schematic diagram of the middle frame of this utility model;

[0019] Figure 4 This is a schematic diagram of the speaker assembly and the middle frame assembly of this utility model;

[0020] Figure 5 for Figure 4Enlarged diagram of A in the middle;

[0021] Figure 6 for Figure 4 Enlarged diagram of B in the middle.

[0022] Explanation of icon numbers:

[0023] 1. Bottom shell assembly; 11. Bottom shell acoustic cavity surrounding bone;

[0024] 2. Middle frame; 21. Middle frame acoustic cavity surround; 22. First receiving groove; 23. Limiting plate; 24. Second receiving groove;

[0025] 3. Screen components;

[0026] 4. Speaker assembly; 41. Speaker spring; 411. First elastic protrusion; 412. First bending part; 42. Grounding conductive cloth; 43. Grounding metal plate;

[0027] 5. Mainboard; 51. Mainboard spring; 511. Second elastic protrusion; 512. Second bending part; 513. Fixing part; 52. Charging interface; 53. Earphone socket; 54. Motor;

[0028] 6. Conductive pattern; 61. First conductive end; 62. Second conductive end; 63. Connecting segment;

[0029] 7. Foam.

[0030] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0031] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0032] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0033] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, if the word "and / or" appears throughout the text, it means including three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0034] Example 1

[0035] Combination Figure 1-6 In one embodiment, a mobile phone speaker conduction structure is proposed, comprising: a bottom shell assembly 1 and a middle frame 2. The middle frame 2 is fixedly connected to a speaker assembly 4 and a motherboard 5. The bottom shell assembly 1 facing the middle frame 2 is formed with a conductive pattern 6 by laser engraving. The conductive pattern 6 is provided with a first conductive end 61 and a second conductive end 62. The speaker assembly 4 is provided with a speaker spring 41 for elastic electrical connection with the first conductive end 61. The motherboard 5 is provided with a motherboard spring 51 for elastic electrical connection with the second conductive end 62.

[0036] The bottom shell assembly 1 is used to carry the conductive pattern 6 and needs to be stably assembled with the middle frame 2. The middle frame 2 is an intermediate structural component that supports and fixes the speaker assembly 4 and the main board 5, etc.

[0037] In this embodiment, the bottom shell assembly 1 and the middle frame 2 can be made of modified plastic, such as PC. The corresponding speaker conduction structure is located at the bottom of the entire phone. In this embodiment, the motherboard 5 refers to the small control motherboard 5 connected to the speaker assembly 4, and is not necessarily the control board of the entire host. The structures of the speaker assembly 4 and the motherboard 5 are existing technologies and are not improvements in this field, so they will not be described in detail here.

[0038] Combination Figure 2 The conductive pattern 6 is a conductive metal pattern formed directly on the bottom shell assembly 1 using laser lithography technology. Specifically, it is a copper / nickel metal circuit pattern. The laser lithography technology is abbreviated as LDS technology, which is a public technology. In this embodiment, the preparation of the conductive pattern 6 can be carried out together with the preparation of the LDS antenna, thereby reducing production costs and achieving efficient production.

[0039] The conductive pattern 6 is used for the connection between the speaker assembly 4 and the motherboard 5. It includes a first conductive end 61 and a second conductive end 62, and a connecting segment 63 for connecting the first conductive end 61 and the second conductive end 62. The first conductive end 61 is used to contact the speaker spring 41 of the speaker assembly 4 to transmit audio signals to the speaker assembly 4. The second conductive end 62 is used to contact the motherboard spring 51 to receive audio signals from the motherboard 5. The first conductive end 61 and the second conductive end 62 can be set as circular or rectangular areas, and the area of ​​the corresponding area is larger than the contact area of ​​one end of the corresponding spring, so as to ensure that the corresponding spring contacts the first conductive end 61 and the second conductive end 62 after the bottom shell assembly 1 and the middle frame 2 are assembled. It should be noted that since other electronic components will be installed on the motherboard 5, the size of the second conductive end 62 should be sufficient to avoid contact with other electronic components. The size of the connecting segment 63 can be smaller than the size of the corresponding first conductive end 61 and the second conductive end 62.

[0040] The conductive pattern 6 can be designed as a single straight line, L-shape, П-shape, serpentine, or grid shape, etc., depending on the wiring requirements. No specific limitation is made. Its two ends form a first conductive end 61 and a second conductive end 62, respectively. The conductive pattern 6, the corresponding speaker spring 41, and the main board spring 51 are all provided in two sets, respectively realizing the transmission of forward and reverse audio signals, thereby driving the speaker assembly 4 to produce sound.

[0041] In this embodiment, the innovative combination of conductive pattern 6 formed by LDS plating and elastic connection of spring contacts eliminates the need for wire grooves or space outside the FPC in the speaker cavity, achieving complete sealing. Furthermore, there is no need for welding between the speaker assembly 4 and the motherboard 5, and the spring contact method facilitates assembly. This method effectively solves the sealing, reliability, and cost problems of traditional speaker connections, making it particularly suitable for the mid-to-low-end smartphone market that pursues high cost-performance.

[0042] Combination Figure 2 and Figure 3 Furthermore, the bottom shell assembly 1 is provided with a bottom shell acoustic cavity surround 11, and the middle frame 2 is provided with a middle frame acoustic cavity surround 21. The contact surfaces of the bottom shell acoustic cavity surround 11 and the middle frame acoustic cavity surround 21 are both planar. The first conductive end 61 is provided in the inner region of the bottom shell acoustic cavity surround 11, and the second conductive end 62 is provided in the outer region of the bottom shell acoustic cavity surround 11.

[0043] In this embodiment, the speaker assembly 4 is located on one side of the middle frame 2, the main board 5 is located in the middle of the middle frame 2, the middle frame acoustic cavity surround 21 is arranged around the speaker assembly 4 and is a corresponding annular protrusion on the middle frame 2, and a shell acoustic cavity surround 21 matching the middle frame acoustic cavity surround 21 is provided at the corresponding position of the bottom shell assembly 1. The contact surfaces of the corresponding acoustic cavity surround 21 are all flat, so that the two are assembled to form a complete acoustic cavity boundary and ensure its sealing.

[0044] Combination Figure 5 In this embodiment, the speaker spring 41 includes a first elastic protrusion 411, which protrudes from the plane of the middle frame acoustic cavity surround 21 and corresponds to the position of the first conductive end 61. Each end of the speaker spring 41 has a first bending portion 412, which bends and connects to the speaker assembly 4. The first elastic protrusion 411 is positioned near the first bending portion 412 at one end of the speaker spring 41 to ensure that the deformation after elastic contact with the first conductive end 61 does not cause the speaker spring 41 to detach from the speaker assembly 4. The height of the first elastic protrusion 411 is higher than the height of the plane of the middle frame acoustic cavity surround 21 to ensure effective elastic contact with the first conductive end 61.

[0045] Combination Figure 6 The corresponding motherboard spring 51 is located on the side of the motherboard 5 near the speaker assembly 4, which facilitates the placement of other components and conductive patterns 6 within the motherboard 5. The motherboard spring 51 includes a fixing part 513 fixed on the motherboard 5, a second bending part 512 connected to the fixing part 513, and a second elastic protrusion 511 connected to the other end of the second bending part 512. The bottom end of the second elastic protrusion 511 has a certain distance from the fixing part 513. The second elastic protrusion 511 protrudes from the plane of the middle frame acoustic cavity surround 21 to ensure its elastic contact with the second conductive end 62.

[0046] Furthermore, a sealing element is provided between the bottom shell acoustic cavity surround 11 and the middle frame acoustic cavity surround 21. The planar surround and the sealing element cooperate to form a complete closed space, which can enhance the response of the speaker assembly 4, avoid air leakage in the acoustic cavity caused by traditional open-hole connections, and eliminate high-frequency noise generated by airflow friction. In this embodiment, the sealing element is foam 7, which is pre-attached to the top surface of the middle frame acoustic cavity surround 21 and automatically compressed to form a seal when the middle frame 2 and the bottom shell assembly 1 are fastened together. In other embodiments, a silicone sealing ring can be used, which can be integrally molded onto the middle frame 2 surround by injection molding.

[0047] Furthermore, the speaker assembly 4 is provided with a grounding conductive cloth 42, and a grounding metal plate 43 is also provided on the middle frame 2. The speaker assembly 4 is grounded through the grounding conductive cloth 42 and the grounding metal plate 43. Two sets of speaker springs 41 are respectively disposed on both sides of the speaker assembly 4, the grounding conductive cloth 42 is disposed between the two speaker springs 41, and the grounding metal plate 43 is fixed to the middle frame 2 and located above the speaker assembly 4. The grounding conductive cloth 42 is made of metal and is used for grounding conductivity between the grounding metal plate 43 and the speaker assembly 4. The grounding metal plate 43 is in-mold injection molded metal. The grounding of the speaker assembly 4 is achieved using the grounding conductive cloth 42 and the grounding metal plate 43.

[0048] In this invention, to ensure the fixation of the speaker assembly 4, a first receiving groove 22 is provided on the middle frame 2 corresponding to the position of the speaker assembly 4. A limiting plate 23 for fixing the speaker assembly 4 is provided around the periphery of the first receiving groove 22. The height of the limiting plate 23 is less than the height of the middle frame acoustic cavity surround 21. In this embodiment, multiple corresponding limiting plates 23 are provided, positioned at the corners of the speaker assembly 4, forming the first receiving groove 22 and clamping the speaker assembly 4 to ensure no displacement occurs after assembly. The height of the corresponding limiting plate 23 is less than the height of the middle frame acoustic cavity surround 21 to ensure that the corresponding limiting plate 23 does not affect the sealing of the acoustic cavity.

[0049] Correspondingly, a second receiving groove 24 is provided in the middle frame 2 at the position corresponding to the motherboard 5. The second receiving groove 24 is located outside the middle frame acoustic cavity surround 21. The depth of the second receiving groove 24 is such that after the motherboard 5 is placed, the second elastic protrusion 511 of the motherboard spring 51 protrudes out of the plane where the middle frame acoustic cavity surround 21 is located.

[0050] In this embodiment, a conductive pattern 6 is formed on the inner surface of the bottom shell assembly 1 by laser electroplating technology, and the speaker assembly 4 and the main board 5 are elastically connected by a spring sheet. Foam 7 is further provided to increase its sealing performance, so as to achieve a fully sealed sound cavity, no welding, easy assembly, high reliability and low cost, which has broad application prospects.

[0051] Example 2

[0052] Combination Figure 4 In this embodiment, protection is sought for a mobile phone including a speaker conduction structure as described in any of the embodiments. Specifically, the speaker conduction structure is located at the lower part of the mobile phone. A screen assembly 3 is also provided on the side of the middle frame 2 away from the bottom shell assembly 1. The bottom shell assembly 1 may have a corresponding position for accommodating the battery. The screen assembly 3 may include a display screen and a TP component. A charging interface 52 and an earphone jack 53 may be connected to the motherboard 5. A motor 54 is provided on the side of the middle frame 2 away from the speaker assembly 4. The mobile phone also includes other components for realizing the functions of the mobile phone. It should be noted that this part is not an innovative point of this solution, but a conventional technical means in the field, and will not be described here.

[0053] Mobile phones with this conductive structure have good sealing properties, which can effectively improve the acoustic performance, electromagnetic compatibility and assembly efficiency of the phone speaker, while reducing manufacturing costs and maintenance difficulty. This is of great value for mid-to-low-end smartphones.

[0054] The above description is only an optional embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A mobile phone speaker conduction structure, characterized in that, include: The bottom shell assembly (1) and the middle frame (2) are fixedly connected to the speaker assembly (4) and the main board (5). The bottom shell assembly (1) facing the middle frame (2) is formed with a conductive pattern (6) by laser plating. The conductive pattern (6) is provided with a first conductive end (61) and a second conductive end (62). The speaker assembly (4) is provided with a speaker spring (41) for elastic electrical connection with the first conductive end (61). The main board (5) is provided with a main board spring (51) for elastic electrical connection with the second conductive end (62).

2. The mobile phone speaker conduction structure according to claim 1, characterized in that, The bottom shell assembly (1) is provided with a bottom shell acoustic cavity surround (11), and the middle frame (2) is provided with a middle frame acoustic cavity surround (21). The contact surfaces of the bottom shell acoustic cavity surround (11) and the middle frame acoustic cavity surround (21) are both planes. The first conductive end (61) is located in the inner region of the bottom shell acoustic cavity surround (11), and the second conductive end (62) is located in the outer region of the bottom shell acoustic cavity surround (11).

3. The mobile phone speaker conduction structure according to claim 2, characterized in that, The speaker spring (41) includes a first elastic protrusion (411), which protrudes from the plane of the middle frame acoustic cavity surrounding bone (21) and corresponds to the position of the first conductive end (61).

4. The mobile phone speaker conduction structure according to claim 2, characterized in that, A sealing element is provided between the bottom shell acoustic cavity surrounding bone (11) and the middle frame acoustic cavity surrounding bone (21).

5. The mobile phone speaker conduction structure according to claim 4, characterized in that, The sealing element is foam (7).

6. The mobile phone speaker conduction structure according to claim 3, characterized in that, The speaker assembly (4) is provided with a grounding conductive cloth (42), and a grounding metal plate (43) is also provided on the middle frame (2). The speaker assembly (4) is grounded through the grounding conductive cloth (42) and the grounding metal plate (43).

7. The mobile phone speaker conduction structure according to claim 2, characterized in that, The middle frame (2) is provided with a first receiving groove (22) corresponding to the position of the speaker assembly (4). A limiting plate (23) for fixing the speaker assembly (4) is provided on the periphery of the first receiving groove (22). The height of the limiting plate (23) is less than the height of the middle frame acoustic cavity surrounding bone (21).

8. The mobile phone speaker conduction structure according to claim 7, characterized in that, The middle frame (2) is provided with a second receiving groove (24) corresponding to the position of the main board (5). The second receiving groove (24) is located in the area outside the middle frame acoustic cavity surrounding bone (21).

9. A mobile phone, characterized in that, Includes the mobile phone speaker conduction structure as described in any one of claims 1-8.

Images